SUCCESSFUL SEMICONDUCTOR FABLESS 2015 Presentation speaker abstract agenda registration

SSF 2015 Program

Abstracts & Speakers Detail1

PROGRAM

Successful Semiconductor Fabless 2015 – Powered by Yole Développement and Serma Technologies 2

SUPPLY CHAIN | MARKET POSITIONING |BUSINESS OPPORTUNITIES | COMPANY VALUE

SUPPLY CHAIN CHALLENGES - The semiconductor industry is evolving in a continuous flow. What's new? What's next?

MARKET PLACE - Emerging technologies, solutions, products and services for design, manufacturing ...

BUSINESS MODELS - Including fabless companies, IDMs, equipment & materials manufacturers, design companies, devices manufacturers,

integrators, R&D institutes ...

NETWORKING - Customer and supplier engagement, partnerships, opportunities, meetings

SSF 2015 program includes four sessions dedicated to the semiconductor industry. The topics they cover include an overview of the market,

design, industrialization and a special focus on the Internet of Things (IoT). SSF 2015 is covering business, technology and supply chain

challenges.

Both partners, Yole Développement and Serma Technologies, invited worldwide industrial and R&D players: large global companies, SMEs and

research institutes. Debates and networking times will punctuate the conference….

REGISTRATION: Click here

http://www.i-micronews.com/events/yole-events/eventdetail/44/-/successful-semiconductor-fabless-2015.html

PROGRAM


NOVEMBER 4

7:30 PM WELCOME COCKTAIL

NOVEMBER 5

8:15 AM WELCOME COFFEE

9:00 AM SUCCESSFUL SEMICONDUCTOR FABLESS 2015 – INTRODUCTIONPascal Matosevic, Marketing & Sales Director, Serma Technologies - Frédéric Breussin, Business Unit Manager, MEMS & Sensors, Yole Développement

SESSION 1 – MARKET OVERVIEW: How can the semiconductor supply chain be secured?Chairman: Frédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole Développement

9:10 AM KEYNOTE PRESENTATION - The Internet of SensorsMo Maghsoudnia, Vice President, Technology and Worldwide Manufacturing, InvenSense

9:55 AM IDM, Foundry, Fabless… Who is getting the most value from the business?Thibault Buisson, Technology & Market Analyst, Advanced Packaging, Yole Développement

10:20 AM To be defined

PROGRAM


SESSION 1 – MARKET OVERVIEW: How can the semiconductor supply chain be secured? (End)Chairman: Frédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole Développement

10:45 AM COFFEE BREAK

11:30 AM Many possible routes for semiconductor start-ups to success: an image sensor company examplePhilippe Rommeveaux, CEO & President, Pyxalis

11:55 AM How to define the right market positioning across a value chain in constant evolution ?Pascal Langlois, CEO, Tronics Microsystems

12:20 AM PANEL DISCUSSIONModerator: Frédéric Breussin, Business Unit Manager, MEMS & Sensors, Yole DéveloppementParticipants: InvenSense – Pyxalis – Tronics Microsystem and Yole Développement

12:40 AM LUNCH & NETWORKING

PROGRAM


SESSION 2– DESIGN: Get ready for future products and emerging marketsChairman: Pascal Salomé, Technical Officer, Serma Technologies

1:40 PM Challenges in failure analyses in advanced technologiesKarine Rousseau, Technical Coordinator, Serma Technologies

2:05 PM Mixed-Signal ASIC Design for Industrial Applications - Nightmare or Opportunity ?Dr.-Ing. Lutz Porombka, CEO, Creative Chips

2: 30 PM Design and Virtual Fabrication Technology for MEMS & Semiconductor EcosystemsChristopher J Welham, Director, Application Engineering, Coventor

2:55 PM ASIC Design and Verification with MATLAB and SimulinkGraham Reith, EMEA Marketing Industry Manager for Semiconductor - Cynthia Cudicini, CDA Application Engineer Team Leader, MathWorks

3:20 PM PANEL DISCUSSIONModerator: Pascal Salomé, Technical Officer, Serma TechnologiesParticipants: Creative Chips, Coventor, MathWorks and Serma Technologies

3:40 PM COFFEE BREAK

PROGRAM


SESSION 3– INDUSTRIALISATION: How can the semiconductor industrialization supply chain be made easier?Chairman: Tomislav Oresic, Business Development Manager, Serma Technologies

4:25 PM Fabless companies and IDM: partners for successful industrialization. An automotive case study.Laurent Vancaillie, Business Development Manager, On Semiconductor

4:50 PM Key success factors for a fabless semiconductor companyPatrizio Piasentin, Sr Regional Sales Manager – South Europe, Silicon Labs

5:15 PM Electrical test as trusted companion from idea to series productionFritz Schlicher, General Manager, Bluetest Testservice

5:40 PM The emerging fabless eco-system for photonic integrated circuits: current statusTwan Korthorst, CEO, PhoeniX Software

6:05 PM PANEL DISCUSSIONModerator: Tomislav Oresic, Business Development Manager, Serma TechnologiesParticipants: On Semiconductor, Silicon Labs, BueTest TestService, Phoenix Software and Serma Technologies

6:30 PM CONCLUSION OF THE DAYYole Développement & Serma Technologies

7:30 PM COCKTAIL & RECEPTION

PROGRAMSeptember 19, 2015


NOVEMBER 6

SESSION 4– INTERNET OF THINGS : Supply chain, collaborations, business cases – this market is under construction!Chairman: Frédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole Développement

9:00 AM KEYNOTE PRESENTATION: The technical challenges of future IoT networks and their consequences on modem’s and SoC’s designChristophe Fourtet, Co-creator and technical director, SigFox Wireless - Eric Mercier, Program Manager of FOXY chip, Commissariat à l’Energie Atomique (CEA)

9:45 AM Wearable Electronics: the most promising part of IoTDr Eric Mounier, Senior Technology & Market Analyst, MEMS & Sensors, Yole Développement

10:10 AM To be confirmed

10:35 AM COFFEE BREAK

11:20 AM Frederic Beaudoin, Amkor Technologies

PROGRAM


SESSION 4– INTERNET OF THINGS : Supply chain, collaborations, business cases – this market is under construction! (End)Chairman: Frédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole Développement

11:45 AM PANEL DISCUSSIONModerator: Frédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole DéveloppementParticipants: SigFox Wireless, Amkor Technologies and Yole Développement

12:05 AM SUCCESSFUL SEMICONDUCTOR FABLESS 2015 – CONCLUSION

12:15 AM LUNCH & NETWORKING – End of the 2015 edition at 2:00 AM

ABSTRACTS & SPEAKER DETAILS

9

SUCCESSFUL SEMICONDUCTOR FABLESS – IntroductionPascal Matosevic, Marketing & Sales Director, Serma TechnologiesFrédéric Breussin, Business Unit Manager, MEMS & Sensors activities, Yole Développement

10Successful Semiconductor Fabless 2015 – Powered by Yole Développement and Serma Technologies

Frédéric Breussin is responsible for the MEMS and Sensors activity. He has supported many companies in their innovation andproduct development strategy in making the bridge between micro systems technologies and their applications in consumer,automotive, industrial, Life sciences, diagnostics and medical device industries. He holds an Engineering diploma from INSA Rouen& a DEA in fluid mechanics from University of Rouen.

To be completed


• The Internet of Sensors

Mo Maghsoudnia, Vice President, Technology and Worldwide Manufacturing, InvenSense

The explosive growth of IoT has led to excess of real-time and high data-rate applications. Every day we create 2.5 quintillion bytes of data andthe number is growing exponentially with 40% percent of all data coming from sensors by 2020. Big data analytics is becoming moreimperative as there is a mandate to turn more of the data into actionable insights that drive operational value/ intelligence and thus enablingreal-time processing and instantaneous action. Implementation of intelligent sensors becomes vital in order to transmit information andcontext to the system/cloud and not just raw sensor data.

Materializing the huge business opportunities offered by IoT infrastructure scaling requires a paradigm shift in sensor manufacturing. In thispresentation, supply chain challenges for new generation of MEMS sensor devices will be illustrated.


Mo Maghsoudnia serves as our Vice President of Technology and Worldwide Manufacturing.Prior to InvenSense, he was the Vice President of Worldwide Manufacturing at NetLogicMicrosystems where he was responsible for all worldwide operations including processtechnology, packaging, corporate quality and supply chain management. At NetLogic,Maghsoudnia successfully managed the manufacturing operations of the company from a singleproduct line to a highly diversified product portfolio. Prior to NetLogic Microsystems,Maghsoudnia spent 15 years at Analog Devices where he was responsible for the management ofwafer fabrication and technology.Maghsoudnia holds a Master of Science Degree in Electrical Engineering from Santa ClaraUniversity and a Bachelor of Science Degree in Microelectronic Engineering from RochesterInstitute of Technology. He holds three U.S. patents and has co-authored various technical papers.


• IDM, Foundry, Fabless… Who is getting the most value from the business?

Thibault Buisson, Technology & Market Analyst, Advanced Packaging, Yole Développement

From Fabless to end-customer, the ecosystem in the semiconductor area has increased in complexity with the diversification of thetechnologies.

Due to the large variety of business models it becomes now a necessity to better understand the supply chain. From More Moore to More thanMoore, several challenges and opportunities have been created and a real game has started between the players. In this context, thispresentation will give an overview of the supply chain linked to the different business models and will emphasize the key role of the fablesscompanies.

Case studies will also be presented to illustrate the change in the supply chain and give future perspectives.


Thibault Buisson is a member of the Advanced Packaging team at Yole Développement. Hegraduated from INPG with a Master of Research in Micro and Nano electronics and from Polytech’Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors asR&D process engineer in the thermal treatment area to develop CMOS technology node devicesfrom 65 to 45nm. Afterwards, he joined IMEC Leuven and worked for more than 5 years asprocess integration engineer in the field of 3D technology. During this time, he has worked onseveral topics from TSV to micro-bumping and stacking. He has authored or co-authored fifteeninternational publications in the semiconductor field.


• To be completed soon

Sage Newman, Vice President, ATREG



• Many possible routes for semiconductor start-ups to success: an image sensor company example

Philippe Rommeveaux, CEO & President, Pyxalis

Imaging is one of the semiconductor sectors which has demonstrated the highest and most robust growth in the past decade.

In parallel of classical fully integrated imaging companies, new flexible fabless company models have been made possible because of themassive adoption of the CMOS technology for image sensors.

A 3-axis analysis of the imaging market place players will be proposed considering business offers, manufacturing models and funding needs.

As a real case study, we’ll explore the way followed by Pyxalis, a 5 year old imaging fabless company, to combine all together technicalinnovation, flexible offer and sustainability.


Philippe Rommeveaux is President & CEO of Pyxalis, a company based in Grenoble area-Francehe founded with a few other colleagues in 2010. Previously he has been image sensor businessunit manager at e2v, responsible of strategic business development at Atmel and started hiscareer as image sensor program manager. He holds a PhD and an engineering degree from OrsayOptical Institute.


• How to define the right market positioning across a value chain in constant evolution?

Pascal Langlois, CEO, Tronics Microsystems

The MEMS industry has always needed to keep up with the fast transitions of an ecosystem hungry for innovation. Now because of theincreasing miniaturization of electronic devices and the proliferation of wearable electronics, the strategic positioning within the value chainneeds more agility and proximity with the partners than ever.

Business opportunities must now match with business models. With more and more players, from well-established leaders on mature marketsto emerging companies on new sectors, the equation is often the same: bring value to meet the industry expectations and better competewith other promising technologies, while remaining valuable.

Today, growing markets with high added value such as aeronautics, medical, consumer electronics, Internet of Things (IoT), etc. feature highlevels of requirement for very specific applications.

Among the key success factors to guarantee a sustainable growth, people, technology, manufacturing and collaboration are the essentials toenable a faster time to market and a simpler industrialization of breakthrough technologies.


Pascal Langlois joined Tronics in 2013 as Chief Executive Officer, with more than 25 years ofexperience in general direction for semiconductor companies.Most recently, he was Chief Sales & Marketing Officer at ST-Ericsson, and prior to that, Founder ofNXP and Senior VP of Sales & Marketing.Mr. Langlois also worked with Philips Semiconductors BV, National Semiconductors, and VLSITechnology, where he held various executive management positions.


• How to define the right market positioning across a value chain in constant evolution? (End)

There is no good business model, only one that meets the challenges of an organic growth coupled with very demanding and fast growingmarkets. At the core of Tronics’ strategy, this approach has enabled the company to run a successful IPO and to build its future ambitions on astrong portfolio of products (from standard to custom series) and services (close engineering support with flexible manufacturing capabilities).Thanks to the implementation of standardized platforms, Tronics aims to create new synergies across the MEMS value chain.


SUCCESSFUL SEMICONDUCTOR FABLESSSESSION 2– DESIGN: Get ready for future products and emerging marketsChairman: Pascal Salomé, Technical Officer, Serma Technologies


Pascal Salomé, Technical Officer, Serma TechnologiesPascal Salome received his degree in electrical engineering from the National Institute of Applied Sciences (INSA) of Lyon, France in1994. He recieved his PhD in 1998, for his studies on physical phenomena in NMOS transistors stressed by ElectroStatic Discharges.In 1998, he joined the Research and Development Center of STMicroelectronics to design ESD protection structures for advancedsubmicron technologies (CMOS & BICMOS). In 2000, he moved into the Design Automation Integrated Systems department whereinhe manages the ESD activities. In 2005, he joined SERMA Technologies for leading the electrical expertise group in charge of Failureanalyses, reliability testings, circuit modifications and ESD/LU investigations.


• Challenges in failure analyses in advanced technologies

Karine Rousseau, Technical Coordinator, Serma Technologies

Today, our environment is more and more connected: smartphone, connected watch, tablet, car sensor, home sensor, smart sticker... Accordingan IDATE Study* this market is expected to reach between 24 and 50 bn of pieces in 2020 from 9 bn in 2014.

This growth is the result of industrial innovation. Using advanced technologies, industrials created systems smaller, faster, smarter and moreefficient. For example: More functionality is integrated in less area using the 3D integration to stack chip or system; utilization of new materialand design allow the reduction of transistor grid size, 14 nm – 28 nm or 3D transistor.

Miniaturization and complexity of these systems create challenges in failure analysis. Using examples of electrical and physical analysis we’lldiscuss of challenge in failure analysis through defects location, sample preparation and defect observation in advanced technological chip.

* www.atelier.net/en/trends/articles/study-everyday-connected-objects-manufacturer-role-still-be-determined_429746


Karine Rousseau received the Ph.D. degree in 2002, from the University of Jussieu in Paris,France. Her Ph.D. thesis was focused on the characterization of « surfacial grain boundaries » inSilicon elaborated by molecular bonding. The technique used was transmission electronmicroscopy. In 2003, she joined RCCAL in STMicroelectronics Rousset (France) to contribute in thedevelopment of a TEM (transmission electron microscopy) characterization laboratory. In additionto characterize most of the technologies presents in this company by TEM, she performed studieson damages introduced by FIB technique in the preparation of thin lamellas. In March 2005, shejoined SERMA Technologies to set up a TEM activity. Today, SERMA Technologies can proposedifferent types of TEM preparations and analyses.


• Mixed-Signal ASIC Design for Industrial Applications -Nightmare or Opportunity?

Dr.-Ing. Lutz Porombka, CEO, Creative Chips

"Industry 4.0" - the dream of a fully automated factory is going to become reality. This needs smart integrated solutions for sensors,communication, process control and data processing inside a harsh industrial environment.

Electronic devices in large industrial production lines have to sustain a harmful environment. At the same time highest functional reliability isexpected in order to eliminate any danger from industrial labour force and to protect valuable production equipment and material. Quality andsafety standards exceed automotive requirements in most cases.

This is a great challenge for the design of those devices and for all production steps of the semiconductor supply chain.

A wide range of dedicated process technologies and tools, the right mixture of specialized analog and digital design experts and a flexiblebusiness model is necessary.


Dr. Lutz Porombka has studied electronics in Dresden, Germany and made his doctors degreebeginning of the 80th. Since this time he is involved in IC design and worked in several responsiblepositions at different semiconductor companies. In 1999 he founded together with threespecialists the CREATIVE CHIPS GmbH and forms with his technical knowledge the development ofthe company.


• Mixed-Signal ASIC Design for Industrial Applications - Nightmare or Opportunity? (End)

Our experience is that fabless semiconductor companies are the right partner for design and production of ASICs for those demandingindustrial applications.

Creative Chips managed these challenges and received more than 50% of their annual revenues from the industrial domain.

We will discuss a few practical examples from industrial mixed-signal ASIC designs and will conclude requirements and possible solutions notonly from the technical point of view.



• Design and Virtual Fabrication Technology for MEMS & Semiconductor Ecosystems

Christopher J Welham, Director, Application Engineering, Coventor

An established provider of software tools that aid three-dimensional design of processes and products, Coventor has been at the forefront ofdeveloping sophisticated simulation tools to help designers and fabs achieve performance, reliability and repeatability in their designs, with afocus on design predictability and yield.

MEMS industry leaders, including MEMS suppliers and foundries, are beginning to recognize the real cost of time-to-market delays caused bythe lack of a universal MEMS design methology to connect device design, fabrication and product integration. This talk will briefly reviewcurrent flows and then detail work towards a new universal methology. This methology will enable the design of MEMS using a parameterizedlibrary of modular building blocks that are design-rule aware and technology-independent. Provided in combination with a PDK, these featuresoffer a robust path to right-first-time design for fabless design houses, SMEs and IDMs. Funded via a German government funded project withX-FAB, Cadence and Bosch, this methodology should substantially lower design barriers and increase the opportunities for widespread use ofMEMS accross a broad range of applications.


Chris Welham studied at Warwick University where he gained a BEng in Electronic Engineering in1992 and a PhD in Engineering in 1996. He then worked for Druck (now GE Druck) developingprecision resonant sensors. He moved to Coventor in 1999 as a Senior Application Engineer forEurope and is now Director of the Applications Engineering Group for MEMS CAD Tools fromCoventor’s Paris Headquarters.


• Design and Virtual Fabrication Technology for MEMS & Semiconductor Ecosystems (End)

For foundries, equipment manufactures and fabless companies operating in the MEMS and Semiconductor ecosystems, improving the linksbetween device design, lithography, process design, metrology and equipment functions can further promote right-first-time design, improvedyield and lower cost. Coventor has been actively working for a number of years with key industrial partners on a virtual fab environment toserve these ecosystems. This talk will also cover some benefits of the virtual fab. For example, how examination of a 3D virtual prototype canreveal design errors before mask tape out and fab run, so eliminating expensive design-fabricate and test cycles. A further advantage is theability to explore the impact of design changes, process variations, virtual defects and assembly misalignment errors before manufacture. Inthe equipment space, the value of virtual fabrication is to facilitate understanding of how individual unit process steps (etch, deposition orlithography) impact on a more complex integrated process flow.



• ASIC Design and Verification with MATLAB and Simulink

Cynthia Cudicini, CDA Application Engineer Team Leader, MathWorks

The development of electronic hardware is time-consuming and costly, and with a highly competitive market it is essential to tape-out with theright product at the right cost point. Recent developments in MATLAB® and Simulink® provide stronger integration with conventional EDAworkflows, reducing the effort in design and verification, and enabling a much more agile development flow allowing the design to rapidlyadapt to changes in requirements. The enabling technology is an integrated flow from detailed system design through to implementation andverification, for digital as well as mixed-signal systems. This includes not only the efficient generation of RTL for implementation of algorithms,but also the generation of effective test benches to aid verification.

In this session, we will discuss how you can: Generate efficient VHDL® or Verilog® code from MATLAB, Simulink, and Stateflow® for FPGA or ASIC implementation Develop system-level testbenches in MATLAB and Simulink, and re-use them for RTL verification through co-simulation with EDA tools

as well as FPGA-in-the-Loop Export models from MATLAB and Simulink to other verification environments, including SystemVerilog and SystemC/TLM


Cynthia Cudicini joined MathWorks in November 2009 as an application engineer specialized insignal processing and code generation products. Cynthia holds an engineering degree in digitalsignal processing from the French engineering school “Ecole Polytechnique de Nice-SophiaAntipolis”. Prior to joining MathWorks, Cynthia worked 7 years as a DSP audio software engineerat Texas Instruments.

SUCCESSFUL SEMICONDUCTOR FABLESSSESSION 3– INDUSTRIALISATION: How can the semiconductor industrialization supply chain be made easier?Chairman: Tomislav Oresic, Business Development Manager, Serma Technologies


Business Development Manager, Tomislav Oresic joined SERMA in 2012, he is currently in charge of promoting the semiconductor offer of SERMA Technologies throughout Europe. Prior to joining SERMA Tomislav worked for a company of United Technologies Corporation (UTC), holding various managerial responsibilities and positions in the UK, Russia and France.Tomislav earned a master’s degree from the Graduate School of Engineering “Ecole Nationale Supérieure d’Arts et Métiers-ParisTech” and a Master of Science in integrated systems engineering from Southampton Institute.


• Fabless companies and IDM: partners for successful industrialization. An automotive case study.

Laurent Vancaillie, Business Development Manager, On Semiconductor

Fabless companies, OEMs and start-ups constantly address market needs with the development of first-of-a-kind and innovative products.Besides time-to-market and first-time-right, the success of a new launch is highly dependent from how critical quality and supply chain relatedaspects have been taken into account in the development phase already.

In this presentation, we’ll take the example of the automotive industry as one of the most demanding ones, and we’ll show how an IDM canshare specific expertise and know how, to partner with fabless companies through qualification and industrialization of products. Additionalvalue added services which are instrumental for fabless companies through the entire product lifecycle will be highlighted as well.


Laurent Vancaillie holds a M.Sc and a Ph.D degree in microelectronics, from the Universitécatholique de Louvain in Belgium.After a technical engineering start as analog design engineer in a design house, Laurent wastickled by a more commercial function and joined ON Semiconductor in 2008 where he currentlyacts as Business Development Manager for the Custom Foundry Division.The Custom Foundry Division offers technologies from the ON Semiconductor portfolio and supplychain services to OEM, fabless companies and design houses.In his position, Laurent is the commercial interface for the different projects and also supports thecustomers during design and industrialization.He likes partnering with his customers and turning great ideas into successful products.


• Key success factors for a fabless semiconductor company

Patrizio Piasentin, Sr Regional Sales Manager, South Europe, Silicon Labs

Silicon Labs is a fabless semiconductor provider. The presentation will highlight some key factors contributing to his success. For nearly 20 years, SiliconLabs have created the silicon, software and tools that enable the world’s leading engineers to develop products that transform industries and improvelives. Silicon Labs started designing the first monolithic GSM chip, then modems, Slics TV& Radio Demodulators / Tuners.

Now Silicon Labs innovative products, tools and technologies empower our customers to work smarter and make the world a more connected andenergy-friendly place. From MCUs, wireless SoCs and sensors for the IoT to advanced timing and power management chips for Internet infrastructure andindustrial automation, Silicon Labs’ solutions provide customers with significant advantages in performance, energy efficiency, connectivity and designsimplicity.


Patrizio Piasentin is Southern Europe Manager at Silicon Labs. A leading provider of silicon,software and solutions for a smarter, more connected world. Patrizio has more than 25 years ofsemiconductor experience with industry leaders like Microsemi/Actel Synopsys/Viewlogic. Hecontributed to introduce disruptive technologies such as behavioral simulation (VHDL) and HighReliability FPGAs in Mil AeroSpace projects. Patrizio was also a contributor to the DO254 usergroup for Avionic certification.Patrizio holds a Master in Microelectronics from ESIEE Paris.


• Electrical test as trusted companion from idea to series production

Fritz Schlicher, General Manager, Bluetest Testservice

In former times the tasks of test houses were limited to either cover overloads of semiconductor manufacturers or perform some sample tests at incoming inspection tests for the buyers of the devices. At that time one could hear voices telling that testing in Europe has no future. Nowadays things have changed completely. Semiconductor test experiences a renaissance with a new focus. Most of the customers of test service providers as Bluetest are fabless design companies many of them without own test capabilities. Development of the test solution goes closely together with the device development in a spirit of partnership. The sooner the collaboration starts the better the results.

Test strategy, test specification available in early stage - a stable and released test program when starting qualification - a Ramp Up phasefollowed by demanding acceptance procedures before releasing a test program to series test. Those puzzle pieces must fit together for a stabletest with sufficient informative value which is eye and ear to the quality of product and production processes.


Fritz Schlicher (married, 2 children) is general manager of Bluetest Testservice GmbH, a Germancompany offering semiconductor test services from test development to electrical testing andconsulting. He founded the company together with two partners in 2011. Decades of work insemiconductor test since his degree in telecommunications in 1983 yield to a wide and practicalexperience with various ATEs, devices and customers. Today he is creating test solutions for ASICsmostly designed by fabless companies and offers on-site engineering support to automotivesemiconductor manufacturers.


• Electrical test as trusted companion from idea to series production (End)

The speech will to encourage to adapt the common practice of big high-quality automotive manufacturers to the needs, capabilities andquantities of fabless design companies.

Take testing into account can help you to avoid over-the-top expensive test solutions, poor test coverage or instable test performance causingtrouble during all the life cycle of a product.



• The emerging fabless eco-system for photonic integrated circuits: current status,

Twan Korthorst, CEO, PhoeniX Software

After a short introduction to integrated photonics, the talk will deal with an overview of the eco-system providing access to photonicintegrated circuit fabrication in III-V materials, silicon nitride (TriPleX) and silicon photonics through Multi Project Wafer and customized runs.Today, most facilities are located in Europe and offer a variety of technologies, suitable for different application areas. This includes serviceproviders for packaging, test and design houses in addition to the chip manufacturing facilities.

Further, to support the fabless business model software solutions providers have invested in developing more integrated design flows,including the required process design kits.


Twan Korthorst did his Master’s degree in Electrical Engineering at the University of Twente(Netherlands) during the final stage of which he co-founded the Microflown Team, developing theworld’s first particle velocity microphone, based on MEMS technologies. In 1996, he started asproduct engineer at Twente Microproducts (TMP). After the acquisition of TMP by Kymata, aScottish-based communications solutions provider utilizing integrated optics, he occupied the postof Director Operations at Kymata Netherlands (later Alcatel Optronics Netherlands). Having beena Manager of Operations at DEMCON Advanced Mechatronics, Twan joined PhoeniX Softwarefrom August 2007 to become General Manager and later CEO.


• The technical challenges of future IoT networks and their consequences on modem’s and SoC’s design

Christophe Fourtet, Co-creator and technical director, SigFox Wireless - Eric Mercier, Program Manager of FOXY chip, Commissariat à l’EnergieAtomique (CEA)

IoT or « Internet of Things », recognized as the future massive extension of "M2M", will become one of the major markets of the followingyears and is going to bring incredible revolutions in industrial, and generally speaking, human activities, like energy, resource management,necessary replacement of programmed obsolescence by predictive maintenance or "on demand improvements" of machines, health careimprovements, optimized agriculture...Etc...

For those revolutions to come true, beyond necessity of other ongoing breakthrough on materials, nano-tech, or sensors, the IoT telecomrevolution itself needs to be a reality. This is the big challenge. Because an unprecedented density of devices, at very low cost, withoutstanding needs for autonomy, that humanity will have to "forget" along their service after "dissemination" on the field, will require acomplete "flip-over" of the philosophy that has been dominating in the telecom industry for 100 years, with a culminating point in modernradiotelephony and internet.

Networks are today massively forcing their "administrated" modems to be highly disciplined (in frequency or modulation accuracy, timesynchronization...) before they can negotiate a single bit of data. For a working IoT world, networks will need to be switched to "highlycognitive", with a high capacity to dynamically adapt to the various behavior of the disseminated devices they will have to "serve", throughmassively parallel Software Defined principles.



• The technical challenges of future IoT networks and their consequences on modem’s and SoC’s design (End)

"Networks at the service of free devices" : A true historic revolution in telecoms in fact !

Those philosophy changes will have unprecedented consequences on the modem's properties that will be embedded in those famous"objects", and thus will have consequences on hardware as well as software components from which they will be built. By cascade effect,consequences on SoC definition and design, will not be of minor importance…


Graduated from INSA de Lyon and holds a DEA in electromagnetism, Christophe Fourtet is a long time enthusiast of science and technology, particularlyradio and electromagnetism. This passion will take him to work on multiple radio projects in companies such as Thomson, TALCO, SAGEM, MOTOROLA, asa design engineer and as a technical manager. He has been working on topics such as PMR, then pioneering digital PMR as well as digital cellular, and then3G / LTE. In fact, caught in the 90s as many radio specialists by the wave of cellular and its quest of broadband, he made a 180 degree turn starting towork on more "frugal" and "low footprint" radio systems, combining low power and high performance for a given service.The modern UNB (Ultra Narrow Band) began to be born, and it is his meeting with Ludovic Le Moan, that triggered the spark of SIGFOX five years ago

Eric Mercier, Program Manager of FOXY chip, Commissariat à l’Energie Atomique (CEA). Eric Mercier is graduated from the ENSEEIH of Toulouse, France,in 1991, and holds a DEA in Microwaves focused on Near-field/Far-field antenna diagram conversion done at Alcatel Space (Toulouse). After having heldpositions in Test Equipment (Schlumberger / Wavetek ) for physical fiber optical link tests and Semiconductor companies ( STm, Atmel ) as R&DApplication, Characterization and Marketing engineer, his is now at CEA-Leti, as Head Manager of the Laboratory for Architectures & Integrated RF design(LAIR). He has also been in charge of the ULP RF projects in the lab with a specific focus on low-power RF transceiver design & implementation as well ason embedded resources dedicated to low-power WSN solutions. He has co-authored some conference papers and participated to a book chapter on WSNtopic. He had also been involved in the IST - e-SENSE, ICT - SENSEI and - WiserBAN projects, before being the project leader of the SIGFOX-CEAcollaboration.


• Wearable Electronics: the most promising part of IoT

Dr Eric Mounier, Senior Technology & Market Analyst, MEMS & Sensors, Yole Développement

Wearable technology is expected to be part of the IoT revolution, bringing useful information directly to the user in a more natural and friendlyway than with traditional electronic devices.

More than 10 million units of wearable devices were sold during the year 2014, but this number is rather low if we consider the totaladdressable market (TAM). These unbacked products seem to have a great but clearly under-exploited potential. In the future, several dozen ofmillions of units are expected, but to that end, not only is a mature technology mandatory, but market drivers as well as the most relevantapplications need to be identified. Furthermore, a successful product must be part of a strong software ecosystem because a successfulwearable device will need to interact with both environment and human, all of this with a seamless technology. This is the first step towardhumans and the technology fusion. At the end, the real questions are, which segment is the most profitable, who will provide the seamlesstechnology, the best business model and where the value can be found?


Dr. Eric Mounier, MEMS & Sensors Senior Analyst. With almost 20 years of experience in MEMS & Sensors applications, markets andtechnologies analysis, Dr Eric Mounier provides a very deep insight to the industry about the current and future trends for MEMS. AtYole Développement, Dr. Eric Mounier is in charge of MEMS & Sensors, but also covers printed electronics and future disruptivetechnologies such as photonics. He has contributed to more than 150 marketing & technological analysis and 60 reports in thesetopics, contributing the MEMS industry moving forward. He has created and has been editor-in chief of numerous media dedicatedto the MEMS and Sensors industry. He is a co-founder of Yole and previously worked at CEA LETI R&D lab in Grenoble, France inmarketing dept. Eric is also an expert at the OMNT (˝Observatoire des Micro & Nanotechnologies˝) for Materials and devices forphotonics. Eric has a PhD in microelectronics from the INPG in Grenoble, after studying at Brighton University and MacGill inMontreal.



Jean-Luc Errant, President, Cityzen Sciences




Frédéric Beaudoin, Senior Director Sales Strategic Accounts, Amkor Technologies
