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Mechatronics 2000 S.T
Mechatronics Systems:A Semiconductor Perspective
These slides are from a presentation given by:
Simon Thomas (Motorola)
September 7, 2000
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Outline
Introduction Automotive Opportunities
- Business
- Motor Control- Smart Connector- MEMS integration- Emerging Systems
In the Home Opportunities
System Needs of Semiconductors- System on Chip- System in Package- Design Methodology
Conclusion
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The synergistic combination of mechanical, electrical, andcomputer engineering
- emphasis on integrated design for products
- optimal combination of appropriate technologies
Mechatronics: Technology Integration
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Mechatronics
Micro to MacroApplications
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MechatronicsFeature/Cost Driven
Multiplex NetworkingFeature/Cost Driven
Automotive Semiconductor TAM World-Wide [$B]
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
1975 1980 1985 1990 1995 2000 2005 2010
Uncertainty 5fth Wave
5fth Wave (EPAS, X-by-Wire, 42V...)
ITS (w/o Radio)
Body (Comfort, Light)
Safety (ABS, Airbag...)
Engine Control
Dynamic Growth in Automobile Electronics
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Typical Applications
Brake-By-Wire system
Steer-By-Wire
Integrated vehicle dynamics
Camless engines
Integrated starter alternator
OEM Driven
Reliability
Reduced weight
Fuel economy Manufacturing flexibility
Design freedom
Advanced safety features
CostSteer-by-Wire
Electric ACCompressor
Electric Brake(Brake-by-Wire)
ElectricValve
Control
Direct FuelInjection
CrankshaftStarter
Generator
Continuously VariableTransmission
ActiveSuspensio
ElectricAssistPower
Steering
42 VoltConverter
ElectricWater Pump
5th Wave(Conversion of Mechanical to Electronic Systems)
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Automotive Semiconductor Market
$0
$50
$100
$150
$200
$250
$300
1999 2000 2001 2002 2003 2004
$Per
Car
0
10
20
30
40
50
60
Vehicles(In
Millions)Rising Semiconductor
Content Per Vehicle
Vehicle Production
Source: Strategy Analytics, 1999
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Motors Are Everywhere:From Simple to Sophisticated
Industrialpicture
automotive
*Motion Tech TrendsFebruary 1999
Window lifts tobrake-by-wire
Single speed tovariable speedfans and blowers
Panel-based settings tointelligent spin control
Hand-held powertools toPrecision-control
robots
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ELECTRIC M OTOR USAGE :M otors per vehicle
0
50
100
150
200
250
1885
1900
1915
1930
1945
1960
1975
1990
2005
Quantity
1/27/99 MIT/Industry Consortium
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0.01 1 2.5 5 15 50 ITYP [A]
ClimateLight Level.
MirrorHydraulics Centr. Locking
R-WiperSeat Mover
F-Wiper
Window LiftSun Roof
Climate Fan
Engine FanP-Steering
StepperDC
AC
DCDC
Solenoid
0.1 10 30 60 120 600 Power [W]
DashboarGauges
d
Stepper
DashboardGauges
Motors in Cars
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Mechatronic Systems
HC05 Systemchip (S3)+ Chip Capacitorin Single Plastic SemiconductorPackage With Lead Frame Formed toMeet Connector Requirements.
Integration of Components andConnector Function Eliminates AnEntire Assembly Level.
Example : Stepper Motor Driver for Climate Control
+
Stepper Motor Existing Control Circuit/Connector Assembly Final Motor Assembly
Solution : A Smart Connector
IC
ChipCapacitor
MotorolaMUX 3
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HC05 Core
1008 Byte programm ROM or E2PROM
On-Chip 4.96 MHz RC Oscillator
On-Chip 5V Voltage Regulator
ISO9141 Single-wire bus interface transceiver (LIN)
Four universal 5 Ohms push-pull outputs
VSUP
R1
L2
L1
R2
BUS
GND
Mechatronics: Stepper motor controller
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Potential Mechatronic Modules in a Car
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Smart Mirror motor-unitpin-header
Smart Window Lift-unit Switchboard withCAN Bus Gateway
3 wire LIN Bus
Smart Doorlock
CAN Bus
Mechatronics Door Modules
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Seat Harness Architecture showing varioussmart connector interconnections solutions
Seat Module Solution
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Typical Smart Connector
uC + TMOS Substrate Assembly and Test
Assembly into Module Final Test
Stamp Leadframe Overmold Leadframe Mold Housing
MCU
CONTROLCONTROL
FETFET FETFET
FETFETFETFET
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Technology Integration
Systeminterconnect and
packagingtechnology
System-on-Chip
and substrate /chip-interconnecttechnology
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Micro Electro Mechanical System (MEMS) Integration
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General Accelerometer ApplicationsGeneral Accelerometer Applications Acceleration / deceleration
Velocity Precision displacement
Shock / vibration
Detecting premature failure in rotating equipment
Detecting & measuring excessive handling/
shock Tilt / Inclinometer
Z Axis Accelerometer
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Z-Axis AccelerometerTwo Chip Packaging Solution
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Basic chip carrier package gauge or differential die
Stainless Steel CapStainless Steel Cap
PackagePackage
PressurePressure
Lead frameLead frame
DieDie
RTV DieRTV DieBondBond
Silicone Gel Die CoatSilicone Gel Die Coat
Wire BondWire Bond
Pressure Sensor- Packaging
Pressure
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MEMS
SensorsMGS1100 Sensor Package
CO CO CO
SnO2Sensor
MetalContacts
Si (2.5m)Membrane
Die attach
Sensor Header
Poly SiHeater
SiO2
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Emerging Systems: Advanced Braking
Brake By Wire
Provides increased features for
Total Stability Control
Advanced Vehicle Dynamics throughintegration of Cruise Control and BrakingSystems
Advanced silicon and fault tolerant protocol
CPUs, Power and SmartMOSTM
Intelligent Sensors
AdvancedBraking
FrontBrake 1 RearBrake1
Front
Brake2
Rear
Brake2
PEDAL
BUS1
BUS2
High Level
ECU or gateway
Brake By Wire Architecture
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Emerging Systems: Hybrid Engines
Moving towards the 3 liter Car!! Increased power (>10kW)
Lowering emissions (-30%) User friendly stop-starts Integration with other 42V systems(Combined Alternator Starter,Electronic Valve Control)
High performance PowerPCTM
HybridEngines
4cyl Engine
StarterGenerator
Inverter
Motor
Nickel/Metal
HydrideBattery
Re-GenerativeBraking
Hybrid Architecture
ECU
Intelligent Sensors for temperature and position Dependable real-time bus
DSP cores for vector control
Advanced control, 42V/14V powersystem and Fifth Wave products
Power and SmartMOSTM products for highpower battery control
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Cellularvoice
data
Pagingmessagingdata
Positioning
(GPS)
Mobile Computernavigationwww serverPIM applications
Total Connectivity
AM/FM/DABMP3/DVD/GamesXM & Command Audio
Existing OEMVehicle Bus
OEM Bus/IDB Gateway(with firewall)
Displaye-call messages
route instructions
PDA SupportPalm Organiser
l
.
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In-the-Home Opportunities
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MORI survey commissioned by Motorola
Appeal of Smart Kitchens
1/3 of European consumers wanttechnology to make home life easier
and more fun
Two most desired smart products:-- One-button washing machine- Intelligent oven
Consumers want technology to:- Reduce environmental waste- Save energy costs
* Smart Sensors
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*
**
*
DigitalDNA Technologyin the Kitchen- Networked appliances
- Motor controls- Smart sensors
*
*
*
*iFridge
Smart Sensors
Motor Controls
Networked Appliances
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* *
*
*
*
**
White GoodsMotor Controls
Industrial Motor Controls
Exercise Equipment
Motor Controls
DigitalDNA Technologyin the Workshop
- Motor controls
Lawn Tool Motor Controls
Washing Machine System
Washing Machine System
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Washing Machine SystemWashing Machine System
SolutionSolution
Motor Driver (IGBT Inverter)
MGP4N60ED
MGP7N60EDMGP11N60ED
TUB
Pressure SensorMPX5006/MPX2010
MOTOR/PUMP
8-bit MCU
Power SupplyRectifiers/Regulator
User Interface
MC7805
MMMM
Motorola
DavesControlCenter
2E72G
bbbbMC68HC08MP16
SSAC9616-A
S kS k D SS
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SmokeSmoke Detector SystemSystem
Smoke
IC
IonChamber
( or Photo
Chamber)
Smoke Test
Smoke Signal
I/O
Horn
To other units,
Escape lights,
Aux. Alarms, etc.
SmokeSmoke
Horn Driver
LED Driver
M t C t l
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Motorola has created afamily of DSPs andMCUs for all motor types (DSP5680X)
Motor Controls:
Turning White Goods Green
These embedded solutions serve as abrain for the motor
Motors are now able to determine amount ofenergy required to get a particular job done
Result: cost and energy savings formanufacturers and consumers alike
Motor Control Example: Washing Machine
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Motor Control Example: Washing MachineIndirect Drive, 3-Phase, AC Induction Motor
DSP56F805
ANALOG
CONDITIONING
POWER
STAGE
Water
Temp
Motor
Temp
C
ycleControlSetting
s
Motor
Control
HotW
aterValveControl
ColdW
aterValveControl
Motor Controls Enable:
More economical to build
Cleaner clothes
Better fabric care
Reduced drying time Improved energy
management
Overall machine control
without additional controller
Motor Control Example: Refrigerator
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Motor Control Example: Refrigerator3-Phase, Sensorless BLDC Motor
DSP56F803
ANALOG
CONDITIONING
Tempera
ture
Readin
g
Tempera
ture
Settin
g
POWER
STAGE
FANMotor Controls Enable:
Improved operating economy
Lower manufacturing costs
Better food preservation
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Local Area Networks
Linking the Entire Home
Connected Home
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ControlServerTM
OSGi usingMCore processor
InvensysReadyTMappliances
Peracom Avcasttechnology
UniversalControllerTM
for HVAC, lighting, security
Communicatingthermostats and sensorsMultiple user interface options
HomeManagerTMsoftware
SmartModuleTM
technology
Connected Home
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System Needs for Semiconductors
S N d f S i d
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System Needs for Semiconductors
POWERPOWER RECTIFIERSPOWER TRANSISTORS
RECTIFIERS
POWER TRANSISTORS
MPUMCU
DSP
MEMORY
MPUMCU
DSP
MEMORY
DECISION
MAKING
DECISION
MAKING
POWER TRANSRECTIFIER
THYRISTOR
IGBTS
RF POWER
POWER TRANS
RECTIFIER
THYRISTOR
IGBTS
RF POWER
WORK
OUTPUT
WORK
OUTPUT
PRESSURECHEMICALACCELERATION
MOTIONPOSITION
SIGNAL
PRESSURE
CHEMICALACCELERATION
MOTIONPOSITION
SIGNAL
SENSING
INPUT
SENSING
INPUT
ISO
CO
UPLE
PROTECT
ISO
C
OUPLE
PR
OTECT
IS
O
COU
PLE
PROT
ECT
ISO
COUP
LE
PROTECT
Today's "glamour chips" such as MPUs, DSPs and DRAMs must besurrounded by a wide array of discretes and passives
S i d t T h l S t
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Semiconductor Technology Spectrum
SMARTMOSCMOS + Flash TMOS
Software IC. Packaging
High-End Computing64/128-bit CPU6-layer metal, 2.5/1.8V
Embedded Control8/16/32-bit microNVM 512Kbyte
limited analog, 40V I/O
Robust I/O, Mid-Power40/65/80V Bip + CMOSdigital/analog/NVM-trim
High-Power40/65/80V Low-RDSON FETprotection and I/T-sensing
Hardware DriverOperating System (OSEK, Time Triggered OS)Networking (LIN, CAN, TTx, MOST)
SoCMCMSystem in Package
0.650.5
0.25
1.40.65
0.65
0.6mcm20.3mcm2
0.15mcm2
SMT, BGAFlip-Chip
AssemblerC
Code Synthesis
200W / 15A / 14V / 85Camb
1.2kW / 30A / 42V / 150Camb
CMOS
0.250.18
0.13
Hi h k & M t l G tC & L k Di l i
CMOS Technology Platform
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Mechatronics 2000 S.T1994 1995 1996 1997 1998 1999 2000 2001
Production Dates
2002 2003 2004
120MHz
350MHz
600 MHz
1.0 GHz
SOI
P
rocessPer
formance
.40ma/MIPS
HighPerf
orman
ceSy
stems
HighP
erform
anceComm
unica
tions
1.8 GHz
1.5 GHzSOI
SOI
.10ma/MIPS
.55ma/MIPS
.12ma/MIPS
.05ma/MIPS
.03ma/MIPS
TiN
Poly Si Cap
Silicide
High k Gate
TFSOIHigh k & Metal GatesCopper & Low k Dielectric
Buried Oxide
Silicon Substrate
Low k Dielectric
Copper
Integrated Packaging for System Solutions
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Integrated Packaging for System Solutions
PCB
MCP
SoC
Increased Density
Increased Performance
Packages on PC Board
Multi-Chip-Package
Modules on Chip
Selected Modules&
MCP TechnologyApplication SpecificSystem Partitioning
Cost-Performance Tradeoff Latitude:_ Technology Mix & Match_ Performance Adaptability
Improved Reliability
R L C IC IC IC
PCB
DRIVING FORCES
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FOR PACKAGE LEVEL INTEGRATION
INTEGRATION OF MIXED TECHNOLOGIES.
PERFORMANCE IMPROVEMENTS. SIZE / WEIGHT REDUCTION.
SYSTEM COST REDUCTION.
MANUFACTURABILITY.
SERVICING ENHANCEMENTS.
ERGONOMICS.
DESIGN FLEXIBILITY.
Mechatronics Packaging
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Mechatronics Packaging
Challenges System Partitioning (function, technology, cost etc)
System Cost Multichip Issues (KGD, Test)
Diverse packaging /interconnect technologies
Thermo-mechanical Performance and DesignGuidelines
Thermal management
Micro vs. Macro electronics
Reliability
Design Approach Today
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System Requirements
Partitioning
Logic PowerMemory
ICdesign
ICdesign
ICdesign
PKGdesign
PKGdesign
PKGdesign
Substrate/Interconnect Design
Debugging
Incompleterequirements
Mechatronics System Design
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Design Infrastructure
MechatronicsDesign
Framework
System Requirements
Partitioning
IC
designkits
Substrate
d
esignkits
Package
library
Systemcost/performance
trade-offFunctional Partitioning
Digital Analog SW
Schematic
Verification
System SimulationTest Generation
Cost
Tech choice
CMOS
TMOS
MEMS
LTCC
PBGA
PASSIVES
Packagedesign
Sub-system
Substrate
design
ICdesign
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Mechatronics---- Confluence of diverse fields of Science and
Technology- Semiconductors key enabler
- Integration of mixed technology componentsfor system performance
- IC Design methodology for System needs
- Business opportunities unlimited
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