STMicroelectronics MASTERGAN1 Half-Bridge Driver

22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr

The first 600V system-in-package half bridge driver from STMicroelectronics integrating two GaN-based HEMTs

SP20580 - Power Electronics report by Taha AYARILaboratory analysis by Youssef EL GMILI

November 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents

Overview / Introduction 5

o Executive Summary

o Market

o Reverse Costing Methodology

Company Profile 13

o STMicroelectronics

Physical Analysis 17

o Summary of the Physical Analysis

o Package Analysis

✓ Package Opening

✓ Package Cross-Sections

o HEMT Die

✓ HEMT Die Views & Dimensions

✓ HEMT Die Process

✓ HEMT Die Cross-Section

✓ HEMT Die Process Characteristics

o IC Die

✓ IC Die Views & Dimensions

✓ IC Die Process

✓ IC Die Cross-Section

✓ IC Die Process Characteristics

Manufacturing Process Flow 47

o HEMT Die Front-End Process

o HEMT Die Fabrication Unit

o IC Die Front-End Process

o IC Die Fabrication Unit

o Packaging Process Flow

Cost Analysis 61

o Supply Chain and Yields

o HEMT Die

✓ HEMT Wafer Front-End Cost and Front-End Cost per Process Step

✓ HEMT Back-End0 Cost: Die Probe Test, Thinning & Dicing

✓ HEMT Die Cost

o IC Die

✓ IC Front-End Cost

✓ IC Back-End0 Cost: Die Probe Test, Thinning & Dicing

✓ IC Die Cost

o Packaging Assembly Cost

o Component Cost

✓ Back-End: Final Test Cost

✓ Component Cost

Price Analysis 79

o Definition of prices

o Estimation of selling price

Comparison 82

o Technology and Cost Comparison between GaN Devices from ST, Power

Integrations and Navitas

Feedbacks 85

System Plus Consulting Services 87

Overview / Introductiono Executive Summaryo Marketo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Feedback

Related reports

About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

Package is analyzed and measured.The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking.Setup of the manufacturing process

Costing analysis

Setup of the manufacturing environmentCost simulation of the process steps

Selling price analysis

Supply chain analysisAnalysis of the selling price

Reverse Costing Methodology

Overview / Introduction

Company Profile & SupplyChain

Physical Analysis o Summaryo Packageo GaN HEMTo IC Die

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

Summary of the Physical Analysis

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

Package Opening – Wire bonding

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

GaN HEMT Cross-Section - Contacts

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

GaN HEMT Cross-Section – Gate/Field plate

Consulting

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

GaN HEMT Cross-Section – Epitaxy

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

IC Die – Delayering

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

IC Die – Cross-Section

Physical Analysis

Manufacturing Process Flowo HEMT Fab Unito HEMT Process Flowo ICs Fab Unito ICs Process Flowo Component Packaging

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

GaN Transistor - Process Flow (6/6)

Drawing not to Scale

Physical Analysis

Cost Analysiso Supply Chain and Yieldso GaN HEMT Costo IC Costo Packaging Costo Component Cost

Comparison

Feedback

Related reports

About System Plus

Component Cost

Physical Analysis

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

Estimated Selling Price

Physical Analysis

Cost Analysis

Comparisono ST vs Power Integrationso ST vs Navitas

Feedback

Related reports

About System Plus

STMicroelectronics vs PI - Component Comparison

Note:Detailed teardown of the PI device can be found here.

Physical Analysis

Cost Analysis

Comparisono ST vs Power Integrationso ST vs Navitas

Feedback

Related reports

About System Plus

STMicroelectronics vs Navitas - GaN HEMT Comparison

Physical Analysis

Cost Analysis

Comparison

Feedback

Related reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

POWER ELECTRONICS & COMPOUND SEMI• Compound Semiconductor Quarterly Market Monitor• Status of the Power Electronics Industry 2020• Power GaN 2019: Epitaxy, Devices, Applications & Technology

Trends

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

POWER SEMICONDUCTORS & COMPOUND• GaN Power Transistor Comparison 2020• GaN-on-Sapphire HEMT Power IC by Power Integrations• Innoscience’s 650 V GaN-on-Si Transistor• Navitas 650V GaNFast Power IC Family• Nexperia’s AEC-Q101 qualified 650 V GaN based power

device

COMPANYSERVICES

Physical Analysis

Cost Analysis

Comparison

Feedback

Related reports

About System Pluso Company serviceso Contacts

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings

Physical Analysis

Cost Analysis

Comparison

Feedback

Related reports

About System Pluso Company serviceso Contacts

Contact

www.systemplus.fr

NANTESHeadquarters

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 82llevenez@systemplus.fr

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 4887onozawa@yole.fr

Mavis WANGTAIWANT :+886 979 336 809CN: +8613661566824wang@yole.fr

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 8267laferriere@yole.fr

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 chris.youman@yole.fr

CORNELIUSYOLE Inc.

STMicroelectronics MASTERGAN1 Half-Bridge Driver

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