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ming-dou-ker documents
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Optimization of broadband RF performance and ESD robustness by -model distributed ESD protection scheme
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Electrostatic discharge (ESD) protection for CMOS output buffers in scaled-down VLSI technology
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Substrate-triggered ESD clamp devices for use in power-rail ESD clamp circuits
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Latchup-free fully-protected ESD protection circuit for input pad of submicron CMOS ICs
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Cascoded LVTSCR with tunable holding voltage for ESD protection in bulk CMOS technology without latchup danger
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Design and Analysis of On-Chip ESD Protection Circuit with Very Low Input Capacitance for High-Precision Analog Applications
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Modeling the positive-feedback regenerative process of CMOS latchup by a positive transient pole method. I. theoretical derivation
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Area-efficient layout design for CMOS output transistors
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Complementary-SCR ESD protection circuit with interdigitated finger-type layout for input pads of submicron CMOS IC's
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Whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuits for submicron CMOS VLSI
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Modeling the positive-feedback regenerative process of CMOS latchup by a positive transient pole method. II. Quantitative evaluation
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ESD implantation for subquarter-micron CMOS technology to enhance ESD robustness
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High-Voltage-Tolerant ESD Clamp Circuit With Low Standby Leakage in Nanoscale CMOS Process
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On-Chip Transient Detection Circuit for System-Level ESD Protection in CMOS Integrated Circuits to Meet Electromagnetic Compatibility Regulation
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Evaluation on board-level noise filter networks to suppress transient-induced latchup in CMOS ICs under system-level ESD test
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On-panel output buffer with offset compensation technique for data driver in LTPS technology
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The impact of low-holding-voltage issue in high-voltage CMOS technology and the design of latchup-free power-rail ESD clamp circuit for LCD driver ICs
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[IEEE 2005 IEEE Conference on Electron Devices and Solid-State Circuits - Hong Kong (19-21 Dec. 2005)] 2005 IEEE Conference on Electron Devices and Solid-State Circuits - Methodology
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Transient analysis of submicron CMOS latchup with a physical criterion