Counterfeit Detection

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Review of IDEA-STD and more advanced methods of detecting countefeit electonic components

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Detection of Counterfeits

Tom Perrett – Soldertec Laboratory

IDEA-STD-1010-A

Independent Distributors of Electronics Association (2006)Recognises and complies with IPC-A-610Attempts to determine with high confidence that parts under examination indicate new condition, and that they have been stored, handles and packaged acceptably.

Agenda

Product InspectionPossible defectsTestingExample

Product Inspection

HandlingNeat area, no food, drink or smokingMinimise handlingUse glovesNo creams especially silicone basedDon’t stack componentsAlways assume ESD sensitiveTrain operators in ESD issues

Product Inspection

Moisture Sensitivity (refers to IPC/JEDEC J-STD-020)

Floor life not exceeding 30.C & 60%RHShelf lifeDryingDry packHumidity indicator cardOxidation risk

Product Inspection

Photographing partsInspector approach/trainingNon conforming until indicated as conformingApplication of statisticsRoHS & appearance issues

Product Inspection

Dates codes – watch for mixed date codesLot codes – does the code on the part match the code on the packagingCo-Planarity - to JEDEC JESD22-B108, in dead bug position on ESD safe block

Product Descriptions - Beware

CloneCrossesDrop-insEquivalentsGenericPlain-wrapReplacementsSubstitute

Visual inspection – low magnification x20 (70+ tests)

LabelsBody descriptionPackaging

TraysTubesReels

Testing - Remarking

3 parts white spirit to 1 part alcohol on a cotton wool bud.MIL-STD-883 requires parts to withstand this.

Testing – Evidence of resurfacing

Acetone on cotton wool budRemoves most “black-topping”Counterfeiters have become aware Mould cavities should be brightAcetone often removes legitimate inks!

From the original manufacturer(in a round about route)

Faulty die do not get scrappedFaulty end product does not get scrappedOver-runsOld stock gets relabelledUpgradingNon RoHS compliant product is relabelled

From another source

Alternative supplier product relabelledAny similar package but without a dieAny similar package but wrong die relabelledFake labels for passivesFrom the dump and reworked Piracy

Possible signs of problems

Bent leadsContaminated leadsMisaligned leadsRe-tinned leadsOxidised leadsPoor wetting on leadsCorrosion on leads and metal parts

Possible defects

Scratched legs or bodyFingerprintsExposed bare metal on leadsChipped cornersExposure to excessive heatEvidence of previous part insertion into a socket

Possible defects

Debris and foreign bodies on partsEvidence of re-tinningEvidence of re-ballingExcessive solderMoulding marks are differentEvidence of remarkingEvidence of resurfacing

Possible defects

Logos not quite rightInconsistency of date and lot codesDifferent texture between parts

Visual & Light Microscope Inspection

Incorrect labellingEvidence of marking removal by solvent or sandingCo-planarity, even number of leadsPoor or incorrect moulding

Differences in printing technique

X-ray Inspection

Different size dieDifferent bondwirelayoutAbsence of diePossibly wrong die

XRFElemental analysis of body & terminationsIs product RoHS compliant

Differences in finish

Differences in plating

SEM/EDXPolymer investigationsMarking removalDamage/sanding

SEM/EDXElemental Analysis

Further testing

None is mentionedNo real time X-rayNo XRFNo de-cappingNo SEMNo electrical testing

….And the counterfeiters know this

Tom.perrett@tintechnology.com01727-875544

Small BGA Demo

Large BGA Demo

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