View
224
Download
0
Category
Preview:
Citation preview
FUJITSU MICROELECTRONICS
IC PACKAGEIC PACKAGE
For further information please contact:
North and South AmericaFUJITSU MICROELECTRONICS AMERICA, INC.1250 E. Arques Avenue, M/S 333Sunnyvale, CA 94085-5401, U.S.A.Tel: +1-408-737-5600 Fax: +1-408-737-5999http://www.fma.fujitsu.com/
EuropeFUJITSU MICROELECTRONICS EUROPE GmbHPittlerstrasse 47, 63225 Langen,GermanyTel: +49-6103-690-0 Fax: +49-6103-690-122http://emea.fujitsu.com/microelectronics/
KoreaFUJITSU MICROELECTRONICS KOREA LTD.206 KOSMO TOWER, 1002 Daechi-Dong,Kangnam-Gu,Seoul 135-280 KoreaTel: +82-2-3484-7100 Fax: +82-2-3484-7111http://www.fmk.fujitsu.com/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering.The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein.The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
2002-2008 FUJITSU MICROELECTRONICS LIMITED Printed in JapanAD81-00001-12Ea April, 2004Edited: Strategic Business Development Dept.
Asia PacificFUJITSU MICROELECTRONICS ASIA PTE LTD.151 Lorong Chuan, #05-08 New Tech ParkSingapore 556741Tel : +65-6281-0770 Fax : +65-6281-0220http://www.fujitsu.com/sg/services/micro/semiconductor/
FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.Rm. 3102, Bund Center, No.222 Yan An Road (E),Shanghai 200002, ChinaTel : +86-21-6335-1560 Fax : +86-21-6335-1605http://cn.fujitsu.com/fmc
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.10/F., World Commerce Centre, 11 Canton RoadTsimshatsui, KowloonHong KongTel : +852-2377-0226 Fax : +852-2376-3269http://cn.fujitsu.com/fmc/tw
FUJITSU MICROELECTRONICS LIMITEDShinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387http://jp.fujitsu.com/fml/en/
Bottom View
Top View
Bottom View
Top View
LSI Chip Heat Spreader PC Board
Au wire Potting ResinSolder Ball
LSI Chip
ResinAu Wire
PC Board
Solder Ball
2
CONTENTS
Technologies of the Future Available NowSupported by LSI technologies, the markets for personal computers, cellular telephones, mobile information terminals and other electronic equipment continue to experience sharp demand growth. Continuing into the future, electronic equipment is expected to become thinner and more compact. LSI packages allowing high-density mounting, such as chip size packages or chip scale packages (CSPs) and ball grid arrays (BGAs), have been developed and become common throughout the market.As packages grow ever more compact, Fujitsu continues to lead the industry in CSPs by beginning mass-production of SON packages that incorporate 16Mbit flash memories. Further efforts to achieve more compact, high-density mounting include the mass production of FBGAs, CSOPs, MCPs and various stacked
MCPs. Fujitsu also mass-produces multipin packages, chiefly PBGAs, EBGAs and LGAs. We continue to break new ground in the field of electronics, devoting tireless efforts to the development of packages for a wide variety of applications, including next-generation and custom packages.■ Multipin packagesQFP, PBGA, EBGA, E-BGA, TAB-BGA, �FC-BGA, LGA■ Thin, compact packagesSSOP, TQFP, BCC, FBGA, CSOP, S-MCP, Super CSP■ Packages for card modulesTSOP, TQFP■ Packages featuring high power dissipation
or for large chipsHQFP, PBGA, EBGA, TAB-BGA, FC-BGA, LGA
Package Lineup
Package Overview and Cross -section Structure
3
Bottom View
Top View
Features
● Stacked MCP (Multi Chip Package) stacks 2 chips in one
package to correspond to increased capacities of memory.
● One package can have the functions of two chips because
chips are stacked. Corresponds to high performance
systems and smaller mounting area.
Resin LSI Chip-2 Au WireLSI Chip-1
AdhesiveSolder Ball
Polyimide Tape
Stacked Multi Chip Package
S-MCP
Features
● High density mounting available
● Superior electrical characteristics from multilayre structure
● Low thermal resistance, and superior cost performance to
ceramic PGA
Enhanced Ball Grid Array
EBGA
Features
● High cost performance by the sealing of plastic resin
● Excellent application to high pin count LSIs
Plastic Ball Grid Array
PBGA
Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES
7
5
3
4
8
8
9
10
11
11
19
9
12
12
13
13
14
14
15
15
16
16
17
17
PBGA
FBGA
HQFP
S-MCP
TAB-BGA
BCC
Flat type
Tape carrier
Dual lead
MCP
Quad lead
Dual lead
BGA
C-lead type
Matrix type
Bumped type
Surface mounted type
Dual lead
Quad lead
LGA
SOP
SSOP
TSOP
EBGA
FC-BGA
CSOP
CSOP
QFP
LQFP
TQFP
HQFP
CSOP
S-MCP
PBGA
TAB-BGA
FDH-BGA
FBGA
FC-BGA
LGA
FLGA
BCC
DTP
Super CSP
EBGAPackage
A typical package is introduced with package overview and a cross-sectional structure figure.
Bottom View
Top View
Die Pad LSI ChipAu Wire
Outer Lead Resin
Top View
Top View
Bottom View
Bottom View
Top View
Top View
Bottom View
5
Features
● With the same packaging capabilities as those of SSOP,
this very small package provides space for COB
● 16-pin Bump chip carrier is about 40% smaller in packaging
area and about 70% smaller in packaging capacity than
conventional SSOP
● This plated resin bump package introduces selective etching
technology to enable reductions in both size and cost
Bump chip carrier
BCC
Features
● Chip-size package
● High price -performance using TSOP packaging technology
● Packaging strength and reliability equal to or better than
TOSP
● Same packaging technology as TSOP
● 40% packaging density max. as compared to TOSP
C-lead Small Outline Package
CSOP
Features
● Excellent thermal dissipation
● The same size as current packages (adopting high standoff
configuration)
QFP with Heat Sink
HQFP-HS (current)
Features
● Excellent mulit-pin as signment applicability
● Excellent thiickness-reduction applicability
● High thermal dissipation
● Excellent narrow-pitch and size-reduction applicability
● Chip size reduction using narrow PAD
TAB-Ball Grid Array
TAB-BGA
Features
● Excellent ultra-multi-pin assignment and high-packaging
density applicability
● Superior electrical characteristics from multilayer structure of
board with low dielectric constand and Low-resistivity wiring
● Low thermal resistance due to heat dissipation from
back of chip
Flip chip-Ball Grid Array
FC-BGA
Features
● Low-cost assembly using existing facilities
● Fan-in and fan-out types
● Fine pitch using Polymide (PI) tape
Fine pitch Ball Grid Array
Package Overview and Cross -section Structure INTEGRATED CIRCUIT PACKAGES
4
LSI ChipHeat Spreader
Polyimide Tape Encapsulation Solder Ball
Stiffener
Bottom View
Top View
FBGA
Encapsulation
Thermal Compound
LSI Chip
Chip Capacitor
Glass Ceramic (thick-film)
Lid
Area Bump
Au WireLSI Chip
Resin
Die attach materialResin Bump
Adhesive Tape
Heat Spreader
Au Wire
Lead FrameResin
LSI ChipResin
Solder BallAdhesive LSI ChipPCB (2Layer)
Au Wire
Surface mount device package
Su
rfa
ce m
ou
nt
de
vice
pa
cka
ge
Lead Pitch Pin CountNominal Dimensions
EIAJ TYPE
1.27mm(50mil)
600mil/VI
450mil/IV
375mil/III
300mil/II
44
28
16 24 28
8 14 16 20 24
80.80mm : 30-PIN 1.00mm : 38-PIN 1.27mm : 8-PIN
76
SOP(Small Outline L-leaded Package)
CSOP(C-lead Small Outline Package)
10×10
Pin Count 48
0.4
Body Size(mm)
Lead Pitch(mm)
Pin Count 8 16 20 24 30 34
0.8 0.65 0.65 0.65 0.65 0.65
1.45 1.45 1.45 1.45 1.45 1.45
Lead Pitch(mm)
Mounting Height(mm)
Pin Count 16 20 24
0.65 0.65 0.65
1.10 1.10
Lead Pitch(mm)
Mounting Height(mm)
1.101.20
8×18.4 10×18.4 12×18.4 12×12.4 14×18.4 12×12.4
Pin Count 32 40 48 48 56 56
0.50 0.50 0.50 0.50 0.50 0.40
1.20 1.20 1.20 1.20 1.20 1.20
Body Size(mm)
Lead Pitch(mm)
Mounting Height(mm)
98
SSOP/TSSOP(Shrink Small Outline L-leaded Package) /(Thin Shrink Small Outline L-leaded Package)
TSOP TYPE I(Thin Small Outline L-leaded Package)
14×14 16×16 20×20 24×24 28×28 7×7 10×10 12×12 14×14 16×16 20×20 24×24 28×28 12×12 14×14 7×7
Pin Count 120 144 176 216 256 48 64 80 100 120 144 176 208 64 80 32
0.40 0.50 0.65 0.80
TQFP(Thin Quad Flat L-leaded Package)
Body Size(mm)
Lead Pitch(mm)
Body Size(mm) 10×10 12×12 12×12 14×14 14×14
Pin Count 64 80 100 100 120
0.50 0.50 0.40 0.50 0.40
1.20
Lead Pitch(mm)
Mounting Height(mm)
28×28 32×32 20×20 24×24 28×28 32×32 40×40 14×20 28×28 10×10 12×12 14×20 28×28 14×20
Pin Count 256 296 120 144 176 208 240 304 100 144 160 44 48 48
0.40 0.50 0.65 0.80 1.00
Body Size(mm)
Lead Pitch(mm)
80 64120
1110
QFP(Quad Flat-leaded Package)
LQFP(Low-profile Quad Flat L-leaded Package)
PBGA (Over mold Type)(Plastic Ball Grid Array)
27×27 35×35 35×35
Ball Count 256 352 420
1.27 1.27 1.27
35×35×3.1 40×40×3.1 35×35×3.1 40×40×3.1 40×40×2.9 45×45×3.1 40×40×2.9 40×40×2.9
Ball Count 352 416 420 576 660 672 792 896
1.27 1.27 1.27 1.27 1.0 1.27 1.0 1.0
Body Size(mm)
Ball Pitch(mm)
Body Size(mm)
Ball Pitch(mm)
Stacked MCP(Stacked Multi Chip Package)
3.51×7.05 3.51×7.05 3.51×4.70 3.51×4.70
Ball Count 48 48 48 48
Package Type BGA LGA BGA LGA
0.5 0.5 0.5 0.5
Body Size(mm)
Ball Pitch(mm)
7×7.2×1.2 7×9×1.2 9×9×1.4 9×9×1.34 8×11×1.4 7×12×1.2 7×11×1.2 8×11.6×1.4 8×11.6×1.34 10.4×10.8×1.3 11×12×1.34 10×9×1.4 9×10×1.4 9×12×1.4
Ball Count 56 59 61 65 69 71 71 73 73 85 101 103 107 115
Stack 2 2 2 2 2 2 2 2 2 3 2 4 3 4 3 4
0.80
Body Size(mm)
Ball Pitch(mm)
1312
Super CSP(Super Chip Size Package)
EBGA (Enhanced BGA)(Plastic Ball Grid Array)
TAB-BGA(Tape Automated Bonding Ball Grid Array)
27×27 27×27 35×35 35×35 40×40
Ball Count 256* 264* 352 436 576*
1.27 1.0 1.27 1.0 1.27
Body Size(mm)
Ball Pitch(mm)
FC-BGA(Flip Chip Ball Grid Array)
42.5×42.5×4.6 45.0×45.0×4.6 47.5×47.5×4.6
Ball Count 1681 1849 2116
1.00 1.00 1.00
Body Size(mm)
Ball Pitch(mm)
21×21×1.4 23×23×1.4 27×27×1.3 31×31×1.3 35×35×1.3 40×40×1.4 40×40×1.3 40×40×1.3
Ball Count 304 352 400 480 560 576 660 720
0.8 0.8 1.0 1.0 1.0 1.27 1.0 1.0
Body Size(mm)
Ball Pitch(mm)
6×8×1.2 6×8×1.2 6×9×1.2 8×9×1.2 7×14.5×1.2 8×9×1.2 7×11×1.2 10×11×1.2 9×9×1.2 7×11×1.2 8×11×1.2 9×12×1.2 8×11×1.2 9.5×14.5×1.2
Ball Count 48 48 48 48 52 60 63 63 64 80 80 80 84 96
Package Type FBGA PFBGA FBGA FBGA FBGA PFBGA FBGA FBGA PFBGA PFBGA PFBGA PFBGA PFBGA FBGA
0.80
Body Size(mm)
Ball Pitch(mm)
8×8×1.13 10×10×1.33 12×12×1.3 14×14×1.33
Ball Count 112 144 224 272 144 176 240 304 360 368 480
Package Type PFBGA PFBGA PFBGA PFBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
0.80 0.50
Body Size(mm)
Ball Pitch(mm)
42.5×42.5×4.7 45.0×45.5×4.7 47.5×47.5×4.7
Ball Count 1089 1225 1369
1.27 1.27 1.27
Body Size(mm)
Ball Pitch(mm)
*: Under planning
1514
FDH-BGA(Face Down Heat spreader BGA)
FBGA/PFBGA(Fine-Pitch Ball Grid Array)/(Plastic Fine-Pitch Ball Grid Array)
LGA(Land Grid Array)
42.50
Land Count 889
1.27
Body Size(mm)
Land Pitch(mm)
9.0×9.0 4.0×5.5 7.0×7.0 5.0×5.0 7.0×7.0 7.0×7.0 11.0×11.011.0×11.012.0×12.014.3×14.316.0×16.0
Land Count 80 20 64 64 80 120 144 176 208 224 288
0.8 0.65 0.65 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65
Body Size(mm)
Land Pitch(mm)
SLIM DTP(Slim Dual Tape-carrier Package)
Pin count 44 233 255 463
0.8 0.1 0.16 0.06Lead Pitch
(mm)
3.4×4.55×0.8 4.2×4.55×0.8 3.4×3.6×0.8 3.4×3.6×0.6 4.0×4.0×0.8 5.0×5.0×0.8 7.0×7.0×0.8 9.0×9.0×0.8 7.0×7.0×0.57.0×7.0×0.8 8.0×8.0×0.5 9.0×9.0×0.810.0×10.0×0.8
Pin Count 16 16 20 20 24 32 48 64 64 64 80 92 100
0.65 0.65 0.5 0.5 0.5 0.5 0.5 0.5 0.65 0.65 0.65 0.65 0.65
Body Size(mm)
Lead Pitch(mm)
1716
FLGA(Fine pitch Land Grid Array)
BCC(Bump Chip Carrier)
24
HQFP(QFP with Heat Sink)
Pin count 160 208 240 256 304
Heat spreader
0.65 0.50 0.50 0.40 0.50
Heat SpreaderHeat SpreaderHeat Spreader Heat Spreader Heat Spreader
Lead Pitch(mm)
Low thermal resistance package
Lo
w t
he
rma
l re
sist
an
ce p
ack
ag
e
1918
Recommended