Spanish Network on Future Linear Accelerators Valencia

A. Ruiz (Segundas Jornadas CPAN. Valencia 1-Diciembre, 2010)

Spanish Network on Future Linear Accelerators

Valencia, December, 1 2010A. Ruiz (IFCA)

The Spanish Network for Future Accelerators, history

In 2005, the seed of the present network was approved ,under the supervision ofJ. Fuster (IFIC) and J. Terrón (UAM).

The spanish institutions were already collaborating on european projects onlinear accelerators (IFIC, CIEMAT,…) or detectors ( see next slides)

Also, interest of phenomenological theory groups (UGR, IFCA,…)

ILC workshop in Valencia (November 2006), with a GDE meeting

The spanish network was approved for 2007-2008 and recently has beenapproved for 2009-2011.

Signed SiD and ILD concepts. Supervision of FTD at ILD, since 2010

It is open to all spanish institutions. Not only ILC/CLIC, but other R@D for futureaccelerators enter in the network

Five workshops between 2008-2010 (Santander, Santiago de Compostela, Barcelona, Madrid and Valencia). Next meeting in Granada, May-2011.

Next LCWS International Meeting, organized by Spain, Granada, September 26-30, 2011

Spanish

Visibility

ILCSC: International

Linear Collider

Steering

Committee. Subpanel

Juan Fuster, european

representative

FALC: Funding

Agencies for

Linear Collider. Francisco del Aguila, member

GDE: Global Design

Effort. Spanish

contributor

WWS: World Wide Study. WWS-OC co-chair

regional representative

RD, Juan Fuster

ILD Concept, Executive

BoardForward

Tracker

Detector, Alberto Ruiz

Outline

Linear Collider status and Future

Spanish Network

Activities and Projects

Last Network meeting ( Valencia, October, 2010)

Accelerator, GDE Report Brian FosterDetector tracking and vertex Marcel VosAIDA Project Iván Vila

Accelerator, detector activities A. Faus, D. Carrillo, C. Lacasta, M.C.Fouz, C.Padilla, M. Fernández, I. Vila, A.Arbat, G. Pellegrino, A. GallasPhysics J.A. Aguilar-SaavedraI+D+i programme F.del Aguila, General Discussion All

(See Angeles Faus talk for details)

ILC Global Plan for SRF R&DYear 07 2008 2009 2010 2011 2012

Phase TDP-1 TDP-2

Cavity Gradient in v. test to reach 35 MV/m

Yield 50%Yield 90%

Cavity-string to reach 31.5 MV/m, with one- cryomodule

Global effort for string assembly and test(DESY, FNAL, INFN, KEK)

System Test with beamacceleration

FLASH (DESY) , NML (FNAL)STF2 (KEK, test start in 2013)

Preparation for Industrialization

Production Technology R&D

Technical Design Phase and Beyond

AD&I studies

2009 2010

RDR ACD concepts

R&D Demonstrations

TDP Baseline Technical Design

2011 2012 2013

RDR Baseline

Beijing W

orkshop

TDP-1 TDP-2ChangeRequest

SB2009 evolve

change control processAAPPACPhysics

orkshop

Technical Design Report completeBaseline established

2011 2012 2013 2014 20162010

Technical design & R&D program

2017 2018

ILC possible timeline

SRF system tests

TDR reviews

Site EOI’s

Cost Estimating

Decision to proceed

Site/host established

Project Implementation Plan complete XFEL operation

Physics Run 1 Physics Run 2Interconnect repair

Existence of low‐

lying SUSY known

Higgs energy

scale known

DetectorsBig advances through collaborativeprojectsAs e.g. EUDET AIDA, …

Very rich detector R&D programme for a Linear Collider• Very good progress in many projects• Good collaboration ILC-CLIC

LC detector R&D has impact on other projects, e.g.

• LHC• B-factories• and beyond HEP

• Funding is critical

• Define plans until 2012 and beyond• Priorities• Integration & „low tech“ issues

J. Mnich, IWLC2010

Pre-EUDET(Vienna 2005)

Today(Geneva 2010)

+ many other advancements in tracking, calorimetry,…

AcceleratorAccelerator a (a (μμmm)) b (b (μμmm))

LEPLEP 2525 7070

SLDSLD 88 3333

LHCLHC 1212 7070

CLICCLIC <5<5 <15<15

ILCILC <5<5 <10<10

Vertex: low material, high granularity, good single point resolution, low power consumption, time resolution

Belle II VXD with DEPFET(2014)

STAR@RHIC with Mimosa(2012)

Some almost mature technologies

Others in well advanced R&D status

IFIC, IFCA, UB, URL, CNM, USC

Alignment Principle: shine laser beam through Si-layer (a la CMS)But: develop more transparent sensors (20% 60% transmission)

Readout: very wide field.Development of mixed analogue-

digital 128 channel ASCIC (SiTR

Integrate the pitch adapter on the sensorSophisticated infrastructure and test benches developed(in Europe within EUDET)

Engineering aspects: • Develop engineering concept for technology• Develop powering and cooling concepts for system

Support structuresPower pulsingCabling, services

Tracking: Well advanced R&D on gaseosus and silicon tracking

IFIC, IFCA, UB, URL CNM, USC

Calorimetry:

Particle Flow concept, double-track resolution with test-beam data

M. Peskin

Silicon for Large Colliders

Strong Spanish participation in DEPFET IFIC (since 2005)‏USC, UB, URL, CNM (since 2008) ‏IFCA ( mechanical alignment and integration)

IFIC, IFCA (since 2005), UB, CNM, USC IFCA EUDET member, several associatesNew EU project: AIDA

CALICECIEMAT Madrid

Forward Tracker

Coordinated effort :-

regular meetings

funding/projects-

R&D interests

the forward tracker…

Coordinated FLC detector-

effort in Spain

BarcelonaU. R. L.U. B.CNM-IMB

IFCA USC

IFIC CIEMAT

and activities in accelerators R&DAlso some theoreticians involved (Granada, IFCA, IFIC…)

Spanish

interest

evolution

Alice LHCb

BelleII/SuperB

Vertex ECal HcalTracker

Vertex-TrackingDEPFET

Tracker SPD

Muons Alignment

Tracker

EndCapTracking/Cal

CIEMAT/IFCA/UO

USC UB/URL

USC/CIEMAT

CNM-IMB/IFAE

CNM-IMB/IFIC

UAM IFAE/IFIC/UV

CNM-IMBIFICUB

URLUSCIFCA

CIEMATCNM-IMB

IFCAIFICUB

URLUSC

IFCA/ITA

Strong Collaboration between different groups

CNM-IMB infrastructure used for R&D, for Future L.C. in particular

Easy access through the Spanish “Access to Large Facilities”Program: ICTS GICSERV

DHP Design, UB (Analog Blocks)

Power supplies and grounding studies, USC, and irradiation campaign

A. Ruiz (Segundas Jornadas CPAN. Valencia 1-Diciembre, 2010) 23Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila

uStrips

Sensors

TransparentSensors

Double Metal LayerThin Sensors5th

GICSERV

CNMSensors

3th, 4th

GICSERV

HPKSensors

ALIVABA

FOS Sensors

FOS in CFC

FOS forEMC DCS

FOS in Silicon

Geometry optimization:

Simulation

Alignment: Optical computation validation:

24Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila

Incidence plane

Validation of optical simulation software with material samples (planar

multilayer samples) Obtain optical parameters

Validation of optical simulation for layered diffraction grating.

Optical simulation of optical test structures and actual sensors.

A. Ruiz (Segundas Jornadas CPAN. Valencia 1-Diciembre, 2010) 25Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila

R&D on mechanics: Bragg grating•

Fiber Bragg Grating optical transducer very common to measure strain and temperature

Calibration of bare fibers with different coattings (acrylate, polyimide, ormocer) and without coattings.

Other sensor studies :

APD´s, 3D, Timepix,…

A big effort and collaborative R&D activities of the spanish groups

detectors:

LongTerm: participate

in the

design

construction

the substantial

detectors

Research

development

technologies

accurate and

efficient

reconstruction

charged

particle

trajectories

as well

as primary

secondary

vertexes•

Alignment

Integration

Simulation

optimization

studies•

Calorimetry, particle

algorithms,…

Intermediate steps ( Belle2,…)

CONCLUSIONS:

Future

Linear Colliders

(ILC/CLIC) are the

worldwide

step(s)

in accelerator

physics, after

LHC, prioritized

by HEP community.

- Structure

policy

stablished

machine

detectors, with

visible spanish

participation

- Spanish

network

Future

Linear Accelerators

working

well, promoting

coordination

national

european

projects, both

accelerators

detectors.

- Medium-term

detector developments

in real experiments

as a way

to define mature

technologies

- Long-term

a strong

coordinated

spanish

participation in future

linear collider

experiments

- High

activities

in the

spanish

groups

BACKUP

ILC/CLIC

Marcel.Vos@ific.uv.es 34

DEPFET TB 2010

DEPFET TB 2008,9,10Marcel Vos, IFIC Valencia

DEPFET Active Pixel Sensors: 20 x 20 m2 pixel size, MIP S/N ~ 200A great opportunity to understand interactions of charged particles withSilicon.

Clusters created by a 120 GeV pion in six DEPFET planesTB2009, IFIC and U. Goettingen

Two pions coming in One pion going out

We can follow the trajectory of a -electron knocked out of atom

Nuclear interactions

TB2010: DUT

New DEPFET active pixel detector prototypesILC design sensors (PXD5)Belle-II auxiliary electronics (SwitcherB, DCDB,

steering and read-out for Belle-II)•(Nearly) full-speed read out •Relevant pedestals, common mode

No PXD6 module, yet(first thin DEPFET sensors to be tested in June 2011)

Wire chamber

DEPFET DUTScintillator triggers

SPS H6 beam line

TB setupSPS beam time 15-21 Nov 2011

Device successfully operated for a week, important development work (DAQ, online monitoring, offline software), very valuableoperating experience

Public results expected in a few months

For 2009 results, see:

Other sensor studies

TEST Beams

Other studies

ATLAS pixels, IFAE, CNM, GlasgowCMS pixels, IFCA,CNM, PSI…

Charge division concept—Charge division used in wire

chambers to determine the coordinate along the sensing wire.

—Same concept with conventional microstrips

with slightly resistive

electrodes

I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th

L2a L3a L4a L5a L6aL1a

P1 P2 P3 P4

L2b L3b L4b L5b L6bL1b

AlResistive material

Particle

Ampl1 Ampl2

=f(y)S2

=f(L‐y)

_Concept Demonstrator: P-Si sensor

45I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th

Designed and produced at IMB‐CNM.

•strip length= 14 mm.• Two different prototypes with

different strip widths:20 μm and

40 μm.•

metal guides

to drive the

contact pads at the same edge of

the detector.

•implant pitch= 160 μm• read out pitch= 80 μm•Multiple guard rings.

standard technology of silicon microstrip

detectors.P‐on‐n, 300 μm thick

detectors.

Only one chip to read outthe detector

Resistive material = highly doped polysilicon.

A. Ruiz (Segundas Jornadas CPAN. Valencia 1-Diciembre, 2010) M. Peskin

Thermal image

Outlet

The CO2 worked well until the desired temperature: ~ -25ºC

Further tests expected in a near future (minimal temperature)

cmarinas@ific.uv.es12

Spanish Network on Future Linear Accelerators Valencia

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