Packaging issues of optical component

M. S. Ramaiah School of Advanced Studies 1

M. Sc. (Engg.) in Electronics System Design

Engineering

GREESHMA SCWB0913004 , FT-2013

7th Module Presentation

Module code : ESE2507

Module name : Electronic Board Design

Module leader : Mr. Ugra Mohan Roy

Presentation on : 13/06/2014

Packaging issues of optical component

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• INTRODUCTION

• PACKAGE SERVES MULTIPLE FUNCTIONS

• OPTICAL PACKAGING HIERARCHY

• OPTICAL PACKAGING MATERIALS

• EXAMPLE: WHY OPTICS?

• ISSUES OF OPTICAL PACKAGING

• OPTICAL PCB ROADMAP

• CONCLUSION

• REFERENCES

Overview

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Introduction

There are different types of packaging

Chip Scale Packages (CSP)

Surface Mounted Devices (SMD)

Dual in-line Package (DIP)

Thin Small Outline Package (TSOP)

Quad Flat Package (QFP)

Pin Grid Array (PGA)

Ceramic Leadless Chip Carrier (CLCC)

Small Outline Package (SOP)

Plastic Leadless Chip Carrier (PLCC)

Ball Grid Array (BGA)

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Introduction

Advanced Packaging are

Multi-chip-Modules (MCMs)

Chip Stacked Packages (CSP)

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Package Serves Multiple Functions

Protection – Environmental Management of Device

Connectivity and routing – Electrical, Optical, Material

– Including Power Management and Signal Integrity

Mechanical Stress Control

Thermal Management

Testability and Burn-in

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Optical Packaging Hierarchy

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Optical Packaging Material

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Example : Why Optics?

Electrical Buses become increasingly difficult at

high data rates (physics):

• Increasing losses & cross-talk

• Frequency resonant affects

• Optical data transmission is easier:

• Much lower loss, esp. at higher data rates

• Additional advantages include:

• Cable bulk, connector size, EMI…

• Potential power savings

• BW * Distance > electrical

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Optical PCB technology has been researched for several years; however, significant

issues remain before commercial implementation can be realized:

•Waveguide fabrication at production scale

•Optical PCB fabrication

•Optical coupling (such as device-board and board-to-backplane)

•Assembly

•Optoelectronic devices in standard ”IC-like” packages used in optical PCB

•Reliability (waveguide, connector, OE device, packaging materials, and system-level

qualification)

•Test vehicles…

•Testing methods, equipments and applied standards

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Issues of Optical Packaging

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Optical PCB Roadmap

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Conclusion

Lithium Niobate is the best optical packaging material. FEM analysis is used to measure

Mechanical stress of the optical component. Optical packaging is better than Electrical

Packaging. The challenges and solutions of integration of high performance waveguides on

packages and PCBs have dealt.

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Reference

1. Henning Schröder (2011). Optical Packaging . Germany Technische Universität Berlin

625-632.

2. Yuzo Ishii (2003). Fully SMT-Compatible Optical-I/O Package With Microlens Array

Interface. Japan JOURNAL OF LIGHTWAVE TECHNOLOGY 275-282.

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Thank You