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© 2014 IBM Corporation zEnterprise EC12 & BC12 Hardware Overview Nome: Felipe Lanzillotta Grandolpho Email: [email protected] IBM Brasil – System and Technology Group (STG) Trainee System zEnterprise

zEC12 e zBC12 Hardware Overview

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©2014 IBM Corporation

zEnterprise EC12 & BC12 Hardware Overview

Nome: Felipe Lanzillotta GrandolphoEmail: [email protected] Brasil – System and Technology Group (STG)Trainee System zEnterprise

©2014 IBM Corporation

TrademarksThe following are trademarks of the International Business Machines Corporation in the United States and/or other countries.

Notes: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area.All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.This information provides only general descriptions of the types and portions of workloads that are eligible for execution on Specialty Engines (e.g., zIIPs, zAAPs, and IFLs) ("SEs"). IBM authorizes customers to use IBM SE only to execute the processing of Eligible Workloads of specific Programs expressly authorized by IBM as specified in the “Authorized Use Table for IBM Machines” provided at www.ibm.com/systems/support/machine_warranties/machine_code/aut.html (“AUT”). No other workload processing is authorized for execution on an SE. IBM offers SE at a lower price than General Processors/Central Processors because customers are authorized to use SEs only to process certain types and/or amounts of workloads as specified by IBM in the AUT.

The following are trademarks or registered trademarks of other companies.

* Other product and service names might be trademarks of IBM or other companies.

* Registered trademarks of IBM Corporation

Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries. Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom. Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency which is now part of the Office of Government Commerce. ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office. Java and all Java based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates.Linear Tape-Open, LTO, the LTO Logo, Ultrium, and the Ultrium logo are trademarks of HP, IBM Corp. and Quantum in the U.S. andLinux is a registered trademark of Linus Torvalds in the United States, other countries, or both. Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both. OpenStack is a trademark of OpenStack LLC. The OpenStack trademark policy is available on the OpenStack website.TEALEAF is a registered trademark of Tealeaf, an IBM Company.Windows Server and the Windows logo are trademarks of the Microsoft group of countries.Worklight is a trademark or registered trademark of Worklight, an IBM Company.UNIX is a registered trademark of The Open Group in the United States and other countries.

DirMaintECKDHiperSocketsIBM*

IBM (logo)*OMEGAMON*Performance Toolkit for VMRACF*

REXXSystem z*zEnterprise*z/VM*

©2014 IBM Corporation

“The postings on this site / presentation are my own and don’t necessarily represent IBM’s positions, strategies or opinions.”

©2014 IBM Corporation

Agenda:

– Sistemas Operacionais e Processadores;– System z Gerações;– zEC12 Hardware;– zBC12 Hardware;– Chips zEC12 x zBC12;– Gerenciamento de Hardware;– Features de I/O;– Referência de Cliente;

©2014 IBM Corporation

Sistemas Operacionais

Tipos de Processadores

ICF

©2014 IBM Corporation

IBM System z - Gerações

©2014 IBM Corporation

N-4N-4

z990•Anunciado em 5/2003•1.2 GHz•32 Cores caracterizáveis•CP, IFL, ICF, zAAP•Memória de 256 GB

z890•Anunciado em 4/2004•1.0 GHz•4 Cores caracterizáveis•CP, IFL, ICF, zAAP•Memória de32 GB Memory

N-3N-3

z9 Enterprise Class•Anunciado em 7/2005•1.7 GHz•54 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 512 GB

z9 Business Class•Anunciado em 4/2006•1.4 GHz•7 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 64 GB

N-5N-5

z800•Anunciado em 2/2002•625 MHz•4 Cores caracterizáveis•CP, IFL, ICF•Memória de 32 GB

z900•Anunciado em 10/2000•770 MHz•16 Cores caracterizáveis •CP, IFL, ICF•Memória de 64 GB

N-2N-2

z10 Enterprise Class•Anunciado em 2/2008•4.4 GHz•64 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 1.5 TB

z10 Business Class•Anunciado em 10/2008•3.5 GHz•10 Cores caracterizáveis• 5 GCP•CP, IFL, ICF, zAAP, zIIP•Memória de 248 GB

N-1N-1

zEnterprise 196•Anunciado em 22/07/2010•5.2 GHz•80 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 3 TB

zEnterprise 114•Anunciado em 12/07/2011•3.8 GHz•10 Cores caracterizáveis •5 GCP•CP, IFL, ICF, zAAP, zIIP•Memória de 256 GB

IBM System z - Gerações

©2014 IBM Corporation

zEnterprise EC12

• zEC12 - Lançada em 28 de Agosto de 2012

– RAIM como design de memória– Memória mínima de 32 GB– Até 768 GB por book– 101 Cores rodando a 5.5 GHz– Até 3 TB por sistema e até 1 TB por LPAR

• 32 GB HSA gerenciado separadamente

©2014 IBM Corporation

For IBM and Business Partner Education Use Only prior to Announcement

Baterias Internas

(opcional)

Fontes de

Energia

2 x SupportElements

PCIe I/O drawers(Máximo de 5 por

zEC12)

Overhead Power

(opcional)

Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts

Radiador N +1 bombas, ventiladores e motores

Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage

Overhead I/O feature é um co-requisito para a opção de overhead power

zEC12 com Resfriamento a ar baseada em radiador – (Model H89 ou HA1) Vista Frontal

©2014 IBM Corporation

For IBM and Business Partner Education Use Only prior to Announcement

Baterias Internas

(opcionais)

Fontes de

energia

I/O cageCarried

Forward Unidades de Resfriamento a água N+1

SupportElements

PCIe I/O drawer

Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts

Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage

zEC12 Resfriada a Água (Upgraded de uma z196) - (Model H89 ou HA1)

©2014 IBM Corporation

zEnterprise EC12 - Modelos

Memória

Memória

MCM

Frente

Conector de resfriamento

3 x Fontes deenergia DCA n+1(Distributed Converter Assemblies)

16 DIMMs( 4 GB, 16 GB,ou 32 GB )

14 DIMMs

©2014 IBM Corporation

zEnterprise EC12 – MCM (Multi Chip Module)

PU 0PU 2

SC 0

SC 1

PU 1

PU 5PU 3 PU 4

Cada PU chip possui 6 cores com Cache L1 e L2 internos, ainda dividindo 2 SC chips de Cache L3 48 MB.

Cada MCM posui 2 SC chips de Cache L4 com 384 MB, que são divididos pelos PU Chips.

©2014 IBM Corporation

zEnterprise BC12

zBC12 - Lançada em 23 de Julho de 2013 – 13 Cores rodando a 4.2 GHz– Até 512 GB por sistema

• Sistema mínimo = 8 GB (Modelo H06), 16 GB (Modelo H13)

• 16 GB HSA gerenciado separadamente• RAIM• Máximo para uso do cliente 496 GB

(Modelo H13)

© 2014 IBM CorporationzBC12TLLB14

Bateria interna

(opcionais)

Fontes de

Energia

I/O Drawer

2 x CPC Drawers, Memória & HCAs

PCIe I/O drawers

Vista Traseira

Vista Frontal

2 x Support

Elements

zBC12 Model H13

©2014 IBM Corporation

zEnterprise BC12 - Modelos

Processor SCM

Processor SCM

Storage Control SCM

Slots for 5 DIMMs

Slots for 5 DIMMs

2 x DCA n+1

©2014 IBM Corporation

zEnterprise BC12 – SCM (Single Chip Module) Cache

– Cache L1 e L2 compartilhado por core

– Cache L3 de 24MB compartilhado por chip

– Cache L4 de 192MB compartilhado por CPC-drawer

Mais processadores no mesmo espaço de uma z114

– 6 cores por PU chip

– Mesmo consumo de energia que a z114– 4.2 GHz por core

L3

C 0

L3

C 1

GXMC

U

Core0

Core1

Core2

Core3

Core4

Core5

© 2014 IBM CorporationzBC12TLLB17

MCM– MCM : 96mm x 96mm– 6 PU chips por MCM

• 6 core chips com 4, 5 ou 6 cores ativos• PU Chip : 23.7 mm x 25.2 mm • 5.5GHz

– 2 SC chips por MCM• 384 MB cache L4 per MCM (por book) • SC Chip : 26.72 mm x 19.67 mm

– Até 4 MCMs por System

zEC12 Multi Chip Module (MCM)

PU SCM– SCM : 50mm x 50mm– Hexa core chip com 4 ou 5 cores ativos– 2 PU SCMs para H06 e 4 PU SCMs para H13– PU Chip: 23.7 mm x 25.2 mm– 4.2 GHz

SC SCM– 1 SC SCM para H06, 2 SC SCMs para H13– 192 MB cache L4 por CPC Drawer– SC Chip : 26.72 mm x 19.67 mm

zBC12 Single Chip Module (SCM)

PU 0PU 2

SC 0

SC 1

PU 1

PU 5PU 3 PU 4

zBC12 SCM vs zEC12 MCM

© 2014 IBM CorporationzBC12TLLB18

Uma HMC pode se comunicar com todos as outras HMCs

– Controle de qualquer servidor em qualquer site.

– No caso de Ensemble existe a necessidade de um HMC secundário

O SE possui uma relação de backup ativo com o segundo SE

– Controle dedicado a um único servidor

HMCHMC HMC

HMC

HMCs e SEs

©2014 IBM Corporation

Estrutura de I/O – PCIe I/O Drawer

Vista Frontal

Vista Traseira

©2014 IBM Corporation

I/O features

Flash Express FICON Express8SCrypto Express 4S

10km LX Feature– 10km – One slot in the PCIe I/O

Drawer– 2Gbps,4Gbps e 8Gbps

SX Feature– 2Gbps até 500 metros– 4Gbps até 380 metros– 8Gbps até 150 metros

– Disponível em pares de placas

– Memória SSD de 1.4 TB por par

– Máximo de 4 pares por máquina

– RAID 10

– Acelerador para operações de criptografia usando SSL/TLS

– Co-processador– De 1 até 16 features por

máquina

©2014 IBM Corporation

I/O features

IBM zEDC Express 10 GbE RoCE OSA- Express 5S

– Prover acelereção para compressão e decompressão dados

– De 1 até 5 features por sistema

– Uma placa pode ser divida por até 15 LPARs

– Exclusiva para z/OS

– Reduzir o consumo de CPU por aplicações TCP/IP

– De 1 até 16 placas por máquina

– Cada placa deve ser dedicada a uma LPAR

10GbE LR Feature 10GbE SR Feature GbE LX Feature GbE SX Feature 1000BASE-T Feature

© 2013 IBM Corporation

22

Desafio

Para suportar a crescente demanda, a Algar Telecom precisava de uma infraestrutura forte e flexível, que entregasse alta disponibilidade e confiabilidade para os serviços de telecomunicações.

Solução

A Algar Telecom consolidou mais de 90 servidores distribuídos em servidores virtuais Linux, usando z/VM em uma única IBM zEnterprise 196, utilizando também uma IBM zEnterprise BladeCenter Extension.

Benefícios

Entregou uma plataforma confiável e flexível para os serviços de ponta, que : Reduziram os custos do data center em 70% Reduziu os esforços em manutenção em 65% Impulsionou a eficiência operacional em 30%

“Transformamoscompletamente nossainfraestrutura e a formacomo a gerenciamos com oIBM zEnterprise System.Como consequência,estimamos que nossaeficiência operacionalaumentou em pelo menos30%.”

Rogério Okada, Gerente de TIAlgar Telecom

Referência de cliente – Algar Telecom

©2014 IBM Corporation

Siglas

CP – Central Processor zEDC - zEnterprise Data Compression

zAAP - System z Application Assist Processors OSA - Open System Adapter

zIIP - System z Integrated Information Processor RoCE – Remote Direct Access over Converged

ICF – Internal Coupling Facility Ethernet

SAP – System assist processor CICS – Costumer Information Control System

IFL – Integrated Facility for Linux IMS – Information Management System

RAIM – Redundant Array of Independent Memory

HSA – Hardware System Area

PCIe - Peripheral Component Interconnect Express

MCM – Multi Chip Module

SCM – Single Chip Module

DIMM - Dual Inline Memory Modules

DCA – Distributed Convertor Assemblies

PU – Processor Unit

SC – Storage Control

CPC – Central Processor Complex

HMC – Hardware Management Console

SE – Support Elements

FICON – Fiber Channel Connection

©2014 IBM Corporation

Referências Bibliográficas

IBM zEnterprise BC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248138.html?Open )

IBM zEnterprise EC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248049.html?Open )

Estudo de caso Algar Telecom ( http://www-01.ibm.com/common/ssi/cgi-bin/ssialias?subtype=AB&infotype=PM&appname=STGE_ZS_ZS_BRPT&htmlfid=ZSC03161BRPT&attachment=ZSC03161BRPT.PDF )