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ELECTRONIC MATERIALS CONFERENCE
June 25-27, 2008 • University of CaliforniaSanta Barbara, California
CALL FOR PAPERS
EMCElectronic Materials Conference
50thAnniversary
2008
Sponsored by
Electronic Materials Committee
www.tms.org/EMC.html
The Premier Annual Forum on the Preparation and Characterization of Electronic Materials for 50 Years
June 25-27, 2008 • Santa Barbara, California
For 50 years, the Electronic Materials Conference (EMC) has been presenting research and developments to advance the field as well as our attendees, who include:
ScientistsEngineersProfessorsResearchersTechniciansResearch and Development ManagersProduct ManagersStudents
You are invited to participate in this year’s event by submitting an abstract for any of the more than 30 topics being presented.
About the TopicsElectronic materials are defined as relating to, produced or operated by the controlled flow of electrons through a semiconductor, gas or free space along with those relating to devices, systems or circuits that employ components such as vacuum tubes, integrated circuits or transistors in their design. In practice, the field is much broader as we have tried to capture in the topics covered.
See the following pages for information on the technical topics and submit your abstract before February 1, 2008.
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LEARN • NETWORK • ADVANCELEARN • NETWORK • ADVANCE
EMCElectronic Materials Conference
50thAnniversary
2008
www.tms.org/EMC.html �
EMC 2008 will include both invited and contributed oral presentations, an exhibition of related products and
services, and special networking and social activities.
General ChairRobert Biefeld, Sandia National Laboratories
(505) 844-1556 • rmbiefe@sandia.gov
Program ChairMark Goorsky, University of California
(310) 206-0267 • goorsky@seas.ucla.edu
EMC and DRCEMC is being coordinated with the Device Research Conference (DRC),
June 23-25, 2008, at the University of California. The coordinated efforts are made in recognition of the strong interaction between electronic materials and device research. This provides for maximum exchange of information
between attendees of both conferences.
DRC InquiriesSteven Koester, IBM TJ Watson Research Center
(914) 945-2189 • skoester@us.ibm.com
Abstracts submitted to DRC may not be submitted to EMC.
For more information about EMC, contact TMS.Meeting Services
(724) 776-9000, ext. 243 • (800) 759-4TMS • mtgserv@tms.org
Table of ContentsInformation for Prospective Authors ...................................... 4Technical Program Topics ..................................................... 6
LEARN • NETWORK • ADVANCE�
Information for Prospective Authors
Abstract Submission
ABSTRACT DEADLINE: FEBRUARY 1, 2008
How to Submit an AbstractSubmit your 450-word abstract by February 1, 2008, using CMS-Plus, the online TMS conference management system, at http://cmsplus.tms.org. Conference organizers receive electronic notification of abstract submissions upon entry. Log in to CMS-Plus to begin.
Author RequirementsAbstracts submitted must reveal and demonstrate reasonable scientific content. Do not submit abstracts describing work that has not been released for public disclosure.Students should clearly mark abstracts as “Student Paper” and must also satisfy format guidelines.Authors are expected to present their papers in person at the conference. If an author must be absent or withdraw a paper, the author must notify the program chair well in advance.
Extended AbstractA one-page, additional abstract is also required to assist organizers in considering the material planned for presentation. The additional page (referred to as “extended abstract” in CMS-Plus) should be uploaded as a Microsoft Word or Portable Document Format (PDF) attachment when your initial abstract is submitted. (Only the required 450-word abstract will be printed in the program book).
“Late News” PapersLate news papers will be considered between February 2 and June 2, 2008. They should be submitted online at http://cmsplus.tms.org by selecting “Late News.” The same formatting instructions for abstract submission apply.
Questions about submitting your abstract? Contact TMS.Christina Raabe Eck, Technical Programming and Publications Manager(724) 776-9000, ext. 212 • (800) 759-4TMS • raabe@tms.org
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www.tms.org/EMC.html 5
Student Awards and AssistanceThe top 5 percent of student presentations, as voted upon by the EMC committee, will receive the EMC Best Student Paper Award at the 2009 conference. Papers are judged on both written abstract and oral presentation.
The EMC committee has allocated funds to assist students to attend the 2008 conference in order to make oral presentations. Those wishing to be considered to receive funds should e-mail Robert Biefeld at rmbiefe@sandia.gov no later than Monday, June 2, 2008.
Publication of PapersSelected technical sessions will be published in the Journal of Electronic Materials. You also are strongly encouraged to submit manuscripts of your work to the journal. Details on eligibility and manuscript submission will be included in the EMC advance program and are available on the Web at http://www.tms.org/jem.html.
LEARN • NETWORK • ADVANCE�
Technical Program Topics
ISSUES FOR WIDE BANDGAP MATERIALS
Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices
Andrew Allerman, Sandia National Laboratories(505) 845-3697 • aaaller@sandia.gov
Russell Dupuis, Georgia Institute of Technology(404) 385-6094 • russell.dupuis@ece.gatech.edu
Randy Feenstra, Carnegie Mellon University(412) 268-6961 • feenstra@cmu.edu
Jung Han, Yale University(203) 432-7567 • jung.han@yale.edu
Michael Manfra, Bell Labs, Lucent Technologies(908) 582-1137 • manfra@lucent.com
Thomas Myers, West Virginia University(304) 293-3422, ext. 1469 • tmyers@wvu.edu
Zinc Oxide: Growth, Doping, Defects, Nanostructures and Devices
Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov
Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it
Yicheng Lu, Rutgers University(732) 445-3466 • ylu@ece.rutgers.edu
Shelby Nelson, Eastman Kodak Company(585) 477-8417 • shelby.nelson@kodak.com
David Norton, University of Florida(352) 846-0525 • dnort@mse.ufl.edu
www.tms.org/EMC.html 7
Jamie Phillips, University of Michigan(734) 764-4157 • jphilli@umich.edu
Silicon Carbide: Growth, Processing, Characterization, Theory and Devices
Michael Capano, Purdue University(765) 494-3563 • capano@purdue.edu
Stephen E. Saddow, University of South Florida(813) 974-4773 • saddow@ieee.org
Robert Stahlbush, Naval Research Laboratory(202) 767-3357 • stahlbush@nrl.navy.mil
Point Defects, Extended Defects and Doping in Wide Bandgap Materials
Leonard Brillson, The Ohio State University(614) 292-8015 • brillson.1@osu.edu
Shigefusa Chichibu, Tohoku University+81-22-217-5363 • chichibu@tagen.tohoku.ac.jp
James Speck, University of California(805) 893-8005 • speck@mrl.ucsb.edu
Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • wetzel@ieee.org
Huili Xing, University of Notre Dame(574) 631-9108 • hxing@nd.edu
LEARN • NETWORK • ADVANCE8
NANOSCALE SCIENCE AND TECHNOLOGY IN MATERIALS
Low-Dimensional Structures: Quantum Dots, Wires and Wells
Diana Huffaker, University of New Mexico(505) 272-7845 • huffaker@chtm.unm.edu
Jim Merz, University of Notre Dame(574) 631-3111 • jmerz@nd.edu
Mark Miller, University of Utah(801) 587-7718 • mark.miller@ece.utah.edu
Akio Sasaki, Osaka Electro-Communication University+81-72-824-1131 • sasaki@isc.osakac.ac.jp
Ben Shanabrook, Naval Research Laboratory(202) 767-3693 • ben.shanabrook@nrl.navy.mil
Glenn Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu
Nanoscale Characterization: Scanning Probes, Electron Microscopy and Other Techniques
Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu
Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov
Susanne Stemmer, University of California(805) 893-6128 • stemmer@mrl.ucsb.edu
Edward Yu, University of California(858) 534-6619 • ety@ece.ucsd.edu
Molecular Electronics: Devices, Materials and Contacts
Mark Hersam, Northwestern University(847) 491-2696 • m-hersam@northwestern.edu
Technical Program Topics
www.tms.org/EMC.html �
David Janes, Purdue University(765) 494-9263 • janes@ecn.purdue.edu
Gregory Lopinski, Steacie Institute for Molecular Sciences(613) 990-4155 • gregory.lopinski@nrc.ca
Theresa Mayer, The Pennsylvania State University(814) 863-8458 • tsm2@psu.edu
Shalom Wind, Columbia University(212) 854-5122 • sw2128@columbia.edu
Nanotubes and Nanowires
Kris Bertness, National Institute of Standards and Technology(303) 497-5069 • bertness@boulder.nist.gov
Theresa Mayer, The Pennsylvania State University(814) 863-8458 • tsm2@psu.edu
Hou T. Ng, Hewlett-Packard Company(650) 857-4169 • hou-t.ng@hp.com
Timothy Sands, Purdue University(765) 496-6105 • tsands@purdue.edu
Raymond Tsui, Motorola(480) 413-4182 • ray.tsui@motorola.com
Chemical and Biological Sensors: Materials, Interfaces and Integration
April Brown, Duke University(919) 660-5442 • abrown@ee.duke.edu
David Janes, Purdue University(765) 494-9263 • janes@ecn.purdue.edu
Laura Rea, U.S. Air Force Research Laboratory(937) 255-9871 • laura.rea@wpafb.af.mil
Albert Alec Talin, Sandia National Laboratories(925) 294-1445 • aatalin@sandia.gov
LEARN • NETWORK • ADVANCE10
Lloyd Whitman, Naval Research Laboratory(202) 404-8845 • whitman@nrl.navy.mil
William Wong, Palo Alto Research Center(650) 812-4660 • wsw@parc.com
ADDITIONAL TOPIC AREAS
Contacts to Semiconductor Epilayers, Nanowires, Nanotubes and Organic Films
Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • mohney@ems.psu.edu
Lisa Porter, Carnegie Mellon University(412) 268-4047 • lporter@andrew.cmu.edu
Tae-Yeon Seong, Korea University+82-2-3290-3288 • tyseong@korea.ac.kr
Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu
Epitaxy
April Brown, Duke University(919) 660-5442 • abrown@ee.duke.edu
Diana Huffaker, University of New Mexico(505) 272-7800 • huffaker@chtm.unm.edu
Amy Liu, IQE Inc.(610) 861-6930 • aliu@iqep.com
Epitaxy for Devices
Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu
Technical Program Topics
www.tms.org/EMC.html 11
Kei-May Lau, Hong Kong University of Science and Technology+852-2358-7049 • eekmlau@ust.hk
Charles Lutz, Kopin Corporation(508) 824-6696, ext. 415 • clutz@kopin.com
Michael Tischler, Ocis Technologies(602) 317-6249 • tisch@ocistech.com
Epitaxy: Configurable �-D, Metamorphic and Template Growth (Other Areas)
Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu
Alan Doolittle, Georgia Institute of Technology(404) 894-0631 • alan.doolittle@ece.gatech.edu
Steven Ringel, The Ohio State University(614) 292-6904 • ringel.5@osu.edu
Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • wang@ll.mit.edu
Point and Extended Defects in Mismatched Materials
Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu
Steven Ringel, The Ohio State University(614) 292-6904 • ringel.5@osu.edu
Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu
LEARN • NETWORK • ADVANCE12
Nondestructive Testing and In Situ Monitoring and Control
Kurt Eyink, U.S. Air Force Research Laboratory(937) 656-5710 • kurt.eyink@wpafb.af.mil
Mark Goorsky, University of California(310) 206-0267 • goorsky@seas.ucla.edu
Andrew Hoff, University of South Florida(813) 974-4958 • hoff@eng.usf.edu
Semiconductor Processing: Oxidation, Passivation, Functionalization and Etching
Michael Capano, Purdue University(765) 494-3563 • capano@purdue.edu
Douglas Hall, University of Notre Dame(574) 631-8631 • dhall@nd.edu
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it
Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • mohney@ems.psu.edu
Materials Integration: Wafer Bonding and Engineered Substrates
Harry Atwater, California Institute of Technology(818) 395-2197 • haa@daedalus.caltech.edu
Karl Hobart, Naval Research Laboratory(202) 404-8542 • karl.hobart@nrl.navy.mil
Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu
Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu
Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu
Technical Program Topics
www.tms.org/EMC.html 1�
Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides and Metal Gates
Evgeni Gusev, Qualcomm MEMS Technologies(408) 546-2096 • gusev@qualcomm.com
Pat Lenahan, The Pennsylvania State University(814) 863-4630 • pmlesm@engr.psu.edu
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it
Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu
Shriram Ramanathan, Harvard University(617) 496-0358 • shriram@seas.harvard.edu
Susanne Stemmer, University of California(805) 893-6128 • stemmer@mrl.ucsb.edu
Si-Based Heterojunctions
Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu
Sarah Olsen, University of Newcastle-upon-Tyne+44-191-222-8552 • sarah.olsen@ncl.ac.uk
Michael Tischler, Ocis Technologies(602) 317-6249 • tisch@ocistech.com
Ya-Hong Xie, University of California(310) 825-2971 • yhx@ucla.edu
Narrow Bandgap Semiconductors: Antimonides and Other Materials
Brian Bennett, Naval Research Laboratory(202) 767-3665 • brian.bennett@nrl.navy.mil
Robert Biefeld, Sandia National Laboratories(505) 844-1556 • rmbiefe@sandia.gov
LEARN • NETWORK • ADVANCE1�
Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu
Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • wang@ll.mit.edu
Indium Nitride: Growth, Processing, Characterization, Theory and Devices
Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu
Yasushi Nanishi, Ritsumeikan University+81-77-561-2679 • nanishi@se.ritsumei.ac.jp
Joan Redwing, The Pennsylvania State University(814) 865-8665 • jmr31@psu.edu
William Schaff, Cornell University(607) 255-3974 • wjs2@cornell.edu
Spin-Dependent (or Spintronic) Electronic Materials
Michael Flatte, University of Iowa(319) 335-0201 • michael_flatte@mailaps.org
Xinyu Liu, University of Notre Dame(574) 631-9787 • xliu2@nd.edu
Chris Palmstrom, University of California, Santa Barbara(805) 893-3618 • cpalmstrom@ece.ucsb.edu
Nitin Samarth, The Pennsylvania State University(814) 863-0136 • nsamarth@psu.edu
Masaaki Tanaka, University of Tokyo+81-3-5841-6728 • masaaki@ee.t.u-tokyo.ac.jp
Dilute Nitride Semiconductors
Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu
Technical Program Topics
www.tms.org/EMC.html 15
Douglas Hall, University of Notre Dame(574) 631-8631 • dhall@nd.edu
Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu
Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu
Charles Tu, University of California(858) 534-4687 • ctu@ece.ucsd.edu
Flexible Thin-Film Electronics
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov
Thomas Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu
Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu
William Wong, Palo Alto Research Center(650) 812-4660 • wsw@parc.com
Organic Thin Film and Crystalline Transistors: Devices, Materials and Processing
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov
Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu
Alberto Salleo, Palo Alto Research Center(650) 812-5065 • asalleo@parc.com
LEARN • NETWORK • ADVANCE1�
Organic-Inorganic Hybrid Photovoltaics
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov
Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov
Max Shtein, University of Michigan(734) 764-4312 • mshtein@umich.edu
Materials and Novel Concepts for UV Detectors and Emitters
Laura Rea, U.S. Air Force Research Laboratory(937) 255-6316 • laura.rea@wpafb.af.mil
Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu
Mike Wraback, U.S. Army Research Laboratory(301) 394-1459 • mwraback@arl.army.mil
OTHER/NEW AREAS
Compound Semiconductor Growth on Si Substrates
Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu
Gene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu
Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu
Fuel Cell and Battery Materials
Stephen Hackney, Michigan Technological University(906) 487-2170 • hackney@mtu.edu
Technical Program Topics
www.tms.org/EMC.html 17
Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu
Solar Cell Materials and Devices
Mark Goorsky, University of California(310) 206-0267 • goorsky@seas.ucla.edu
Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu
Glen Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu
Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • wetzel@ieee.org
Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu
Graphene and Carbon Nanotubes
Randy Feenstra, Carnegie Mellon University(412) 268-6961 • feenstra@cmu.edu
Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu
Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu
Mark Miller, University of Utah(801) 587-7718 • mark.miller@ece.utah.edu
Randy Sandhu, Northrop Grumman Space Technology(310) 813-4815 • rajinder.sandhu@ngc.com
Glen Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu
EMCElectronic Materials Conference
50thAnniversary
2008
LEARN • NETWORK • ADVANCE18
Technical Program Topics
Thermoelectrics and Thermionics
Mayank Bulsara, Massachusetts Institute of Technology(617) 258-7147 • mbulsara@mit.edu
Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu
Timothy Sands, Purdue University(765) 496-6105 • tsands@purdue.edu
Jeff Snyder, California Institute of Technology(626) 395-6220 • jsnyder@caltech.edu
Joint Session with DRC
Steven Koester, IBM TJ Watson Research Center(914) 945-2189 • skoester@us.ibm.com
Submit your abstract online at http://cmsplus.tms.org.
www.tms.org/EMC.html 1�
EMC Exhibition
The 2008 EMC exhibition will feature electronic materials-related technology and services from worldwide companies. Exhibitors will
bring equipment, publications, software and services, relative to electronic materials applications and research, to the floor. More than
400 professionals from corporations, universities and government laboratories, interested in electronic materials, will be attending.
To find out how your company can participate in the exhibition, contact TMS no later than Friday, June 6, 2008:
Joe Rostan, Exhibit Sales Representative(724) 776-9000, ext. 231 • (800) 759-4TMS • exhibits@tms.org
For Your CalendarFebruary 1, 2008 – Abstract Submission Deadline
April 4, 2008 – Notification of AcceptanceJune 4, 2008 – Advance Registration Deadline
June 25, 2008 – Welcoming Reception
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