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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
AMF-AUT-T0732
SBCs: Power Management Solutions for 16- & 32-bit MCUs in Automotive Applications
November 10, 2010
Designing with Freescale SeminarsToronto
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Introduction
During this session we will review :
• Automotive market overview for:
Power Management
Networking
• Freescale System Basis Chip (SBC) Portfolio with CAN and/or LIN and its combination with MCU (Micro-control Unit) market
• See the latest Freescale solutions for:
Energy Management
Functional Safety
EMC/ESD (Electro-Static Discharge) Immunity
• 45 minutes of Presentation, 15 minutes of Q&As
2
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Session Objectives
After completing this session you will be able to:
• Detail the content of a System Basis Chip
• Select the right SBC for your MCU
• Describe how the Freescale Analog Solution can help to improve energy savings
• Describe how the Freescale Analog Solution can help to secure safety application features
• Ask your Freescale representative about the latest tools available to design with our SBCs
3
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 44
Agenda
Market Challenges and Trends
Automotive Networking and EMC Considerations
Power Management and System Values for MCU Segmentation
System Basis Chip Solutions and Values with CAN/LIN
Easy-to-Use Tools to Encourage Design-ins
Summary
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
5
SBC Ecosystem
System
Management
Power Management
Physical
Layer
SBC in a Few Words
SBC means System Basis Chip, which combines required design functionality on a
single standard IC:
• Physical Layer
Transmits digital network information across the network via
OEM (Original Equipment Manufacturer) standards
• Power Management (LDOs - Low Drop-Out Regulators)
Supplies MCU, CAN, and other loads
• System Management
Manages Energy savings
Contributes to (Electronic Control Unit) ECU
safety modes
• Easy to Use Ecosystem (Support Community)
Simplifies customer usage
Can provide Electro Magnetic Compatibility (EMC)
compliance reports
Freescale introduced the first SBCs to the market over 10 years ago
Large customer base built a community, a base of system expertise,
and network acceptance
100 Million SBCs (cumulative) were sold into the market before a product family was
launched
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
1990s: The Birth of Networking into Cars
Challenges:
• Diversity of Networks
• Proprietary Solutions
• Need for Consistency and Reuse
7
Body Controller
Engine Management
CAN, VAN or J1850 (depending on car makers)
Anti-lockBraking
Instrument Cluster
Airbag
Immobilizer Radio
Lighting
Alarm
Trailer Connection
Air conditioning
Window lift
Proprietary communication, K-line
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
2000s: CAN and LIN Standards Dominate
Car OEM strategy is oriented to select the best architecture
Distributed and centralized architectures coexist and depend on OEM’s car strategy
LIN provides intelligence closer to the load (reduce EMC, wire harness, lower EMC)
Challenge: to manage the complexity with limited bandwidth and non-determinism
8
RKE and TPMS Rx
Engine Management
CAN (Controller Area Network)
Anti-lockBraking
LIN (Local Interconnect Network)
Instrument Cluster
Airbag
Immobilizer
Infotainment
SJB
Body Controller / Gateway
Seat modules
Door module
DisplayMotors
Motors
Sunroof
HVACFlaps
Lighting
Transmission
Power Steering
Fuel Pump
GlowPlug
OccupantClassification
Radio
Seat BeltPretent.
MotorsMotors
Motors
FlapsFlaps
Flaps Blower
MotorsMotors
MotorsMotors
Steering column
Alarm
InfotainmentDiagnostic CAN
Amplif.
Rear module
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 9
2010s: Hierarchical Networks
RKE and TPMS Rx
Engine Management
CAN
Anti-lockBraking
LIN
Instrument Cluster
Immobilizer
Display
Body Controller / Gateway
Seat modules
Door module
VideoMotors
Motors
HVACFlaps
TransmissionPower Steering
Fuel Pump
GlowPlug
OccupantClassification
Radio
Pass. Seat Belt Pretent.Motors
MotorsMotors
FlapsFlaps
Flaps Blower
MotorsMotors
MotorsMotors
St. column
Alarm
MOST/Ethernet
Diagnostic CAN
Amplif.
Rear module
FlexRay
Cooling fan
Integrated Chassis Management
SuspensionSuspension
SuspensionSuspension
VideoVideo
Adaptive Cruise Ctrl
Driver Seat Belt Pretent.
Battery management
Active Steering
SJBLighting L
Door moduleMotorsMotors
MotorsMotors
Nav
Lighting R
Rain sensor
MotorsMotors
Motors
4x4
Temp
Park Assist
Rear Lighting
Blind Spot Det.
Wipers
Flaps
Flaps
NOX
Sensor cluster
Sunroof
Airbag
Complex architectures tend to make the car maker want to harmonize, resulting in:
• Convergence of Systems (standardization of LIN, CAN)• Improved robustness of in-vehicle networks• Increased bandwidth, with backbone architectures• Each new function cannot generate a new ECU• Car Electrification:
•Higher Voltages•Higher Power Revolutions
• Partitioning by application area and the combining of functions
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 11
Standard Physical Layers: the Landscape
J2602 / LIN CAN Low Speed / High Speed
20kBd
Single Wire Bus
Master Slave
125kBaud
DifferentialFault Tolerant
1MBaud
Differentialw Diagnostic
CSMA –Carrier Sense Multiple Access
2.5 / 5.0 / 10MBaud
Differential
TDMA – Time Division Multiple Access
Low Side Half Bridge Full Bridge
Flex Ray
10kBd
Body, PowerTrain All Market Segments Safety, Gateways
High growth Ramp upDecrease Growth
Network Arbitration
Physical Layer
Bandwidth
Hardware
Topology
Market target
Market trend
MotivationsProduction start
Low Cost / Plug & Play
Decision close to loadStarted in 2000
Bandwidth / DeterminismInter-car areasStarted in 2006
Fault TolerantLow BandwidthStarted in 90s
BandwidthIntersystemStarted 80’s
Freescale Analog Portfolio (MC33)
689, 91x, 62x, IDCs 389, 889 742, 989, 90x Flex Ray P/L IP (hold)
700Mu 100M#<100Mu 900MuTAM, in 2014*
200kBd/189kBd
Diff / SinglePower & Signal
Sync. / Bidirect.
Half Bridge
DSI / PSI5
Safety
Ramp up
SafetyReduce wires
Started in 2000
P/L avail.
100Mu
*Source : strategy analytics
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Source of Electromagnetic Disturbances
12
IC
RF signals from communication devices
EM waves from electrical devices
ESD from humans or machines
Lightning
Electronic devices inside the car
Inductive loads or motors
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Impact of Technology Trends on Electromagnetic Conduction (EMC)
13
Clock frequency10
100
1000
10000
1990 1995 2000 2005 2010
[MHz]
Years
Clock frequency10
100
1000
10000
1990 1995 2000 2005 2010
[MHz]
Clock frequency10
100
1000
10000
1990 1995 2000 2005 2010
[MHz]
Years
Supply Voltage
1
2
3
4
5
Years1990 1995 2000 2005 2010
[V]Supply Voltage
1
2
3
4
5
Years1990 1995 2000 2005 2010
[V]
Years
Channel length
0.4
0.8
1.2
1.6
1990 1995 2000 2005 2010
[µm]
Years
Channel length
0.4
0.8
1.2
1.6
1990 1995 2000 2005 2010
[µm]
Channel length
0.4
0.8
1.2
1.6
1990 1995 2000 2005 2010
[µm]
Higher Integration
Higher Switching and Noise
Higher Frequencies
Higher Frequency Spectrum
Lower Voltage
Lower Noise Margin
Higher Sensitivity
More emission
Less immunity against EMC/ESD
More emission
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 14
Vehicle
Electronic Control Unit (ECU)
Printed Circuit Board (PCB)
IC
Stress Propagation
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Understanding Standards: the Specification Landscape
15
Target: No External
Protection
²
ISO 10605
ESD
IEC 61000-4-2
ESD
ESD JEDEC
HBM, CDM, MM
IEC 61967
EMC - Emission
ISO7637-2
Electrical disturbance
IEC 62132
EMC - Immunity
ISO 11451 EMC
Emission
Conducted radiated
ISO 11452
EMC - ImmunityISO 10605
ESD
CISPR25
CISPR12
AECQ100
CISPR25
CISPR12
95-54-EC
95-56-EC
SAE J551
SAE J1113
Car OEM specific
requirements
Specific
requirements
2004-104-EC
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Design for High ESD and EMC Robustness Example of ESD Stress: System Level vs. IC Level
16
0
5
10
15
20
25
30
35
40
-50E-9 50E-9 150E-9 250E-9
Time (s)
Curr
ent
(A)
IEC61000-4-2150pF/330ohm +8kV
ISO10605330pF/330ohm +8kV
System level
IC level
AECQ100
+2kV (HBM)
+500V (CDM)
+200V (MM)
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 17
Physical Layer (P/L) Performance vs. Acceptance Tests
Conformance Conformance
Test (C&S)Test (C&S)
EME (IBEE)EME (IBEE)
EMI (IBEE)EMI (IBEE)
ESD HBM (IBEE)ESD HBM (IBEE)
ESD IEC (IBEE)ESD IEC (IBEE)
150pF, 330 Ohm150pF, 330 Ohm
LIN P/LLIN P/L
LIN 2.0 / 2.1LIN 2.0 / 2.1
J2602J2602
40dB40dBµµV @ 200kHzV @ 200kHz
15dB15dBµµV @ 10MHzV @ 10MHz
Direct Power InjectionDirect Power Injection
& Bulk Current Injection& Bulk Current Injection
>+/>+/--8kV8kV
+/+/--11kV w/o Cap11kV w/o Cap
+/+/--20kV w Cap20kV w Cap
Passes StandardPasses Standard Fails StandardFails Standard
** with choke** with choke
CAN HS P/LCAN HS P/L
GIFT certifiedGIFT certified
ISO11898ISO11898--2 and 2 and --55
55dB55dBµµV @ 250kHz**V @ 250kHz**
25dB25dBµµV @ 10MHz **V @ 10MHz **
Direct Power InjectionDirect Power Injection
& Bulk Current Injection& Bulk Current Injection
>+/>+/--8kV8kV
>+/>+/--8kV8kV
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Different Standard Solutions for Different System Needs
Low Power Strategies
• Low consumption
• Wake up (W/U) detection & time management
• Periodic scan & consumption events
Functional Safety Level• Watch Dog integration
• Fail safe state machine
• FMEA (Failure Modes
& Effects analysis)
and safety
19
ECU_A ECU_B ECU_D
RF
ECU_C
LIN_a
CAN_2
LIN-b
Vdd
CAN P/L
Vreg
BUS
INH
Simple low power mode
Mainly used with Vbat disconnect
ECU: A
MCU
Vbat
LIN / CAN
Vreg
Vbat
SBC
Vdd 8/16bitMCU
BUS
ECU: B
Medium complexity
CAN & local wake-up
16/32bitMCU
Vdd
Vbat
RST
INT
SAFE
CAN P/L
SW
LDO
OSC
BUS
SBC
MSDI
LIN RF
ECU: C,D
CAN
High complexity in W/U mechanisms
CAN, LIN wake-up
MC33902 MC3391x, 903 MC33904,5
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2020
Power Management Alignment with MCU Solution
MCU Type 8 bit MCUs 16bit MCUs 32bit MCU 32bit MCUs
TAM 2014 (Mu) 950Mu 500Mu 580Mu
Market Segment Freescale MCU Core SO8 S12, S12X Power Arch (z0,1) Power Arch (z3,4,5,7)
PowerTrain
Engine Control S08SG/MP MPC563xM Parts TBA
Transmission MPC563xM Parts TBA
Hybrid S12DG MPC563xM Parts TBA
Body
BCM/Gateway S08SG S12XE MPC560xB (BCM) MPC560xB Gateway
Windows/Doors/Seat S08EL / S08SG S12P, S12XS, S12G MPC560xB
Lighting S08DZ S12XS, S12XE MPC560xB
HVAC S08LG S12XH, S12G MPC560xB
Security S08EL / S08SG S12XS
Safety & Chassis
Braking / VSC S08SG/SL/EL
Suspension S08SG/SL/EL MPC560xP MPC564xL & TBA
Steering S08SG/SL/EL MPC560xP MPC564xL & TBA
ICM MPC560xP MPC564xL & TBA
ADAS MPC560xP MPC564xL & TBA
Airbag S08SG/SL/EL
TPMS
Driver InfotainmentDashboard SPECTRUM
Infotain/Telematics
SBC Market
Seat Belt Pret.
TPMS receiver
ME Dashboards
Fuel pump, Glow Plug, LE EMS
HE Door/SeatLE/ME BCM ME/HE BCM
Junction BoxW/L, Roof
HVAC
LE EMS –Low End Engine ManagementSystemsW/L – Windows/Window LiftLE/ME BCM - Low and Middle End Body Controller ModuleHE – High End Door & Seat ModulesHVAC – Heating, Ventilation, and Air Conditioning Seat Belt Pret.- Seat Belt PretensionerTPMS – Tire Pressure Monitoring System
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 22
LIN Solutions
Wake UpFrom Vsupply
LIN 2.0 / J2602
Hall SensorSupply
SPI & Watch Dog
Low Power Modes
LQFP32
Scalable System Integration
• For space savings, for applications
distributed close to the load, with a
scalable pinto-pin compatible family
solution
High EMC and ESD performance
• Ultra low noise emission through
innovative wave shape management
• Sustain harsh system ESD pulses up to
+/-11kV (gun stress – 150pF/ 330Ohms)
without the need for external protection
• Sustain latest DPI requirements
Low Power Modes
• Minimize battery discharge
Easy to use:
• LIN vehicle OEM acceptance reports
MCU Power ManagementFor 8bit / Low end 16bit MCUs
5V LDO +/-2% 60mA(Vdd)
DC Motor Pre-Driver
DC Motor Current Monitoring
33910
33911
33912
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 23
Ballast regulator (Vaux)
Flexible (I/O)Wake/INH
CAN High Speed
Internal CAN Regulator (Vcan)
LIN (1 and 2 options)
SPIAvd W/D
Secured State Machine
Low Power Modes
SOIC Wide Body Package with Exposed Pad
Power Management Scalability
MCU Power Supply (Vdd): 5V or 3.3V / 150mA (Power Split option for scalable needs; up to 300mA)
5V or 3.3V Vreg for Auxiliary loads
Dedicated 5V Vreg for CAN High Speed
Functional Safety
Innovative Cranking Pulse Management during Vdd low.
Fail Safe & configurable State Machine
Extensive protection and diagnostics
Energy Savings
Ultra Low Power Modes (typical:15µA @Vdd = Off)
Innovative Wake Up Management and cyclic sensing
Robust Physical Layers
Certification to LIN2.1 and ISO11898-2-5 standards
Successfully passing stringent EMC, ISO, ESD standards
Easy to use :
Debug Mode saves time during Application development
Ecosystem: can lower development time and simplify access
Flexibility & compatibility:
Selectable parameters (Reset (RST) time, Watch Dog)
1 or 2 LIN options (905S and 905D)
Power sharing (Vdd ballast)
MCU Regulator (Vdd)
33904
33905
33903
CAN & LIN Solutions
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Energy Efficiency : Four Functions Contribute to Reduce System Current Consumption
24
RUN modeAll ECU functions
running
STOP mode
T-stop
STOPmode
T-stopT-awake
Timer wake up
C – Reduce awake time
•Optimise SPI structure& commands
•Optimize stop mode over current detection
C
D – Increase stop mode
•Increase timer duration
•A few RAM cells are included in SBC
D
B - Reduce “low power mode”consumption
B
Awakestate
A - Reduce “run mode”current consumption
A
Wake up
RUN modeAll ECU functions
running
Current consumption
All Four Act to Reduce System Current Consumption
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Automotive Commitment to Reduce Low Power Modes (LPM)
25
Stop mode currentLPM ACTIVE VDD
Sleep mode currentLPM ACTIVE VDD
0
10
20
30
40
50
60
70
80
90
MC33742 UJA1065 TLE7263 MC3390x
Innovative Design Architectures LowerCurrent Consumption in Stop and Sleep Modes
SYSTEM INNOVATIONS FOR LPM
•Reduce system awake time
•Improve SPI data management (saves
time)
•Use SBC memory to save data when the
MCU is in sleep mode
•Inhibit wake-up in specific conditions
µA
compet1 compet2 MC3390xMC33742
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 26
Manage Battery Cranking Situations
Vdd
Vsup
Dro
p
~200m
V> 3.8V (typ)
<=5V
5V
11.3V13V
4.8V
RSTb
RSTb
INTb
Vbat
4.5V
~5V
12V13.5V
4.6V
3.2V
Regulator Vdrop
Maskable INT on Vbat < 9VVsup <7V and Vdd low.
3 Vdd under voltage thresholds:
4.6V => Reset or INT (SPI selectable)
3.2V = > Reset
Vbat
8.6V
6V
VSUP1 VDD
Vbat
D
Control
Csup Cvdd
SBC
ECU
MCU
RST
INTVsense
INT
INT
6V
INT
Vse
nse_
low
Vdd
_low
Vsu
p_hi
gh
Example of INT capabilities & a possible strategy
New
Reset at Vdd < 4.6V
Vsu
p_lo
w
Dio
de d
rop
INT Dro
p
>200m
V
Vbat Capacitor Reduction:
•Cost Savings•Space Savings
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 27
Functional Safety - MCU/SBC Integrity
SBC secured MCU
Benefits•Contribute to application safety improvements•Definition of the IC to address functional safety situations•HW innovations and documentation to ease safety assessment process
SBC Diagnostic• CAN /LIN
• I/O
• VREGs
• Wake up event monitoring
• RST/INT source identification
• Critical pin monitoring (RST/SPI)
• Fail safe output
SAFE & ROBUST STATE MACHINE CRITICAL CHANGE
• Random and unpredictable protocol to change critical SBC behavior
SPI Data Integrity • Read back SPI data
• Optional parity check
• SPI clock check
• EMC disturbance-proof
ECU Bill of Material Traceability• P/N & product revision is register-encoded to
guarantee traceability
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Functional Safety - MCU/SBC Integrity FMEDA of the SBC Safety Related Subsystem
Three abstraction levels:
• SBC IC level
• ECU level
• Vehicle level
Analyze each failure in the FMEDA (Failure Modes, Effects, & Diagnostic Analysis) and try to assign FIT (Failure In Time ) data for each failure
28
5V Auxiliary regulator
VDD regulator
Fail safePower management
State machine
OscillatorSPI
Analog monitoring
Signal conditioning & Analog mux
Configurable
input-output
5V-CAN
regulator
Enhanced
High-speed CAN
physical interface
LIN 2.0 interface #1
LIN 2.0 interface - #2
SBC 33905
MCU
5V
RST
INT
ATD
TXD (CAN)
TXD (CAN)
TXD (SCI) LIN #2
RXD (SCI) LIN #2
RXD (SCI) LIN #1
TXD (SCI) LIN #1
RST
INT
5V
MOSI
MISO
SCLK
CS
MOSI
MISO
SCLK
CS
MUXOUT
5V CAN
TXD
RXD
CANH
Split
CANL
TXD_L1
RXD_L1
VS2-Int
VS2-Int
LIN_Term1
LIN_1
LIN_Term2
LIN_2
IO_1
Vsense
GND
Dbg
SAFE
VSup2
IO_0
VBAUX VCAUX VAUX VSUP1 VE VB
Failsafe
circuitry
ESD
ESD
VBatt
ESD
ESD
ECU level
Vehicle level
LIN1
LIN2
CANL CANH
GND
Switch input
Ext. 5V supply
2
1
4
10
3
9
11
12
1413
15 17
16
7
8
3 15 4
5
7
6
19
17
2021
22
23
24
25
11
10
13
12
8
16
1
7
1
2
1
3
4
5 6
9
2
56
5b
18
14 14
26
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Monitoring of Critical Environment Conditions
29
D1
VBAT
VSUP S_in
IO-1
IO-0
Multiplexer
VDD-I_COPY
RM(*)
(*)Optional
A/D in
MCU
S_iddc
MUX-OUT
S_g3.3
Temp
VSENSE
S_g5
RSENSE 1k
RMI
S_ir
S_in
S_in
S_in
Vref: 2.5V
5V-CAN5V-CAN
VSUP Monitoring
• Monitor battery voltage after rev. battery
• Protection diode
VSENSE
• Detect sudden voltage
drops on VBAT
• Compare against VSUP
voltage
I/Os
• Monitor direct input voltage
•Identify short circuits
Temp
• Identify temperature variations on the IC (to highlight a possible failure). Temp coeff 9.6mV/°C
Vref
• Have a fixed reference voltage level, to compare against other voltages (i.e. Vdd supply, VCan, Vaux)
Vdd-I_copy
• Identify variations on the MCU load current to identify potential failures (short circuits, internal failures on the MCU)
New
Benefits• Integrate key voltage monitoring to save discrete components
• Solution: manage cranking pulse with low cost design (no SMPS)• Cost savings on buffer capacitors• Space savings on buffer capacitors
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
SBC Evaluation Board – KITMC33905SEVME
Quickly evaluate the performance of SBC Gen2 with CAN & LIN
Comprehensive technical documentation
Easy-to-use tools such as thermal predictions and hands-on training
31
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 32
USB to SPI and SBC Gen2 Setup Interface
USB link
Graphical interface USB to SPI board (s)
Set up HW & SW:• SBCGen2 User Software (.exe)• KIT: USB to SPI
• Part number: KITUSBSPIDGLEVME
• Evaluation board (EVB) for the MC3390x•Part number: KIT33905D5EKEVBE
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
MC33904 and MC33905S/D Development Tools and Support
Fast Evaluate the Performance of SBC Gen2 with CAN & LIN
• Easy-to-Use EVB - Evaluation Platform kit including MC33905D EVB Evaluation Board (Standard EVB):
• USB to SPI Board KITUSBSPIDGLEVME
• User-Friendly graphical interface
• Standard EVB – basic evaluation board
Technical Documentation:
• Datasheets
• Technical reports (EMC & ESD) and OEM’s release status
• Application notes
• Official reports from external laboratories: IBEE-Zwickau,
• ISO11989-2-5 CT C&S, LIN2.1CT C&S, J2602 C&S
• EVB contents
Easy-to-Use solutions: Support Design Development
• Thermal prediction tool & Iq calculator (tools)
• Technical Training and hands-on training on demand
33
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 35
S12XS faimily60-128k
Perf
orm
an
ce
S08 family16-60k
551x, 561x families256k – 2.0M
S12X family128k – 1M
Summary – Range of MCU Companion (Attach) Solutions
8-bit 16-bit 32-bit (low end)
MC3391x
MC33902/903
Current between 20 to
60mA
Cost driven solutions
Simple system
requirements
Currents between 60 - 120mA
Safety System requirements
Low power modes
Pinout & Power Management Scalability
MC33904 w/o Power Sharing
MC33905 w/o Power Sharing
MC33742
Currents between 100 up to 200mA, external ballast required
Improved Safety requirements
Advanced Low Power Modes
Companion chip of Power Architecture MCU solutions for Body and some Safety & Power Train
MC33904 with Power Sharing
MC33905 with Power Sharing
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Freescale SBCs for Automotive
Freescale’s next generation of SBCs addresses the needs of OEMs for in-vehicle networks in cars that have increasing electrical content
Freescale SBCs integrate an energy management module to power the system MCU. The transceiver interfaces to connect with in-vehicle networks and connection to low-power modes conserves battery life
The new SBCs integrate fully certified CAN and LIN according to the latest electrical/ESD/EMC market requirements
Freescale is the No. 1 supplier of automotive semiconductors and has been at the forefront of the automotive industry for more than 30 years
36
31 2
Functional SafetyEnergy Efficient High EMC Robustness
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 37
Market Problems
Problem Description Implications
Pollution and cost of car ownership
CO2 emissions too high
Fuel price generates need for higher energy efficiency
Reduce weight of ECUs
•improve fuel efficiency
•save money (plastic vs metal)
•but reduce Power dissipation (1W=1€)
Reduce power losses on ECU (20% reduction)
Use appropriate Power: harmonize Low Power Mode
Network sensitivity to harsh EMC and ESD
constraints
Higher number of connected applications per car in harsh car environment
Evolution to system behavior vsIC breakdown in the past
Standardization of specification for Physical Layers.
Increased EMC and ESD robustness criteria to improve system quality
New trend of ESD Class A robustness (no reset allowed)
Large car recalls highlight the need for
fail safe
Failure is not an option, when a failing application needs to predict the failure state
Safety related product definition is expected
Safety documentation application guide
Long waits for car maintenance at garage
Several decades of hours to
reprogram a full car at garage
Network complexity
Centralization of electronics controls per car area
(Chassis, Power Train, Body, Info)
Complementary strategy with LIN distributed nodes
Diagnostic protocol under investigations to save time (objective less than 1 hour to reprogram full car)
Influence of emerging markets
Complex solutions and time constraints can be a barrier to the sales process
Need simple and cost driven solutions
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 38
3390333902 33904
Vreg MCU (3.3V/5.0V)
Vreg MCU w/Power Sharing
Vreg CAN
Vaux ballast (3.3V/5.0V)
eCAN HS (ISO11898-5)
eLIN
I/O (config. Input/Output)
SPI (16-bit)
Analog MUX
Low Power (Voff/Von µA)
Fail safe
Package
3
MCU companionAutonomous
CAN HS node 8 / 16 bit MCUs S12XE / BOLERO
PICTUS, MONACO
100mA 150mA 150mA
41
Adv W/DStandard
15/25 (+10 osc.)15/2515
Pseudo SPI
Features
1 Input
Adv.Adv.Std.Std.
33905S
SOIC32ePSOIC32ePSO14
Adv W/D
2
150mA
Adv.
33905D
Adv W/D
21
SOIC54eP
+ 300mA + 300mA + 300mA
SOIC32eP
S12XE / BOLEROPICTUS, MONACO
S12XE / BOLEROPICTUS, MONACO
new
MC MC MCMC
Freescale SBC CAN LIN Gen2 Portfolio Segmentation
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Wide Range of SBC Applications
High-Performance Automotive Applications
• Body control modules
• Lighting modules
• Door/seat modules
• Seatbelt pretensioners
• Central TPMS
• Fuel/water pumps
• Glow plugs
• Low-end engine management systems
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 40
0
200
400
600
800
1000
1200
1400
1600
1800
2000
M U
nits
Proprietary 17 15 12 9 5 3 1 1 1 1
Multimedia 6 9 12 17 19 28 39 49 70 84
Flexray 0 0 0 1 2 5 13 23 37 51
Safety Bus 8 13 18 24 27 37 50 64 80 103
LIN/J2602 34 76 135 180 197 271 371 463 555 647
J1850 102 84 64 40 12 1 0 0 0 0
CAN 406 467 531 560 503 607 741 831 917 1003
Total Nodes 573 664 773 831 764 952 1215 1431 1660 1889
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
Source: Strategy Analytics
13% CAAGR
Includes NAFTA, Europe, Japan, S.Korea, China, India
BODY CAN HS,
353.7, 33%
INFOTAINMENT -
CAN HS, 126.0,
12%
BODY CAN SW,
23.6, 2%
CHASSIS - CAN
HS, 121.8, 11%
BODY CAN LS,
94.3, 9%
SAFETY - CAN HS,
163.4, 15%
PWT - CAN HS,
192.1, 18%
BODY CAN SW,
61.7, 9%
BODY CAN HS,
61.7, 9%
INFOTAINMENT -
CAN HS, 80.6, 12%
PWT - CAN HS,
119.5, 18%
SAFETY - CAN HS,
93.0, 14%BODY CAN LS,
185.2, 27%
CHASSIS - CAN
HS, 75.7, 11%
CAN Market OverviewTotal Available Market (TAM)
of 1000 Mu CAN Nodes in 2014
CAN Network Topology: CARRIER SENSE MULTIPLE ACCESS (CSMA)
TARGET MARKET : All Automotive Segments• Body : Gateway, BCM, Door, Lighting, Column, …• Infotainment : Dashboard, • Safety & Chassis : Break, Suspension, Steering, Airbag, …• Power Train : EMS, Transmission
CAN market & segmentation (Market,Mu,%)
2009
2014
Legend : Market, Volume (Million units), Market share
Automotive Physical Layer Market
Source : strategy analytics
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 41
0
200
400
600
800
1000
1200
1400
1600
1800
2000
M U
nits
Proprietary 17 15 12 9 5 3 1 1 1 1
Multimedia 6 9 12 17 19 28 39 49 70 84
Flexray 0 0 0 1 2 5 13 23 37 51
Safety Bus 8 13 18 24 27 37 50 64 80 103
LIN/J2602 34 76 135 180 197 271 371 463 555 647
J1850 102 84 64 40 12 1 0 0 0 0
CAN 406 467 531 560 503 607 741 831 917 1003
Total Nodes 573 664 773 831 764 952 1215 1431 1660 1889
2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
Source: Strategy Analytics
13% CAAGR
Includes NAFTA, Europe, Japan, S.Korea, China, India
BODY, 618.2, 90%
CHASSIS, 0.0, 0%INFOTAINMENT,
27.6, 4%
SAFETY, 16.9, 2%
PWT, 30.8, 4%
Physical Layer MarketTAM of 700Mu LIN Nodes in 2014
LIN NETWORK TOPOLOGY : MASTER – SLAVE
TARGET MARKET : LIN Slave Nodes Window Lift, Roof, HVAC, Camera Control, Siren, Compass, Rear Wiper, Rear Climate control, Auxiliary Alarm, Remote, Interior Mirror, Column position sensor, Universal Door opener, Vbat monitor, Accessory switch monitor, Seat memory, Rain sensor …
BODY, 240.2, 90%
CHASSIS, 0.0, 0%
INFOTAINMENT,
9.3, 4% SAFETY, 5.0, 2%
PWT, 10.9, 4%
LIN Market & Segmentation (Market, Mu, %)
2009
2014
Legend : Market, Volume (Mu), market share
Automotive Phys. Layer Market
Source : strategy analytics
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 42
LINSBC2.5G Market Positioning
Benefits Differentiation on low power management
Saves EMC /ESD circuits
Do more than SBC- Relay control- PWM motor- LED dimming
Saves hall sensor supply Saves external calibration
Differentiation on fail-safe mode and save external circuits
Key features- 50mA 5V low dropout voltage regulator with Low-
Voltage-Reset (LVR) - Windowing watch-dog with prescaler- Sleep and Stop low-power modes- Cyclic wakeup and sense (20ms-1120ms)
- LIN 2.1 physical layer interface 11kV ESD, 36dBm DPI immunity, adaptive to bus impedance
-2x low-side relay drivers including:-PWM capability up to 10kHz-Load disconnection detection/Current limitation/Thermal shutdown
-2x 50mA high-side switch:-PWM capability up to 10kHz-Load disconnection detection/Current limitation/Thermal shutdown
- 4x wake-up/high voltage analog/digital inputs- Switchable 5V HALL sensor supply- Precision differential-amplifier with selectable gain for current sensing- Battery voltage, wake-up pins, voltage monitor, and die temp monitor
Target applications
• Anti-pinch window lifter
• Sunroof
• LIN switches / keypad
• Multifunction steering wheel
• LIN wiper
• LIN diagnostics
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 43
ESD Contact
From P. Besse
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Product / Application / MCU Companion
Products to Address Power, System, and Network Management with LIN
44
Products Analog P/N Order part number Package Applications MCU companion chip
SBC LIN Gen2.5 with Motor Control and I sense
MC33912G5 MC33912G5AC
MC34912G5AC
LQFP32
Window Lift, Roof, Water pump, … with current recopy
8Bit
Low end 16Bit
SBC LIN Gen2.5 w Motor Control
MC33911G5 MC33911G5AC
MC34911G5AC
LQFP32
Window Lift, Roof, Water pump, …
8Bit
Low End 16Bit
SBC LIN Gen2.5 with HSD
MC33910G5 MC33910G5AC
MC34910G5AC
LQFP32
General Purpose LIN Slave nodes
8Bit
Low end 16Bit
MC33xxx : is used for -40°C / +125°C temperature rangeMC34xxx : is used for -40°C / +85°C temperature range
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Product Numbering
45
MCZ 33 905 S 5 EK / R2
QUALIFICATION STATUS:PC PRE-QUALIFICATION,
ENGINEERING SAMPLES
MC FULLY QUALIFIED
xxZ ENVIRONMENTAL PKG
(SOIC only)
TEMPERATURE RANGE:
33 Ta = -40°C to 125°C
34 Ta = -40°C to 85°C
VARIATION:
5 5.0V VDD output Regulation Voltage
3 3.3V VDD output Regulation Voltage
TAPE AND REEL DESIGNATOR:
R2 TAPE AND REEL
PACKAGING DESIGNATOR:
EK SOICeP LEAD FREE
DEVICE DESIGNATOR904 = CAN only905 = CAN and LIN
VARIATION:
A No LIN (used on 904 only)
S Single LIN
D Dual LIN
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Product / Application / MCU Companion
Five products to address Power, System, and Network Management
46
Products Analog P/N Order part number Package Applications MCU companion chip
SBC Gen2 CAN HS & 2 LIN
MC33905D - 2 LIN
3.3V Vdd option
5.0V Vdd option
PCZ33905D3EK
MCZ33905D5EK
SOIC54EP
BCM, SJB , Door, Gateways …
MPC5516
S12XE
V850
SBC Gen2 CAN HS & 1 LIN
MC33905S - 1 LIN
3.3V Vdd option
5.0V Vdd option
PCZ33905S3EK
PCZ33905S5EK
SOIC32EP
BCM, Door, Gateways …
MPC5516
S12XE
V850
SBC Gen2CAN HS
MC33904
3.3V Vdd option
5.0V Vdd option
PCZ33904A3EK
PCZ33904A5EK
SOIC32EP
BCM, Doors,EPB, Seat Belt, Fuel Pump ...
MPC5516
S12XE or S12
SBC Gen2 LightCAN HS
MC33903
PCZ33903A3EG
PCZ33903A5EG
SO20
RadioHVAC…
S08,S12 (low end)
Microchip
AutonomousCAN HS
MC33902 PCZ33902EG SO14 Power TrainGateways …
Low end SO8 in very specific cases
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
IBEE – Zwickau – MC333905Final Test Report
47
IBEE Zwickau front pages test report
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Test Report Adder for LIN2 (MC33905D)
48
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 49
CAN High Speed Conformance Test
CAN conformance front page test report
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 50
J2602 front page test report
LIN-J2602 and LIN 2.1 Conformance Test Reports
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 515151
54 SOIC eP
FeaturesLDO Linear Power Supply 5.0V or 3.3V, up to
300mA through external transistor.
LDO Auxiliary Regulator with Ballast (5.0 / 3.3V configurable)
Under Voltage management for cranking
Internal 5V regulator for CAN driver supply
Low current consumption in sleep mode
Fail safe state machine linked with SAFE pin
Secured SPI with Watch dog capability
High precision Vsup sense monitoring
Multiple Analog sensing to 1 MUX output
CAN, ISO11898-2 and 11898-5 compliant
Dual configurable I/O with W/U feature
2 LIN transceiver 2.0, 2.1 compliant
Compatible with SAE J2602
Key CharacteristicsMCU Linear Vreg (LDO)
Current (w / wo ballast)
Bus Output
Data Rate
Stop/Sleep current
ESD (CAN/LIN) **
Operating voltage
Operating temp.
5.0 / 3.3V Conf.
150mA / 300mA
CAN
60kB/s – 1MB/s
15/25µA
±8000V
5.2V-27V
-40°C<Ta<125°C
Pinout compatible with MC33905S and MC33904
MC Qualified
MCU Companion chip :S12X, MPC5516
MPC560x
MC33905D – SBC CAN High Speed & 2 LIN Gen2
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 525252
MC Qualified
32 SOIC eP
FeaturesLDO Linear Power Supply 5.0V or 3.3V, up to
300mA through external transistor.
LDO Auxiliary Regulator with Ballast (5.0 / 3.3V configurable)
Under voltage management for cranking
Internal 5V regulator for CAN driver supply
Low current consumption in sleep mode
Fail safe state machine linked with SAFE pin
Secured SPI with Watchdog capability
High precision Vsup sense monitoring
Multiple Analog sensing to 1 MUX output
CAN, ISO11898-2 and 11898-5 compliant
Dual configurable I/O with W/U feature
1 LIN transceiver 2.0, 2.1 compliant
Compatible with SAE J2602
MCU Companion chip :S12X, MPC5516
MPC560x
Key CharacteristicsMCU Linear Vreg (LDO)
Current (w / wo ballast)
Bus Output
Data Rate
Stop/Sleep current
ESD (CAN/LIN) **
Operating voltage
Operating temp.
5.0 / 3.3V Conf.
150mA / 300mA
CAN
60kB/s – 1MB/s
15/25µA
±8000V
5.2V-27V
-40°C<Ta<125°C
Pinout compatible with MC33905D and MC33904
MC33905S – SBC CAN High Speed & 1 LIN Gen2
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 535353
FeaturesLDO Linear Power Supply 5.0V or 3.3V, up to
300mA through external transistor.
LDO Auxiliary Regulator with Ballast (5.0 / 3.3V configurable)
Under voltage management for cranking
Internal 5V regulator for CAN driver supply
Low current consumption in sleep mode
Fail safe state machine linked with SAFE pin
Secured SPI with Watchdog capability
High precision Vsup sense monitoring
Multiple Analog sensing to 1 MUX output
CAN, ISO11898-2 and 11898-5 compliant
CAN wake up & failure detection / mngnt
Quad configurable I/O with W/U feature
Key CharacteristicsMCU Linear Vreg (LDO)
Current (w / wo ballast)
Bus Output
Data Rate
Stop/Sleep current
ESD (CAN) **
Operating voltage
Operating temp.
5.0 / 3.3V Conf.
150mA / 300mA
CAN
60kB/s – 1MB/s
15/25µA
±8000V
5.2V-27V
-40°C<Ta<125°C
Pinout compatible with MC33905S and MC33905D
32 SOIC eP
MC Qualified
MCU Companion chip :S12X, MPC5516
MPC560x
MC33904 – SBC CAN High Speed Gen2
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
IC Level IEC Standards (150kHz to 1GHz)
54
Immunity Emission
RadiatedConducted
IEC 62132 IEC 61967
TEM Cell and wideband TEM cell
Bulk Current Injection
Direct RF Power Injection
Work Bench Faraday Cage
Radiated
Conducted
TEM Cell and wideband TEM cell
Surface Scan
1Ω/150Ω direct coupling
Work Bench Faraday Cage
Magnetic probe
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Emission Measurement
55
IEC 61967-4: 1Ω/150Ω Method E
mis
sio
n [
dB
µV
]
-1001020304050607080
1 10 100 1000
f (MHz)
0.1
Specification for emission
Em
issi
on
[d
Bµ
V]
-1001020304050607080
1 10 100 1000
f (MHz)
0.1
Specification for emission
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Immunity Measurement [1]
IEC62132-4 Bulk Current Injection (BCI)
• Injection in one or more wires
• Immunity to conducted current induced by
radiated disturbances
56
PASS
FAIL
Current monitoring
Power injection
Injection probe
Measurement
probe
GND
VSS
DUT
Idisturbance
DUT
monitor
Z DC
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
BCI Test Bench
57
ISO11452-4
Bulk Current Injection for
system immunity test 1MHz to
400MHz
IEC 62132-3
Common test method for
characterizing communication bus
(CAN, LIN, Flexray) and power supply
Injection
clamp
System Level
Current probe
DUTPower
Supply
Wire
IC Level up to 400mA
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Immunity Measurement [2]
IEC62132-4 Direct Power Injection (DPI)
• Conducting RF resulting from radiated
• High degree of repeatability
• Up to 36dBm 4 Watts +40V / -40V !
58
PASS
FAIL
Amplifier
DC bloc
DC
RF
Generator
DUT
monitor
150kHz – 1GHz
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
Immunity Measurement (DPI)
59
Imm
un
ity
leve
l [d
Bm
]Current injection limit
15
25
30
35
40
1 10 100 1000f (MHz)
20
PASS
Specification
FAIL
10
Imm
un
ity
leve
l [d
Bm
]Current injection limit
15
25
30
35
40
1 10 100 1000f (MHz)
20
PASS
Specification
FAIL
10
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
ESD Standards and Test Procedure
ESD System Level Standards
• ISO 10605 (Jul. 2008)
“Road vehicles – test methods for electrical disturbances from electrostatic
discharge”
• IEC 61000-4-2 (Dec. 2008)
“Part 4: Testing and measurements techniques, Section 2: Electrostatic
discharge immunity test – Basic EMC publication”
ESD/EMC Test Methods At The IC Level (not standard)
• Specific OEMs Requirements
“Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive
Application”, Audi, BMW, Daimler, Porsche, Volkswagen
“LIN Conformance Test Specification Package for LIN2.1”
• ESDA Human Metal Model (HMM)
“Workgroup 5.6 of the ESD Association has developed a test method for
applying IEC61000-4-2 at the IC level”
60 /HMM09/
TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.
ISO10605 vs IEC61000-4-2
61
ESD STANDARDS ISO 10605:2008 IEC 61000-4-2:2008
ParametersContact
(Conductive Surface)
Air
(Non-Conductive Surface)
Contact Air
Output Voltage 2-15kV 2-25kV 2-8kV 2-15kV
Delay between zaps Minimum 1s Minimum 1s
Polarity at each stress voltage level
Positive and Negative Positive and Negative
Network Capacitance150pF (outside vehicle)330pF (inside vehicle)
150pF
Network Resistance 330Ω/2000Ω 330Ω
Number of Zaps ≥ 3 ≥ 10
ESD Generator ground reference
Battery ground Earth
Test conditionsUnpowered/Powered
with batteryUnpowered / Powered
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