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Electrode surface coarsening in potentiostatic copper electrodeposition
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Behaviour of the lead electrode during anodization in chlorate-carbonate solutions
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Fundamental aspects of pulsating current metal electrodeposition I: The effect of the pulsating current on the surface roughness and the porosity of metal deposits
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Fundamental aspects of pulsating current metal electrodeposition II: The mechanism of metal film formation on an inert electrode
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The effect of periodic reverse current on the surface roughness of metal deposits and the maximal deposition rate
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Fundamental aspects of plating technology I: The determination of the optimum deposition current density
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Fundamental aspects of plating technology II: Morphological aspects of metal electrodeposition from complex salt solutions
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Fundamental aspects of pulsating current metal electrodeposition VIII: The effect of pause-to-pulse ratio on microthrowing power of metal deposition
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Fundamental aspects of pulsating current metal electrodeposition IX: The prevention of spongy deposit formation on inert substrates
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Fundamental aspects of plating technology III: The effect of electrodeposition from complex salt solutions on metal distribution over macroprofiles
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Fundamental aspects of plating technology IV: The effect of simple salt plating bath composition on the morphology of metal deposits
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Dendritic electrocrystallization of lead from lead nitrate solution
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Electrocrystallization of silver from silver nitrate solutions at low overpotentials
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Fundamental aspects of pulsating current metal electrodeposition IV: Tafel equation in the deposition of metals by a pulsating current
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Some aspects of current density distribution in electrolytic cells I: Dendritic growth of cadmium at the cathode edge in galvanostatic electrodeposition
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Fundamental aspects of pulsating current metal electrodeposition VII: The comparison of current density distributions in pulsating current and periodic reverse current electrodeposition
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Physical and mathematical models of an inert macroelectrode modified with active hemispherical microelectrodes
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Polarization curves in the ohmic controlled electrodeposition of metals
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A new approach to metal electrodeposition at a periodically changing rate: Part I. The reversing overpotential method
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The current density distribution on stationary wire electrodes during copper and lead electrodeposition
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Morphology of tin powder particles obtained in electrodeposition on copper cathode by constant and square-wave pulsating overpotential from Sn(II) alkaline solution
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