poore120 documents

A More Business-centric Approach to help Reduce Business Continuity Risk
Business A More Business-centric Approach to help Reduce Business Continuity Risk
Siebel Analytics in IBM: Building a Sense & Respond Solution
Technology Siebel Analytics in IBM: Building a Sense & Respond Solution
OBI Analytics in IBM
Technology OBI Analytics in IBM
US Patent 4862322 - Improved Semiconductor Device Packaging Structure
Technology US Patent 4862322 - Improved Semiconductor Device Packaging Structure
SecureTech 2014: Risk, Business Continuity and Cybersecurity - A Resiliency Perspective
Technology SecureTech 2014: Risk, Business Continuity and Cybersecurity - A Resiliency Perspective
Bonding Method Employing Organometallic Inerconnectors (SuperConductivity Bonding Method) United States 5,503, 698 Pat5503698
Technology Bonding Method Employing Organometallic Inerconnectors (SuperConductivity Bonding Method) United States 5,503, 698 Pat5503698
Multi-level circuit card structure - US Patent 5786986
Technology Multi-level circuit card structure - US Patent 5786986
US Patent 5132351 Chemical Solder et. al
Technology US Patent 5132351 Chemical Solder et. al