Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications_2015 Report by Yole Developpement

June © 2015

From Technologies to Market

Photolithography for Advanced

Packaging, MEMS & LEDs

Report

From Technologies to Market

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Biography & contact

ABOUT THE AUTHORS

Amandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials for Advanced Packaging

Claire TROADEC, Market & Technology Analyst, MEMS and Semiconductor Manufacturing

Amandine is in charge of equipment & material fields for the Advanced Packaging & Manufacturing team at Yole Développementafter graduating as an engineer in Electronics, with a specialization in Semiconductors and Nano Electronics Technologies. Sheworked in the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.

Contact: [email protected]

©2015 | www.yole.fr | Photolithography for Adv. Packaging, MEMS and LEDs

Claire Troadec has been a member of the MEMS manufacturing team at Yole Développement since 2013. She graduated fromINSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXPSemiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, sheoversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authoredor co-authored seven US patents and nine international publications in the semiconductor field and before joining YoleDéveloppement managed her own distribution and e-commerce company.


Jérôme AZEMAR, Market & Technology Analyst, Advanced Packaging Manufacturing

Jérôme Azémar is a member of the Advanced Packaging & Manufacturing team. Upon graduating from INSA Toulouse with amaster’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three years as an ApplicationSupport Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he thenhoned over a two year stint as a Process Engineer at STMicroelectronics. While with ST he developed new processes, co-authored an international publication and worked on metrology structures embedded on reticules before joining YoleDéveloppement in 2013.


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TABLE OF CONTENTS

1/2

• Introduction, Definitions & Methodology

• Glossary

• Companies Cited in this Report

• Definitions, Limitations & Methodology

• Who Should be Interested in this Report?

• EXECUTIVE SUMMARY

2014-2020 Forecasts Breakdown by application

o Lithography equipment market forecasts provided both in $M,

Munits with associated growth rates

o Volume shipment by application (packaging platform vs MEMS)

o Volume shipment by technology

Overall Market Share: breakdown by MEMS,AP & LEDs

Major suppliers positioning (by techno, by application)

• PART 1: CURRENT LITHOGRAPHY EQUIPMENT & MATERIALS

Geographical mapping of the players

Major suppliers positioning

Technology overview (MA, Projection steppers, scanners)

ADVANCED PACKAGING

o Equipment

Current lithography technologies used

Future or potential technologies used

Current status

Technical specification required

Challenges

Unmet needs by process step

Technology trends

2014–2020 market forecast in $M and units

Equipment and materials suppliers involved in lithography

Market share in 2014

Case studies: cost structure examples and process steps

o Photoresist materials

Current materials technologies used

Trends

Challenges

Key technical specifications

Market share in 2014

Breakdown by material supplier

Breakdown by type of photoresist: positive vs negative; spin

vs dry


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TABLE OF CONTENTS

2/2

• Unmet needs by process step

• Technology trends

• 2014–2020 market forecast in $M and units

• Equipment & materials suppliers involved in lithography

• Market share in 2014

• Case studies: cost structure examples & process steps

o Photoresist materials overview

• PART II: DISRUPTIVETECHNOLOGIES

Technology overview

o Laser direct imaging

o Laser ablation

o Nanoimprint lithography

Geographical mapping of the players

Major suppliers positioning

• PART III: LITHOGRAPHY COMPETITIVE LANDSCAPE SCENARIOS

AND TRENDS

• Conclusions & Perspectives

• Company presentation

MEMS

o Equipment

• Current lithography technologies used

• Future or potential technologies used

• Current status

• Technical specification required

• Challenges

• Unmet needs by process step

• Technology trends

• 2014–2020 market forecast in $M and units

• Equipment and materials suppliers involved in lithography

• Market share in 2014

• Case studies: cost structure examples and process steps

o Photoresist materials overview

LEDS

o Equipment

• Current lithography technologies used

• Future or potential technologies used

• Current status

• Technical specification required

• Challenges©2015 | www.yole.fr | Photolithography for Adv. Packaging, MEMS and LEDs

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REPORT OBJECTIVES (1/2)

• We have decided to make a technology and market report on the lithography technology for the following reasons:

• Growing interest for lithography has been noticed in the industry

• Competitive market which attracts new entrants in the lithography business

• The objectives of the reports are :

• Provide an overview of the lithography technologies

• Description of the key lithography applications

• Who are the current and future industrial users in each application

• Provide market data and forecasts on lithography equipment and materials for lithography technologies

• Identify the lithography solutions and equipment suppliers supporting Advanced Packaging, MEMS & LEDs markets

• Determine the competing landscape for each segment mentioned above


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REPORT OBJECTIVES (2/2)

• Assess the market for lithography tools

• Production forecast 2014-2020 in number of tools and in revenue

• Production forecast 2014-2020 by lithography method

• Players roadmap, expected year for market entry

• Analyze the lithography techniques (mask aligner, stepper, projection scanner, laser ablation, laser direct

imaging) trends

• Global lithography technologies and materials used for lithography trends

• Manufacturing challenges related to each lithography method

• Provide an overview of the technological trends for lithography tools and materials solutions for

lithography

• The following applications, where lithography processes are also required, are not included:

• Power devices (IGBT, MOSFET…)


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WHO SHOULD BE INTERESTED IN THIS REPORT?

• Equipment & material suppliers:• Identify new business opportunities and prospects

• Understand the differentiated value of yourproducts and technologies in this market

• Identify technology trends, challenges and preciserequirements related to lithography

• Evaluate your lithography technologies’ marketpotential

• Position your company in the market

• Monitor and benchmark your competitors

• IDMs, CMOS foundries and OSAT players:• Understand technology trends related to

lithography technologies when used in AdvancedPackaging, MEMS and LED devices

• Spot new opportunities and define diversificationstrategies

• R&D organizations and investors:• Evaluate market potential of future

technologies and products for new applicativemarkets

• Identify the best candidates for technologytransfer

• Monitor the global activity and consolidationcurrently occurring in the semiconductorequipment and material business in order toidentify new partners and targets, and makethe right decisions before committing to oneparticular supplier


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COMPANIES CITED IN THE REPORT (NON-EXHAUSTIVE LIST)

ASML, Canon, Dongjin Semichem Co., Dow Corning Corporation, Dow Electronic Materials, Eulitha, Enthone (Cookson Electronics), EVG Group, Hefel Advantools Semiconductor co, Ltd, HD Micro/Dupont, Heidelberg Instruments, JSR Micro, Limata,

SUSS MicroTech, JSR Micro, Merck/AZ Em, Micronic Mydata, Molecular imprint, Nikon, Obducat, Orbotech, ORC, Rudolph, Shanghai Micro Electronics Equipment Co. Ltd. (SMEE), SCREEN, Tokyo Ohka Kogyo Co., LTD. (TOK), Shin-Etsu MicroSi,

Ultratech, USHIO, Visitech, and many more…


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SCOPE OF THE REPORT

Indiquer applifinal market


Resolution

(µm)10 µm1 µm0.01 µm 0.1 µm

Mainstream Front-End

(Logic+Memories)

> $400B

Advanced Packaging

>$9B

MEMS

>$11B

LEDs

>$14B

2014 Market size

($B)

Small

Large

Focus of the report

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OVERVIEW OF LITHOGRAPHY TECHNOLOGIES

• There are 5 main available technologies that could be used in the Advanced Packaging, MEMS devices and LED applications :

• Today, patterning is performed by various photolithography solutions such as: Mask aligner, Projection stepper & scanner.

• Laser direct imaging and Laser ablation could be alternative solution to the lithography technologies used today

Patterning in Advanced Packaging is required for Via formation, bumping process and RDL

Lithography technologies for Advanced Packaging,

MEMS & LEDs

Mask aligner Projection

Stepper

Scanner

Laser direct imaging Laser ablationNanoImprint

(NIL)

on production

on production

Ready for

production

Qualification on

FO WLP

Ready for production

Disruptive technologies

on production


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STRONG COMPETITION IN THE LITHOGRAPHY AREA: HOW CAN NEW EQUIPMENT VENDORS ENTER THE MARKET AND BECOME SUCCESSFUL?


Advanced Packaging and substrates

MEMS devices LED devices

EQU

IPM

ENT

SU

PP

LIER

S

Mask aligner

Projection (Stepper & scanner)

Laser ablation

Laser direct Imaging

NIL

Stepper NIL

Full-field NIL

DTL

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OVERVIEW OF THE EQUIPMENT VENDORS INVOLVED IN THE PACKAGING AREA

*SUSS provides Projection scanner which is in-between mask

aligner and projection stepper

Major competitors for steppers

Major competitors for Mask

aligners*

Internal re-use or re-sale

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LITHOGRAPHY EQUIPMENT TECHNOLOGY

Price vs Resolution capabilities

Top-tiers vs specializedequipmentvendors

Price ($M)

Resolution (µm)

$1M

$2M

$3M

$4M

1 µm 2 µm 3 µm 4 µm

Laser ablation


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Current solutions

Type of lithography technologies

Mask alignerProjection Laser

direct imaging

Laser ablation

Stepper Scanner

3D IC & 2.5D interposer

FO WLP

WLCSP

Flip Chip wafer bumping on BGA

3D WLP (CMOS ImageSensors)

Embedded die

FO WLP Panel

Organic/Glass panel interposer

LITHOGRAPHY TECHNOLOGIES TRENDS IN ADVANCED PACKAGING


Disruptive technologies/Future solutions

Mask aligner

Projection Laserdirect

imaging

Laser ablation

NIL

Stepper Scanner

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LITHOGRAPHY EQUIPMENT TECHNOLOGY

Price vs Resolution capabilities

l

Throughput (Wafer/hour)

Resolution (µm)

20

50

80

100

Stepper~50-60

Laser

ablation

~20 to 100 (depending

on the

material

type)

1 µm 2 µm 3 µm 4 µm

Laser Direct

Imaging ~70 to 90


ScannerWafer

~75

Mask Aligner~100

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KEY LITHOGRAPHY CHALLENGES BY ADVANCED PACKAGING PLATFORM

With their own characteristics

MEMS

PCB

Fan-OutWLP

Package

FO WLP challenges• Warpage

• Overlay issue due to die shift

3DICwithTSV

3D IC withTSV• Resolution: < 2µm

• IR alignment

Flip-Chip

Flip Chip• Sidewall coverage

• bump pitches reduced, very thick

resist required

Embedded Devices

Embedded die challenges• Line width/spacing limited today

• Die placement accuracy

• Die shift issues

3-D WLP 3D WLP• No specific concerns in

the lithography process

steps

WLCSP challenges• Resolution

• Challenging to go down to

2µm L/S

• Vertical sidewalls

• Dielectric processing


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0

50

100

150

200

250

300

2014 2015 2016 2017 2018 2019 2020

Too

l sh

ipm

ent

fo

reca

st (

in u

nit

s)

Photolithography equipment market forecastfor Advanced Packaging, MEMS and LED devices (in unit of production tools)

Breakdown by application

Advanced Packaging MEMS devices LED devices

Yole Developpement © June 2015

LITHOGRAPHY EQUIPMENT MARKET FORECAST

Number of production tools

Advanced Packaging represents more than half of the projection systems shipped in 2014 and exhibit the highest CAGR (15%)


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PHOTORESIST FOR ADVANCED PACKAGING

Breakdown per equipment supplier

Ultratech isleading the lithographymarket for Advanced Packaging


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PHOTORESIST FOR ADVANCED PACKAGING

Breakdown per material supplier

JSR is leadingthe photoresistmarket for Advanced Packaging


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PROFILES OF COMPANIES ADDRESSING THE MEMS MARKET

2 main profiles serving the MEMS projection system market:

Mainstream Front End players with internal re-use or re-sale equipment

Niche market players with dedicated new MEMS equipment


Mainstream

Front End

2014 Revenue ($M)

>$100M

Niche

markets

> $150M

> $1B

> $10B

Mainly internal re-use or re-sale base

New equipment base

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MEMS PROJECTION SYSTEMS TAM

For new equipment in Units

We estimate the total available market to be 42 tools in 2014. This would represent a 9% CAGR2015-2020


C

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INVOLVEMENT OF THE FE AND BE EQUIPMENT SUPPLIERS

• Requirements especially in the Advanced Packaging have driven the adoption of equipment coming from Front-End and Back-End area

migration for equipment suppliers towards Middle-End space

FEWafer manufacturing

++ More suitable for achieving

aggressive features

-- Expensive

BEAssembly & Test

++ Lower cost

-- Scaling issues

Specialized equipment

vendors already involved

in the Packaging area

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MORE SLIDES EXTRACTS

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OUR LATEST REPORTS

N

o

k

i

a

3D IC Business Update

2014

N

o

k

i

a

3D IC & WLP Equipment

and Materials

2014

Coming

SoonComing

Soon

Coming

Soon

Coming

Soon


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The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing.

In the “More than Moore” industry the holy grail isn’t downscaling any more – it’s adding functionality. There are two clear leaders, SUSS MicroTec in the MEMS and Sensors industry, and Ultratech in the Advanced Packaging industry. They’re closely followed by the outsiders, EVG, Rudolph and USHIO.

But the similarities are only superficial, because the market entry barrier is much lower in the “More than Moore” market. Equipment in the Advanced Packaging, MEMS

and LEDs industries is less complex but customer adoption needs are higher, which leads to a much broader photolithography landscape.

The photolithography market structure for these three industries is very different compared to the “More Moore”, or mainstream semiconductor, industry. New entrants can penetrate these markets with a good knowledge of the technological building blocks. But the key to success is to adapt the equipment to the specific customer’s needs. That means that these markets are complex to develop and that they take a long time to penetrate.

Some players entered through acquisition. Rudolph acquired Azores Corp. in 2012 to enter the Advanced Packaging photolithography equipment arena. Also in 2012, Suss MicroTec acquired Tamarack Scientific Co. Inc. to enlarge its semiconductor back end photolithography equipment market.

Others like Orbotech, which acquired a leading MEMS and Advanced Packaging company, SPTS, is today only present in substrate and PCB direct imaging.

Equipment and Materials Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications

CLEAr LEADErS AnD outSiDErS: At firSt gLAnCE, thE ProjECtion SyStEMS inDuStry SErving thE “MorE MoorE” AnD thE “MorE thAn MoorE” MArkEtS ArE SiMiLAr…

Market & technology report

KEY FEATURES OF THE REPORT• 2014-2020 forecast for

lithography equipment and materials, with unit and market value metrics for Advanced Packaging, MEMS and LED devices

• In-depth analysis of the lithography equipment and materials landscape

• Key technical insights and detailed analysis of lithography equipment and material solutions, trends, requirements and challenges

• Competitive landscape, including market share, product split, lithography technology overview, comparison and roadmaps

• Technology roadmap for adoption of new lithography technologies and associated key equipment suppliers

• Analysis of market disruptions and impact on the current lithography market

• Cost structure analysis of various MEMS and LED devices

REPORT OUTLINE• Photolithography Equipment and

Materials for Advanced Packaging, MEMS and LED Applications

• PDF & Excel file• €5,990 – Multi user license (300+

slides) €4,990 – One user license (300+ slides)

• June 2015• 300+ slides

Strong competition in the lithography area: how can new equipment vendors enter the market and become successful?

Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps

(Yole Développement, June 2015)

Advanced packagingand substrates

MEMS devices LED devices

EQ

UIP

MEN

T SU

PPLI

ERS

Mask aligner

Projection (Stepper & scanner)

Laser ablation

Laser direct Imaging

NIL

Stepper NIL

Full-field NIL

DTL

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Find all our reports on www.i-micronews.com

Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications

Of course, in these “More than Moore” markets, retrofi t equipment does represent a big slice of the pie. Nevertheless business opportunities for brand new equipment are important, considering the very fragmented and therefore highly customer specifi c orientation of these equipment markets.

We estimate the projection systems market for Advanced Packaging, MEMS and LEDs to represent more than US$150M in 2014. Advanced Packaging has the strongest growth, with an estimated equipment installation base of 60 systems in 2014 and a compound annual growth rate (CAGR) of 14-15% envisaged through 2020.In the meanwhile, MEMS photolithography equipment looks set for an 9% CAGR and LEDs 3%.

The Advanced Packaging market is very interesting and is growing dynamically as it includes many different players along the supply chain. It encompasses outsourced assembly at test fi rms (OSATs), integrated manufacturers (IDMs), MEMS foundries and mid-stage foundries.

In comparison, even if the MEMS and Sensor industry is growing at a fast pace, components are also experiencing die size reduction due to strong cost pressure in the consumer market. Consequently wafer shipments are not following the same trend as unit shipments. Lastly, LED equipment growth is back to a normal rhythm, after big investments made in recent years.

The technology mix for projection systems in the Advanced Packaging, MEMS and LEDs markets is quite important. Mask aligners and projection steppers offers a wide resolution range while disruptive technologies like laser direct imaging (LDI), laser ablation, and nano-imprint lithography could re-shuffl e the photolithography pack by offering “good enough” technology specifi cations at lower prices. This will of course depend on the fi nal application as roadmaps differ in terms of resolution needs.

We do not foresee any big specifi cation evolution in the future. However, the MEMS sector is evolving towards greater stepper needs, as layer to layer alignment is becoming very accurate

– down to 0.1 µm – and any misalignment of mechanical features will lower performances, for example in gyros and micromirrors. However this technological evolution is happening slowly as MEMS do not follow Moore’s law, with its constant two-year cycles. The LED equipment market is also very stable as the 2010-2011 investment cycle resulted in worldwide overcapacity at most levels of the value chain.

Advanced Packaging has very complex technical specifi cations. Warpage handling as well as heterogeneous materials represent big challenges to photolithography. Due to aggressive resolution targets in Advanced Packaging, performance must be improved. The current minimum resolution required is below 5 µm for some advanced packaging platforms, like 3D integrated circuits, 2.5D interposers, and wafer level chip scale packaging (WLCSP). A lot of effort is being made to reduce overlay issues due to shifting dies and obtain vertical sidewalls for fl ip-chip and WLCSP. Although steppers are already well established in the packaging fi eld, new disruptive lithography technologies are also emerging and could contribute to market growth from 2015-2016.

Huge business opportunities in the Advanced Packaging market are therefore driving photolithography equipment demand. Given the high growth rate of this market, there is no doubt that already established photolithography players and new entrants will be attracted.

thE ADvAnCED PACkAging, MEMS AnD LEDS ProjECtion SyStEMS MArkEt rEPrESEntS uS $150M in 2014

tEChnoLogy MiX iS iMPortAnt



Photolithography equipment market forecast for Advanced Packaging, MEMS and LEDs (in system units)

key lithography challenges for Advanced Packaging

0

50

100

150

200

250

300

2014 2015 2016 2017 2018 2019 2020

Tool sh

ipm

ent

fore

cast

(i

n u

nits)

Advanced Packaging MEMS devices LED devices

CAGR ~ 3%

CAGR ~ 9%

CAGR ~ 15%

MEMS MEMSMEMSMEMS

PCB

Fan-Out WLP Package

FO WLP challenges • Warpage • Overlay issue due to die shift

3DIC with TSV

3D IC with TSV • Resolution: < 2µm• IR alignment

Flip-Chip

Flip Chip • Sidewall coverage • bump pitches reduced, very thick resist required

Embedded Devices

Embedded die challenges • Line width/spacing limited today • Die placement accuracy • Die shift issues

3-D WLP 3D WLP • No specific concerns in

the lithography process steps

WLCSP challenges • Resolution • Challenging to go down to

2µm L/S • Vertical sidewalls • Dielectric processing

Market & technology report

oBjECtivES of thE rEPort

Claire troadec has been a member of the MEMS manufacturing team at Yole Développement since 2013. She graduated from INSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in the semiconductor field and before joining Yole Développement managed her own distribution and e-commerce company.Contact: [email protected]

AuthorSAmandine Pizzagalli is in charge of the equipment and material areas for the Advanced Packaging and Manufacturing team at Yole Développement. She graduated as an electronics engineer, with a specialization in semiconductors and nanoelectronic technologies. In the past, she worked for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.Contact: [email protected] To provide:

• Market metrics both at lithography equipment and photoresist materials levels from 2014 to (Forecast until 2020: revenue, unit count)

• Market share of the key equipment and materials suppliers involved in the packaging, MEMS and LED industries

• Key technical insights into future lithography equipment and materials trends and challenges• Analysis of the technology trends

- Technology roadmap- Latest technical innovations

• Analysis of the key equipment and materials vendors • Analysis of market disruptions and impact of alternative technologies on the lithography market• New analysis based on the competitive landscape and market share for all main equipment

and materials suppliers• Key technical insights and detailed analysis on equipment and materials solution trends,

requirements, and challenges• Roadmap for technology, evolution and future development, including disruptive technologies

This report provides an overview of all the key lithography technologies used in Advanced Packaging, MEMS and LED applications and benchmarks them in terms of feature requirements. Moreover, it provides examples of lithography process steps for these applications. It describes associated technological breakthroughs and manufacturing process. More insights are included on specific lithography equipment tools for Advanced Packaging, MEMS and LED devices.

Competition trends are carefully analyzed and presented as a competitive landscape and competitive analysis of the major equipment and materials suppliers involved in Advanced Packaging, MEMS and LED applications. Finally, a section is also dedicated to disruptive technologies such as LDI, laser ablation and nanoimprint lithography, which could reshape the lithography landscape in the future. Possible reshaping scenarios are described, including acquisitions, mergers, and joint ventures, along with their anticipated impact on the global photolithography market.

CoMPAniES CitED in thE rEPort (non exhaustive list)ASML, AZ EM/Merck, Canon, Dongjin Semichem Co., Dow Corning Corporation, Dow Electronic Materials, DuPont Electronic Technologies, Enthone (Cookson Electronics), Eulitha, EVG Group, Hefei Advantools Semiconductor co, Ltd, HD Micro/Dupont, Heidelberg Instruments, JSR Micro, Limata, SUSS MicroTech, JSR Micro, Micronic Mydata, Molecular Imprint, Nikon, Obducat, Orbotech, ORC, Rudolph, Shanghai Micro Electronics Equipment Co., Ltd. (SMEE), SCREEN, Shin-Etsu MicroSi, Inc, Tokyo Ohka Kogyo Co., LTD. (TOK), Ultratech, Ushio, Visitech, and many more...

Introduction, definitions and methodology p4Executive summary p8

> 2014-2020 forecasts, broken down by application- Lithography equipment market forecasts

provided both in $M, and Munits with associated growth rates

- Volume shipment by application (packaging platform vs MEMS)

- Volume shipment by technology> Overall market size: breakdown by MEMS and

Advanced Packaging> Major supplier positioning by technology

and application

Current lithography equipment and materials used today p27

> Geographical mapping of the players> Major suppliers positioning> Technology overview: Mask aligners, projection

steppers and scanners> Advanced packaging

- Equipment : Current lithography technologies used / future or potential technologies used / current status / technical specification required / challenges / Unmet needs by process step / technology trends / 2014–2020 market forecast in $M and units / equipment and materials suppliers involved in lithography / market share in 2014 / case studies: cost structure examples and process steps

- Photoresist materials : Current materials technologies used / trends / challenges / key technical specifications / Market share in 2014 (Breakdown by material supplier and by type of photoresist: positive vs negative; spin vs dry)

> MEMS- Equipment : current lithography technologies

used / future or potential technologies used / current status / technical specification required / challenges / unmet needs by process step / technology trends / 2014–2020 market forecast in $M and units / equipment and materials suppliers involved in lithography / market share in 2014 / Case studies: cost structure examples and process steps

- Photoresist materials overview> LEDS

- Equipment : current lithography technologies used / future or potential technologies used / current status / technical specification required / challenges / unmet needs by process step / technology trends / 2014–2020 market forecast in $M and units / equipment and materials suppliers involved in lithography / market share in 2014 / Case studies: cost structure examples and process steps

Disruptive technologies p229

> Technology overview- Laser direct imaging- Laser ablation- Nanoimprint lithography- Geographical mapping of the players- Major suppliers positioning

Lithography competitive landscape scenarios and trends p277Conclusions & Perspectives p310Company presentation p315

tABLE of ContEntS

jérôme Azémar is a member of the Advanced Packaging & Manufacturing team. Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. While with ST he developed new processes, co-authored an international publication and worked on metrology structures embedded on reticules before joining Yole Développement in 2013.Contact: [email protected]

orDEr forMPhotolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications

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• Europe & RoW: Jérôme Azemar - [email protected]

• Korea: Hailey Yang - [email protected]

• General: [email protected]

(1) our terms and conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx the present document is valid 24 months after its publishing date: June 18th, 2015

/

ABoUt YoLE DEVELoPPEMENt

BILL to

Name (Mr/Ms/Dr/Pr):

Job Title:

Company:

Address:

City:

State:

Postcode/Zip:

Country*:

*VAT ID Number for EU members:

Tel:

Email:

Date:

PRoDUct oRDERPlease enter my order for above named report : one user license*: Euro 4,990 Multi user license: Euro 5,990- The report will be ready for delivery from July 6th, 2015- For price in dollars, please use the day’s exchange rate.

All reports are delivered electronically at payment reception. For French customers, add 20% for VAT

I hereby accept Yole Développement’s terms and conditions of Sale(1)

Signature:

*one user license means only one person at the company can use the report.

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

MEDiA & EvEntS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Technology Magazines dedicated to MEMS, Advanced Packaging,

LED and Power Electronics• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com

ContACtSFor more information about :• Consulting Services: Jean-Christophe Eloy ([email protected])• Financial Services: Jean-Christophe Eloy ([email protected])• Report Business: David Jourdan ([email protected])• Press relations: Sandrine Leroy ([email protected])

ConSuLting• Market data & research, marketing analysis• Technology analysis• Reverse engineering & costing services• Strategy consulting• Patent analysisMore information on www.yole.fr

rEPortS• Collection of technology & market reports• Manufacturing cost simulation tools• Component reverse engineering & costing

analysis• Patent investigationMore information on www.i-micronews.com/reports

finAnCiAL SErviCES• Mergers & Acquisitions• Due diligence• FundraisingMore information on www.yolefinance.com

Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”.

“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests.

“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.

“intellectual Property rights” (“iPr”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights.

“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:• One user license: one person at the company can use the report.• Multi-user license: the report can be used by unlimited users

within the company. Subsidiaries and Joint-Ventures are not included.

• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.

“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.

“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.

1. SCoPE 1.1 The Contracting Parties undertake to observe the following

general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.

1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.

1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted.

2. MAiLing of thE ProDuCtS 2.1 Products are sent by email to the Buyer:

• within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.

2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.

2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.

2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.

2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .

2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk.

3. PriCE, invoiCing AnD PAyMEnt 3.1 Prices are given in the orders corresponding to each Product

sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.

3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.

3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587

To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days

from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.

3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.

4. LiABiLitiES 4.1 The Buyer or any other individual or legal person acting on

its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.

4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement

4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.

4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.

4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.

4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.

4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.

4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.

5. forCE MAjEurE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.

6. ProtECtion of thE SELLEr’S iPr 6.1 All the IPR attached to the Products are and remain the

property of the Seller and are protected under French and international copyright law and conventions.

6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including

any local area network); • Use in any timesharing, service bureau, bulletin board or

similar arrangement or public display; • Posting any Product to any other online service (including

bulletin boards or the Internet);• Licensing, leasing, selling, offering for sale or assigning the

Product. 6.3 The Buyer shall be solely responsible towards the Seller of

all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.

6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.

6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.

6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.

7. tErMinAtion 7.1 If the Buyer cancels the order in whole or in part or postpones

the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.

7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.

8. MiSCELLAnEouS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.

9. govErning LAw AnD juriSDiCtion 9.1 Any dispute arising out or linked to these Terms and Conditions

or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.

9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.

tErMS AnD ConDitionS of SALES

© 2015

Yole Développement

FromTechnologies to Market

http://www.yole.fr/

http://www.yole.fr/

26

MEMS &

Sensors

LED

Compound

Semi.

Imaging Photonics

MedTech

Manufacturing

Advanced

PackagingPV

Power

Electronics

FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas


http://www.yole.fr/

http://www.yole.fr/

27

4 BUSINESS MODELS

o Consulting and Analysis• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports• Market & Technology reports

• Patent Investigation and patent infringement risk analysis

• Teardowns & Reverse Costing Analysis

• Cost Simulation Tool

www.i-Micronews.com/reports

o Financial services• M&A (buying and selling)

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yolefinance.com

www.bmorpho.com

o Media• i-Micronews.com website

• @Micronews e-newsletter

• Technology magazines

• Communication & webcast services

• Events

www.i-Micronews.com


http://www.yole.fr/

http://www.yole.fr/

28

A GROUP OF COMPANIES

Market,

technology and

strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Fundraising

Maturation of companies

IP portfolio management & optimization

www.bmorpho.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr


http://www.yole.fr/

http://www.yole.fr/

29

OUR GLOBAL ACTIVITY

Yole JapanYole Inc.

Yole

Korea

40% of our business is in

EU countries30% of our business is in

North America

30% of our business is in

Asia


http://www.yole.fr/

http://www.yole.fr/

30

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plan along the entire supply

chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers


http://www.yole.fr/

http://www.yole.fr/

31

CONTACT INFORMATION

o Consulting and Specific Analysis

• North America: Steve LaFerriere, Business Development Manager, Yole Inc

Email: [email protected]

• Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.


• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement


o Report business

• North America: Steve LaFerriere, Business Development Manager, Yole Inc


• Europe: Jérôme Azemar, Business Development Manager, European Office


• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.


• Korea: Hailey Yang, Business Development Manager, Korean Office


o Financial services

• Jean-Christophe Eloy, CEO & President


o General

• Email: [email protected]

Follow us on


http://www.yole.fr/

http://www.yole.fr/

http://www.linkedin.com/company/yole-d-veloppement?trk=top_nav_home

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