Upload
greeshma-s
View
60
Download
1
Tags:
Embed Size (px)
DESCRIPTION
Citation preview
M. S. Ramaiah School of Advanced Studies 1
M. Sc. (Engg.) in Electronics System Design
Engineering
GREESHMA SCWB0913004 , FT-2013
7th Module Presentation
Module code : ESE2507
Module name : Electronic Board Design
Module leader : Mr. Ugra Mohan Roy
Presentation on : 13/06/2014
Packaging issues of optical component
M. S. Ramaiah School of Advanced Studies 2
• INTRODUCTION
• PACKAGE SERVES MULTIPLE FUNCTIONS
• OPTICAL PACKAGING HIERARCHY
• OPTICAL PACKAGING MATERIALS
• EXAMPLE: WHY OPTICS?
• ISSUES OF OPTICAL PACKAGING
• OPTICAL PCB ROADMAP
• CONCLUSION
• REFERENCES
Overview
M. S. Ramaiah School of Advanced Studies 3
Introduction
There are different types of packaging
Chip Scale Packages (CSP)
Surface Mounted Devices (SMD)
Dual in-line Package (DIP)
Thin Small Outline Package (TSOP)
Quad Flat Package (QFP)
Pin Grid Array (PGA)
Ceramic Leadless Chip Carrier (CLCC)
Small Outline Package (SOP)
Plastic Leadless Chip Carrier (PLCC)
Ball Grid Array (BGA)
M. S. Ramaiah School of Advanced Studies 4
Introduction
Advanced Packaging are
Multi-chip-Modules (MCMs)
Chip Stacked Packages (CSP)
M. S. Ramaiah School of Advanced Studies 5
Package Serves Multiple Functions
Protection – Environmental Management of Device
Connectivity and routing – Electrical, Optical, Material
– Including Power Management and Signal Integrity
Mechanical Stress Control
Thermal Management
Testability and Burn-in
M. S. Ramaiah School of Advanced Studies 6
Optical Packaging Hierarchy
M. S. Ramaiah School of Advanced Studies 7
Optical Packaging Material
M. S. Ramaiah School of Advanced Studies 8
Example : Why Optics?
Electrical Buses become increasingly difficult at
high data rates (physics):
• Increasing losses & cross-talk
• Frequency resonant affects
• Optical data transmission is easier:
• Much lower loss, esp. at higher data rates
• Additional advantages include:
• Cable bulk, connector size, EMI…
• Potential power savings
• BW * Distance > electrical
M. S. Ramaiah School of Advanced Studies 9
Optical PCB technology has been researched for several years; however, significant
issues remain before commercial implementation can be realized:
•Waveguide fabrication at production scale
•Optical PCB fabrication
•Optical coupling (such as device-board and board-to-backplane)
•Assembly
•Optoelectronic devices in standard ”IC-like” packages used in optical PCB
•Reliability (waveguide, connector, OE device, packaging materials, and system-level
qualification)
•Test vehicles…
•Testing methods, equipments and applied standards
M. S. Ramaiah School of Advanced Studies 10
Issues of Optical Packaging
M. S. Ramaiah School of Advanced Studies 11
Optical PCB Roadmap
M. S. Ramaiah School of Advanced Studies 12
Conclusion
Lithium Niobate is the best optical packaging material. FEM analysis is used to measure
Mechanical stress of the optical component. Optical packaging is better than Electrical
Packaging. The challenges and solutions of integration of high performance waveguides on
packages and PCBs have dealt.
M. S. Ramaiah School of Advanced Studies 13
Reference
1. Henning Schröder (2011). Optical Packaging . Germany Technische Universität Berlin
625-632.
2. Yuzo Ishii (2003). Fully SMT-Compatible Optical-I/O Package With Microlens Array
Interface. Japan JOURNAL OF LIGHTWAVE TECHNOLOGY 275-282.
M. S. Ramaiah School of Advanced Studies 14
Thank You