View
218
Download
0
Category
Preview:
Citation preview
8/7/2019 EDA360 the Way Forward Vision
1/32
The Way Forward for Electronic Design
As founder of an organization that is transforming the economics and technology of an
industry so that we can improve opportunity for millions, I am constantly watching what
others are doing. Cadence has a vision and model with the potential to transform the
economics and performance of the microprocessor industry and, by extension, devices
every consumer takes for granted. This document outlines a vision that bears watching.
Nicholas Negroponte, Founder and Chairman, One Laptop per Child
8/7/2019 EDA360 the Way Forward Vision
2/32
The changing basis o competition in some mainstream semiconductor markets will
punish frms that do not adapt to the new environment. EDA360 lays out a high-level
ramework, leveraging modularity and architectural innovation, or proftable adaptation
to this new wave o disruptive change.
Steven King, Founder, Innovo Strategies
Todays 1.5B connected consumers will balloon to 6B or more by 2015but those
consumers will join the global network in emerging markets, where actors like income,
literacy, and access to electrical power require a new set o breakthroughs in the
electronics industry. The EDA360 document issues a call to action or the semiconductor
industry to deliver these breakthroughs.
Yankee Groups Emily Green, author o Anywhere: How Global Connectivity is
Revolutionizing the Way We Do Business
Being able to design complete systems rom the ground up and deliver a total platorm
or system integration, applications development, and system validation represents the
uture o EDA. The EDA360 vision has the potential to allow semiconductor companies
to create powerul products that would enable consumer technology providers to deliver
a device platorm with an ecosystem o hardware, sotware, and services. That in itsel
could help tech companies be more competitive and proftable.
Tim Bajarin, President, Creative Strategies, Inc.
EDA360: ThE WAy ForWArD For ElEcTronic DEsign
capte 1: EDA idut Fu st t iteat ad Pftabt 1
capte 2: Appat-Dve stem reazat 8
capte 3: stwae-Awae sc reazat 16
capte 4: EDA360 Eabe s reazat 22
cADEncE V is ion - EDA360 - ThE WAy ForWArD For ElEcTronic DEs ign
8/7/2019 EDA360 the Way Forward Vision
3/32
IntrOduCtIOn a reVOlutIOn Interrupted?
Fom mobi os o ioim vics i cs, om ii cms o
moios, om -s o wo-w visios, o wo is s b icsi
soisic ii coic vics. a wo wio vics w
icocivb js 10 o 20 s o wo b iob o. t ssms
smicoco comis s is coics voio v o o ics
cioi oi, b v so ss coss o oi w w os
o css mo comi ow miios o os 30 s o.
Wi w coiz ms sc s IBM, I, Sms, a, So s s o
is coics voio, is imo o mmb is o iovio s b
mow b coic si omio (eda). t commci eda is ovis
sow, svics, ic o (Ip) m vc smicoco
ssm si ossib. Sv cs o, eda sow ws i vo
ws s o b w comis. Ov s 30 s, commci
eda is s bo vc i cici (IC) si cbiiis o comis
o sizs, ici ss v vo som o mos civ ocs i
m.
to, ssms smicoco comis oi isiv somio
so oo v bs-ow comis wi b imc. t eda is
ow ss cossos w i so ms c i o o coi s sccss,
i bsiss. Wio c, eda wi bcom m is
oi sboim, oo soios i o sov csom obms. as
s, ow ovi b coics voio wi com o ssi.
t s? a sq ooi o coo iovio, imiis
coibio b coics is o -bi ob coom.
t isiv somio w si o is o bo eda voi w si
oos. I is o bo w mooois. I is o bo cio vicio cisis, o
mov o coic ssm v (eSl) si, o o isss v omi
iscssios bo eda o . I is bo somi mc . I bis wi si om
si cio o iio i coic ssms is, ss i w ocs
o obii. tis izio, i , os w o eda360, w visio o w
eda is c bcom.
to so, owv, w ms s bc o mom o w vi
ss coics cosm.
Chapter 1:
EDA InDustry Focus shIFts to IntEgrAtIon
AnD ProFItAbIlIty
8/7/2019 EDA360 the Way Forward Vision
4/32
the neW COnSuMer eleCtrOnICS Market
eda ovis v o iv v o com-i si (Cad) ms
ii ms, b v o i o sccss ic v oosiio o
coo s. to o so, eda ovis ms s m imivs
coics comis ci, os comis iv v o i
csoms. e cosm ms s eda coo vom. Fo m,
m o ow-ow vics o b ivs s o owi si o
ow-ow IC si oos.
So w o coics cosms w? ti is vocios owi. as o
ow, mos v ms ic:
Mui,cocurrsofwaraicaios.Cosms w o m o
cs, wc movis, icios, is, s Wb o sm
mobi vic.
Commoii.Cosms w o coc o I w, im.
t w iwi, ob vics wi o b ivs. a w i
ics wi s vics o b smss, qii i v o
iio mo vic, sow, wo.
Audio,ido,3Dgrahics.t voic o o o sci. W iv i
vis-oi wo w i-soio vio ics bcomi
ssi o coics oc.
a o cos, cosmizio co wi os coom ivs cos ss.
t is sci iv mb o oi cosms ocs i
Ci Ii.
esbis comis i ssms si sc v so o s
cs b mi sm is o icm imovms v m o.
t v coi o c o i smicoco s o s, b, ow-
ow ICs, b mos v o c i m bsiss mos. a o,
sbis coics comis bi c b m-ci w s.
M o wcoms i i isis o icios, o s.
Fo m, i mobi s m, sbis comis sc s noi,
Sms, Mooo comi wi wcoms ici goo (aoi),
a (ipo), htC, rIM. I mobi isc m, comis sc s
ac/lc, no, eicsso ci w s ici hwi Zte.
a i pC m, ass ac ci w-ow s sc s d hw-pc.
aicios i oms i i isis. as i mobi ss co
ic io, vio, mi, mi o icios vib i its So.
Today, systems and semiconductor companies are undergoing a disruptive transormation
so proound that even the best-known companies will be impacted. The EDA industry now
stands at a crossroads where it also must change in order to continue as a successul,
independent business.
8/7/2019 EDA360 the Way Forward Vision
5/32
as i mobi isc co ic oi, c iscio,
cio/cio. a is s s o vi v vic is.
t siic oi is mos o wcoms ocsi i iovio
iiio o s.
M o wcoms osoci w si. I iio, icsi o smicoco ovis o s oios o sow sc, sc s
iosics, ivs, oi ssm (OS), miw. W mi, i
c, icio- oms wi w sow o iv icio,
sc s mobi comi. t comss vc o icio- -
om s bcom s imo s vi s, s, mos ow-ci siico.
t wcoms ii i ocs b bii iq sow icios o
o o os oms.
t sv ocs o bii icio- oms. I iio,
is vom oc, w is vo s, OS
icios . I w- oc sc s a ipo,
w OS i, b icios ms si coom o
w. I w-i, icio-iv vom momi
b o-soc goo aoi OSw c b bi o m s o icio. W wi iscss s ocs i mo i i C 2.
FrOM CreatOrS tO IntegratOrS
Smicoco ms, mwi, v b csi Moos lw o s
cs. tis w os mb o sisos c b c o IC
obs v wo s. I s o coii miio o ow ocss os o
i omc i siz vs. howv, Moos lw is ii w
o isi vom coss. accoi o s m Smico, ssm-o-ci (SoC)
vom coss comi 32m ocss o wi oc $100 miio.
Mc o is cos wi b SoC sow vom.
Figure 1 SoC development costs have soared rom $20 million at 90nm to nearly
$100 million at 32nm. Sotware is the astest growing part o the cost. [source: IBS]
0
90nm
$MILLIONS
65nm 45nm 32nm 22nm
20
40
60
80
10 0
12 0
14 0
16 0
SoC SOFTWARE
ARCHITECTURE, DESIGN,AND VERIFICATION
IMPLEMENTATION
AND MANUFACTURING
8/7/2019 EDA360 the Way Forward Vision
6/32
to b ob o moiz is $100 miio ivsm, smicoco com
m o si 80 miio is. Cosii a si i mo
40 miio is o ipo b o 2009, 80 miio is is .
I s, smicoco comis wo si si o ICs, izi s
o o o wo o m wo cc vs o o s.
a vc ocss os is o o sib. ev smicoco si is
ciic ms b icb o bo m. Js o vom ojc
os ow c si si com.
a w smicoco comis wi coi o oow Moos lw si
ss, mos com, sms ICs. ts iovos si creators. Wi
wi ovi cci o i is, o o sc comis c is.
C ms b w o b sccss ow voms o wi ss vc siico.Cosm m is si s o w is o coc vics w v
v imi . I coic si is o vib o o cos wo c
o m mo b sii 80 miio is, w o s vics wi b bi
ivsi cosms w wi o miiz.
Fo, is o w. Som iovos wi msvs s integrators.
t wi i siico, SoC, ssm vs. t wi m v s o
si siico sow ic o, wi o s
m ocss os, wi ivs vi i mb sow vom.
t wi bcom icio-ocs om ovis, o ci ovis. ts
ios ms c siv obii o i iio
wio scici qi o sc.
t iio s ivovs i s o cs cio. Ios o
b b o oc Ip, v i, soc i mo civ v v bo.
t o i Ip io i om w, si wv cobii is
qi. t o vi s i oms SoCs. Ios so o
i vi mb sow. Fmo, sic -wo cosm
icios ivov bo o ii cici, ios wi o bi
vi mi-si oms.
Bo cos ios im coc bo cos, b oo
obm i i ws. Cos mos coc bo ivi siico wi
bs omc, ows ow, sms i siz. Ios w w
is oo o o sv icio s, b i bis cocs qi,
cos, im o m.
t eda is o s o sv s o cos. I s mos com
io integrators, wo i s o oos cbiiis. W, o m, oos o siico Ip vio, qi ssc, s-i iio? W is
so i siico Ip iio-? a w is bi o o s vicio o
o/ii o w/sow ics?
W o v is mm, vi oos i i. a owi mb o
ios mi somi b.
The EDA industry to date has only served the needs o creators. It has almost completely
ignored integrators, who need a dierent set o tools and capabilities.
8/7/2019 EDA360 the Way Forward Vision
7/32
FrOM prOduCtIVIty tO prOFItaBIlIty
t mb o coc o co is ocivi. t s b mc iscssio
bo owi ocivi i IC si s ocss os si comi
ows. Sim , ocivi is ic bw siico cci
ii o ic bw w co b, w c is.
Cosi ocivi is om sov obm, i is o eda ovis
c so coi o ss. eciv ocivi mm bis ioviv
ii cbiiis o si, vicio, immio.
a design v, ocivi wi b c b movi o i v o bscio
b icsi si s. a verication v, ocivi wi b imov wi
mic-iv oc comssi simio, om vicio, mio.
a physical implementation v, eda coo ms wi owi ii
si comi vc os, so mci-w, mi ii,
o co-si.
Figure 2 Closing the productivity gap requires an integrated approach to design,
verication, and implementation.
dsi, vicio, immio ms b cos i. a oo o s
ss om i isoio wi imi bc mo ii ms.
Wi eda commi c so coi o imov ocivi, w
io mos cs bo is obii. t is owi obii i
coics is s b iscss. I is bw bsiss os
si cos, smicoco i cos, im o m (o cos). I so,
i is ic bw w o c m w o c m mo o.
to cos obii , comis ms coo w/sow vom
coss ow coss o ci, mci, s. Bo cooi
coss, ios ms ics v. tis c b o b mi i im-o-m
DESIGN
VERIFYIMPLEMENT
PRODUCTIVITY
MANAGEMENT
8/7/2019 EDA360 the Way Forward Vision
8/32
CREATE
INTEGRATEOPTIMIZE
PROFITABILITY
MANAGEMENT
wiows, b sii i oc o i m i im,
voii ovsoo ovis mo cosms wii o o.
t eda is ms cos obii . Cosi ivovs
ss:
Cra.Wv o wv w o sow Ip is vob i o
o i si ms b c wi iio i mi. I ms com wi i
ocmio, b vi, b cob o icio.
Igra. dsi ms ms b b o i i Ip io oms,
vi com SoC o om, ici ics bw o ii
bocs s w s w sow.
Oimi. dsi ms ms b b o c i c coss wi si
qi, owi ow cosmio, immi s coss o omio.
t ms c mb o -s iios.
Figure 3 Silicon IP integration and die/package optimization help close the protability gap.
Fi, coboiv cossm ici smicoco si comis, Ip ovis,
svic ovis, ois, eda vos, ssmb/ci oss is , o
wi bm o o, ss-bs soios. Wio sc cossm,
coics is wi cos bc io o , vic-i comis.
While the EDA community can and should continue to improve productivity, what theintegrator most cares about is protability. There is a growing protability gap in
the electronics industry that has rarely been discussed.
8/7/2019 EDA360 the Way Forward Vision
9/32
TOwardS The nexT GeneraTIOn O eda
eda360 povis p, 360-g visio o eda tt svs itgtos s ll
s ctos. eda360 lps clos t poftbility gp toug itgtio-y IP ctio,
IP itgtio, optimiztio. Giv tt mb sot c tk up l t cost
o SoC vlopmt, eda360 lso suppots /sot itgtio vifctio.
It tus ps t scop o eda ll byo its oigil bouis.
wil titiol eda ocuss o giig tms oly, eda360 ill povi cpbilitis
o pojct busiss mgmt. It ill c coss customs ti globl
ogiztiogis, pojct mgs, copot lsto bl poftbility
comptitivss i ts cllgig tims.
wit eda360, uss stt it ustig o t sot pplictios tt ill
u o giv /sot pltom, f systm quimts, t ok
ti y o to sot IP ctio itgtio. eda360 suppots
t impott cpbilitis:
SystemRealization is t vlopmt o complt /sot pltom
tt ill povi ll cssy suppot o -us pplictios. T pltom iclus
o o mo SoCs vlop toug SoC rliztio, s mb sot
istuctu tt typiclly iclus OS, mil, c pplictios.
Systm rliztio is iv by t pplictios tt ill u o t complt systm.
To b succssul, it quis tpis-lvl pogm mgmt.
SoCRealization is t compltio o iiviul SoC (o lttiv pckgig
coic, suc s 3d IC). alog it t itgtio o silico IP vlop toug
Silico rliztio, SoC rliztio iclus b-mtl sot suc s ivs
igostics. I t eda360 visio, Op Itgtio Pltom cilitts IP
itgtio ito SoCs.
SiliconRealization psts vytig it tks to gt sig ito silico. T
sult coul b log o igitl IP block o SoC, IP subsystm, o complt
IC itout mb sot. Silico rliztio icsigly ivolvs t ctio
itgtio o lg compl igitl, log, mi-sigl IP blocks. It gos ll
byo covtiol mi-sigl sigs tt itgt smll log blocks
ito igitl SoC.
IP ctio, us, soucig t t co o t eda360 visio. IP itgtio tks
plc uig ll t stps list bov, it sot IP comig ito ply uig SoC
rliztio Systm rliztio. Itgtio is t is om t top
mts t is possibl om t bottom.
With EDA360, users start with an understanding o the sotware applications that will run
on a given hardware/sotware platorm, defne system requirements, and then work their
way down to hardware and sotware IP creation and integration.
8/7/2019 EDA360 the Way Forward Vision
10/32
Chapter 2:
ApplICAtIOn-DRIvenSySteMReAlIzAtIOn
SYSTEM REALIZATION
SoC REALIZATION
SILICONREALIZATION
Add Embedded Software
Add Application Software
Add Mechanical (Board, etc.)
Add Bare-Metal Software
Add Packaging
IP INTEGRATION IP Creation
IP Reuse
IP Sourcing
Figure 4 EDA360 extends down rom System Realization to SoC and Silicon Realization.
COnCluSIOneda360 wi cos obii o cio, iio, oimizio,
i wi ovi b so o bo cos ios. as sc, i wi
s coic o vib, ioi coics is wi oss o
s. t is wi o o c w w wo i wi ovi
soios w o cosvio, viom, c, cio,
soio.
to i mo isi io eda360 wo i wi s, i is bs o s wi
iscssio o Ssm rizio. tos mos commci sccss ssms
icio-iv, wic ms i si s o b o i co. tis qis
om wi ow -s icios o m i si i omis,
osiiv imci bo obii ii ocivi.
ecoics ocs o bo icios. as sc, w si w
oc o ssms si i wic comis bi ojcs wi si
o s o icios wi o ssm. t, s
si o vo oimiz om o so icios. I iio
o w, is om ics b m (w-)
oi ssm s o sow.
tiio, i cos, mos ssms vo om boom , si wi
w. t OS iss o is vo wi v ic si o
i w, icios wi wii imiios o
-mi w sow isc cbiiis.
8/7/2019 EDA360 the Way Forward Vision
11/32
t s b mc i coic si wo bo w ssm comiss.
I is iscssio, iz ssm is w/sow om o
icio(s). Ssm rizio ms com vs o sow sc, om
b-m sow OS o ibis icios.
t platorm coc is c o Ssm rizio. I smicoco is,
ios bi cob oms cosc om ibis o comos sc
s ic o bocs o m si ms o cosmizioi-
obii, s im o m, ow cos. I SoC rizio s scib i C
3, s Ip bocs o js iio siico Ip. t o oimiz Ip sc
om b-m sow o sic ows visibii io coo o w om OS icio.
a w-ow om m i smicoco is is nxp ni,
wic is s o coc mimi vics. I iio o ommb SoCs
comio ICs, ni coms wi c sis, ssm sow, vom
oos. no ss imo is nxps si om, wic bis cossm o
ni soios.
a dISJOInted apprOaCh tO SySteM deVelOpMent
t iio oc o ssm vom is is. I mos css, w
si is iscoc om sow isc vom. to c w,
ssm SoC si ms c o b siico Ip. tis m b Ip wi
sic os, o so Ip c b cov o -v sio wi oic ssis oo. ao mo fib Ip, so Ip is ic
is-s v (rtl), iv ow v o bscio ssms
mico-cic. dsis coi wi immio vicio i
w is si siico Ip iio is com.
Wi oi ssm is -sc, icio vom is
bsc om w. I bsc o vi oo o moc-
oois o wi s b sow vosicios co b com
i w is sic vib. I bcoms zi o o so im
sc, ci o b omms wi i o o coo o, o visibii io,
w socs. hw/sow iio bi occs i
si cc, csi sc s, cos ovs, qi obms.
t -s icios vo, mos i b i wo s i
miii wi i w o sow. aicios ms coom o imiios imos b w o sow. uss i is ov-si, i
om wi obb so ow o icio qims, imii
civi o icios vos.
Electronics products today are all about the applications. As such, we are seeing a new
approach to systems design in which companies begin projects with an understanding o
the needs o the applications that will run on the end system.
8/7/2019 EDA360 the Way Forward Vision
12/32
aicio, sow, w vom o b i ms si
i ow oos Ip. tms commic s oc i is
ois. t s is csm bw c o ssicios,
sow, w.
Figure 1 In traditional system development, hardware design comes rst and sotware
is appended later.
asi om im-o-m s, is i obm wi is is
oc. a ics oi ivov mo o o omis is
bov v ic o sov. I icio css, is obm i icio
is, isc sow, o w? I isc sow om
ics mmo o, is b i sow o i w is?
M si ms c oos o ow o c ow sc obms qic.
Is, is o i--o o wi o o iio somims o
soio.
I w is si s, sow is , i is ic o oimiz ssm v. to, o m, m ssms ms b oimiz o ow cosmio.
avc eda si fows so ow oimizio ciqs sc s ow so
o mi vo vs. B i sow is o oimiz o v o sc
s, wo b v civ. Fo civ ow-ow oimizio, sow
w so b cosi coc.
to so o icios cosms v com o c, w ms
w-s im o is mov ow icio-iv Ssm
rizio oc.
MOVIng tOWard applICatIOn-drIVen deSIgn
Wi icio-iv Ssm rizio, o o s b bii wo
s b visioi icios o w o . t o w omo wi ssm sow, ici ivs, OS, miw. how o o obi
w/sow om s i o o icio? as o o,
wo i ocs o icio-iv siw- w-
i.
Open Source, Microsoft Studio, e.g.
Hardware
Software
Applications
SYSTEM DOMAIN DESIGN ENVIRONMENT
Silicon IP, EDA tools
OS, embedded software tools
8/7/2019 EDA360 the Way Forward Vision
13/32
I w- oc, w is -si i i wi
ssm sow bow icio v. a sow vom i (Sdk) ovis
si viw o ssm, o wi vi vos o c icios
civ o om. t a ipo ss is oc.
Wi w- mooo, icio vos v sb, icbom o wic o bi vi o icios. t c vo icios
so sb icb, bi s m qic, wio sci ow-
o i sow w. Wi s mos vs,
icios ms b wi i coomc wi oms cbiiis. t w
co b co o c. Fom w soi, is cos ssm.
I w-i oc, o i w is o sci.
tis is oc goo s wi aoi, sow sc o mobi vics
ics oi ssm, miw, icios. aoi is ,
o-soc oi coms wi Sdk ovis oos icio
ommi ics (apIs) o voi icios. aoi ovis
o ssm.
Wi w-i oc o icio-iv si, o c soc o
bi om oimiz o o o icioo oo mc cbii, o oo
i, b js i. I cos, w- om co b co o
c, i is i o b oimiz o icio o w o .
Figure 2 Hardware-independent applications development makes it possible to create the
right hardware or a given application.
tis os o m o wo bi o soc csom w o v icio.
r, wi cob w/sow om, sow icio
c co w i w sis icio. Sos o v wbicio ics vio. t icio wi w o o cocio bw
vio ics iv mmo s wi s ossib, s cosi ow
o cios o o wb s. l o, w is im o o som
comio, w wi b co i. t icio,
Cpu, is ioiizi socs.
HARDWARE-
INDEPENDENT
e.g. Android
circa 2008
Hardware
Hardware-independentApplication Platform
ApplicationCustomization
HARDWARE-DEFINED
e.g. iPhone
circa 2006
Operating Systemand Hardware
Application
DISAGGREGATED
Hardware
Operating System
Application
8/7/2019 EDA360 the Way Forward Vision
14/32
aicio-iv Ssm rizio ois o 180- o om
is, w-s vom mo. Is o ssm cbiiis ivi
icios, icios ivi ssm qims. B voi
soio is js i o ov-si, ios c sis i im
cocscos, im o m, qi cos obii .
hOW eda needS tO reSpOnd
to so icio-iv Ssm rizio, eda360 ms ovi w
cbiiis. Fiv sc cbiiis s oows:
earsofwardom
Aicaio-drissmigraio
Aicaio-drissmricaio
Drirdomkis
Aicaiodomkis
Is imo o o o o si vo c ovi soios
o w/sow cio, iio, vicio. t is sci
Ssm rizio v, w bo mb sow w
is qi. ecossm coboio wi b ssi o sccss, s wi o
ss ovi coic o csoms. eda vos wi o wi
mb sow comis, Ip ovis, csoms o ovi m o
cbiiis scib bow.
early SOFtWare deVelOpMent
Fom icios sciv, o sim w o o icios i
s soo s ossib o w/sow om ms s qims. yo
ci o w o, sow, si ocss i wic icio vom is
s i w is com. I, sow vom wi s s soo
s ocssos ii s o i bo ov cic.
Vi oos o sow vos c b sow si s
ocsso mos scio-v mos o i w, w bo
w is c bi. tis cbii cs im-o-m cs vom
coss. W imi ccc is qi, owv, w mio oos .
emos c imi- bs vi oo wo miss,
mio is ow vib wi mic ow sis.
Fi, b sow vom so is o mi-co SoCs wi mi
ocssos. tis is sci wi oos mi-co SoCs v i
s o ocssos i oi ssms. to, vos o o o m
iioi i--o wo. B soios qi, wi qi
coboiv o ics eda vos, mb sow ovis,
cmic isi sc commiis.
To support the range o applications consumers have come to expect, we must turn
the hardware-rst paradigm on its head and move toward an application-driven
System Realization approach.
8/7/2019 EDA360 the Way Forward Vision
15/32
applICatIOn-drIVen SySteM IntegratIOn
SoCs ssmb om ibis o o, ii, mi-si Ip bocs. ts Ip
bocs somims c i b mo o cs om i-
comis o cqi om o si os. pi Ip o civ
ci is siic c is o w sv b eda is o.
as s, som comis o Ip iio c cos mo wic s mc
s i coss o b Ip i s c.
Ssm rizio c b viw s Ip iio c, o is v o
bscio Ip mi b i SoC, oi ssm, o c ic-
io. hw/sow iio is i ssm v, sci w w
is si s sow is wi imi coo o visibii io
w. t w-sow ic is o o iis cs o bs o occ,
w o, is v ic o mi w cm om w,
mw, sow, o icio.
a icio-iv oc ss w/sow iio cs. h,
o c s sow vom s soo s w bsic cisios (sc s ocsso)
v b m, bsc w qims om sow. W-i
ss m is s. Ci-i oos o i,
simios o ow, i siz, i, cos ow vib. Ov im, ssm
i oos cosi bo sow w wi m.
as iio ocs, om ii c o (eCO) cbii is v v o bscio. Cs ivib, co is
si cc. I so o b css o ssm o -ssiz i
Ip boc bcs o o sm c. t i is o c w/sow
om, o c sci om.
aom eCO oos vib o. ts oos om vi cs, ow
icm si cs miimiz isio. tis cbii is si ocs o
w, b s c b o i-v ssis.
applICatIOn-drIVen hardWare VerIFICatIOn
hw si ms ow vicio cosms mos o w vo-
m im cos. Sow vicio bi q im-cosmi.
a Ssm rizio v, ios ms vi i ssm ms qims cios s c.
Ssm rizio qis icic vicio. t ms o so b b o
vi Ip oc, cc i o, o vi i-boc ics v i
bscio. B im o o Ssm rizio, o ics bw mjo
ssm comos so mi. I wo, o, o o -vicio
No single vendor can provide all the solutions that are needed or hardware/sotware
creation, integration, and verication. That is especially true at the System Realization
level, where both embedded sotware and hardware expertise are required. Ecosystem
collaboration will be essential or success.
8/7/2019 EDA360 the Way Forward Vision
16/32
occs, vicio coss o/ii o w/sow bois is m
com. to m is mo comic, ssm-v vicio ms ms
m o s sqcs o co cs bs.
t mic-iv vicio oc voc b Cc ovis v
o w vos o. I ows si ms o s wi cb vic-
io c cov mics sow ow com vicio ocss is.
Bii is coc io mb sow wo, w omiz vicio
mooo is ci, wo b Ssm rizio. Coboio bw
IBM Cc s sow si vicio c coo c bo
w sow vicio.
Mi-si vicio ssm SoC vs is m ci. ao
simos oo sow o ssm-v vicio, v wi bvio moi
ciqs, ic bw o ii cici is v com. B ii
simoswic os o mi s o simosc, i c,
sim o sis i v o coscs ow vib i
s o moi s.
Wi ocs o icios, o vicio cs. I is o o o
o js sims oo wvoms o soc co. to vi vio icio
Ssm rizio v, o w o s vio. to vi msic icio,
o w o msic. I o wos, o w o vi icios i co
o ssm. I is ossib o oios o iv icios o si vioos o mio oos.
drIVer deVelOpMent kItS
to, sow iv vom o csom w is m o. I o s
wi icio c o i w, voi css ivs
c b bi obsc. a wi m w oios o coios, o
m wi mb o i ivs o sm w om.
a iv vom i c . Imi, o m, li iv vom
viom ics ms m i s o wi ivs o mb
li, sowi sow vos ow o sci os is.
Part o EDA360 is providing new tools that oer a dashboard to help companies
manage system development projects, and provide metrics that make sense in hardware
and sotware engineering environments.
8/7/2019 EDA360 the Way Forward Vision
17/32
applICatIOn deVelOpMent kItS
a ovis ci sow vom i o icio vos. t i
bscs w is bo i w sow, ovii o w
vos o ow o m icios wo o om. t wbc is
w co b oimiz o csomiz. aoi Sdks s aoi, b
obvios o w goo os ovi.
t is c o icio-iv Sdks o bs o w o
sow oms, b si s bsic cios qi o ic
css o icios. Fo m, i o mobi icios wo s c
i oi, s w s qims o o o io qc (rF) so.
ManagIng the SySteM realIZatIOn prOCeSS
t vom viom bs icio-scic Ssm rizio is is
ssm s ooi mm ic. Mc i is sow
ovi o bsisss, is-v mm is o cos, sc,
so soc mm scs o ssms vom. ts oos o
m oic-iss ms s w s Siico rizio ojcs c
coss mi comis.
eis soc i (erp) oos ovi som o s cbiiis, b
i v ccss o i o si o cs
qims o coic ssm vom. a oo w o ssm iio
co o o sc o ssm iio. a oo wi o si o
vicio co o c moio vicio ocss.
ts, o eda360 is ovii w oos o sbo o comis
m ssm vom ojcs, ovi mics m ss i w
sow ii vioms. t mic-iv vicio cbii vib
ow ois w o w s o b o. to, si vicio ms c
c cb vicio iis ojc mics, cs simio
is, cs cov mics. t c viw os cs wi m m o cos vicio ocss, mi w vicio is
o. as s, vicio socs s civ ov coss c,
i cos obii .
COnCluSIOn
t iio oc i smicoco is is o bi w,
sow (i w v o!) sombo s wo bo icios
i o -bi w. B i comiiv cosm viom w
iiio coms om s civ icios, obii is o
i, is covio oc is i o o sm. Wi icio-iv
Ssm rizio oc, vos c s b visioi icio. t
c si ssm v s s ossib, wo ow o sow,
bi o b w.
t icio-iv oc wi cos obii b ssi cos,
im o m, qi. B is com w w o ooi si, i
cs w ms o ssm ios eda ovis. eda360 is i o
m os ms.
8/7/2019 EDA360 the Way Forward Vision
18/32
Wi Ssm rizio ocs com w/sow om oicios om, SoC rizio ss sccss vom o si
SoC o m ssm s. tic, SoCs cosi o b o w siico
is com. I eda360 viw, owv, SoC rizio is o com wio
sow vic ivs o c w sbssm. W biv s ivs so
b vo wi SoC c o s o com
w viw o ow siico Ip so b ovi.
Is o ii o Ip s iso bocs, w oos Ip sc ics
b-m sow s w s w Ip. B-m sow s o vi
bow OS , mos omi o b-m sow is vic
ivs. t Ip sc ic bow so ics vicio Ip (VIp) vis Ip
cioi iio. t sc m ic mcos wi os
o wi ssizb Ip is-s v o scio-v moi
(tlM) v. I so ics si cosis.
Figure 1 An IP stack includes synthesizable RTL or TLM IP, verication IP, and hard macros,
in addition to driver sotware and design constraints.
div sow ows OS icio o m w socs. as sc,
coic ssms ms v icoo vic ivs. So w b m wi
siico Ip ic m s o SoC rizio?
Cosi ow ivs ic vo. I covio SoC si mooo,
w is bi s ivs wi , s b somo w o
is ( s iii cbiiis) o w. tis vs wo b
coics. O is siv, csom iv vom o b somo wo obb
s i w owo i is w so, i o o OS ow.t o coic is o cs ic iv wi v o si
o ow iv o w so o OS, wo v o
o cbiiis o o w.
VIP
HARD
MACRO
HARD
MACRO
HARD
MACRO
DRIVER
DESIGNINTENT
POWER,AREA,TIMING
TLM DIGITAL
RTL DIGITAL
ii
i
Li
I
l
i- ii i-
iI
li iE l
i
Chapter 3:
soFtwArE-AwArE soCReAlIzAtIOn
8/7/2019 EDA360 the Way Forward Vision
19/32
I i cs, icios iscoc om i w ssm.
t s is w i bw icio w. yo c v
bi ssm wi mo o ss wob i wi obb b sb-oim, ov-
si o -si, , obb oo siv o i obii.
I ivs o Ip sc, owv, wi s o iw cbiiis o oi ssm. tis ms i si o OS o ic
coo o co w socs o m s o icio. Fo m,
vio icio c ic immi c o bwi i s o o
s wb s. I c co w i o som comio.
tis cbii is imiis i ivs o com w.
I is so imo o ic si cosis wi Ip sc. t mos commo
cosis os o ow, imi, . ts cosis com om vios
socs, ici Commo pow Fom (CpF) s o ow, imi scis o oic
ssis, sic o cosis o o bocs. Cosis ssio
o si i, o so bvo v i si cc.
to sv si i, cosis ms b com oo si,
vicio, immio ss css o cos ocivi .
So w ic cosis wi Ip sc? Bcs wio oo si
o si cosis, iio o Ip io SoC wi b ic o-o.
Bs mo i o i ics bw Ip sbssms, ov ssm
cioi m b comomis o , vicio wi b mo cos. a w-sci, oo s o si cosis is s imo sc o iio-
Ip. Cosis so b ovi o s o sc, ici o
mcos, ssizb ii Ip, iv sow.
a BrOader deFInItIOn OF SoCS
Fom siico soi, SoC is cob o ommb IC ics
s o ocsso, som csom oic, mmo coo. a icsi mb o
SoCs mi-co ICs v mi ocssos o sm o i s, sc
s Cpus, gpus, dSps, sciiz w ccos. SoCs m so v o-ci
mmo, is, ooco ics. a o s comos oiz io
sbssms Cpu sbssm, mmo sbssm, I/O sbssm, so o.
giv icsi comi o os SoCs, i is vi o s ci commic-io mo s sbssms. I commicio cic is iq, coc-
i sbssms o wi b i immio s. ts i is ssi o
com commicio wo cic s o SoC rizio.
a w o-ci commicio oc c wo o ci (noC) is omisi
ics fibii o mi-co SoCs.
SoC Realization is not complete without sotware device drivers or each hardware
subsystem. We believe these drivers should be developed with the SoC rather than tacked
on laterand that leads to a completely new view o how silicon IP should be provided.
8/7/2019 EDA360 the Way Forward Vision
20/32
Figure 2 SoCs are organized into subsystems. One o the subsystems provides a
communications abric or the others.
So wv s covio iio o SoCs. Wi sow- SoC
rizio, owv, ivs ovi wi c sbssm. t ivs ow
OS o ic v o sciiz w s i c sbssm,
ici o-ci commicios bic.
SoC rizio is mos ci w mi Ip scs ssmb io Ip sbssms.
ts, i , so mjo w sbssms, sc s I/Os, Cpus, o mmo.
Ip ms so b oimiz o iio. dsi cosis imo o
oimizio.
InSIde the Ip StaCk
ls cos oo Ip sc. Covio, mos ii siico Ip ics
coo sic (phy). Fo ss-bs Ip, sc s pCI ess o
uSB, coo is s so o ssizb Ip, wi phy is ic ,
mi ssis o v b com. Cpu Ip, owv, is s
i ssizb.
So Ip is ic bi is-s v o. ts owi mov o
i v o bscio, scio-v moi, wic wi ow mc s si
vicio coic o mico-cics. tscio-v mos c so b
s o bi vi oos o sow vicio. Wi c vibii
o SsmC i-v ssis wi i qi o ss, css oos o
miio o tlM i c.B tlM-bs ii Ip is js o o so. Vicio Ip s bcom icsi
imo so b o Ip sc. VIp ovis com sbcs
o vi Ip coio iio. I iio o sbcs, VIp is vib
ow wi ooco comic mm, so o ssios, scio-bs
ccio, s o mio.
PROCESSOR SUBSYSTEM
On-ChipData Memory
EMBEDDEDCPU
Fabric
On-Chip
Instruction Memory
HIGH-SPEED PERIPHERAL SUBSYSTEM
PHY
PCIe G1/G2 Other IP
PHY
AH B
APB
AXI
BRIDGE
USB3
MEMORY SUBSYSTEM
FlashController
PHY
DDR/LPDDRController
DDR PHY
LOW-SPEED PERIPHERAL SUBSYSTEM
UART I2C INTC
ii
i
Li
I
l
i- ii i-
iI
li iE l
i
BRIDGE
8/7/2019 EDA360 the Way Forward Vision
21/32
Sic SoCs mi-si, Ip sc wi i ic som o
mcos. Ci-v, mi-si vicio is o o os cs c b SoC
ssm sis o. O w vib soio ms i ossib o sim
o sis isi ii simio viom, wi i v o
mic-iv oc vib o ii vicio.Ws w bo Ip sc iscss , owv, is icsio o vic
ivs si cosis. W Ip co ovis ivs, is o o
css o somo wi i o o w ow o bi m c.
W Ip ovi ics cosis, SoC io c ssmb Ip scs
sbssms wi coc.
Wi is w Ip oc, os o cic imm SoC i?
t sw is mic s is o i w coc c O
Iio pom.
Open IntegratIOn platFOrM
SoC iio ivovs ss:
Analyze the architecture. Bs o icio qims, ssm sis
om w-i ss (bsiss cic), vo ov o SoC,
cosi ms sc s ocssos, I/Os, mmo. t so
b-m sow ows OS o coo w. Ci i
oos c vib o wi som o s ss b owi i, w-i
ss o ow, , cos.
Develop or source integration-optimized IP. W i coms om i socs
o i is, sis ms b b o oc Ip s bs o icio om
m socs vib. tis qis co o ib o Ip ows cic
cos comisos, s w s oos mi w-i sis o ow, omc,
cos. I som css, sis wi ci o c iio-oimiz Ip. Som o
qims o iio oimizio ic:
Fucioaiisw-ddaddocumd
Sourc,shsis,adimmaioackagsarroiddforigraio
Siico-aidadIpisaaiawihcharacriaiodaa
Ipmsdocumdquaiguidis
Ipocksararamrid
Ipsackscomwihdsigcosrais
tsaformforIpcomswihacomricaioiromfor
hardwaraddrirs
Dirasicudacssarscris,guidis,chckiss,ad
documaio
When the IP creator provides the drivers, its no longer necessary or someone with little
or no hardware knowledge to build them ater the act.
8/7/2019 EDA360 the Way Forward Vision
22/32
Integrate IP to realize the SoC. Wi iivi bocs o Ip, iio is i
s. W Ip is oiz io -vi, iio-oimiz sbssms, i bcoms
mc si. dsis o b b o s o sbssms. t design, veriy,
implementss o cos ocivi scib i C 1
, vovi o m s o w Ip iio im. pocivicois o b imo o SoC rizio ocss so svs o cos
obii .
a O Iio pom ovis mwo wii wic o c o s
ss. I is iv b Iio dsi eviom is oos o Ide
(I dvom eviom) s b sow vos. I ovis
comsiv s o cbiiis o vo os SoCs, mimizi bo ocivi
obii. I is bs o o ss i Oaccss bs, O
Vicio Mooo (OVM), Ip-xaCt om o Ip sciios, SsmC
tlM 2.0 moi s.
Woi om is SoC-Ide (Iio dsi eviom), sis wi i
csom-scic icio-scic qims, bi i Ip sbssms om
i o socs. t m m s o i- csomizio svics o
ovi is o so ios o imo m, o bi i som ois o sov qsios o mi-si sbssms. Ios c si,
vi, imm iio Ip is , ssmb vi
com SoC, ovii iomio css o bicio o o.
t SoC-Ide ovis sbo o i si, vicio, imm-
io oos. I s s v o isi cbiiis sc s mic-iv vicio,
ow-ow si, mi-si immio vicio, w/sow
iio. ts cbiiis wi coi o vov o m s o SoC ios.
Figure 3 An Open Integration Platorm makes it possible to produce an integrated
SoC rom IP subsystems.
FOUNDRY
THIRD-PARTYSERVICES
INTEGRATIONSERVICES
THIRD-PARTY IP
INTEGRATIONOPTIMIZED IP
(Software and Subsystems)
INTEGRATION DESIGN ENVIRONMENT
DESIGN
VERIFYIMPLEMENT
CUSTOMER EXPERTISE
8/7/2019 EDA360 the Way Forward Vision
23/32
SoC rizio s scib cs o sis o c iio-oimiz Ip
w , o i bo i c soc Ip, o vi
oimiz SoC o m ssm qims. ts, ss cos obii
create, integrate, optimize cci o SoC rizio s w.
COnCluSIOn
t eda360 viw o SoC rizio cs o iio o SoCs ics
b-m sow, o wi mo comsiv w o ooi Ip s
scom sic ooco (coo) o ivs o wi
ssoci vicio Ip si cosis. B ici iv sow, ciic
w i is i, owi icios o wo o OS o c o
cis w socs i s.
to so is visio o SoC rizio, w coo is qi. O s is
o m i si o Ip cos o bi ivs. ao s is o cii oo,
mic-iv Ip vicio o oi w -vicio o Ip is css. a
eda360 wi o ovi O Iio pom, wi is bii o w-i
sis o mi bs ossib cic iio, vo iii SoCcic, qic i vi Ip io vi SoCs.
t o Ip wv scib c o com bo o coboiv
cossm. eda comis, mb sow OS vos, Ip ovis, ois,
-s comis ms wo o o iio o Ip o
b-m sow com sbssms.
t oc oi i is c wi o oo o ob, icio-iv
Ssm rizio. Is o si im mo o v sciis vo
csom ivs, o cci imiios o ic iv, SoC ios wi v
iv sow ss cbiiis o i w. Is o fi
bi i io obms wi iio, SoC vos wi oow cosi-
iv iio mooo. t oc scib s ios m
os o cos, im-o-m, qi, o cosi obii .
With individual blocks o IP, integration is a daunting task. When IP is organized into
pre-veried, integration-optimized subsystems, it becomes much easier.
8/7/2019 EDA360 the Way Forward Vision
24/32
eda s ws b coc wi Siico rizio. I c, s b i ocs o eda is sic is icio. Fom eda360 oi o viw, Siico
rizio is o o si oi o ssm vom i mis s
ssi s v, is bcomi mc mo ci.
Siico rizio ss vi i s o si io siico, o
si, vicio, immio. I sos so o sow vom
iio, wic ss com wi SoC rizio Ssm rizio.
t o o Siico rizio m b o, ii, o mi-si Ip boc s
i io SoC; IC os o qi mb sow vom;
o SoC o sow iio.
as coics is movs ows icio-iv Ssm rizio,
cocs is bo owi obii , sco comi o Siico
rizio cs wi msoom. Comi wi ow v mo com wi
mov o vc ocss os sc s 32m 22m. Bo eda is iscsoms ms s so o cs.
Sic ici o -wo qis o cici, Siico rizio ws
ivovs combiio o o ii Ip. B Siico rizio os bo
iio viw o mi-si si, wic ic ivovs imoio o w
o mcos io ii SoC. Siico rizio ivovs cio i-
io o m , com o mi-si bocsici bocs
w i cis i vios ocss iosio SoCs so bo s
o cioi. ts s som o/mi-si bocs m b ommb o
cob, s is cs wi sow- io.
Figure 1 Many SoCs today integrate large digital, analog, and mixed-signal blocks, including
audio, video, and wireless interaces that may have previously been entire chips.
Chapter 4:
eDA360enAbleSSIlICOnReAlIzAtIOn
RF Audio
TV
FM
DSP
Modem
Video/camera
interface
LCDdriver
IO/Keypad
USB
SIMPLL
Bluetooth
Wi-Fiinterface
PMU
Communi-cation
processor
Imageprocessor
Applicationprocessor
Externalmemory
interface
S1 S2 S3 S4
Memory
8/7/2019 EDA360 the Way Forward Vision
25/32
Siico rizio so ivovs cio o -csom ii, o, rF Ip bocs
ICs. Cocs bo ocivi obii js s c o csom sis
s i ii wo s ss si omio. poss is
i csom IC si s w, som is occi. O m is vo-
m o cosi-iv o si fows.Wi Ssm rizio SoC rizio imi ss o ios, bo
cos ios om Siico rizio. ts, eda360 ms ss s
o cos b cosi ocivi , so ss s o ios b
cosi obii . t m i is o o om coc o siico s
qic s ossib s c s ossib, wi ii i qi
cosms v com o ow m.
three COnCeptS BehInd SIlICOn realIZatIOn
t commo ms bi mos o ocs o cos
ocivi obii s i Siico rizio:
Merge top-down design and bottom-up design. t iio si oc is
boom sis s wi siico sow ic-
ios . t mi icio-iv oc ss wi icio, s
ssm, bscs w sow qims om ssm
iio. B is o o-ow; iomio ms fow w om siico v
s w. I is ssi o s ow, omc, cos ssm v,
is c o i iomio bo siico si, ci, mci is
m vib i vs o bscio.
Raise the level o abstraction. t m ws o wo i, ic v o
bscio. t c mov b ii si vicio ms o scio-v
moi ss o oc, b os. Fo m, o sis
si bvio moi s sc s Vio-aMS, c ow sim o
cicis i ii viom si w . howv is o, i
vs o bscio boos ocivi, ss im-o-m, ow coss.
Apply unifed design intent. W o -csom o ii si, si,
com, co sio o si i wi voi os oo
Siico rizio fow. tis i si i cs scs o si
ici cio, cosis, izioo s vi is woi ows
commo o commo si. Woi om is commo si i
cs iss o scicio misss -sis, ss cs c
imm coc cosis oo si ocss.
Silicon Realization involves the creation and integration o extremely large, complex
analog and mixed-signal blocksincluding blocks that were entire chips in previous process
generationsinto SoCs that support broad ranges o unctionality.
8/7/2019 EDA360 the Way Forward Vision
26/32
ClOSIng the prOduCtIVIty gap In SIlICOn realIZatIOn
Cosi ocivi qis ioviv ii cbiiis i si,
vicio, immio. eda360 s o iv oowi cbiiis o
cos ocivi .
deSIgn FOr prOduCtIVIty
Raise the abstraction level early in the design process. Fo bo o ii
si, i is css o c si i s ic i-v om s ossib, s
s ossib. t, oos c ovi o omio o sbsq
si civi. tis ows fibii i i si w ciic si
immio cisios m. Wi tlM, o m, ii sis o
oc io mico-cic, om SsmC i-v ssis ms i
s o o i coics si qims. O o si,
si Vio-aMS o w mos s sis c si i
cc vicio cc o Ip iio.
Tackle multiple objectives simultaneously. tiio, is oc o m
ssims o ow si wi wo, o ocs o js sm mb o
si cosis. a b oc is o ovi -o s
o so iom cisios o bo bsiss cic vs. pomc, ow,
i, mcbii, cos ms b cosi coc i isoio.
ei o os ci i oos, eda360 oos wi ow i, coc
w-i sis b b i vs o bscio.
Use a single source o design intent. t is o oss o i s o s osiico si is o o os woi o s. Wi si, vi
soc o si i, is o oss o i, o is o sio.
I ii si, o soc c si i mb o i omssc s
tlM o is s v Ip Commo pow Fom mos o ci ow
i. I vc mi-si si ssm, commo s o o ii
cosis c si s miis i oo Siico rizio.
VerIFy FOr prOduCtIVIty
Holistic verifcationuse the best tool or the job. t m i
ciqs o ii vicio, ici simio, om vicio, mio.
aocs o o simio om siso-v SpICe simio o o
bvio moi wi Vio-aMS . Woi wi si o ovii si i, iizi vicio , eda oos ms coos
bs oc o iv s o vicio ocss is bc o
vicio . t s is oisic oc o vicio si mos ociv
mos o c s.
Whether or ull-custom or digital design, a single, complete, and coherent representation
o design intent will help avoid errors throughout the Silicon Realization fow.
8/7/2019 EDA360 the Way Forward Vision
27/32
Apply metric-driven, predictable verifcation. a mo IC si c coi mo
oi ss mb o oms i ivs (o 1080), so si v
ossib combiio is o sib. Ws is ii vicio ows
ws b s w s. a mic-iv, cb vicio ms
i ossib o moio c si o cov mics mi w sis o b vi. t sm so so sv mi-si vicio o o
ii ics.
Use the right verifcation abstraction. abscio is o o imo o si
i is so ciic o vicio. W omi vicio w o s mos
ssiv sciio vib, ovi js i mo o i o job
o. Fo m, si im sbc is mo wo b v ici
w o om c moi i wo swic. liwis, si SpICe bscio
o mi-si boc i omc si wo o siic s i
vicio cc.
IMpleMent FOr prOduCtIVIty
Use single-pass design. avoii iios qis i s im oc
b b -ow o imo si io c s o si
immio. as iv si m is imm, o iomio s o
b o si s o voi oi obms sv ciic ssmios
om vios ss. ev so, cs ivib. Wi om ii
c o (eCO) cbii i o om vicio, si ocss c coi
smoo w c occs o b is .
Understand realization. I is imo o ow ow si wi b imm.
I si is o o ii Ip boc, sis so ow w s o SoCs i
mi sv w o Ip i mi b ici wi. I si wi b c-
i sc-i (3d IC) coio, is wi ifc m coics. I c s
o si ocss, bo i immio ms b m vib
oi vs o bscio o m civ si os.
Intelligently partition large digital blocks. a vc siico ocss os sc
s 32/28m, si ii Ip boc m coi miios o s. W i
o gi g, gi hz SoC si. tis ss i m cs, ici
com mci s, si siz osio, si o s, i m,
vibii, m os. l, ii si ms so o v o b ici
iio io sm ics o oo sicios o imiios i si is.
eda360 oos wi cci sco, owi sis o wo i mo
sio, o voi m o obscs o ov com mismc
sic oic icis i si. tis bcoms sci imo s i
vs o bscio ow is o c siic oios o si.
For both analog and digital design, it is necessary to capture the design in as rich and
high-level a orm as possible, as early as possible. Then, tools can provide a greater degree
o automation o subsequent design activity.
8/7/2019 EDA360 the Way Forward Vision
28/32
ClOSIng the prOFItaBIlIty gap In SIlICOn realIZatIOn
to cos obii o ios, eda360 ms so cio, iio,
oimizio. tis ss somw i s o cs soios
com o os o ocivi .
Create FOr prOFItaBIlIty
Use high levels o abstraction. t sm sciio ws iv i o cos,
b ocs o ios is i i. h, coc is owi i-
os o ocs o v b imii s m css ss s
ossib ci bswo. Ci o soci Ip tlM v is o w o
ccomis o.
Make IP reuse practical. rs is ic s o b cos-civ o mos
comis. I o coss mo o s Ip o bi i om scc. Ios wo
c Ip ms i c bo w i wi o, w icios i wi sv,
w cbiiis i os os o . t ms ovi oi ocmio
ivbs, io o qi cobii. Fi, Ip so b
oo vi so -vicio is o i iio s.
Maintain design intent. a si si o si i is ci
oo cio ocss wi v cos os. tis si so
b ocm cb b s o si ocss. lvi
omio bs o is commo si i wi v siic cos svis.
Integrate FOr prOFItaBIlIty
Apply piece-by-piece signo (iterative correctness). a siic oio o
ov si cos is o vicio, o vicio is om
ici s o si. as c Ip como is bi o soc,
ios so s i s qi cbii o o job. I comos
o vi vi, ios o wo bo ics
i-o cios w ssmb comos. t so b o
o -vi iivi bocs, v os soc .
Use enablement services. a com socs osi Ip m moi
som sciiz is o om v. Fo m, ii si com
mi soc som o Ip bocs wi mi-si iio
vicio. t is siic cos cim c i bii i
m wi o si o sis is is qim. a mo cos-
civ oc wo b o v o i- svics o is so-m
is .
A metric-driven, executable verication plan makes it possible to monitor and track
testing through coverage metrics and determine what still needs to be veried. The same
plan should also serve mixed-signal verication or analog and digital interaces.
8/7/2019 EDA360 the Way Forward Vision
29/32
Oer visible integration. W o bocs bo io ii SoC, o ii
bocs bo io mos o IC, imo o o ii comos
o bc bos wi o visibii io i scs. O, bo
mos. tis ss i iciv iio si om i oo mc visibii, wic
cs omc, o oo i visibii, wic imcs qi. Bo oos ovis oIp so b js o visibii o s iio s.
OptIMIZe FOr prOFItaBIlIty
Optimize or cost. Wi cos m msiz cic iios sc s ow
omc, ios coc bo cos o si. t
o sc mos cos-ci immio voi ossib ov-si. t
iio oc ivovs ovsii wi siic s o bs o
miimiz oi obms cos isss. Fo m, bs m qi
imi mi s i s 30 o 50 c, oci ci si o so mc
bo-- o imi omc o vibii, wic i iocs
oo qi, siic ws, os obii . B vi cc-
isics sc s w-i sis bs o i vs o bscio, si ss si,
immio wss, o is i o ov-si c b voi.
Manage changes. Cs ivib, i is mm o is c
c m ic bw ob si s o sc, si
is o m i o m. as sc, i is imo o simi m c
wii si ocss. Fo ios, is is o o o cs m b i
ow m, b b ms o sis om wic Ip ws soc. W
cs , i imc so b miimiz, ociz, c o o
comio si o cbiiis sc s is mm, eCO omio, mic-iv vicio. Mi c civ is mi obii.
Consider sotware as a service. M si ms s o o si
viom v w si c fow b i ocio . Mc
o is ic is c o c o oi is sb ics
i isc. usi Sow-s--Svic ows si viom o b
co os si i ic i- svs o co
comi. SS c ios v cbiiis w
i. tis o c c si cos cc obii. B mi is
viom ocio-w, viom is oimiz o js o csom,
b o o is mci si. t s is i oimiz
si ocss w om si o mci.
I bi, bs w o ss obii is o v o-ow viw o w o
i o bi, om s m is s ossib, s vi comos c sim b s o. lo bocs ovi oo o. Wi lo bocs,
o s b visioi ojc sc s ci s. yo joi mi sm objcs
o o bi bi objcs, i oss. t o c c mi oss o
s. B si oi is si -sc visio o w o o bi.
Reuse is dicult and has not been cost-eective or most companies. It oten costs
more to reuse IP than to build it rom scratch.
8/7/2019 EDA360 the Way Forward Vision
30/32
COnCluSIOn
Siico rizio s b o o cs, b w w oo i o
s o bo cos w b o ios, w sciv ms.
Wi iio eda s o ocs o scs o Siico rizio, v-icsi
sco o cs ms is mo wo v o cos ocivi .
Fo m, eda360 ss o is bscio v o bo o ii
si; s si socs o si i; mo mic-iv vicio; s si-
ss, coc-b-coscio si; ovi ii iioi oic
sic vs.
t w c is i ios cos obii . h, eda360 wi
ovi soios m Ip s si, ow iiv cocss, oimiz cos,
m c coss sis i ms. B eda360 is o
js bo oos coo; i so s io bsiss m mos.
Sow-s--Svic mos, o m, wi ios imov si ocss
coo coss, wi svics ms wi ovi ccss o is o
s- bsis.
Wi is c, w is Visio p w eda ic bis ocioo cos-civ, ow-ci siico. B o s, i is o jo b
wi -s m o mi, coc sow icios; w, im
cocivi; io, vio, 3d ics. W v s ow vom o
v-mo civ icios is ivi ssm vom ivi is o w
css o iovos c ios. W v sow ow s o ios
i om os o cos eda is s ws sv.
as wi cisis o ifcio oi, is bo ooi o isi
ovis. a Cc, w s ooi. W o b s i viiz eda
is wi sv bo cos ios. W wi wo wi o cossm
s o ovi css so o Ssm, SoC, Siico rizio, o
b w o icio-iv si. ps joi s s ow w o
i www.cadence.com/eda360 .
http://www.cadence.com/eda360http://www.cadence.com/eda360http://www.cadence.com/eda360http://www.cadence.com/eda3608/7/2019 EDA360 the Way Forward Vision
31/32
2010 Cadence Design Systems, Inc. All rights reserved. Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. SystemC is a registered trademark
of the Open SystemC Initiative in the U.S. and in other countries and is used by permission. All others are properties of their respective holders. 21451 04/10 MK/ED/PDF
8/7/2019 EDA360 the Way Forward Vision
32/32
Corporate Headquarters
2655 Seely Avenue San Jose, CA 95134
Phone: 408.943.1234
Fax: 408.428.5001
www.cadence.com/eda360
http://www.cadence.com/eda360http://www.cadence.com/eda360Recommended