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Review of IDEA-STD and more advanced methods of detecting countefeit electonic components
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Detection of Counterfeits
Tom Perrett – Soldertec Laboratory
IDEA-STD-1010-A
Independent Distributors of Electronics Association (2006)Recognises and complies with IPC-A-610Attempts to determine with high confidence that parts under examination indicate new condition, and that they have been stored, handles and packaged acceptably.
Agenda
Product InspectionPossible defectsTestingExample
Product Inspection
HandlingNeat area, no food, drink or smokingMinimise handlingUse glovesNo creams especially silicone basedDon’t stack componentsAlways assume ESD sensitiveTrain operators in ESD issues
Product Inspection
Moisture Sensitivity (refers to IPC/JEDEC J-STD-020)
Floor life not exceeding 30.C & 60%RHShelf lifeDryingDry packHumidity indicator cardOxidation risk
Product Inspection
Photographing partsInspector approach/trainingNon conforming until indicated as conformingApplication of statisticsRoHS & appearance issues
Product Inspection
Dates codes – watch for mixed date codesLot codes – does the code on the part match the code on the packagingCo-Planarity - to JEDEC JESD22-B108, in dead bug position on ESD safe block
Product Descriptions - Beware
CloneCrossesDrop-insEquivalentsGenericPlain-wrapReplacementsSubstitute
Visual inspection – low magnification x20 (70+ tests)
LabelsBody descriptionPackaging
TraysTubesReels
Testing - Remarking
3 parts white spirit to 1 part alcohol on a cotton wool bud.MIL-STD-883 requires parts to withstand this.
Testing – Evidence of resurfacing
Acetone on cotton wool budRemoves most “black-topping”Counterfeiters have become aware Mould cavities should be brightAcetone often removes legitimate inks!
From the original manufacturer(in a round about route)
Faulty die do not get scrappedFaulty end product does not get scrappedOver-runsOld stock gets relabelledUpgradingNon RoHS compliant product is relabelled
From another source
Alternative supplier product relabelledAny similar package but without a dieAny similar package but wrong die relabelledFake labels for passivesFrom the dump and reworked Piracy
Possible signs of problems
Bent leadsContaminated leadsMisaligned leadsRe-tinned leadsOxidised leadsPoor wetting on leadsCorrosion on leads and metal parts
Possible defects
Scratched legs or bodyFingerprintsExposed bare metal on leadsChipped cornersExposure to excessive heatEvidence of previous part insertion into a socket
Possible defects
Debris and foreign bodies on partsEvidence of re-tinningEvidence of re-ballingExcessive solderMoulding marks are differentEvidence of remarkingEvidence of resurfacing
Possible defects
Logos not quite rightInconsistency of date and lot codesDifferent texture between parts
Visual & Light Microscope Inspection
Incorrect labellingEvidence of marking removal by solvent or sandingCo-planarity, even number of leadsPoor or incorrect moulding
Differences in printing technique
X-ray Inspection
Different size dieDifferent bondwirelayoutAbsence of diePossibly wrong die
XRFElemental analysis of body & terminationsIs product RoHS compliant
Differences in finish
Differences in plating
SEM/EDXPolymer investigationsMarking removalDamage/sanding
SEM/EDXElemental Analysis
Further testing
None is mentionedNo real time X-rayNo XRFNo de-cappingNo SEMNo electrical testing
Small BGA Demo
Large BGA Demo
