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Dynamic & Proto Circuits Inc.

Corporate Presentation

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DAPC Facility 54,000 Sq.ft./6,000 Sq.M

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Multilayer Process

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Solder Mask OptionsBLUE

BLACK

GREENRED

CLEAR

DRY FILM

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Investing in Technology

New equipment to optimize our production and delivery

capabilities

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HASL Machine

The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced.

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High Speed / Small Hole N/C Drilling Equipment

The Schmoll Drilling machines have 6 (six) stations per drilling machine and allow DAPC to be more efficient in drilling panels with a large volume of vias at a rapid speed and accuracy. We are able to mechanically drill holes as small as 6 mil. This greatly enhances the efficiency of high mix low volume production and mass production quantities of printed circuit boards.

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Mass VCP-5001Via Plugging

Machine

This machine is designed to fill holes in printed circuit boards with conductive or non-conductive paste. The hole filling can be performed with through-hole vias and blind vias. The machine is equipped with a full vacuum chamber and heated heads to ensure reliable via filling for the most demanding aspect ratios and a glass cover for visual quality control on both panel sides.

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Soldermask Coater

The DP-1500 applies all types of liquid photoimageablecoatings, including soldermask, primaryimage, dielectric, and legend. This versatile machine incorporates more than eight years of experience of dual-sided coating with many new features designed to reduce cycle time, increase yields and improve process reliability.

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Technology Roadmaps

Materials and Manufacturing Capabilities

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Technology RoadmapAttribute Standard Advanced 2012

Minimum Line Spacing, Internal Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”Minimum Line/Spacing, External Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”Minimum drilled hole size 0.008” 0.006” 0.004”Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1Land Size Internal (Diameter over Drill) 0.012” 0.010” 0.010”Land size External (Diameter over Drill) 0.012” 0.008” 0.008”

No Connect (Diameter over Drill) 0.020 0.016 0.015Plated Hole Tolerance ± .003” ± 0.002” ± 0.002”Minimum Laser Via Hole N/A N/A .004”Laser Via Aspect Ratio N/A N/A 1.5:1

Laser Via Land Size (Diameter Over Drill) N/A N/A 0.008”Minimum Dielectric Thickness 0.004” 0.003” 0.002”Minimum core Thickness 0.004” 0.003” 0.002”

Maximum PCB Thickness 0.125” 0.256” 0.256”Thickness Tolerance (%) 10 7 6Maximum Board Dimensions 16.5”x22.5” 19.5”x22.5” 19.5”x22.5”

Bow And Twist (Through Hole) % 1.50 1.25 1.00Bow And Twist (SMT) % 0.75 0.75 0.75Minimum Conductor to Edge 0.012 0.010 0.008

Layer-To-Layer Registration Tolerance 0.005” 0.004” 0.003”Component Pitch 0.020” 0.016” 0.010”Soldermask Clearance 0.005” 0.003” 0.002”

Soldermask Dams 0.004” 0.003” 0.002”Impedance Tolerance (>50 Ohms) % ± 10 ± 5 ± 3Maximum layers 22 36 36

Maximum Copper Weight Internal (oz.) 3 3 3Maximum Copper Weight External (oz.) 4 5 5

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Technology Roadmap continued

Materials

Via Construction

Surface Finish

Electrical Test Method

Attribute Standard Advanced 2012

FR4 Yes Yes YesHigh Tg FR4 – (170C..) Yes Yes YesBT Epoxy Yes Yes YesPolyimide Yes Yes YesTeflon Yes Yes YesDuroid Yes Yes YesRoHS Compliant Materials Yes Yes Yes

Nelco N4000-13 Yes Yes YesHeatsink Manufacturing and Lamination Yes Yes Yes

Through Hole Yes Yes YesBlind (Mechanical) Sequential Lamination Yes Yes YesBuried (Mechanical) Yes Yes YesBlind Laser No No Yes

ENIG Yes Yes YesOSP Yes Yes YesWhite Tin Yes Yes YesHASL Yes Yes YesElectrolytic Nickel/Gold Yes Yes YesSilver Yes Yes YesQuality SystemMIL-P-55110 Yes Yes YesMIL-PRF-31032 Yes Yes YesISO-9001:2000 Yes Yes

Flying Probe Yes Yes Yes

YesAS9100B Yes YesYes

Isola FR408 Yes Yes Yes

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Substrate Materials

13 PPM70 PPM0.0134.3260Nelco N7000-2V0Polyimide

12 PPM55 PPM0.0093.8250Nelco N8000Cyanate Ester

15-18 PPM140 PPM0.0134.1185Isola G200BT-Epoxy

CTE-X & Y AxisCTE-Z AxisDissipation

Factor

DielectricConstant @

1 MHZTg (° .C)Supplier/Material

TypeMaterial

High Temperature Materials

11-13 PPM65 PPM0.015-0.0234.0180Isola IS410Hi-Temp FR4

10-14 PPM45 PPM0.015-0.0224.4180Matsushita R-1755VHi-Temp FR4

10-14 PPM35 PPM0.0093.9200Nelco N4000-13

13-14 PPM<55 PPM0.01-0.0153.8 Typ.175-185Isola FR408

10-14 PPM37 PPM0.0234.4180Nelco N4000-6Hi-Temp FR-4

12-16 PPM45 PPM0.0274.4140Nelco N4000-2FR-4

CTE-X & Y AxisCTE-Z AxisDissipation

Factor

DielectricConstant

@1 MHZTg (° .C)

Supplier/MaterialTypeMaterial

Standard

Modified FR-4

Modified FR-4

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Substrate Materials

YesYes12/15952.50-3.20 @ 10

GHzArlon

YesYes9.5/9.51200.001 typ @

10 GHz2.40-2.60 +/-

0.04RogersUltralam 2000

YesYes17/17240.0025 @ 10

GHz6.15 +/- 0.15 @

10 GHzRogersRO3006

YesYes14/1650

0.0040 @ 10 GHz

3.48 +/- 0.05 @10 GHzRogersRO4350

YesYes14/1646

0.0022 @ 10 GHz

3.38 +/- 0.05 @ 10 GHzRogersRO4003

YesNo

31/482370.00092.20 +/- 0.020RT/duroid 5880

YesNo16/1624

0.0012 @ 10 GHz

2.94 +/- 0.04 @ 10 GHzRogersRT/duroid 6002

YesYes19/2464

0.0018 @ 1.9 GHz3.50 @ 1.9 GHz

TaconicRF-35

YesYes9-12130-145

0.0019 @ 10 GHz

2.45-2.65 +/-0.04 @ 10 GHz

TaconicTLX

YesYes

9-12700.0030 @ 10

GHz2.75-3.20 +/-

0.05 @ 10 GHzTaconicTLC

Immersion Gold/Tin Finish?

HASLFinish?

CTE-X & Y AxisCTE-Z Axis

Dissipation Factor

Dielectric Constant

Supplier/MaterialTypeMaterial

High Frequency Materials (core material only)

AD Series0.0018-0.0038

@ 10 GHz

Rogers

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North AmericanTop Tier Customers

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Let the DAPC team get started on your project today!