Mechatronics System

8/2/2019 Mechatronics System

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Mechatronics 2000 S.T

Mechatronics Systems:A Semiconductor Perspective

These slides are from a presentation given by:

Simon Thomas (Motorola)

September 7, 2000


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Outline

Introduction Automotive Opportunities

- Business

- Motor Control- Smart Connector- MEMS integration- Emerging Systems

In the Home Opportunities

System Needs of Semiconductors- System on Chip- System in Package- Design Methodology

Conclusion


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The synergistic combination of mechanical, electrical, andcomputer engineering

- emphasis on integrated design for products

- optimal combination of appropriate technologies

Mechatronics: Technology Integration


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Mechatronics

Micro to MacroApplications


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MechatronicsFeature/Cost Driven

Multiplex NetworkingFeature/Cost Driven

Automotive Semiconductor TAM World-Wide [$B]

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

1975 1980 1985 1990 1995 2000 2005 2010

Uncertainty 5fth Wave

5fth Wave (EPAS, X-by-Wire, 42V...)

ITS (w/o Radio)

Body (Comfort, Light)

Safety (ABS, Airbag...)

Engine Control

Dynamic Growth in Automobile Electronics


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Typical Applications

Brake-By-Wire system

Steer-By-Wire

Integrated vehicle dynamics

Camless engines

Integrated starter alternator

OEM Driven

Reliability

Reduced weight

Fuel economy Manufacturing flexibility

Design freedom

Advanced safety features

CostSteer-by-Wire

Electric ACCompressor

Electric Brake(Brake-by-Wire)

ElectricValve

Control

Direct FuelInjection

CrankshaftStarter

Generator

Continuously VariableTransmission

ActiveSuspensio

ElectricAssistPower

Steering

42 VoltConverter

ElectricWater Pump

5th Wave(Conversion of Mechanical to Electronic Systems)


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Automotive Semiconductor Market

$0

$50

$100

$150

$200

$250

$300

1999 2000 2001 2002 2003 2004

$Per

Car

0

10

20

30

40

50

60

Vehicles(In

Millions)Rising Semiconductor

Content Per Vehicle

Vehicle Production

Source: Strategy Analytics, 1999


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Motors Are Everywhere:From Simple to Sophisticated

Industrialpicture

automotive

*Motion Tech TrendsFebruary 1999

Window lifts tobrake-by-wire

Single speed tovariable speedfans and blowers

Panel-based settings tointelligent spin control

Hand-held powertools toPrecision-control

robots


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ELECTRIC M OTOR USAGE :M otors per vehicle

0

50

100

150

200

250

1885

1900

1915

1930

1945

1960

1975

1990

2005

Quantity

1/27/99 MIT/Industry Consortium


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0.01 1 2.5 5 15 50 ITYP [A]

ClimateLight Level.

MirrorHydraulics Centr. Locking

R-WiperSeat Mover

F-Wiper

Window LiftSun Roof

Climate Fan

Engine FanP-Steering

StepperDC

AC

DCDC

Solenoid

0.1 10 30 60 120 600 Power [W]

DashboarGauges

d

Stepper

DashboardGauges

Motors in Cars


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Mechatronic Systems

HC05 Systemchip (S3)+ Chip Capacitorin Single Plastic SemiconductorPackage With Lead Frame Formed toMeet Connector Requirements.

Integration of Components andConnector Function Eliminates AnEntire Assembly Level.

Example : Stepper Motor Driver for Climate Control

+

Stepper Motor Existing Control Circuit/Connector Assembly Final Motor Assembly

Solution : A Smart Connector

IC

ChipCapacitor

MotorolaMUX 3


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HC05 Core

1008 Byte programm ROM or E2PROM

On-Chip 4.96 MHz RC Oscillator

On-Chip 5V Voltage Regulator

ISO9141 Single-wire bus interface transceiver (LIN)

Four universal 5 Ohms push-pull outputs

VSUP

R1

L2

L1

R2

BUS

GND

Mechatronics: Stepper motor controller


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Potential Mechatronic Modules in a Car


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Smart Mirror motor-unitpin-header

Smart Window Lift-unit Switchboard withCAN Bus Gateway

3 wire LIN Bus

Smart Doorlock

CAN Bus

Mechatronics Door Modules


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Seat Harness Architecture showing varioussmart connector interconnections solutions

Seat Module Solution


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Typical Smart Connector

uC + TMOS Substrate Assembly and Test

Assembly into Module Final Test

Stamp Leadframe Overmold Leadframe Mold Housing

MCU

CONTROLCONTROL

FETFET FETFET

FETFETFETFET


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Technology Integration

Systeminterconnect and

packagingtechnology

System-on-Chip

and substrate /chip-interconnecttechnology


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Micro Electro Mechanical System (MEMS) Integration


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General Accelerometer ApplicationsGeneral Accelerometer Applications Acceleration / deceleration

Velocity Precision displacement

Shock / vibration

Detecting premature failure in rotating equipment

Detecting & measuring excessive handling/

shock Tilt / Inclinometer

Z Axis Accelerometer


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Z-Axis AccelerometerTwo Chip Packaging Solution


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Basic chip carrier package gauge or differential die

Stainless Steel CapStainless Steel Cap

PackagePackage

PressurePressure

Lead frameLead frame

DieDie

RTV DieRTV DieBondBond

Silicone Gel Die CoatSilicone Gel Die Coat

Wire BondWire Bond

Pressure Sensor- Packaging

Pressure


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MEMS

SensorsMGS1100 Sensor Package

CO CO CO

SnO2Sensor

MetalContacts

Si (2.5m)Membrane

Die attach

Sensor Header

Poly SiHeater

SiO2


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Emerging Systems: Advanced Braking

Brake By Wire

Provides increased features for

Total Stability Control

Advanced Vehicle Dynamics throughintegration of Cruise Control and BrakingSystems

Advanced silicon and fault tolerant protocol

CPUs, Power and SmartMOSTM

Intelligent Sensors

AdvancedBraking

FrontBrake 1 RearBrake1

Front

Brake2

Rear

Brake2

PEDAL

BUS1

BUS2

High Level

ECU or gateway

Brake By Wire Architecture


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Emerging Systems: Hybrid Engines

Moving towards the 3 liter Car!! Increased power (>10kW)

Lowering emissions (-30%) User friendly stop-starts Integration with other 42V systems(Combined Alternator Starter,Electronic Valve Control)

High performance PowerPCTM

HybridEngines

4cyl Engine

StarterGenerator

Inverter

Motor

Nickel/Metal

HydrideBattery

Re-GenerativeBraking

Hybrid Architecture

ECU

Intelligent Sensors for temperature and position Dependable real-time bus

DSP cores for vector control

Advanced control, 42V/14V powersystem and Fifth Wave products

Power and SmartMOSTM products for highpower battery control


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Cellularvoice

data

Pagingmessagingdata

Positioning

(GPS)

Mobile Computernavigationwww serverPIM applications

Total Connectivity

AM/FM/DABMP3/DVD/GamesXM & Command Audio

Existing OEMVehicle Bus

OEM Bus/IDB Gateway(with firewall)

Displaye-call messages

route instructions

PDA SupportPalm Organiser

l

.


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In-the-Home Opportunities


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MORI survey commissioned by Motorola

Appeal of Smart Kitchens

1/3 of European consumers wanttechnology to make home life easier

and more fun

Two most desired smart products:-- One-button washing machine- Intelligent oven

Consumers want technology to:- Reduce environmental waste- Save energy costs

* Smart Sensors


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*

**

*

DigitalDNA Technologyin the Kitchen- Networked appliances

- Motor controls- Smart sensors

*

*

*

*iFridge

Smart Sensors

Motor Controls

Networked Appliances


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* *

*

*

*

**

White GoodsMotor Controls

Industrial Motor Controls

Exercise Equipment

Motor Controls

DigitalDNA Technologyin the Workshop

- Motor controls

Lawn Tool Motor Controls

Washing Machine System

Washing Machine System


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Washing Machine SystemWashing Machine System

SolutionSolution

Motor Driver (IGBT Inverter)

MGP4N60ED

MGP7N60EDMGP11N60ED

TUB

Pressure SensorMPX5006/MPX2010

MOTOR/PUMP

8-bit MCU

Power SupplyRectifiers/Regulator

User Interface

MC7805

MMMM

Motorola

DavesControlCenter

2E72G

bbbbMC68HC08MP16

SSAC9616-A

S kS k D SS


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SmokeSmoke Detector SystemSystem

Smoke

IC

IonChamber

( or Photo

Chamber)

Smoke Test

Smoke Signal

I/O

Horn

To other units,

Escape lights,

Aux. Alarms, etc.

SmokeSmoke

Horn Driver

LED Driver

M t C t l


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Motorola has created afamily of DSPs andMCUs for all motor types (DSP5680X)

Motor Controls:

Turning White Goods Green

These embedded solutions serve as abrain for the motor

Motors are now able to determine amount ofenergy required to get a particular job done

Result: cost and energy savings formanufacturers and consumers alike

Motor Control Example: Washing Machine


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Motor Control Example: Washing MachineIndirect Drive, 3-Phase, AC Induction Motor

DSP56F805

ANALOG

CONDITIONING

POWER

STAGE

Water

Temp

Motor

Temp

C

ycleControlSetting

s

Motor

Control

HotW

aterValveControl

ColdW

aterValveControl

Motor Controls Enable:

More economical to build

Cleaner clothes

Better fabric care

Reduced drying time Improved energy

management

Overall machine control

without additional controller

Motor Control Example: Refrigerator


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Motor Control Example: Refrigerator3-Phase, Sensorless BLDC Motor

DSP56F803

ANALOG

CONDITIONING

Tempera

ture

Readin

g

Tempera

ture

Settin

g

POWER

STAGE

FANMotor Controls Enable:

Improved operating economy

Lower manufacturing costs

Better food preservation


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Local Area Networks

Linking the Entire Home

Connected Home


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ControlServerTM

OSGi usingMCore processor

InvensysReadyTMappliances

Peracom Avcasttechnology

UniversalControllerTM

for HVAC, lighting, security

Communicatingthermostats and sensorsMultiple user interface options

HomeManagerTMsoftware

SmartModuleTM

technology

Connected Home


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System Needs for Semiconductors

S N d f S i d


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System Needs for Semiconductors

POWERPOWER RECTIFIERSPOWER TRANSISTORS

RECTIFIERS

POWER TRANSISTORS

MPUMCU

DSP

MEMORY

MPUMCU

DSP

MEMORY

DECISION

MAKING

DECISION

MAKING

POWER TRANSRECTIFIER

THYRISTOR

IGBTS

RF POWER

POWER TRANS

RECTIFIER

THYRISTOR

IGBTS

RF POWER

WORK

OUTPUT

WORK

OUTPUT

PRESSURECHEMICALACCELERATION

MOTIONPOSITION

SIGNAL

PRESSURE

CHEMICALACCELERATION

MOTIONPOSITION

SIGNAL

SENSING

INPUT

SENSING

INPUT

ISO

CO

UPLE

PROTECT

ISO

C

OUPLE

PR

OTECT

IS

O

COU

PLE

PROT

ECT

ISO

COUP

LE

PROTECT

Today's "glamour chips" such as MPUs, DSPs and DRAMs must besurrounded by a wide array of discretes and passives

S i d t T h l S t


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Semiconductor Technology Spectrum

SMARTMOSCMOS + Flash TMOS

Software IC. Packaging

High-End Computing64/128-bit CPU6-layer metal, 2.5/1.8V

Embedded Control8/16/32-bit microNVM 512Kbyte

limited analog, 40V I/O

Robust I/O, Mid-Power40/65/80V Bip + CMOSdigital/analog/NVM-trim

High-Power40/65/80V Low-RDSON FETprotection and I/T-sensing

Hardware DriverOperating System (OSEK, Time Triggered OS)Networking (LIN, CAN, TTx, MOST)

SoCMCMSystem in Package

0.650.5

0.25

1.40.65

0.65

0.6mcm20.3mcm2

0.15mcm2

SMT, BGAFlip-Chip

AssemblerC

Code Synthesis

200W / 15A / 14V / 85Camb

1.2kW / 30A / 42V / 150Camb

CMOS

0.250.18

0.13

Hi h k & M t l G tC & L k Di l i

CMOS Technology Platform


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Mechatronics 2000 S.T1994 1995 1996 1997 1998 1999 2000 2001

Production Dates

2002 2003 2004

120MHz

350MHz

600 MHz

1.0 GHz

SOI

P

rocessPer

formance

.40ma/MIPS

HighPerf

orman

ceSy

stems

HighP

erform

anceComm

unica

tions

1.8 GHz

1.5 GHzSOI

SOI

.10ma/MIPS

.55ma/MIPS

.12ma/MIPS

.05ma/MIPS

.03ma/MIPS

TiN

Poly Si Cap

Silicide

High k Gate

TFSOIHigh k & Metal GatesCopper & Low k Dielectric

Buried Oxide

Silicon Substrate

Low k Dielectric

Copper

Integrated Packaging for System Solutions


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Integrated Packaging for System Solutions

PCB

MCP

SoC

Increased Density

Increased Performance

Packages on PC Board

Multi-Chip-Package

Modules on Chip

Selected Modules&

MCP TechnologyApplication SpecificSystem Partitioning

Cost-Performance Tradeoff Latitude:_ Technology Mix & Match_ Performance Adaptability

Improved Reliability

R L C IC IC IC

PCB

DRIVING FORCES


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FOR PACKAGE LEVEL INTEGRATION

INTEGRATION OF MIXED TECHNOLOGIES.

PERFORMANCE IMPROVEMENTS. SIZE / WEIGHT REDUCTION.

SYSTEM COST REDUCTION.

MANUFACTURABILITY.

SERVICING ENHANCEMENTS.

ERGONOMICS.

DESIGN FLEXIBILITY.

Mechatronics Packaging


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Mechatronics Packaging

Challenges System Partitioning (function, technology, cost etc)

System Cost Multichip Issues (KGD, Test)

Diverse packaging /interconnect technologies

Thermo-mechanical Performance and DesignGuidelines

Thermal management

Micro vs. Macro electronics

Reliability

Design Approach Today


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System Requirements

Partitioning

Logic PowerMemory

ICdesign

ICdesign

ICdesign

PKGdesign

PKGdesign

PKGdesign

Substrate/Interconnect Design

Debugging

Incompleterequirements

Mechatronics System Design


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Design Infrastructure

MechatronicsDesign

Framework

System Requirements

Partitioning

IC

designkits

Substrate

d

esignkits

Package

library

Systemcost/performance

trade-offFunctional Partitioning

Digital Analog SW

Schematic

Verification

System SimulationTest Generation

Cost

Tech choice

CMOS

TMOS

MEMS

LTCC

PBGA

PASSIVES

Packagedesign

Sub-system

Substrate

design

ICdesign


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Mechatronics---- Confluence of diverse fields of Science and

Technology- Semiconductors key enabler

- Integration of mixed technology componentsfor system performance

- IC Design methodology for System needs

- Business opportunities unlimited

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Mechatronics System