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eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 1
EPC2033
EPC2033 – Enhancement Mode Power Transistor
VDSS , 150 VRDS(on) , 7 mID , 48 A
Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment leveraging the infrastructure that has been developed over the last 60 years. GaN’s exceptionally high electron mobility and low temperature coefficient allows very low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG and zero QRR. The end result is a device that can handle tasks where very high switching frequency, and low on-time are beneficial as well as those where on-state losses dominate.
EPC2033 eGaN® FETs are supplied only inpassivated die form with solder bumps. Die Size: 4.6 mm x 2.6 mm
• High Frequency DC-DC Conversion• Motor Drive• Industrial Automation• Class-D Audio
EFFICIENT POWER CONVERSION
Maximum Ratings
VDS Drain-to-Source Voltage (Continuous) 150 V
IDContinuous (TA = 25˚C, RθJA = 4˚C/W) 48
APulsed (25˚C, TPULSE = 300 µs) 260
VGSGate-to-Source Voltage 6
VGate-to-Source Voltage -4
TJ Operating Temperature -40 to 150˚C
TSTG Storage Temperature -40 to 150
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Static Characteristics (TJ= 25˚C unless otherwise stated)
BVDSS Drain-to-Source Voltage VGS = 0 V, ID = 0.7 mA 150 V
IDSS Drain Source Leakage VDS = 120 V, VGS = 0 V 0.1 0.5 mA
mAIGSS
Gate-to-Source Forward Leakage VGS = 5 V 1 8 mA
Gate-to-Source Reverse Leakage VGS = -4 V 0.1 0.5
VGS(TH) Gate Threshold Voltage VDS = VGS, ID = 9 mA 0.8 1.4 2.5
7
V
RDS(on) Drain-to-Source On Resistance VGS = 5 V, ID = 25 A 5 mΩ
VSD Source-to-Drain Forward Voltage VIS = 0.5 A, VGS = 0 V 1.9
Thermal Characteristics
RθJC Thermal Resistance, Junction to Case 0.45 ˚C/W
RθJB Thermal Resistance, Junction to Board 3.9 ˚C/W
RθJA Thermal Resistance, Junction to Ambient (Note 1) 45 ˚C/W
TYP UNIT
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board. See http://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details.
All measurements were done with substrate shorted to source.
HAL
www.epc-co.com/epc/Products/eGaNFETs/EPC2033.aspx
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 2
EPC2033
0
50
100
150
200
250
0 1 2 3 4 5 6
I D-D
rain
Cur
rent
(A)
VDS - Drain-to-Source Voltage (V)
VGS = 5 V
VGS = 4 V
VGS = 3 V
VGS = 2 V
VGS = 5 V
VGS = 4 V
VGS = 3 V
VGS = 2 V
250
200
150
100
50
00 1 2 3 4 5 6
I D –
Dra
in Cu
rrent
(A)
Figure 1: Typical Output Characteristics at 25°C
VDS – Drain-to-Source Voltage (V)
VGS = 5 VVGS = 4 VVGS = 3 VVGS = 2 V
20
15
10
5
03.0 3.5 4.0 4.5 5.0
R DS(o
n) –
Dra
in-to
-Sou
rce R
esist
ance
(mΩ)
VGS – Gate-to-Source Voltage (V)
ID = 10 AID = 25 AID = 50 AID = 100 A
Figure 3: RDS(on) vs. VGS for Various Drain Currents
I D –
Dra
in Cu
rrent
(A)
VGS – Gate-to-Source Voltage (V) 1.00.5 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 2: Transfer Characteristics
25˚C125˚C
VDS = 3 V
25˚C125˚C
VDS = 6 V
250
200
150
100
50
0
3.0 3.5 4.0 4.5 5.0
Figure 4: RDS(on) vs. VGS for Various Temperatures
R DS(
on) –
Dra
in-to
-Sou
rce R
esist
ance
(mΩ)
VGS – Gate-to-Source Voltage (V)
25˚C125˚C
VDS = 3 V
25˚C125˚C
ID = 25 A
20
15
10
5
0
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CISS Input Capacitance
pFCOSS Output Capacitance
RG Gate Resistance Ω
COSS(ER)E�ective Output Capacitance,
Energy Related (Note 2)
COSS(TR)E�ective Output Capacitance,
Time Related (Note 3)
nCQGD Gate-to-Drain Charge
QG(TH) Gate Charge at Threshold
Source-to-Drain Recovery Charge
QGS Gate-to-Source Charge
QOSS Output Charge
QRR
1400
720
QG Total Gate Charge 15
135
Note 2: COSS(ER) is a �xed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% BVDSS.Note 3: COSS(TR) is a �xed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% BVDSS.
VDS = 120
VDS = 0 to 120 V, VGS = 0 V
V, VGS = 0 V
VDS = 120 V, VGS = 5 V, ID = 25 A
VDS = 120 V, ID = 25 A
VDS = 120 V, V = 0 VGS
CRSS Reverse Transfer Capacitance
1160
6
480
670
900
0.5
12
3.8
3.2
2.8
90
0
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 3
EPC2033
All measurements were done with substrate shortened to source. TJ= 25°C unless otherwise stated.
Capa
citan
ce (p
F)
1000
100
10
10 50 100 150
Figure 5b: Capacitance (Log Scale)
VDS – Drain-to-Source Voltage (V)
COSS = CGD + CSD
CISS = CGD + CGS
CRSS = CGD
0.50 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
I SD –
Sour
ce-to
-Dra
in Cu
rrent
(A)
VSD – Source-to-Drain Voltage (V)
Figure 7: Reverse Drain-Source Characteristics150
100
50
0
25˚C125˚C
VDS = 3 V
25˚C125˚C
VGS = 0 V
Figure 9: Normalized Threshold Voltage vs. Temperature
Norm
alize
d Th
resh
old
Volta
ge
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.600 25 50 75 100 125 150
TJ – Junction Temperature (°C)
ID = 11 mAID = 8 mA
Capa
citan
ce (p
F)
0 50 100 150
Figure 5a: Capacitance (Linear Scale)
VDS – Drain-to-Source Voltage (V)
2000
1500
1000
500
0
COSS = CGD + CSD
CISS = CGD + CGS
CRSS = CGD
Figure 6: Gate Charge
V GS
– Ga
te-to
-Sou
rce V
olta
ge (V
)
5
4
3
2
1
00 10 128642
QG – Gate Charge (nC)
ID = 25 AVDS = 120 V
Figure 8: Normalized On-State Resistance vs. Temperature
ID = 30 AVGS = 5 V
Norm
alize
d On
-Sta
te R
esist
ance
RDS
(on)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.60 25 50 75 100 125 150
TJ – Junction Temperature (°C)
ID = 25 AVGS = 5 V
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 4
EPC2033
Figure 12: Transient Thermal Response Curves
0.1
1
10
100
0.1 1 10 100
I D – D
rain
Curre
nt (A
)
VDS - Drain-Source Voltage (V)
Limited by RDS(on)
Pulse Width 100 ms
10 ms 1 ms
100 µs
Figure 11: Safe Operating Area
TJ = Max Rated, TC = +25°C, Single Pulse
I G –
Gate
Curre
nt (m
A)
VGS – Gate-to-Source Voltage (V)
Figure 10: Gate Leakage Current
25˚C125˚C
40
30
20
10
00 1 2 3 4 5 6
tp, Rectangular Pulse Duration, seconds
Z θJC
, Nor
mal
ized T
herm
al Im
peda
nce
0.5
0.050.02
Single Pulse
0.01
0.1
Duty Cycle:
Junction-to-Case
PDM
t1
t2
10-510-6 10-4 10-3 10-2 10-1 1
1
0.1
0.01
0.001
0.0001
Notes:Duty Factor: D = t1/t2
Peak TJ = PDM x ZθJC x RθJC + TC
tp, Rectangular Pulse Duration, seconds
Z θJB
, Nor
mal
ized T
herm
al Im
peda
nce
0.5
0.1
0.020.05
Single Pulse
0.01
Duty Cycle:
Junction-to-Board
PDM
t1
t2
10-5 10-4 10-3 10-2 10-1 1
1
0.1
0.01
0.001
0.0001
Notes:Duty Factor: D = t1/t2
Peak TJ = PDM x ZθJB x RθJB + TB
10+1
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 5
EPC2033
2033 YYYY
ZZZZ Die orientation dot
Gate Pad bump is under this corner
Part Number
Laser Marking
Part #Marking Line 1
Lot_Date CodeMarking Line 2
Lot_Date CodeMarking Line 3
EPC2033 2033 YYYY ZZZZ
DIE MARKINGS
TAPE AND REEL CONFIGURATION4mm pitch, 12mm wide tape on 7” reel
7” reel
a
d e f g
c
b
EPC2033 (note 1) Dimension (mm) target min max
a 12.00 11.70 12.30b 1.75 1.65 1.85
c (see note) 5.50 5.45 5.55 d 4.00 3.90 4.10 e 4.00 3.90 4.10
f (see note) 2.00 1.95 2.05 g 1.50 1.50 1.60
Note 1: MSL 1 (moisture sensitivity level 1) classi�ed according to IPC/JEDEC industry standard.Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket, not the pocket hole.
Dieorientation
dot
Gatesolder bump is
under thiscorner
Die is placed into pocketsolder bump side down
(face side down)
Loaded Tape Feed Direction
2033 Pads 1 and 2 are Gate;
Pads 5, 6, 7, 8, 9, 15, 16, 17, 18, 19 are Drain;
Pads 3, 4, 10, 11, 13, 14, 20, 21, 22, 23, 24 are Source;
Pad 12 is Substrate
DIE OUTLINESolder Bump View
Side View
DIM MIN Nominal MAX
A 4570 4600 4630B 2570 2600 2630c 1000 1000 1000d 500 500 500e 285 300 315f 332 369 406
510 t
yp
SEATING PLANE
79
0 typ
280+
/−28
B
A
cX4
e
e
155 10 20
d X4
f
1
166 11 212
177 12 22
188 13 233
199 14 244
Micrometers
eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2016 | | 6
EPC2033
Information subject to change without notice.
Revised December, 2016
Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others.
eGaN® is a registered trademark of Efficient Power Conversion Corporation.U.S. Patents 8,350,294; 8,404,508; 8,431,960; 8,436,398; 8,785,974; 8,890,168; 8,969,918; 8,853,749; 8,823,012
RECOMMENDEDLAND PATTERN (units in µm)
Pads 1 and 2 are Gate;
Pads 5, 6, 7, 8, 9, 15, 16, 17, 18, 19 are Drain;
Pads 3, 4, 10, 11, 13, 14, 20, 21, 22, 23, 24 are Source;
Pad 12 is Substrate
Land pattern is solder mask definedSolder mask opening is 330 µmIt is recommended to have on-Cu trace PCB vias
2600
4600
1000X4
300
300
500
X4330
155 10 201
166 11 212
177 12 22
188 13 233
199 14 244
RECOMMENDEDSTENCIL DRAWING (units in µm)
RECOMMENDEDSTENCIL DRAWING (units in µm)
Recommended stencil should be 4mil (100 µm) thick, must be laser cut, openings per drawing.
Additional assembly resources available at http://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx
Recommended stencil should be 4mil (100 µm) thick, must be laser cut, openings per drawing.
Additional assembly resources available at http://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx
2600
4600
1000X4
300
300
500
X4
330
2600
4600
1000300
300
500
300
350
Option 1 : Intended for use with SAC305 Type 4 solder.
Option 2 : Intended for use with SAC305 Type 3 solder.
Recommended