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INVESTOR PRESENTATION
January 2019
Safe Harbor Statement
This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking
statements, which are found in various places throughout the press release, including, but not limited to, statements relating to expectations of orders,
net sales, product shipments, backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and
capital expenditures. The use of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,
“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking statements contain these
identifying words. The financial guidance set forth under the heading “Outlook” contains such forward looking statements. While these forward looking
statements represent our judgments and expectations concerning the development of our business, a number of risks, uncertainties and other important
factors could cause actual developments and results to differ materially from those contained in forward looking statements, including any inability to
maintain continued demand for our products; failure of anticipated orders to materialize or postponement or cancellation of orders, generally without
charges; the volatility in the demand for semiconductors and our products and services; failure to develop new and enhanced products and introduce
them at competitive price levels; failure to adequately decrease costs and expenses as revenues decline; loss of significant customers, including
through consolidation or the emergence of industry alliances; lengthening of the sales cycle; acts of terrorism and violence; disruption or failure of our
information technology systems; inability to forecast demand and inventory levels for our products; the integrity of product pricing and protection of our
intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with
substantial foreign customers, suppliers and foreign manufacturing operations, particularly to the extent occurring in the Asia Pacific region; potential
instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; any inability to attract and retain skilled
personnel; those additional risk factors set forth in Besi's annual report for the year ended December 31, 2017; and other key factors that could
adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We
expressly disclaim any obligation to update or alter our forward-looking statements whether as a result of new information, future events or otherwise.
2January 2019
Agenda
I. Company Overview
II. Market
III. Strategy
IV. Financial Review and Summary
V. Appendix
3January 2019
I. COMPANY OVERVIEW
4January 2019
Besi Overview
• Leading assembly equipment supplier with #1 and #2 positions in key markets. 36% addressable market share
• Broad portfolio: die attach, packaging and plating
• Strategic positioning in substrate and wafer level packaging
• Global operations in 6 countries; 1,914 employees. HQ in the Netherlands
Corporate Profile
• LTM revenue and net income of € 585.9 and € 157.2 million
• Cash/deposits at Q3-18: € 443.5 million
• Net cash/deposits at Q3-18: € 160.1 million
• € 470.7 million of dividends and share repurchases since 2011
Financial Highlights*
• Applications for emerging digital society are key long term drivers: Internet of Everything, AI, Big Data, Cloud computing, 3D imaging, 5G network roll out
• Advanced packaging is critical part of semi value chain to realize promise
• China market growth and share gains also benefit revenue development
• European overhead reduction, optimization of Asian production and common parts initiatives also help drive profit potential of business model
Investment Considerations
5
* As of September 30, 2018.
January 2019
Company History
€ 85.5
€ 585.9
25.9%
56.7%
20%
25%
30%
35%
40%
45%
50%
55%
60%
65%
0
100
200
300
400
500
600
2003 LTM
Gro
ss M
arg
in (
%)
Reven
ue
(eu
ro m
illio
ns)
Revenue Gross Margin
•2000 2002 2005 2009
Die Attach Acquisitions
• Expanded advanced packaging leadership into die attach area
• Gained market share organically and via acquisitions
• Gained mindshare with key industry leaders
• Growth in China, key customers and electronics supply chains
Product Strategy
• Asian production transfer combined with European restructuring enhanced profit potential
• Developed two key Asian production hubs (MY and CN), Singapore development/support center and Asian supply chain
• Scalability enhanced. Break even revenue levels reduced
Successful Execution of Strategic Plan Initiatives
• Achieved industry benchmark gross and net margins
• Improved cash flow generation
• Implemented attractive capital allocation policy
Financial Metrics
6January 2019
Best in Class Product Portfolio
Multi Module Attach• 2200 evo
• 2200 evo plus
• 2200 evo hS New
Die Sorting• WTT
• TTR
New
New
Die Bonding
• 2100 xP plus / hS
• 2100 sD plus / PPP plus
• 2100 sD advanced
Flip Chip• 8800 CHAMEO advanced
• 8800 TCB advanced
• 8800 FC Quantum advanced
• 2100 FC hS
New
New
Plating• Leadframe
• Solar
•Next generation Die Attach
•Next generation Packaging
•Common modules
AMS-W/LM• Substrate
AMS-i• Leadframe
• MEMS
• Sensors
FML• Wafer
• Panel
New FSL• Singulation
• Sorting
FCL• X
• P
• X/PNew
New
• 2009 SSI
• 2100 DS
• 2100 SC
Die Lid Attach• DLA New
• Film & Foil
• Battery
Die Attach
Packaging
Plating In Development
New
New
New
New
7January 2019
Product Positioning
8
Semiconductor Manufacturing Equipment
(2017: $57.7B)*
Front end: $48.0B
(83%)
Assembly: $4.6B
(8%)
Test: $5.2B
(9%)
* Source: VLSI October 2018
** Includes Molding, Trim and Form and Singulation Systems
Dicing
Semiconductor Assembly Process
Die Attach Wire Bond Packaging** Plating
Leadframe Assembly
Substrate
Wire Bond Assembly
Substrate
Flip Chip Assembly/TCB
Wafer Level Packaging
Flip Chip Assembly/ Fan Out
January 2019
Customers OEMs End Products
Customer Ecosystem
• Diversified, blue chip customer base, top 10 = 62% of 2017 revenue
• Leading IDMs and subcontractors. 65/35% split in 2017
• Also supply leading fabless companies: Qualcomm, Broadcom, MediaTek via subcontractors
• Long term relationships, some exceeding 50 years
IDMs
Subcontractors
9January 2019
Current Operational Profile
• Development activities in Europe
• Production in Asia
• Sales/service activities in Asia, US and Europe
Sales Office
Production Site
Sales, Production & R&D Site
Leshan
ChengduShanghai
Korea
Taiwan
Philippines
Malaysia
Singapore
Suzhou
Radfeld, (Austria)Steinhausen,
(Switzerland)
Duiven & Drunen,
(The Netherlands)
Chandler
Shenzhen
10
YTD September 30, 2018
Europe/NA Asia
Revenue (MMs) € 152.4 35.2% € 280.3 64.8%
Headcount 551 28.8% 1,516 71.2%
January 2019
Year Ended December 31,
(€ millions, except share data) 2015 2016 2017 YTD 17 YTD 18
Revenue 349.2 375.4 592.8 439.5 432.7
% seq. change (8%) 8% 58% (2%)
Gross margin 49% 51% 57% 57% 57%
EBITDA 73.0 89.8 222.8 167.3 157.2
Pretax income 57.1 73.6 199.2 150.5 132.9
Net income 49.0 65.3 173.2 129.6 113.5
Net margin 14% 17% 29% 30% 26%
EPS (diluted) (a) 0.64 0.85 2.17 1.59 1.40
EPS (basic) (a) 0.65 0.87 2.32 1.74 1.52
Dividend per share (a) 0.60 0.87 2.32
Net cash 136.5 168.1 247.6 165.4 160.1
Summary Historical Financials
11
(a) Adjusted for 2:1 stock split in May 2018
January 2019
Capital Allocation Policy and Distribution Trends
11.3 12.4
56.945.4
65.3
174.0
2.7
4.0 22.4
22.8
22.5
14.0 12.4
60.967.8
88.1
196.5
0
40
80
120
160
200
2013 2014 2015 2016 2017 2018*
eu
ro m
illio
ns
Dividends Share Repurchases
Cumulative distributions: € 470.7 MM since 2011*
* Dividend and share repurchases through September 30, 2018.
12
Current policy:
• Net cash above € 80 million available for dividends and share
repurchases
• Absolute level and mix can vary per annum
• Pay 40-100% of net income/annum in dividends
• Convertible funds available for acquisitions and long term
investment
Expanding share repurchases as % of mix
• Since 2011, mix skewed to dividend distributions
• € 22.5 million repurchased in 2018 through Q3-18
• New € 75 million buyback program announced in July
• 5.8 million shares held in treasury at average price of € 13.19
• Regular share repurchase activity
5.6 5.7
11.2
0
5
10
15
Q1-18 Q2-18 Q3-18
eu
ro m
illio
ns
2018 Quarterly Share Repurchases
January 2019
Besi Market Information
13
Market
Profile
Share
Ownership
60%
42% 41%
0%
10%
20%
30%
40%
50%
60%
70%
2015 2016 2017
Top 10 Shareholders (d)
(% of shares outstanding)
• BESI
• Euronext Midcap AMX
Symbol/ Index
• € 1.4 billion ($1.6 USD)
• 74 million shares net (b)
Market Cap (a)
• Pay out 40-100% of net income per annum
Dividend Policy
a) As of October 25, 2018
b) Net of 6.0 million treasury shares
46%30%
20%
17%
20%26%
11%
14% 18%
14%17% 21%
13% 19% 15%
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2015 2016 2017
By Geography
0
5,000
10,000
15,000
20,000
25,000
0
200
400
600
800
1000
2014 2015 2016 2017 2018
Avg V
ol *
Avg P
rice (
€ thousands)
Vo
lum
e (
tho
usa
nd
s)
Avg. Daily Volume (c) & Liquidity
Other
Europe
ex. NL
UK
US
NL
c) Shares adjusted for 2:1 stock split in May 2018
d) Besi estimates
January 2019
II. MARKET
14January 2019
Assembly Equipment Market Trends
3.0
3.9
3.23.7
4.6 4.64.0
4.4
-22.0%
26.8%
-17.5%
16.1%23.9%
0.0%
-12.4%
9.9%
-30%
-20%
-10%
0%
10%
20%
30%
0.0
1.0
2.0
3.0
4.0
5.0
2013 2014 2015 2016 2017 2018E 2019E 2020E
US
$ b
illio
ns
Assembly Equipment MarketMarket Size YoY Growth Rate
Source: VLSI December 2018
• VLSI has revised 2018 to show no growth from 2017 vs. 18% at start of year
• It anticipates order downturn in 2019 after which new product cycle begins again
254.9
378.8 349.2 375.4
592.8
439.5
-6.9%
48.6%
-7.8%7.5%
57.9%
-1.5%
-50%
0%
50%
100%
150%
0
200
400
600
2013 2014 2015 2016 2017 YTD-17 YTD-18
eu
ro m
illio
ns
Besi RevenueRevenue YoY Growth Rate
432.7
15January 2019
Die Bonding49.8%
Flip Chip12.4%
Die Sorting4.1%
Singulation4.5%
Presses15.4%
Molds7.2%
Lead Trim & Form5.0%
Plating1.5%
Assembly Equipment Market Composition
• Roughly half of assembly market represented by die attach and packaging equipment
• Die Attach represents Besi’s largest addressable market
Die Attach
66%
Packaging
32%
Plating
2%
Assembly Equipment Market *
(2017: $4.6 billion)Besi Addressable Market *
(2017: $1.8 billion)
* Source: VLSI October 2018.
Wire Bonding21.6%
Die Attach31.1%Packaging
15.7%
Plating0.6%
Other Assembly
(Inspection, Dicing)31.0%
16January 2019
New Era of Chip Growth and Applications Will Drive Greater Computing and Data Needs
Digital society
Driven by new technologies
- 5G
- AI – big data
- Robotics
- Transportation
- Environment
- Health care
Will need continuous new solutions
- 1zb = 1,000,000,000 tb
- 1zb= 1,000 data centres
- 1zb = 180,000,000 homes (energy
requirements)
Source: IMEC ITF 2018
17
KB – MB – GB – TB – PB – EB – ZB - YB
3 6 9 12 15 18 21 24
January 2019
Requiring Increased Density, Higher Accuracy and Smaller Form Factors for Next Generation Devices
Today => TomorrowFront End
Transistor scaling
Lithography
New structures 3D
Back End Assembly
More contacts
Smaller pitches
Thinner/denser
more complex packages
Stacked structures 3D
WLP/FOWLP packages
From simple Wire Bond to BGA/Flip Chip to complex 3D structures with TSVs,
microbumps and thin dies
to WLP/FOWLP packages
without substrate interposer
18January 2019
As Well As Changes in Assembly Processes, Structures and Equipment
New Assembly Structures
• 2D/2.5D/3D structures
• Die to Die or Die to Wafer Stacking
• Integration with Photonics
Assembly Equipment
• High accuracy 200nm and beyond
• Super clean
• Photonic element handling
• TCB and Direct bonding
• Substrate-less solutions - Fan Out
• Large Panel WLP for low cost or
specific high-end requirements
Sources: IMEC, GF, Chipworks
19January 2019
Advanced Packaging Critical to Next Generation Applications
20
Greater Miniaturization
Greater Complexity
Increased Density
Higher Performance
Lower Power Consumption
Higher Accuracy
Die Bond
Datacon 8800 TC
Datacon 8800 CHAMEO fan-out
Esec DB2009
Esec DB2100
Packaging
Fico AMS-LM
Fico Singulation Line
FML wafer molding
Fico Compact Line – X
Mobile Revolution
• Mobile Internet
• Messaging
• Social Media
• Shared Economy
• Gaming
• Geo-location
• Audio/Video
• Auto electronics
Digital Society
• Smart mfg, cities, mobility and homes
• Driverless Cars
• Data Mining
• Cloud Servers
• IoT
• Wearable Devices
• Artificial Intelligence
• VR/AR
• High Performance Computing
• MEMS
January 2019
Besi Portfolio Well Positioned by Node Size and Accuracy
15%
40%
20%
25%
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Typical Application Besi Equipment
Automotive, SiP
Power
Softsolder, Epoxy, MultiModule,
Flip Chip Die Bonders
Packaging
Plating
IOT
General ICs
Softsolder, Epoxy, MultiModule,
Flip Chip Die Bonders
Packaging
Plating
Computer, PC, Mobile Epoxy, MultiModule, Fan Out
Flip Chip Die Bonders
Packaging
High Performance Computing
Memory
Epoxy, TCB, D2W, Fan Out
Flip Chip Die Bonders
Packaging
Accuracy
Micron
10+
10
7
3
Size
NM
28+
28
17
10
Estimated % of 2017 Revenue
• 75% of Besi equipment revenue advanced packaging as per VLSI definition
• 55% equipment revenue is < 7 micron accuracy & sub 17 nanometer
• Most rapidly growing market segment
21January 2019
Advanced Packaging Unit Volume and Market Share Are Increasing
22
• Advanced packaging applications have grown
significantly since 2010
• Currently, estimated 36% of wafers use
advanced packaging interconnects
• Leading growth segment of assembly equipment
market
• Flip chip and WLP are leading AP assembly
processes next five years
Source: VLSI February 2018
13%
19%
26%
31%
32%
34%36%
37%38%
39%40%
42%
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
-
5
10
15
20
25
30
35
40
45
2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022A
P M
ark
et
Sh
are
%
M w
afe
rs, 3
00
MM
Eq.
Advanced Packaging Silicon Demand Growth & Market Share 2011 - 2022
TSV (3D & 2.5D) Fan-Out Wafer Level Packaging
Wafer Level Packaging Flip Chip
Advanced Packaging Unit Market Share (%)
January 2019
And Is Reflected in Besi End User Application Trends
Source: Company Estimates
23
• Mobile Internet devices, Computing
and Automotive are largest end
markets and most rapidly growing
• New device introductions in 2017
grew mobile internet share to 35%
• Computer/PC growth due to
increased demand for high end logic
and memory solutions
• Steady growth in automotive reflects
ever increasing electronic content
• Service/spare parts is roughly 11%.
Less volatile revenue growth stream
35%
25%
17%
10%
2%
11%
0%
5%
10%
15%
20%
25%
30%
35%
40%
2017 % of Revenue
January 2019
Besi Has Gained Share In Its Addressable Markets
2013 2014 2015 2016 2017
Addressable Market ($ Million) $1,200 $1,616 $1,216 $1,453 $1,844
Besi Market Share 26.4% 30.5% 31.3% 28.6% 36.0%
Total Die Attach 31.9% 37.1% 37.5% 35.4% 44.2%Die Bonding 39.1% 40.3% 38.9% 35.3% 48.4%Flip Chip 24.1% 33.2% 31.5% 33.0% 28.9%
Die Sorting 6.5% 14.9% 47.7% 44.6% 39.8%
Total Packaging 15.9% 17.9% 18.1% 14.9% 17.1%Molding 19.1% 19.9% 15.6% 14.1% 16.0%
Lead Trim & Form 17.6% 19.7% 27.8% 22.9% 30.3%Singulation 5.1% 9.4% 16.8% 10.6% 7.9%
Total Plating 82.3% 75.4% 78.5% 85.5% 78.1%
Total Assembly Equipment 10.7% 13.0% 12.2% 11.3% 14.5%
24
Source: VLSI June 2018 and Besi estimates
January 2019
And Has a Large Share of Wallet at Key Customers
25
• Customers are largest semi mfrs.
engaged in most advanced packaging
applications
• Significant share of wallet up to 100%
• Customer market shares vary p.a. due
to capacity needs, purchasing and
development cycles
• Primary competition in Besi’s
addressable markets:
• Die Attach: ASM-PT, Fasford,
Shinkawa, Toray, Shibaura
• Packaging: Towa, Hanmi, ASM-PT
N/B No reported bookings for Besi nor its competitors
• Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly done by subcontractors.
Share of Wallet
2014 2015 2016 2017 2014 2015 2016 2017
Subcons Subcons
ASE 70% 80% 70% 55% ASE 35% 25% 15% 40%
Amkor 90% 95% 95% 75% Amkor 20% 25% 10% 65%
JCET/Stats 70% 30% 60% 85% JCET/Stats 50% 5% 30% 50%
SPIL 90% 100% 60% 65% SPIL 20% 25% 25% 0%
TFME (NFME/Nantong) 100% 100% 100% 90% TFME 0% 35% 0% 100%
UTAC 100% 100% 100% 100% UTAC N/B 100% 20% 100%
Unisem 100% 100% 100% 75% Unisem N/B 100% N/B N/B
Cowell/Foxconn 100% 100% 100% 100% Cowell/Foxconn N/B N/B N/B N/B
IDM's IDM's
Skyworks 100% 100% N/B 80% Skyworks 40% 90% 25% 5%
ST Micro 80% 95% 85% 90% ST Micro 40% 45% 45% 85%
Infineon 100% 90% 75% 90% Infineon 90% 95% 20% 50%
Micron 45% 80% 100% 50% Micron 100% 100% N/B 15%
NXP 100% 100% 90% 80% NXP 100% 55% 90% 80%
Bosch 100% 95% 100% 100% Bosch 100% 100% N/B N/B
Qorvo 100% 100% 100% N/B Qorvo 100% 100% 90% 0%
Above customers as % of
revenue Besi65% 42% 47% 58%
Above customers as % of
revenue Besi66% 73% 69% 67%
Die Attach Packaging
January 2019
What Drives Besi’s Business?
Macro GDP trendsTech capabilities in
24/7 production environment
IDM customer and supply chain
choice
Timing of customer road maps and
capital spending programs
Competitive cycle times and scalability
26January 2019
Besi Addressable Market Share of Mobile Increasing
Besi technology can support virtually all device platforms utilized in latest mobile devices.Source: Tech Insights
27
Component Illustration
Growth in
features vs.
units is
driving
revenue
January 2019
Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity
Wire Bonding Flip Chip Bonding
Reduces board area by up to 95%.
Requires far less height
Offers higher speed electrical
performance
Greater I/O connection flexibility
More durable interconnection
method
Lower cost for high volume production,
with costs below $0.01 per connection
Flip Chip Advantages
Source: VLSI December 2018
• Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process
• Flip chip revenue represents 25% currently of total market of $1.3 billion as per VLSI
• Flip chip expected to gain share over next 5 years
• Growth could accelerate depending on adoption rates by key IDMs/subcons
CAGR 2017 – 2023E
Flip Chip 2.4%
Wire Bond -0.1%
Flip Chip$390 28%
Wire Bonding
$983 72%
2023
Flip Chip$338 25%
Wire Bonding
$991 75%
2017
28January 2019
Fan Out WLP and TCB/TSV Are Emerging Process Technologies
Enabling technology for high
end memory and optical
applications
Next step beyond Flip Chip
TCB/TSV (Substrate Based)Fan Out WLP (Wafer Level)
Fan Out Advantages:
• Wafer scale. Eliminates expensive substrate
• No wire bonding
• More cost effective than TSV in many applications by factor of 2x
Leading market position:
• Installed base of ~70 systems in production
• Estimated 70% market share
• Principal Competition: Shibaura
32 Stacked Die Capability
Besi TCB Advantage
• 32 die stack at <5 micron accuracy (current market:
4-8 die stack)
• High accuracy over large area placement
• Highly stable
• Industry leading throughput
• Compact form factor
Leading market position
• Installed base of 40 systems in production
• Estimated 25% market share of active systems
• Highest penetration of memory and GPU markets
• Principal competition: Toray, ASM PT, Shinkawa
Preferred process for high data
transfer and optical devices in IoT,
mobile and power
29January 2019
III. STRATEGY
30January 2019
Summary Strategy
Maintain best in
class tech leadership
Increase market
presence and share
Achieve more
scalable and lower cost mfg.
Grow via timely
acquisitions
31
• Leverage technology leadership to reach
40-45% market share in next 5 years
• Market high quality mid-range products to
increase mainstream penetration
• Expand share of wallet in China
• Expand software and process support in Asia
to better serve installed base
• Continue West-East personnel transfer
• Target 80% Asian headcount
• Further reduce euro based costs
• Target local production. Shorten cycle times
• Accelerate common parts development
• Seek € 15-20 million cost savings
• Target 53-57% through cycle gross margin
• Expand capabilities for:
• eWLB, TCB, panel size, ultra thin die bonding
• Large area, ultra thin, wafer level molding
• Solar and lithium ion battery plating
• Introduce next generation products for next
investment round
• Acquire companies with complementary
technologies and products
• Emphasis on wafer level processing
• Seek to leverage Asian production platform and
supply chain
January 2019
Favorable Drivers:
Digital Society
Big Data
Smart Everything
Cloud Expansion
Revenue Opportunities
32
Roll out 3D imaging and other features to 4G and 5G mobile customers/supply chains
Expand share of Korean and Chinese Android mobile customers
Sell next generation equipment to increase SoW in the Memory/Logic space
Expand share of Japanese automotive supply chain
• Capitalize on steady growth of electronic content and safety requirements
Substantial expansion of Chinese semiconductor infrastructure as per new five year government plan
Introduce complete Besi portfolio for production and sale in local Chinese market
Renewed interest in WLP, Panel WLP and TCB processes by customers
January 2019
Asian Production Transfer Has Reduced Break Even Revenue Levels and Improved Cash Flow Generation
Asian Production Has Significantly Expanded
Leading to Lower Fixed European + NA Headcount
And Reduced Break Even Revenue Levels
Improved Cash Generation
741
502
802 1,222
1,543
1,724
0
400
800
1,200
1,600
2,000
2011 2017
Europe/NA Fixed HC Asia Fixed HC
270
209
0
50
100
150
200
250
300
2011 2017
€ millionsHeadcountShipments
(32.3%)
(22.6%)
-
289 396
1,301
396
1,590
43%
99%
0
400
800
1,200
1,600
2,000
2010 2017
China Other Asian % Direct
49
168
183
107
0
20
40
60
80
100
120
140
160
180
2011 2017
Total Cash Flow from Operations
Cash Conversion Cycle
€ millions
Cash Conversion
Cycle Days
33January 2019
Materials Cost Reduction Is Also a Key Priority
• 80% of material now purchased in Asia
• Asian supply chain expansion:
• Enhances revenue scalability (+/-)
• Limits capex and inventory investment
• Reduces personnel, transport and logistic cost
Supply Chain Actions
• Redesign products for common parts, platforms
• Increase standardization
• Lower unit cost, design and maintenance hours
• Shorten cycle times
Development Actions
53-57% Thru
Cycle Gross
Margin
• Management reviews progress weekly component by component
Material costs are largest single cost = ~40% of revenue
34January 2019
Workforce Has Become More Asia Centric, Scalable and Flexible
1,489 1,489 1,549
1,724 1,754 1,754 1,738 1,688
60%64%
67%
71% 71% 72% 72% 72%
40%36%
33%
29% 29% 28% 28% 28%25%
35%
45%
55%
65%
75%
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2,000
2014 2015 2016 2017 Q1-18 Q2-18 Q3-18 Q4-18E
Headcount
Europe/NA Fixed HC Asia Fixed HC Asia % Europe/NA %
Fixed Headcount
Total Headcount
• Asia now represents 72% of total fixed
headcount, up from 57% in 2013
• European and NA fixed headcount continues
to decline:
• -36.0% since 2011
• -12.2% vs. 2015
• Scalability aided by Asian temp workers
• Aligning overhead with 2018 market
conditions:
• 16% headcount reduction estimated by
year end vs. Q2-18
• Mostly temps (269 or 78% reduction)
591 540 508 502 500 495 483 474
898 949 1,041 1,222 1,254 1,259 1,255 1,214
143 50 120
316 383 343 176
74 1,632
1,5391,669
2,0402,137 2,097
1,9141,762
0.0%
2.0%
4.0%
6.0%
8.0%
10.0%
12.0%
14.0%
16.0%
18.0%
20.0%
0
500
1,000
1,500
2,000
2,500
2014 2015 2016 2017 Q1-18 Q2-18 Q3-18 Q4-18E
Tem
p %
of
Tota
l
Headcount
Europe/NA Fixed HC Asia Fixed HC Temporary HC Temp % of Total
35January 2019
Besi’s Asian Expansion Supports Future Growth
36
Units Shipped Gross Margin
82 99
625483
68220
236
482
423
4541,434
1,738
0
400
800
1,200
1,600
2,000
2013 Q3-2018
Fixed Headcount by Country
Other Asia Europe/NA Singapore China Malaysia
+7.3%
+104%
+224%
-22.7%
33139
289173
633
675
1,301
769
48.8%
51.0%
57.1% 56.9%
45%
47%
49%
51%
53%
55%
57%
59%
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2015 2016 2017 2018 YTD
Asian Production Trends
Chinese Shipments Malaysian Shipments Total Gross Margin
January 2019
Besi Strategic CSR Objectives
37
CSR Achievements 2017
Improvement in KPI metrics for supply chain activities
Conducted surveys:
Company wide employee engagement
Customer satisfaction
First time participation in:
Carbon Disclosure Project
Transparency Benchmark by Dutch Ministry of Economic
Affairs
CSR Objectives
Safeguard safe and healthy working
conditions Maintain best practices
environmental and ethical behavior
Reduce environmental
impact of products and operations
Promote employee
talent, training and diversity
Conserve natural
resources
Develop sustainable
supply chain. Minimize impact of conflict
materials
Reduce packaging,
waste, transportation
& energy
Responsible tax practices
in all jurisdictions
✔
✔
✔
✔
✔
✔
✔
January 2019
IV. FINANCIAL REVIEW AND SUMMARY
38January 2019
€ 161.1
€ 116.7
29.3%
25.1%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0
20
40
60
80
100
120
140
160
Q2-18 Q3-18
Net
marg
in %
Revenue (
euro
mill
ions)
Revenue Net Margin
Gross Margin
OPEX
Headcount
Effective Tax Rate
€ 439.5 € 432.7
29.5%26.2%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0
40
80
120
160
200
240
280
320
360
400
440
480
YTD-17 YTD-18
Net
marg
in %
Revenue (
euro
mill
ions)
Revenue Net Margin
Gross Margin
OPEX (a)
Headcount
Effective Tax Rate
-119
+5.2%
- 0.5 points
-183
+ 2.0 points
-8.5%
+ 1.5 points
Solid YTD-18 Performance Despite Softening Market Conditions. Margins Stay at Elevated Levels
39
12.9% 14.9%
2,097 1,914
€ 31.8 MM € 29.1 MM
56.5% 58.0%
Q3-18/Q2-18
€ 47.2
YTD-18/YTD-17
€ 113.5
€ 129.6
13.9% 14.5%
2,033 1,914
€ 95.0 MM € 99.9 MM
57.4% 56.9%
-1.5%
- 3.3 points
€ 29.3
+ 0.6 points
-27.6%
- 4.2 points
(a) Excluding variable comp, OPEX was € 84.1 MM in YTD 2018, an increase of 1% vs. € 83.4 MM in YTD 2017
January 2019
Liquidity Trends
Cash flow generation significantly improved. Has
supported shareholder friendly capital allocation:
• Total cash of € 443.5 million & net cash of € 160.1 million as
of Q3-18
• € 196.5 million of dividends and share repurchases in YTD18
• New € 75 million share buy back program in Q3-18
€ 300 million total Convertible Note issuance provides solid
base to fund growth opportunities:
• 1.33% blended coupon
• 6.0 year blended average maturity
• Minimal operating restrictions
89.6
135.3
157.8
304.8
527.8
571.0
395.5
443.5
71.0
118.0 136.5
168.1
247.6
290.1
110.2
160.1
0
100
200
300
400
500
600
2013 2014 2015 2016 2017 Q1-18 Q2-18 Q3-18
eu
ro in
mill
ion
s
Cash and Deposits Net Cash
40
€ 174.0 MM
Dividend
2017
January 2019
Currency Exposure Trends
41
Currency Exposure (2015) Forex Financial Impact
• USD revenue mix % increasing as customer base expands in Asia and US
• Cost exposure shifting to Asia:• Asian costs grew to 49% of 2017 total from 30% in 2013• EUR and CHF should continue to decline as % total cost• Production transfer increases importance of MYR, CNY and SGD
Revenue Expenses
2015 2016 20172017 ∆
vs. €**2015* 2016 2017
2017 ∆
vs. €**
Euro 29% 25% 18% 30% 26% 21%
US dollar 70% 74% 82% 5% 5% 9%
Swiss franc - - - 23% 21% 19%
Malaysian ringgit - - - 28% 30% 31%
Chinese renminbi - - - 7% 11% 13%
Singapore dollar - - - 4% 4% 5%
Other 1% 1% - 3% 3% 2%
Total 100% 100% 100% 100% 100% 100%
* Excludes restructuring benefit, net in 2015.
** Currency variance in 2017 based on average forex rates vs. the euro
January 2019
Operating Expenses
€ 29.1
Q3-18 Q4-18
2017 2018
Gross Margin
57.1%
56%
-
57%
Guidance Q4-18 and FY 2018
42
Q3-18 Q4-18
Gross Margin
58.0%54%
-
56%
Revenue
Q3-18 Q4-18
€ 116.7 -20%
-
-25%
Revenue
2017 2018
€ 592.811%
-
12%
Operating Expenses
€129.2
2017 2018
Q4-18E/Q3-18 2018E/2017*
* Full year assuming mid point of Q4-18 guidance
Approx.
EqualApprox.
Equal
January 2019
Summary
43
Assembly market ever more critical
step in semiconductor
value chain
Successful Asian production
expansion has been a game
changer
Long term secular trends
drive continued advanced packaging
growth
Tech leadership, scalability and
cycle times have led to benchmark financial returns
Disciplined strategic focus has created an industry leader
Attractive capital allocation policy
rewards shareholders
Market presence has grown via
key IDM customers and supply chains
January 2019
V. APPENDIX
44January 2019
Quarterly Revenue/Gross Margin Trends
110
170159
153155
161
117
90
55.7%
57.3%
58.7%
56.3% 56.5% 56.5%
58.0%
55.0%
45.0%
50.0%
55.0%
60.0%
65.0%
70.0%
0
20
40
60
80
100
120
140
160
180
200
Q1-17 Q2-17 Q3-17 Q4-17 Q1-18 Q2-18 Q3-18 Q4-18*
Gro
ss M
arg
in %
eu
ro in
mill
ion
s
Revenue Gross Margin
* Midpoint of guidance: Revenue -20%-25% vs. Q3-18, Gross Margin 54-56%.
45January 2019
206
166 168 164
215
140132
2.2
0.8
1.0 1.0
1.3
0.5
0.9
0
50
100
150
200
250
0.0
0.3
0.5
0.8
1.0
1.3
1.5
1.8
2.0
2.3
2.5
Mar 17 Jun 17 Sep 17 Dec 17 Mar 18 Jun 18 (a) Sep 18
Besi Backlog Besi Book to Bill
Book to Bill Ratio Backlog (euro millions)
2017-2018 Quarterly Backlog and Book to Bill Trends
46
(a) Includes € 28 million of order cancellations in Q2-18.
January 2019
Revenue and Gross Margin Cycles Since 2006
47
191
351
379
593
526
164
302
424
56.6%
34.1%
39.5%
51.1%
0.0%
10.0%
20.0%
30.0%
40.0%
50.0%
60.0%
0
100
200
300
400
500
600
700
2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018E*
Revenue Gross Margin
euro millions
4 year
averages
* Assumes midpoint of Q4-18 guidance.
-12.9%
-7.8%
-6.9%
-11.3%
526
526
January 2019
Base Line Operating Expense Trends
48
25.6 29.7
27.1 31.2 31.7 30.7
26.2
4.9
4.4
3.3
3.0
7.4
0.9
2.9
30.5
34.1
30.4
34.2
39.1
31.6 29.1
0
5
10
15
20
25
30
35
40
45
Q1-17 Q2-17 Q3-17 Q4-17 Q1-18 Q2-18 Q3-18
Base Opex Other Opex
Baseline Opex 25,6 29,7 27,1 31,2 31,7 30,7 26,2
As % of Revenue 23,2% 17,5% 17,0% 20,4% 20,5% 19,1% 22,5%
Other Operating Expenses
Capitalization of R&D (1,9) (1,8) (1,2) (1,8) (2,6) (3,4) (2,7)
Amortization of R&D 2,0 1,9 1,9 2,1 2,1 2,1 2,4
Capitalization & Amortization , net 0,1 0,2 0,8 0,3 (0,5) (1,3) (0,3)
Variable Pay (a) 4,4 4,0 3,2 3,9 9,5 3,3 2,7
Restructuring cost/(benefit) - - - - - 0,1 0,4
Forex (b) and other 0,4 0,2 (0,7) (1,2) (1,6) (1,2) 0,1
Subtotal 4,9 4,4 3,3 3,0 7,4 0,9 2,9
Total Opex 30,5 34,1 30,4 34,2 39,1 31,6 29,1
As % of Revenue 27,7% 20,1% 19,1% 22,3% 25,2% 19,6% 24,9%
(a) Includes both short term and long term incentive comp.
(b) Year over year variance per quarter.
January 2019
Net Income Trends
49
24.3
52.4 52.9
43.6
37.1
47.2
26.2
4.8
4.7 3.7
4.3
10.0
3.8
3.1
29.1
57.1 56.6
47.9 47.1
51.0
29.3
22.0%
30.8%
33.2%
28.4%
23.9%
29.3%
25.1%
0%
10%
20%
30%
40%
50%
60%
0
10
20
30
40
50
60
Q1-17 Q2-17 Q3-17 Q4-17 Q1-18 Q2-18 Q3-18
euro
in m
illio
ns
Net Income Variable Compensation (a) Net Margin
(a) Includes variable compensation from both cost of goods sold and operating expenses.
January 2019
Cash Generation Trends
50
18.1
73.3
86.5
98.7
168.2
127.5
7.1%
19.3%
24.8%
26.3%
28.4%29.5%
0
20
40
60
80
100
120
140
160
180
2013 2014 2015 2016 2017 2018 YTD
% of Revenueeuro millions
Total Cash Flow from Operations As % of Revenue
January 2019
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