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Ele
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Electronic Packaging and
Manufacturing
An overview
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Concepts Covered:
Electronics Industry
What is Electronic Packaging
Levels of Packaging
Wafer Fabrication
What is Electronic Packaging?
Why is packaging important?
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Electronics Industry
Multi trillion dollar industry
Growing at 5-8% YoY
Growth very high for consumer electronics
Electronics influence the way we live
Possibilities turn into commodity products in a very short time span
Technological advancement and price erosion enable high growth
rate
http://www.makeinindia.com/article/-/v/india-s-electronics-sect-1
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Features of Electronic Industry
Technology driven business
Continuous price erosion
High growth rates
Large volumes in global markets
Short life cycles
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Major Electronic systems and markets
Computers and business equipment
Calculators, desktops, printers, photocopiers
Communication
Telephones. Fax, Modem
Automotive electronics
Engine control management, cruise control, power steering, safety features, sensors
Consumer electronics
TV, VCR, Audio, watches, games
Medical and industrial systems
High end, high power systems
Military electronics
Missiles, radars, fire control systems, communication mech14.weebly.com
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Tummala, 2001
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Integrated Circuits
Main element of an electronic product
A product also requires
Passive components
• resistors, capacitors, inductors
Electrical/Mechanical components
• Switches, connectors, cables, jumpers
Cooling components
Storage devices
Batteries / Power Supplies
Display components – LEDs, LCDs, Plasma display …
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What is Electronic Packaging?
X X
X
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What is Electronic Packaging?
Source: IET
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What is Electronic Packaging?
Service and art of providing a suitable
environment to the electronic product as
a whole to perform reliably over a period
of time.
No addition to functionality
Protection Communication
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Tummala, 2001
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Mechanical Design aspects of packaging
Connections
Manufacturing
Thermal Management
Maintenance
Shock and Vibration
Ergonomics
Environment
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Alternate definition: Electronic Packaging
Physical realization of an electronic systems based on:
• Design
• Materials (Metals, Plastics, Ceramics..)
• Choice of technology to implement design
• Electrical and thermal analysis
• Reliability analysis
• Much more
Packaging is the step after semiconductor design and
fabrication
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Why is packaging important?
Processor capability
64-bit processor
Billions of transistors
Challenges
Connection of a small chip
with so many I/Os over a
tiny area
Ensure that the transistors
do not overheat
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Why is packaging important?
Display capability
Retina HD display
LED-backlit, Multi-
Touch with IPS
technology
1334-by-750-pixel
resolution at 326 ppi
Challenges
Connect 326
conductor lines per
inch (13 per mm) for
display control and
additional ones for
touch sensing
On a minimal frame
around a large display
Ensuring nothing
breaks
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Why is packaging important?
Sensor capability
Touch ID
Barometer
Three-axis-gyro
Accelerometer
Proximity sensor
Ambient light
sensor
Challenges
Package highly complex
and miniaturized micro-
electro-mechanical
components
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Why is packaging important?
Camera capability
15 MP camera
Depth vision
1080p HD video
recording
Challenges
Connect to the
imaging CMOS chip
- 15 million pixels
each having 1.5μ x
1.5μ dimension
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Why is packaging important?
Connectivity
GSM/EDGE
UMTS/HSPA+
DC-HSDPA
CDMA model: CDMA
EVDO
LTE
802.11a/b/g/n/ac Wi-Fi
Bluetooth 4.0
NFC
GPS and GLONASS
Challenges
How do you integrate a
wide range of GHz
wireless antennas while
limiting crosstalk?
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Why is packaging important?
Physical Dimensions Challenges
How do you find
place for everything,
and ensure that
everything works
reliably ?
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Purpose of Packaging
Provide connection between device (IC)
and PCB and system
Signal/Power distribution to/from the
device (IC) and other components
Protect device from external
environment
Chemical, Mechanical Shock, Water,
etc.
Provide effective path to remove heat
Ensure package is reliable
All at lowest cost
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Levels of Packaging
Dally, 1990
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Formation of a wafer
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Czochralski Process
Named after Jan Czochralski
discovered the method in 1916
Molten Silicon (ultra pure) in a heated crucible
Dopant impurity atoms such as boron, phosphorus can be added to the molten intrinsic silicon in precise amounts
Seed crystal brought in contact with fused Si
rotated (for homogeneity) and pulled upwards
Crystal starts growing in the form of an ingot
thin wafers are chopped off
Source: WAFERPRO
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Source: Wikimedia Commons
https://www.youtube.com/watch?v=xftnhfa-Dmo
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Source: WAFERPRO
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Fundamentals revisited
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Conductors, Insulators and
Semiconductors
Conductivity depends on # of free electrons in outer shell
Al has 3 electrons in outer shell
R = ρL/A where r – resistivity depends on atomic structure
Al: 2.83 x 10-6 Ω-cm SiO2: ~ 1014 Ω-cm
Ag: 1.63 x 10-6 Ω-cm Al: ~ 1015 Ω-cm
SiO2 have covalent bonds resulting in no free electrons on the
outer shell
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Semiconductor - Silicon
Silicon
4 electrons on outer shell
Form covalent bonds with 4 neighbouring atoms
Electrons are not FREE charge carriers
Atomic structure is not perfect
Some electrons have sufficient energy to jump from valence to
conduction band
rSi – 1.56 x 105 Ω-cm (between conductors and insulators)
One in 2 x 1013 electrons may have sufficient energy to move to
conduction band (INTRINSIC CONDUCTION)
Source: https://www.electronics-tutorials.ws/diode/diode_1.html
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Extrinsic Semiconductor
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Resistivity of extrinsic semiconductor
Source: https://www.pveducation.org/ko/pvcdrom/general-properties-of-silicon mech14.weebly.com
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P-N junction
At the junction,
electrons and holes
combine to form a
depletion layer
The resultant
potential barrier
prevents flow of
charge carriers
across the junction
Source: https://www.electronics-tutorials.ws/diode/diode_1.html
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P-N junction diode
Zero Bias
Reverse Bias
Source: https://www.electronics-tutorials.ws/diode/diode_1.html
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P-N junction diode
Forward Bias I-V plot
Source: https://www.electronics-tutorials.ws/diode/diode_1.html
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Fabrication of a Diode
Source: All about Circuits
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