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This is a technical review for electrical and mechanical engineers and project managers involved in designing your next-generation products. We will cover the two processes for producing 3-dimensional molded interconnects; Double-Shot molding and Laser Direct Structuring, with an emphasis on laser direct structuring.
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SelectConnect Technologies3D-Molded Interconnect Device Technical Review
www.selectconnecttech.com
3D MID
• Double-Shot and Laser Direct Structuring Processes
• LDS Materials
• LDS Design Rules
• Applications/Markets
Contents
3D-Interconnects by DS / LDS
Double-Shot Single-Shot LDS
LDS 3-D MID
LDS Summary
LDS Summary
LDS Technical Summary
Laser Direct Structuring – LDS
LDS Technical Summary
LDS Technical Summary
LDS Technical Summary
LDS Technical Summary
LDS Pitch for High Yield
8 mil lines
10 mil spaces
(18 mil pitch)
Kavo Dental Tool
Business Drivers for 3D-MID
Business Drivers for 3D-MID
Kavo Dental Tool
LDS Grade Materials
Reflow temperatures
• Pb Free 245 -260° C
• Sn/Pb 225 -235° C
LDS Design Rules
Siemans Hearing Aid Component
LDS Design Rules
LDS Design Rules
LDS Design Rules
LDS Design Rules
Optimum cycle times
LDS Design Rules
LDS Design Rules
Metallization
Electroless Copper Nickel Immersion Gold [Electroless Gold]
Typical builds:
SelectConnect™ Metallization
Copper 100 – 250 micro-inches (2.5 – 5.0 µm)
Nickel 50 – 150 micro-inches (1.2 – 2.5 µm)
Gold Immersion, ~ 8 micro-inches (0.2 µm)
Key Markets / Applications
Medical Devices
OmniPod® Insulin Management System
OEM: Insulet
Molder: Phillips Plastics
Plater: Arlington Plating
Material: PC, PC/ABS (doped)
Process: DS (Double Shot)
3-dimensional PCB for Hearing Aids
Stereo hearing aid component:
Source: Harting / Siemens
process steps
Material: Vectra E820i LDS
Medical Devices
Switch Ring for Caries Diagnostic Laser Pen
Features:
Reduction of assembly time (6s vs. 20s)
Increase of assembly yield
Reduction of parts (3 vs. 8)
Reduction of cost (78%)
Source: KaVo Dental
Material: Vectra E840i LDS
Medical Devices
Military / Defense
Security Housing
Manufacturer: BournsMaterial: Pocan DP 7102 (PBT)
Multi-function HMI
Source: Kromberg & Schubert GmbH & Co. KGBMW K46 Superbike
Automotive
Material: Ultramid T 4381 LDS
SMD Process Steps:
Source: Kromberg & Schubert GmbH & Co. KG
Automotive
3D Pick and Place Electrical Components
HMI
Tracability:
Source: Kromberg & Schubert GmbH & Co. KG
Data Matrix Code
Automotive
Potential Automotive-Applications
Tracability:
Source: Kromberg & Schubert GmbH & Co. KG
Data Matrix Code
Seat Module
Sensors and Actuators
In-Door Electronics
Lightning
Switches
Automotive
Automotive Steering Wheel
TRW’s “Base-Line” MID after assembly:
Source: I&T 3D-Produktionsgesellschaft mbH
Automotive
ASIC deposited onto MID with LPKF-LDS®
technologyConventional Solution
Sensor ASIC
MID using LPKF-LDS® technologySource: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Flipped
Positioned
SignalGround
Support bumps
Automotive
Qualification:
Temperature Shock
-40°C…150°C
Realized by Flip Chip on LPKF-LDS® MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Automotive
Qualification:
Warm-Humidity
85°C/85% rel.H
300 pcs. - no defects after 1000hSource: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Automotive
Former deviceDiameter approx. 10mm
Prototype new Sensor Diameter: 5mm Realized by Flip Chip
on LPKF-LDS® MID
Source: Robert Bosch GmbH
Rotation Sensor for Automotive Brake System (ESP)
Automotive
Final Part
Source: ZMD AG
AMR Sensor (Automotive)
Material: Vectra E840i LDS
Automotive
Source: Harting
Sensors
LED Lighting
LED Indicator Light
Source: Kromberg & Schubert GmbH & Co. KG
before
after
Automotive
LPKF-LDS® antenna
Cellular Electronics
Hundreds of millions of cell phone, tablet antennas produced annually
Source: Harting Mitronics AG
RFID-Transponder
RFID
LDS 3D-MID
Company Overview
SelectConnect Technologies
Division of Arlington Plating Company
Palatine, Illinois
Company Overview
Source Point Associates
Brentwood, California 94513
Larry Megugorac 925.516.2082
Mobile 650 678 8987
Larry@SourcePointAssociates.com
www. SourcePointAssociates.com
LinkedIn:
http://www.linkedin.com/in/larrymegugorac
Twitter: @SourcePointAsso
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