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Why Inhouse PCB Prototyping?PCB Prototyping by milling or lasering
Content
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
2© LPKF Laser & Electronics AG
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
3© LPKF Laser & Electronics AG
How could a typical workday for a passionate electronic engineer look like?
4© LPKF Laser & Electronics AG
1. Typical Day for a passionate Electronic Engineer
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1. Advantages of Inhouse Prototyping
• Flexibility• It’s your decision when you need a Prototype PCB!
• Independence• Never again waiting time for the Board House!
• Creativity• Be the master of your own ideas!
• Confidentiality• No need to share confidential data!
• Close to reality• Same materials as in mass production
• Environmental friendly• Chemical free process!
6© LPKF Laser & Electronics AG
Preparing data
Milling/lasering layout
Through-hole plating
Solder mask
Printing solder
paste
Components
assembly
Reflow soldering
Drilling holes
1. Workflow Inhouse PCB Prototyping
Double-
sided PCB
(Gerber,…)
7© LPKF Laser & Electronics AG
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
8© LPKF Laser & Electronics AG
2. PCB prototyping by milling
• Milling layout, drilling and cut out on same system
• Line/space: 100µm/100µm(FR4, Cu 18µm)
• Materials: FR4, RF materials
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2. PCB prototyping by milling
Copper
FR4
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2. PCB prototyping by milling: Sample Board
Process by ProtoMat S104 Processing Time
Drilling 304 holes 13:40
Structuring top 50:07
Structuring bottom 33:25
Cutting approx. 3min
- Typical double-sided PCB design
- Convenient size: 80 mm x 100 mm x 1 mm
- Contains 304 holes of different sizes, from vias, through-hole connectors to large assembly holes
- Contains SMT components including 0,5 mm pitch QFP
11© LPKF Laser & Electronics AG
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
12© LPKF Laser & Electronics AG
3. PCB prototyping by lasering
• Lasering layout, drilling and cut out on same system
• Line/space: 50µm/20µm (FR4, Cu 18µm)
• Materials: FR4, RF material - PTFE or ceramic filled (Rogers, Taconic,...), flexible materials, ceramics, LTCC, Si, glass,...
13© LPKF Laser & Electronics AG
3. How the structuring process works on laminated material
First process step: Contour• The copper surface is cut by the laser beam following the conductive
tracks in the layout
Second process step: Hatch• In the areas where the copper must be removed the laser beam cuts the
surface in 160µm thick copper stripes
Third process step: Head• The copper strips are heated up by the defocused laser beam. The
adhesion between substrate and copper decreases and the air knife removes the loosen copper stripes. The vacuum cleaner absorbs them from the substrate
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for laminated materials like FR4, Rogers materials,…
3. How the structuring process works on laminated material
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3. Structuring and Cutting of Laminated RIGID Materials
Structuring FR4 with CU surface 5 µ - 35 µm
Structuring RO3003 with electroplated CU 20µm
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3. Structuring and Cutting of Laminated Flex Materials
Structuring and cutting double sided Pyralux® TK with CU surface 18 µm
Structuring and cutting single sided FR4 with CU surface 18 µm
e.g. for multilayer production
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3. PCB prototyping by lasering: Sample Board
Process by ProtoLaser S4 Processing Time
Drilling 304 holes 07:05
Structuring top 11:20
Structuring bottom 12:04
Cutting 5:02
- Typical double-sided PCB design
- Convenient size: 80 mm x 100 mm x 1 mm
- Contains 304 holes of different sizes, from vias, through-hole connectors to large assembly holes
- Contains SMT components including 0,5 mm pitch QFP
19© LPKF Laser & Electronics AG
3. How the structuring process works on non laminated material
On non laminated material, e.g. thin film metallization on AL²O³, a direct vaporization process could be necessary. The specialized algorithm “x/y parallel” is optimized for the direct vaporization process and is integrated in CircuitPro PL.
X parallel Y parallelContour
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3. How the structuring process works on non laminated material
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3. Structuring and Cutting of LTCC Materials
Structuring, drilling and cutting of LTCC
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3. Structuring and Cutting of Fired Ceramic Materials
Structuring and cutting of fired ceramics e.g. Al2O3 with different metal surfaces
Line/Space 30 µm / 20 µm
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23
3. Structuring and cutting: copper on pure PTFE
• CuFlon: pure PTFE with double-sidedcopper
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1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
© LPKF Laser & Electronics AG 25
4. Through-hole plating
26
by galvanic copper platingby conductive paste
© LPKF Laser & Electronics AG 26
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
© LPKF Laser & Electronics AG 27
5. Multilayer Prototyping
28
Multilayer up to 8 layer
© LPKF Laser & Electronics AG 28
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
© LPKF Laser & Electronics AG 29
6. Post processes and SMT
• Solder resist
• Solder paste printing
• Semi-automatic pick-and-place
• Reflow oven
© LPKF Laser & Electronics AG 30
1. Inhouse PCB Prototyping
2. PCB Prototyping by mechanical process
3. PCB Prototyping by laser process
Summary
4. Through-hole plating
5. Multilayer
6. Post processes and SMT
Content
© LPKF Laser & Electronics AG 31
Summary Inhouse PCB Prototyping
• Flexibility• It’s your decision when you need a Prototype PCB!
• Independence• Never again waiting time for the Board House!
• Creativity• Be the master of your own ideas!
• Confidentiality• No need to share confidential data!
• Close to reality• Same materials as in mass production
• Environmental friendly• Chemical free process!
32© LPKF Laser & Electronics AG
Disclaimer
This presentation is intended exclusively for the purpose of providing information to the respective recipient.
Use for personal purposes, publication, duplication and/or forwarding the presentation and its contents is permissible only with the written consent from LPKF Laser & Electronics AG (”LPKF“).
The presentation was composed according to the best knowledge available at the time it was prepared and with the greatest possible care. LPKF is not liable for the completeness, correctness, function or fitness for purpose of the content presented, except in the event of willful intent or gross negligence. The content of the presentation shall become neither a component of a contract nor does it represent warranted properties.
All content is subject to copyright law. Logos, designs and names used may be registered trade marks of LPKF or third parties. Technologies or products can contain or relate to the intellectual property of LPKF or third parties.
33© LPKF Laser & Electronics AG
Thank you for your attention!
Stephan Krause Sales Director DevelopmentQuipment
LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen Germany
Tel.: +49 (5131) 7095-1580 Mobil: +49 (172) 5150024 Fax: +49 (5131) 7095-90 E-Mail: stephan.krause@lpkf.com
34© LPKF Laser & Electronics AG
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