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Cu Pillar % µ-Bump Ag% µ-Bump Ag% (Sn-Ag)
W CMPSilicideHKMGHfOx
SOI/SiGe/Si:C
Cu Seed & Barrier
Metal Cu CMP
Non VisualCrystalline
defects
UBM thickness Waf
erLe
vel
Pack
aging
Cu M
etall
izatio
nGa
teSiG
e,HK
MG
Subs
trate
BOXSiGe SiGe STISiGe
X-RayTechnologies
3D geometry
Metal Cu CMP
XRR
GI-XRF
HRXRD
XRDI
WAXRD
XCD
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