MSC COM modules 2017

Engineering Leadership

03 | 2017

Computer-On-Modules

2 | www.msc-technologies.eu

MSC Technologies at a Glance

youtube.com/mscembedded

”Our aim is to deliver the best engineering performance to provide our customers with a leadership position in their markets.”

Silvano Geissler, Vice President

Board Solutions, MSC Technologies

3

4 | www.msc-technologies.eu 5

Computer on Module Product Range

MSC has the complete portfolio of COM Ex-

press modules. From low end Intel Atom to

high end Core i7 and Xeon processors, from

Mini to Basic format.

MSC’s widespread Qseven portfolio is one of

the widest in the industry. From Single-Core

ARM to Quad-Core x86, Cortex-A9 to latest x86.

The SMARC 2.0 product range is steadily grow-

ing and spans ARM Cortex-A9 to latest x86

Atom SOCs.

The nanoRISC module family combines com-

pact size with low power and low cost. With

ARM Cortex-A8 and A9 processors.

®

X86 TechnologyARM Technology


Scalability of COMs

Other Advantages of COMs

Vertical Markets

• Reduced complexity

• Focuses core competence on system design

• Faster development cycles – shorter Time to Market

• Lower cost-of-ownership

• Minimizes development risk

• High flexibility

• Extended lifecycle concept

• Second source availability due to standardization

“Scalability of Performance“ describes the capability of COMs to allow

alternative modules of different performance and feature levels to be

used in the module socket of the same carrier board.

Medical TransportationGaming Building AutomationPOS/POI SecurityIndustrial


MSC - The Technology LeaderPremier PartnersMSC is a premier partner of Intel® and AMD, and has early access to all

new microprocessor generations.

ProcessorsWe are using the best ARM processors from NXP and Texas Instruments

on our Qseven, SMARC 2.0 and nanoRISC® modules.

BIOS PartnershipOur BIOS partnership with AMI ensures that our software engineering

capabilities in the BIOS/ UEFI development includes customization of

the source code.

MSC - The Standards InnovatorSince 2005 MSC is an executive member of the PCI Computer Manu-

facturer Group (PICMG), and has been driving the development of new

versions of the popular COM Express™ standard.

MSC was one of the founders of the Standardization Group for Embed-

ded Technologies (SGeT), focusing on the development of specifications

for embedded computer products. As a prominent member of SGeT,

MSC has been driving the standardization process for the Qseven™ and

the SMARC™ 2.0 specifications.

Internet of Things In the course of the next industrial revolution, billions of intelligent

devices, systems and machines are going to be interconnected by the

Internet of Things. All of MSC’s Computer-on-Modules are ready for ap-

plication in IoT devices, network concentrators and the cloud.

Cloud Services are available from Microsoft for a wide range of require-

ments. Microsoft Azure is a growing collection of integrated cloud ser-

vices implemented through Microsoft’s global network of data centers.

MSC is providing an On-Board Tool which allows connecting to IoT nodes

consisting of Computer-on-Modules and/or Computer Boards effective-

ly reading out status information and application results.

All current Computer-on-Modules from MSC are certified for the Mic-

rosoft Azure Cloud and can be employed for IoT-related applications.

SMART LIVING INDUSTRY 4.0INTELLIGENT HOSPITAL

CLOUD & SERVICE

SMART CITY

Renewable Energy

Home Automation

Network Optimization

Smart Store

Smart Grid

Hospital Information

Medical Devices

Traffic Optimization

Traffic Camera

IntelligentDigital Signage

Factory Automation

Security

Fitness Center

Microsoft Azure Cloud

Microsoft Azure Certified Hardware for IoT products

Get a head start connecting your product to the Microsoft

Azure cloud and take advantage of the many apps and

solutions available in Azure. Start your development

today with any of Avnet’s Azure-certified hardware

platforms (developed by MSC Technologies in Germany)

for a high-quality hardware solution.

Eval kits featuring support documentation and pre-configured BSP connecting

to Microsoft Azure are available for Windows 10 IoT Enterprise and Linux.

Come and meet the family:

TechnologyIoT Ideas November 2016

Archi-tecture

CPUGENERIC PLATFORM

SKUsDescription

x86 Baytrail9 CPU across 5 platforms, COM-X & Q7

Intel® Atom™ E3800 Series / Celeron® SOC (formerly codenamed “Bay Trail”)

x86 Braswell5 CPU across 2 platforms, COM-X & Q7

Intel® Atom™ / Pentium® / Celeron® SOC (formerly codenamed “Braswell”)

x86 Skylake4 CPU single chip, 10 Dual core across 2 platforms, COM-X

Intel® Core™ 6th Generation (formerly codenamed “Skylake H & Skylake U”)

x86 ApolloLake5 CPU across 5 platforms, CCOM-X & SMARC

Intel® Atom™ E3900 Series / Pentium® / Celeron® SOC (formerly codenamed “Apollo Lake”)

ARM iMX64 CPU across 3, Q7, SMARC & NanoRisk

ARMiMX6Plus

2 CPU across 3 platforms, Q7, SMARC & NanoRisk

Order your Azure certified hardware today! Contact your Avnet Embedded account manager.

All trademarks and logos are the property of their respective owners. This document provides a brief overview only, no binding offers are intended. Avnet disclaims all representations, warranties and liabilities under any theory with respect to the product information, including any implied warranties of merchantability, fitness for a particular purpose, title and/or non-infringement, specifications, use, legal compliance or other requirements. Product information is obtained by Avnet from its suppliers or other sources deemed reliable and is provided by Avnet on an ”AS IS“ basis. No guarantee as to the accuracy or completeness of any information. All information is subject to change, modifications and amendments without notice.

www.avnet-embedded.eu

IoTGateways

Azure IoT Suite

Enables you to Connect assets Mine data Take action

Remote Monitoring

Asset Management

Predictive Maintenance

Addresses commmon scenarios:


Best-in-class Engineering since 1987MSC has more than 30 years of experience in complex and high-speed

circuit design, development and production. Our skilled design engineers

have many years of experience designing boards with high-end x86 and

ARM CPUs as well as with fast memory technology and programmable de-

vices (CPLD, FPGA). Ultra-fast system signal design and layout has always

been one of our specialties.

Leading-Edge ManufacturingMSC runs three state-of-the art manufacturing sites in Germany and in

Malta. Latest production equipment and a high degree of automation

allows us to achieve best-in-class throughput at very low manufacturing

cost and highest quality.

Best-in-Class QualityThe MSC product engineering, test development and production engi-

neers are working hand in hand to achieve optimized product quality.

Our sophisticated SAP-integrated MES and quality system ensures

full traceability of our products, and includes strict version control for

each product made.

MSC - Research & Development MSC - Production

• x86 CPU Architecure

• ARM Cortex-Ax Architecture

• FPGA / FPGA SOC Design

• High Speed Designs (DDRx DRAM, PCIe, USB 3.0,

Frontside Buses, Graphics, ….)

• Simulation (Thermal, Signal Integrity, Functional)

• Operating System support

(Windows / Windows Embedded / Linux Embedded)

• BIOS and software development

Certificate of Registration

In the issuance of this certificate, Intertek assumes no liability to any party other than to the Client, and then only in accordance with the agreed upon Certification Agreement. This certificate’s validity is subject to the organization maintaining their system in accordance with Intertek’s requirements for systems certification. Validity may be confirmed via email at [email protected] or by scanning the code to the right with a smartphone. The certificate remains the property of Intertek, to whom it must be returned upon request.

This is to certify that the Quality Management System of

MSC Technologies GmbH Industriestraße 16 D-76297 Stutensee

has been assessed and registered by Intertek Certification GmbH as conforming to the requirements of

DIN EN ISO 9001:2015

The Quality Management System is applicable to Development, production and sales of customer specific and own electronic systems,

boards, components and display solutions as well as distribution of electronic components and display products at the sites listed in the annex.

Certificate Reg. No.: 2015-02239

Validity Date: 03.12.2015 till 02.12.2018

Initial Certification on: 17.08.1999

Issue Date: 24.11.2015 The appendix is part of this certificate and consists of 1 page.

Christina Weiglein, Certification Body Intertek Certification GmbH - Hanns-Martin-Schleyer-Straße 2, D-41199 Moenchengladbach, Germany

Certificate

It is hereby confirmed that company

MSC Technologies GmbH

including the sites of the companies:

141026U-A MSC Technologies GmbH Industriestrasse 16 D-76297 Stutensee

scope of application: Development and production of electronic devices and systems as well as distribution of electronic components and devices

141026U-B Avnet Logistics Stutensee GmbH Industriestrasse 18 D-76297 Stutensee

scope of application: Services in logistics division

141026U-C Avnet Logistics PMC Stutensee GmbH Industriestrasse 16 D-76297 Stutensee

scope of application: Programming of electronic components

has fully implemented a management system in accordance with the standard

DIN EN ISO 14001:2009

for the above-named scope of application.

Date of initial certification:

12/12/2011

Certificate registration no.: 141026U This certificate is valid until: 11/12/2017

Chemnitz, 12/12/2014

ICG Zertifizierung GmbH, Wildparkstraße 3, D-09247 Chemnitz / Germany Certifying Body


BIOS / Software

Monitoring

Fan Control

Power Sequencing

Watchdog

Display Backlight Control

Smart Battery Support

Health Data

EDID Emulation

Customized Functions

Runtime Metering

UEFI BIOSFor all x86 modules MSC is using the advanced AMI Aptio V BIOS which

implements the UEFI architecture with Secure Boot enhancements.

MSC ontinuously improves its BIOS solutions with new functions and

technologies such as Advanced Boot Device Configuration.

MSC is offering to adapt the BIOS for customers, but is also offering the

MSC BIOS Configuration Tool which enables users to easily modify BIOS

binary images and set configuration defaults, add splash screen images,

pre-define passwords etc. MSC is maintaining user-friendly interfaces

such as EAPI (Embedded Application Programming Interface) to allow

low-level control of non-volatile memory, I2C bus access, backlight set-

tings, watchdog timer etc.

Operating SystemsMSC is supporting all popular and important operating systems, i.e. Windows 10, Windows 7 and

Linux. Older modules are supporting Windows 7 and/or Windows 8. For most recent modules,

Linux support is based on the Yocto Project which is the standard for up-to-date embedded sys-

tems controlled by Linux.

MSC-On-Board ControllerMSC implements a powerful microcontroller (EC) on all advanced modules which helps to control

correct operation of the module and takes over most of the house holding functions: it controls

the fan speed, monitors temperatures and voltage levels and controls power on/off of the board.

Besides health monitoring and logging, the EC has implemented a power-on and boot watchdog

and display backlight control. The optional smart battery support makes it easy to design full

battery powered systems.

SecurityThe AMI Aptio® V BIOS as used by MSC supports the “Chain of Trust”

according to the TCG (Trusted Computing Group):

• From power-on every step is monitored

• CRTM (Core root of trust for measurement) is essential

• Hash values in TPM are compared to actual values of SW modules

• Boot process stops if integrity of one chain link is doubtful

• SecureFlash update tool allows signed update files only

• Root of Trust cannot be modified

SECURED

Distributed/ Network Apps

Apps

OS Drivers

OS Kernel

Boot Loader

Option ROMs

BIOS (POST Phase)

“Root of Trust”(CRTM)

Boot Block

TPM

“Cha

in o

f Tr

ust”


MSC is offering a large number of different cooling devices for its Com-

puter-on-Modules portfolio. Among these are various heatspreaders,

heatsinks and a selection of heatsinks with fans for active cooling. All

coolers can be customized by MSC to optimize functionality, efficien-

cy and cost. For high-volume applications, MSC offers to design custom

cooling solutions optimized for specific purposes.

MSC performs thermal simulations prior to producing cooling solutions

in hardware. This ensures that all requirements will be considered and

that the result will perform near the theoretical optimium. MSC provides

thermal consulting as a service to its customers helping to ensure that

the resulting cooling solutions will be adequate on the system basis.

15

Cooling Solutions Thermal Simulations


Thermal Characteristics of Standard Products MSC is offering most products in standard temperature and

in industrial temperature variants. This temperature rating

is tested on a sample basis since all components used for

these products are specified accordingly.

Compliance Test• Pre & Post Layout Signal Simulations

• EMC, ESD in Reference Environment (CE)

• Signal Compliance of High-Speed Interfaces

Environmental Test• Temperature Tests

• Shock

• Vibration

Certification• Support for applications specific certifications

• Collaboration with external certification agencies

Product Screening and Ruggedization For boards which are only specified in the standard tem-

perature range, MSC is offering a screening service result-

ing in the same products available in an extended tempera-

ture range to be specified by the customers.

17

Environmental Testing & CertificationRUGGED Built to Fit

MSC offers customization of its standard modules accord-

ing to the requirements of the customers. This will help to

achieve required price points for volume projects by not

populating components which are not required, i.e. less

memory or less controllers of unnecessary functionality.

In addition, MSC offers to assemble Computer-on-Modules

on carrier boards, optionally with suitable cooling and with

memory modules inserted.

Customized Assembly – Individual Solutions• Mounted and tested (memory, cooling, baseboard)

• Individual test profile

• Pre-configured BIOS

• Baseboard Electronic Manufacturing Service (EMS)


Customization Service

< Standard Qseven Module

From Standard to Full-Custom A complete Computer-on-Module can be treated as a functional macro

and inserted into a full-custom board design. That will shorten the de-

velopment time of customer-specific board designs dramatically, and

help to achieve the shortest possible time-to-market because the func-

tional macro is already proven to work, and comes with full software

and firmware support.

Custom Development• Carrier board

• Single-Board Computer

• Add-on boards

• Non-standard modules

19

FPGA CapabilitiesMSC has been designing FPGA-based boards and systems for several de-

cades. For very many application areas, we have successfully designed

cutting-edge high-speed and high-complexity boards providing ultimate

performance and functionality.

< Standard Qseven Module

on Baseboard

< Qseven Technology into

full-custom design


Global Leadership

Avnet Headquarters Phoenix / Arizona

Worldwide SupportNo matter where in the world you are, the next

Avnet regional sales office is only a phone call

away. MSC Technologies is Avnet’s own brand of

embedded boards and systems, and is supported

by the entire Avnet sales force around the planet.

Regional sales engineers are supported by local

FAEs and Business Development Managers, who

all have direct access to MSC’s Product Marketing

and Technical Support groups.

Design-in ServicesTechnical Support• Pre- and Post-Sales Support

• Experience sharing

• OEM baseboard design reviews and debugging

• Baseboard Design Guidelines and Trainings

• Benchmark performance comparisons

• Customized starter kits

Support Website• Drivers, BSPs, BIOS updates

• Software APIs (EAPI) and other Software Tools

• User Manuals, App Notes, Mechanical infos, etc….

MSC Headquarters and Boards Manufacturing Plant

Stutensee

MSC Systems Manufacturing Plant Freiburg

MSC Boards Manufacturing Plant Malta

900 Employees

120 Engineers in R&D

4 Design Centers

3 Manufacturing Sites

More than 500,000 Boards per year


COM Express™, the widely spread COM standard

in the embedded world, has been defined by the

PICMG® (PCI Industrial Computer Manufacturers

Group) in 2005. Since that time and after a few

updates, COM Express has become the most ver-

satile and most scalable COM standard support-

ing small and cost-sensitive applications as well

as high-end computing and graphics intensive

solutions. It is designed for the latest chipsets

and serial signaling protocols, including PCI Ex-

press Gen 3, SATA, USB 3.0, and high resolution

video interfaces. COM Express provides the high-

est performance of the many small form factor

standards and products available.

COM Express™

COM Express™ Properties

106.00

70.00

0.00

0.00

4.00

80.0

0

151.

00

4.00

Extended91.00

121.

00

91.0

0

Compact Basic

51.00

Mini

18.00

6.00

16.5

0

74.2

0

Common for all Form FactorsExtended onlyBasic onlyCompact onlyCompact and Basic onlyMini only

All dimensions are shown in millimeters.

106.00

70.00

0.00

0.00

4.00

80.0

0

151.

00

4.00

Extended91.00

121.

00

91.0

0

Compact Basic

51.00

Mini

18.00

6.00

16.5

0

74.2

0

Common for all Form FactorsExtended onlyBasic onlyCompact onlyCompact and Basic onlyMini only

All dimensions are shown in millimeters.

COM Express™ Extended• For special applications only

• Not commonly used

• 155 mm x 110 mm

COM Express™ Basic• Standard COM Express format for high level

solutions

• 125 mm x 95 mm

COM Express™ Compact• Preferred format for entry and mid level solutions

• Highly integrated, fully featured and space saving solution

• 95 mm x 95 mm

COM Express™ Mini• Entry level format for small and rugged solutions

• Reduced feature set (uses only one connector)

• 84 mm x 55 mm

The COM Express™ Standard supports four sizes:

Mini, Compact, Basic and Extended. All sizes utilize

two high-speed, 220-pin connectors except for the

Mini format which only supports one connector.

Signal distribution of this connector is similar to the

other formats but by no means identical.


Highlights

• Intel® Core™ i7-7820EQ (quad-core, 3.0/3.7GHz),

Intel® Core™ i5-7440EQ (quad-core, 2.9/3.6GHz),

Intel® Core™ i5-7442EQ (quad-core, 2.1/2.9GHz),

Intel® Core™ i3-7100E (dual-core, 2.9GHz),

Intel® Core™ i3-7102E (dual-core, 2.1GHz),

Intel® Xeon® E3-1505Mv6 (quad-core, 3.0/4.0GHz),

Intel® Xeon® E3-1505Lv6 (quad-core, 2.2/3.0GHz)

• Intel® HD Graphics 630, P630

• Intel® chipsets QM175, HM175 or CM238

• Up to 32GB DDR4-2133 SDRAM, dual channel

(ECC optional)

COM Express™ - Basic

The MSC C6B-KLH module is based on Intel‘s 7th generation Core processor family. The Intel two-chip solu-

tion allows highest performance in graphics and computing on a COM Express module in basic form factor.

MSC C6B-KLHIntel® Core™ - 7th Generation

Type 6

• Four SATA 6Gb/s mass storage interfaces

• Three DisplayPort/HDMI/DVI interfaces

• Embedded DisplayPort / LVDS (24 Bit,

dual channel) interface

• Triple independent display support

• DirectX 12, OpenGL 4.4, OpenCL 2.x

• Resolution up to 4096 x 2304

• Eight PCI Express™ x1 lanes; PEG x16

• Four USB 3.0/2.0 and four USB 2.0 interfaces

• Trusted Platform Module

• UEFI Firmware

NEW

95 x 125

35/55 W

Highlights

• Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz)


• Intel® HD Graphics GT2 or GT3e

• Intel® 8-Series chipset

• Up to 16GB DDR3L-1600 SDRAM, dual channel

• Four SATA mass storage interfaces, up to 6Gb/s


• Two embedded DisplayPort interfaces

This module is based on Intel's 5th generation Core™ processors produced in 14nm technology. It

supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB

3.0 on a COM Express Type 6 module.

95 x 125

55 W

MSC C6B-8SBIntel® Core™ - 5th Generation

Type 6

• LVDS (24 Bit, dual channel) and CRT interface


• DirectX 11.1, OpenGL 3.2, OpenCL 1.2


• Seven PCI Express™ x1 lanes



25

COM Express™ - Basic

Highlights


• Intel® Core™ i5-4400E (dual-core, 2.7/3.3GHz)

• Intel® Core™ i5-4402E (dual-core, 1.6/2.7GHz)

• Intel® Core™ i3-4100E (dual-core, 2.4GHz)


• Intel® Celeron® 2000E (dual-core, 2.2GHz)


• Intel® HD Graphics GT1/GT2

• Intel® 8-Series chipset

• Up to 16GB DDR3L-1600 SDRAM, dual-channel

• Four SATA mass storage interfaces, up to 6Gb/s

Based on Intel's 4th generation Core™ processors this COM Express family supports the latest

digital display interfaces like DisplayPort, HDMI and DVI and controls up to three independent

displays. USB 3.0 interfaces connect to the fastest peripheral devices available.

95 x 125

35 / 55 W

MSC C6B-8S / CXB-8SIntel® Core™ - 4th Generation

Type 6 / Type 2







• Seven PCI Express™ x1 lanes

• Four USB 3.0 and four USB 2.0 interfaces


• Also available in Type 2 pin-out

95 x 125

35 / 55 W

MSC C6B-SLHIntel® Core™ - 6th Generation

Type 6

Highlights







• Intel® Celeron® G3900E (dual-core, 2.4GHz)

• Intel® Celeron® G3902E (dual-core, 1.6GHz)

• Intel® Xeon® E3-1505Mv5 (quad-core, 2.8/3.7GHz)

• Intel® Xeon® E3-1505Lv5 (quad-core, 2.0/2.8GHz)

• Intel® HD Graphics 530, P530

• Intel® chipsets QM170, HM170 or CM236

• Up to 32GB DDR4 SDRAM, dual ch. (ECC opt.)


• LVDS (24 Bit, dual channel) or eDP interface

• Triple independent display support (4K)


• Four SATA 6Gb/s; Trusted Platform Module

• Eight PCI Express™ x1 lanes; PEG x16


The MSC C6B-SLU module is based on Intel‘s 6th generation Core™ processor family with a new

processor architecture based on 14 nm process technology. The Intel two-chip solution allows

highest performance in graphics and computing on a COM Express module in basic form factor.

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6b-klh.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6b-8sb.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6b-8s.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6b-slh.html


COM Express™ - Basic / Compact

Highlights

• Intel® Core™ i7-3612QE (quad-core, 2.1GHz)

• Intel® Core™ i7-3615QE (quad-core, 2.3GHz)

• Intel® Core™ i7-3555LE (quad-core, 2.5GHz)

• Intel® Core™ i7-3517UE (dual-core, 1.7GHz)

• Intel® Core™ i5-3610ME (dual-core, 2.7GHz)

• Intel® Core™ i3-3120ME (dual-core, 2.4GHz)

• Intel® Core™ i3-3217UE (dual-core, 1.6GHz)


• Intel® Celeron® 1047UE (dual-core, 1.4GHz)

• Intel® Celeron® 927UE (single-core, 1.5GHz)

• Up to 16GB DDR3-1600 SDRAM, dual channel





• DirectX 11, OpenGL 3.1, OpenCL 1.1


• Seven PCI Express x1 lanes, four SATA-300




95 x 125

25 / 65 W

MSC C6B-7S / CXB-6SIIntel® Core™ - 3rd Generation

Type 6 / Type 2

Based on Intel’s 3rd generation Core™ processors this COM Express module supports the latest

digital display interfaces, up to three independent displays and USB 3.0. Ultra low-power vari-

ants with only 17W CPU power dissipation allow passively cooled system designs.

Highlights

• Intel® Core™ i7-7600U dual-core 2.8/3.9GHz,

4MB L2, 15W TDP


3MB L2, 15W TDP

• Intel® Core™ i3-7100U dual-core 2.4GHz,

3MB L2, 15W TDP

• Intel® Celeron™ 3965U dual-core 2.2GHz,

2MB L2, 15W TDP

• Integrated Intel® Gen. 9 HD graphics

• Up to 32GB DDR4 SDRAM, dual-channel

• Three SATA 6Gb/s mass storage interfaces

• MicroSD card socket

• Two DisplayPort/HDMI/DVI interfaces

• Embedded DisplayPort / LVDS

(24 Bit, dual channel) interface

• Three independent displays supported




• Eight PCI Express™ x1 lanes


• UEFI Firmware

95 x 95

17 / 19 W

MSC C6C-KLUIntel® Core™ - 7th Generation

Type 6

The MSC C6C-KLU module is based on Intel‘s 7th generation Core processor family. The Intel

multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier

and allows extremely compact high-performance designs.


COM Express™ - Compact

Highlights

• Intel® Atom™ E3950 quad-core 1.6/2.0GHz, 12W

• Intel® Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W

• Intel® Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W

• Intel® Pentium® N4200 quad-core 1.1/2.5GHz, 6W

• Intel® Celeron® N3350 dual-core 1.1/2.4GHz, 6W


• Up to 16GB DDR3L SDRAM, dual-channel

• Two SATA 6Gb/s mass storage interfaces


• eMMC option

• DisplayPort/HDMI/DVI interface

The MSC C6C-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation

that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one

solution. The modules with Intel® Atom™ processors are also available in extended temperature versions.

MSC C6C-ALIntel® Atom™/Pentium®/Celeron® SOC

Type 6

• LVDS/embedded DisplayPort interface




• Two high-speed UARTs

• eMMC option

• Up to five PCI Express™ x1 lanes

• UEFI Firmware


• Extended temperature variants

NEW

95 x 95

7/14 W

-40... +85 °C

95 x 95

17 / 19 W

MSC C6C-SLUIntel® Core™ - 6th Generation

Type 6

Highlights


4MB L2, 15W TDP, 7.5/25W cTDP


3MB L2, 15W TDP, 7.5/25W cTDP

• Intel® Core™ i3-6100U dual-core 2.3GHz, 3MB

L2, 15W TDP, 7.5 cTDP

• Intel® Celeron® 3955U dual-core 2.0GHz, 2MB

L2, 15W TDP, 10W cTDP



• Three SATA 6Gb/s mass storage interfaces







• Eight PCI Express™ x1 lanes


The MSC C6C-SLU module is based on Intel‘s 6th generation Core™ processor family with a new

processor architecture based on 14 nm process technology. The multi-chip-package includes pro-

cessor, graphics and chipset on one carrier and allows extremely compact high-performance designs.

NEW

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6b-7s.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-slu.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-klu.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-al.html


95 x 95

8 / 14 W

Highlights

• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP

• Intel® Atom™ E3827 dual-core 1.75GHz, 8W TDP

• Intel® Atom™ E3826 dual -core 1.46GHz, 7W TDP


• Intel® Atom™ E3815 single-core 1.46GHz, 5W TDP

• Intel® Celeron® N2920

quad-core 1.86/2.00GHz, 7.5W TDP

• Intel® Celeron® J1900

quad-core 2.00/2.42GHz, 10W TDP







• VGA interface

• Two independent displays supported


• One USB 3.0 and up to seven USB 2.0 interface

• Trusted Platform Module (option)


Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express module

brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent dis-

plays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module.

MSC C6C-BT / CXC-BTIntel® Atom™ / Celeron® SOC

Type 6 / Type 2

-40 +85 °C



29

95 x 95

8 / 14 W

Highlights

• Intel® Pentium® N3700 quad-core 2.40GHz, 6W TDP

• Intel® Celeron® N3150 quad-core 2.08GHz, 6W TDP

• Intel® Celeron® N3050 dual -core 2.16GHz, 6W TDP

• Intel® Celeron® N3000 dual -core 2.08GHz, 4W TDP










• Up to five PCI Express™ x1 lanes


The MSC C6C-BW module is based on Intel‘s next generation Atom processors in14nm techno-

logy . These multi-core systems-on-chip provide outstanding computing and graphics power

and are more power efficient compared to their predecessors. The new module brings triple in-

dependent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power

saving and cost-efficient module. Dual- and quad-core processors are supported by this design.

MSC C6C-BWIntel® Pentium® / Celeron®

Type 6

Highlights

• AMD GX-420CA quad-core 2.0GHz, 25W TDP,

Radeon HD 8400E

• AMD GX-415GA quad-core 1.5GHz, 15W TDP,

Radeon HD 8330E

• AMD GX-217GA dual-core 1.65GHz, 15W TDP,

Radeon HD 8280E

• AMD GX-210HA dual-core 1.0GHz, 9W TDP,

Radeon HD 8310E

• Integrated AMD HD 8000E graphics






• VGA interface



• Two USB 3.0 and six USB 2.0 interfaces

This compact COM Express Type 6 module is based on AMD‘s Embedded G-Series SOC platform,

a high-performance, low-power System-on-Chip solution with outstanding HD graphics and

multimedia capabilities. The power saving and cost-efficient module offers dual independent

display support, DirectX 11.1, fast DDR3 memory and USB 3.0.

95 x 95

12 / 30 W

MSC C6C-GXAMD Embedded G-Series SOC

Type 6

AMD PRODUCT BADGE GUIDELINES PAGE 12

Embedded SolutionsOpteron X53116B

Embedded SolutionsOpteron A(For future use)

Segments: Embedded and Server

Embedded Solutions 53120B

Embedded Solutions“R” Series X 53057B

Embedded Solutions“R” Series A

Embedded SolutionsGeode

Embedded SolutionsRadeon Graphics53121B

Embedded Solutions“G” Series X 53058B

Embedded Solutions“G” SeriesB

OpteronEmbedded

Opteron Family53117B

Opteron X53118B(showcase specific Opteron X86 technology platform)

Opteron A53119B(For future use)

-40 +85 °C

95 x 95

25 / 35 W

Highlights

• AMD R-460L quad-core 2.0/2.8GHz, 25W TDP,

Radeon HD 7620G

• AMD R-252F dual-core 1.7/2.3GHz, 17W TDP ,

Radeon HD 7400G

• AMD R-452L quad-core 1.6/2.4GHz, 19W TDP,

Radeon HD 7600G

• AMD R-260H dual-core 2.1/2.6GHz, 17W TDP,

Radeon HD 7500G

• Integrated AMD HD 7000G graphics

• Up to 16GB DDR3-1333 SDRAM, dual-channel

• Four SATA 3Gb/s mass storage interfaces

• MicroSD card socket, bootable



• VGA interface

• Four independent displays supported


• Resolution up to 4000 x 2000 @ 30 Hz

• Six PCI Express x1 lanes


Based on AMD‘s Embedded R-Series platform this compact COM Express Type 6 module offers

unprecedented integrated graphics and multi-display capabilities. It brings quad independent

display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding /

decoding support graphics- and video-centric applications.

MSC C6C-A7AMD Embedded R-Series

Type 6

AMD PRODUCT BADGE GUIDELINES PAGE 12

Embedded SolutionsOpteron X53116B

Embedded SolutionsOpteron A(For future use)

Segments: Embedded and Server

Embedded Solutions 53120B

Embedded Solutions“R” Series X 53057B

Embedded Solutions“R” Series A

Embedded SolutionsGeode

Embedded SolutionsRadeon Graphics53121B

Embedded Solutions“G” Series X 53058B

Embedded Solutions“G” SeriesB

OpteronEmbedded

Opteron Family53117B

Opteron X53118B(showcase specific Opteron X86 technology platform)

Opteron A53119B(For future use)

http://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-a7.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-bt.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-a7.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-bw.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6c-gx.html

COM Express™ - Mini


COM Express™ - Accessories

31

Highlights



• Intel® Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W




• Up to 8GB DDR3L SDRAM (ECC option)


• eMMC option


The MSC C10M-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation

that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces. The

rugged design with soldered memory, optional ECC support and extended temperature range

combined with a long-term availability commitment make it perfectly suited for modern IoT solutions.

55 x 84

7/14 W

MSC C10M-ALIntel® Atom™/Pentium®/Celeron® SOC

Type 10




• Two USB 3.0/2.0 and six USB 2.0 interfaces

• Two high-speed UARTs

• Up to four PCI Express™ x1 lanes

• UEFI Firmware



-40... +85 °C

Highlights






• Intel® Celeron® N2930 quad-core 1.83/2.16GHz, 7.5W TDP

• Intel® Celeron® J1900 quad-core 2.00/2.42GHz, 10W TDP




• eMMC option





• One USB 3.0 and up to seven USB 2.0 interfaces



• Also available with USB client support

55 x 84

8 /14 W

Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 mod-

ule brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very com-

pact, power saving and cost-efficient COM Express Mini module. The rugged design with soldered

memory, optional ECC support and extended temperature range opens new application areas.

MSC C10M-BT / C10M-BTCIntel® Atom™ / Celeron® SOC

Type 10

-40... +85 °C

NEW

Highlights

• Socket for COM Express™ Type 6 modules

• PCI Express x16 slot (useable as PEG or x4)

• PCI Express Mini Card slot

• Four SATA connectors

• Four USB 3.0 interfaces

• Up to four USB 2.0 ports

• Three DisplayPort connectors

• LVDS and eDP connectors

• GbE interface

• SD Card slot

• HD audio codec

• Super I/O

• Various additional COM Express™ specific interfaces

• Power supply via ATX-style power connector or

12V-only power jack

• Wide power input range

This evaluation board in the popular Mini-ITX format provides the interface infrastructure for

COM Express Type 6 modules and offers various PC type connectors for external access.

170 x 170

MSC C6-MB-EVEvaluation Motherboard

Type 6

• LVDS interface

• Embedded DisplayPort connector

• HD audio codec; six audio jacks and SPDIF

• LAN interface

• mSATA and Mini PCI Express sockets

• Various additional COM Express specific interfaces

• ATX-style power connector

• POST code LED display

• ATX form factor

305 x 244 This versatile carrier board was designed for evaluation, prototyping and software development.

It provides the interface infrastructure for COM Express Type 6 modules and offers various PC

type connectors for external access.

Highlights

• Socket for COM Express Type 6 modules in

Basic or Compact form factor

• One PCI Express x4 slot

• Four PCI Express x1 slots

• One PCI Express x16 PEG slot

• Four SATA connectors

• Four USB 3.0, four USB 2.0 interfaces

• Two DisplayPort/HDMI connectors

• VGA/DVI connector

MSC C6-MB-EVAEvaluation Motherboard

Type 6

https://www.msc-technologies.eu/products/boards/com-express-type-10/msc-c10m-bt.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6-mb-eva.html

https://www.msc-technologies.eu/products/boards/com-express-type-10/msc-c10m-al.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6-mb-ev.html


The COM Express Starterkit for Type 6 modules is available for the whole range of Type 6

modules. The kit contains all necessary products to quickly enable the user to run and evaluate

COM Express Type 6 modules. The kit does not include a COM Express module in order to give the

user greater flexibility as to which particular module variant and CPU core and speed is desired.

Highlights

• COM Express™ Type 6 baseboard

• 2x 4GB DDR3L SO-DIMM memory modules

• Heatsink for safe operation of module

• Type 6 module socket


• Up to four SATA connectors

• Up to four USB 3.0 interfaces

• Up to four USB 2.0 ports

• Up to three DisplayPort connectors


• GbE Interface, SD Card slot

• HD audio codec, Super I/O

• Baseboard size 170 x 170 mm

• Getting Started Manual

• Download link for drivers and BSPs

• Optional display kits with cables

MSC C6-SKStarterkits for COM Express

Type 6

This evaluation board in the popular Mini-ITX format provides the interface infrastructure for

COM Express Type 10 modules and offers various PC type connectors for external access.

170 x 170

MSC C10-MB-EVEvaluation Motherboard

Type 10

• GbE interface

• SD Card slot

• HD audio codec

• Super I/O

• Various additional COM Express™ specific interfaces

• Power supply via ATX-style power connector or

12V-only power jack

• Wide power input range

Highlights

• Socket for COM Express™ Type 10 modules

• PCI Express x4 slot


• Two SATA connectors

• Two USB 3.0 interfaces

• Up to six USB 2.0 ports

• DisplayPort connectors


Depending on the computing performance,

processor technology and system environ-

ment, COM Express modules require different

cooling measures.

MSC has developed various solutions that help

the system designer to quickly solve the heat

dissipation problems and ensure optimal envi-

ronmental conditions for the module.

Heatspreaders

Standardized thermal interfaces for easy

integration in customers' cooling con-

cepts and full interchangeability.

Passive cooling

Optimized heatsinks for best cooling

performance even in industrial envi-

ronments.

Active cooling

Heatsinks combined with a dedicated

speed controlled fan. Off-the-shelf solu-

tions for demanding ambient conditions.

COM Express™ Cooling Solutions

The COM Express Starterkit for Type 10 modules is available for the whole range of Type 10 mod-

ules. The kit contains all necessary products to quickly enable the user to run and evaluate COM

Express Type 10 modules. The kit does not include a COM Express module in order to give the

user greater flexibility as to which particular module variant and CPU core and speed is desired.

Highlights

• COM Express Type 10 Baseboard

in Mini-ITX format

• Suitable Heatspreader for COM Express

Mini Modules Type 10

• 12V Power Supply with suitable connector

for COM Express baseboard

• Getting Started Manual with download links

for drivers and BSP

• PCI-Express x4 Slot

• PCI-Express Mini Card Socket and SD Card Socket

• 2x SATA Gen. 3.0 Connectors

• 2x USB 3.0 and 8x USB 2.0 Connectors

• DisplayPort Connector

• Embedded DisplayPort Connector

• LVDS Single-Channel JILI30 Connector

• Audio Codec with 1x3 Jacks and SPDIF In/Out

• Gigabit LAN Connector

• Baseboard Size 170 x 170 mm

MSC C10-SKStarterkits for COM Express

Type 10

COM Express™ - Accessories COM Express™ - Accessories

https://www.msc-technologies.eu/products/boards/com-express-type-10/msc-c10-mb-ev.html

https://www.msc-technologies.eu/products/boards/com-express-type-6/msc-c6-sk-8s-t6t2.html

https://www.msc-technologies.eu/products/boards/com-express-type-10/msc-c10-sk-bt-ev.html

35

The most popular embedded Computer-On-

Module standard for entry level performance

and low power applications with a very attractive

price performance ratio. Qseven is an open stan-

dard of the SGeT Standardization Group. Taking

advantage of the ongoing development in pro-

cessor technology towards smaller and more

power efficient CPUs, Qseven has in recent years

become the most widely adopted new standard

for small form factor modules.

The Qseven™ specification has been extended to

include module architectures based on the ARM

processor which is renowned for its excellent

performance to power ratio. Providing differ-

ent processor architectures and a wide range

of modules for commercial and extended tem-

perature together with matching baseboards,

the MSC Qseven family leads the way to feature

rich and small, low power modular systems.

Qseven™


Qseven™ Properties

The Qseven™ Standard uses the inexpensive

MXM-2 connector which provides 230 pin con-

nections. The connector is robust and proven,

and there are versions available which are certi-

fied for automotive use. The edge contacts en-

able a low-resistance high-speed contact which

is usable even for advanced signal speed up to

Gigabit Ethernet, PCI-Express and SATA.

70 mm

70

mm

Qseven™

70 x 70

7/12 W

MSC Q7-BTIntel® Atom™ E3800 SoC

Qseven™ Rev. 2.0

Highlights






• Up to 8GB DDR3L SDRAM (opt. ECC)

• Up to 64GB SATA Flash Disk (optional)

• Up to 32GB eMMC Flash (optional)

• 2x SATA interfaces (1 used for opt. Flash Disk)

• Integrated Intel® Gen. 7 HD Graphics

• HDMI up to 1920x1200

• DisplayPort 1.1a up to 2560x1600

• Dual-Channel LVDS 24 or 18 bit up to 1920x1200

• 3x PCI Express x1 Gen. 2.0 ports, GbE LAN

• USB 3.0 Host, optional USB 3.0 Device

• Up to 6x USB 2.0 Host, optional USB 2.0 Device

• UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM

The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel‘s multi-core

System-On-Chip (SOC) Atom E3800 generation based on Intel’s 22nm processor technology.

The quad-core, dual-core or single-core Atom processor provides outstanding computing and

graphics power and is accompanied by a comprehensive set of peripherals.-40 +85 °C

Qseven™

70 x 70

4/6 W

The MSC Q7-IMX6PLUS module provides the NXP™ i.MX6 ARM Cortex-A9 CPU (quad, dual, du-

al-lite or single core) as well as the new i.MX 6QuadPlus and 6DualPlus Processors with up to

1.2 GHz, up to 4GB DDR3 DRAM and up to 64GB eMMC Flash memory as well as an extensive

set of interface controllers.

Highlights

• NXP™ i.MX6 ARM® Cortex™-A9

quad-, dual-, dual-lite or single-core CPU

• Supports i.MX 6QuadPlus, i.MX 6DualPlus

• “Triple-Play“ Graphics and Video Subsystem

• Up to 4GB DDR3L SDRAM

• Up to 64GB eMMC or 4GB NAND Flash

• Gigabit Ethernet

• PCI Express x1 port

• HDMI/DVI up to 1920 x 1200 @30Hz

• Dual-Channel LVDS 18/24 bit up to 1920 x 1200


• SATA-II (3Gbps, quad-/dual-core only)

• USB Host / Device + up to 4x USB 2.0

• MMC / SD / SDIO Interface

• CAN Interface, I2S Audio

• MIPI CSI-2 Camera Interface

MSC Q7-IMX6PLUSNXP™ i.MX6 ARM® Cortex™ -A9 SoC

Qseven™ Rev. 2.0

-40 +85 °C

70 x 70

7/12 W

MSC Q7-ALIntel® Atom™/Pentium®/Celeron® SOC

Qseven™ Rev. 2.1

Highlights



• Intel® Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W






• Two SATA-III interfaces (6Gbps)



• Triple Independent Display support


• Up to 4x PCI Express x1 Gen. 2

• Up to 3x USB 3.0 Host interfaces

• Up to 8x USB 2.0 Host interfaces

• 1x USB 2.0 Host/Device support

• Trusted Platform Module (optional)

• Qseven Rev. 2.1 compliant

• UEFI Firmware

The new MSC Q7-AL module features Intel's next-generation low-power System-on-Chip (SOC)

for the Internet of Things. The Intel® Atom™ Processor E3900 series integrates processor core,

graphics, memory, and I/O interfaces into one solution and provides considerably higher graphics

and computing performance compared to its predecessors.

NEW

-40... +85 °C

70 x 70

6/9 W

MSC Q7-BWIntel® Atom™ / Pentium® / Celeron® SOC

Qseven™ Rev. 2.0

Highlights

• Intel® Pentium® N3710 quad-core 2.56GHz, 6W TDP

• Intel® Celeron® N3160 quad-core 2.24GHz, 6W TDP

• Intel® Celeron® N3060 dual-core 2.48GHz, 6W TDP

• Intel® Celeron® N3010 dual-core 2.24GHz, 4W TDP

• Intel® Atom™ x5-E8000 quad-core 2.0GHz, 5W TDP

• Integrated Intel® Gen. 8 HD Graphics

• Up to 8GB DDR3L SDRAM (dual-channel)

• Up to 64GB SATA Flash Disk (optional)


• HDMI/DVI interface up to 3840x2160

• DisplayPort 1.1a up to 3840x2160

• Dual-Channel LVDS 24 or 18 bit up to 1920x1200



• 3x PCIe x1, GbE, SATA-III, UART, LPC, SPI, I2C, SMBus

• USB 3.0, opt. USB 3.0 Device

• Up to 7x USB 2.0, opt. USB 2.0 Device

The MSC Q7-BW module is based on Intel‘s next generation Atom™ processors in 14nm

technology. These multi-core systems-on-chip provide outstanding computing and graphics

power and are more power efficient compared to their predecessors. The new module brings

triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact,

power saving and cost-efficient module.


https://www.msc-technologies.eu/products/boards/qseven/msc-q7-bw.html

https://www.msc-technologies.eu/products/boards/qseven/msc-q7-imx6plus.html

https://www.msc-technologies.eu/products/boards/qseven/msc-q7-al.html

https://www.msc-technologies.eu/products/boards/qseven/msc-q7-bt.html

Qseven™ - Accessories Qseven™ - Accessories

The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used

in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as

DVI/HDMI. In addition a mini PCI Express™ and an mSATA slot as well as an SD-Card socket are

supported. Module slot on bottom side.

MSC Q7-MB-EP4Embedded Platform DDI

Highlights

• One DVI port up to 1920 x 1080 for Qseven

modules with SDVO

• Dual Gigabit Ethernet

• Mini PCI Express slot

• MMC/SD Card socket

• Two SATA onboard connectors

• One RS-232 onboard pin header

• One CAN interface

• Six USB 2.0 interfaces, four external

• Touch screen controller on board

• LVDS display connection via Jili30

• Backlight interface 3.3 / 5 / 12VDC

• Size 148 x 102 mm

• Wide input range from 10 - 28VDC

148 x 102

148 x 102 148 x 102 The Qseven™ Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded

interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI,

DisplayPort and LVDS display interfaces. In addition a mini PCI Express™, an mSATA and an SD

Card socket are supported. Module slot on bottom side.

Highlights

• HDMI and DisplayPort connectors for direct

output of TMDS signals from Qseven module


• Mini PCI Express card slot

• MMC/SD card and mSATA card sockets

• 1x SATA connector

• RS-232 on DB9 connector

• RS-485 and RS-232 on pin header

• LPC / GPIO on pin header

• USB 3.0 host connector

• 2x USB 2.0 host connector

• 1x USB 2.0 on pin header

• 1x microUSB 2.0 OTG connector

• LVDS / eDP via Jili30 connector

• Backlight interface 3.3 / 5 / 12VDC

• SPI / I2C / SMBus, CAN bus, I2S audio

• Wide input range from 10 - 28VDC

MSC Q7-MB-EP6Embedded Platform Qseven™ Rev. 2.0

MSC Q7-MB-EP5Embedded Platform Qseven™ Rev. 2.0

Highlights

• Low-cost application board for any Qseven

computer module (x86 and ARM based)


• Up to 2x SATA-II connectors

• Mini PCI Express Card

• mSATA Card socket

• MMC/SD Card slot

• 1x USB 3.0, up to 3x USB 2.0 connectors

• 1x USB 2.0 Host/Client on µUSB connector

• DisplayPort connector for output of graphics

signals from Qseven module

• RS-232, RS-485 or opt. CAN

• Dual-channel LVDS on JILI30 connector

• Backlight power 3.3V, 5V or 12V

• Adjustable Backlight intensity

• WLAN / Bluetooth / NFC with antenna (option)

• 4-wire touch controller (option)

• I2S or HD Audio codec (option)

• SPI / I2C / GPIO on Feature Connector

• Input voltage up to 36V

• Industrial temperature versions available

The new Qseven™ Rev. 2.0 embedded platform MSC Q7-MB-EP5 offers a variety of interfaces

commonly used in embedded applications such as Gigabit LAN, USB 3.0, USB 2.0, RS232/485

and CAN as well as DisplayPort and LVDS display interfaces. By design the EP5 was optimized

for low production cost and simple customization. MSC is offering to produce any customized

variant of the MSC Q7-MB-EP5 for medium to high volume.

-40... +85 °C

QSeven Slot

Single USB 3.0 Type A

MicroABHost/Client

WLAN ModuleH&D Wireless

SPB209A

PCI Mini Card Socket

Single USB 2.0 Type A

4-Wire Touch

4 Pin JST Conn

4 Pin JST Conn

Single USB 2.0 Type A5 Pin Header

POWER IN

Gbit LAN RJ45

Feature Connector 220 Pin Header

Feature Connector 120 Pin Header

Gbit LAN RJ45

SATA Conn

Intel® mSATA Card Socket

uSD / SD Card Socket

LVDS JILI 30

Audio Header

Backlight

USB1

USB2

SATA 0

SATA 1

SDIO

UART

CAN

SPI, I2C, GPIO

Power

USB0

USB6/7

USB3

USB5

USB4

PCIe 0

PCI 1

Q7 Eth

LVDS/eDP

HDMI/DP

Audio

LAN ControllerPCIe intel® I210

I25 Codec

HDMI-DPConverter

HDA Codec

Micro SIM card slot

4-Wire Res. USBTouch Controller

Microchip AR1100

RS232Driver

Analog/PWM3.3V/5V/12V

System Signals

RS485Driver

CANDriver

OptoCoupler

12VRegulator

3.3V and 5VRegulator

OtherRegulator

DisplayPort

Note: can also be used as PCAP Touch I/F


https://www.msc-technologies.eu/products/boards/qseven/msc-q7-mb-ep4.html



Qseven™ - Accessories

For all its Qseven modules, MSC is offering tai-

lored cooling solutions which perfectly fit the

geometry of the COM product.

MSC is providing a heatspreader for each Qseven

module, and a single-piece heatsink for the high-

er-performance modules.

Qseven™ Cooling Solutions

A heatspreader offers a blank surface allowing to

mount a cooling device or to contact the metal

housing of a system, while the underside provides

contact areas for the heat generating parts of the

module’s geometry.

A heatsink is shaped like the heatspreader,

but shows cooling fins on the upper side so

as to maximize the surface used to dissipate

heat into the surrounding air.

Heatspreaders Heatsinks

Qseven™ - Accessories

Highlights

• One PCI Express™ x16 slot and 3 x1 slots

• Two graphic card slots for

HDMI / DP / eDP / LVDS

• Mini PCI Express™ & mSATA slot

• SD Card socket and SIM Card slot

• Two SATA onboard connectors

• Winbond W83627DHG Super I/O

• EXAR X28V384 Super I/O

• 7x COM, HW monitor

• CAN Transceiver

• HD audio codec

• USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces

The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify

Qseven™ Rev. 2.0 modules for compatibility with the specification. It offers a large variety of

interfaces commonly used in industrial applications. It is a key instrument to shorten design

cycles and to improve time to market of new Qseven™ based systems.

MSC Q7-MB-RP3Reference Platform Qseven™ 2.0

The MSC Q7-SK-IMX6-EP4 Starterkit is based on the 3.5" carrier board MSC Q7-MB-EP4 and

contains all necessary products to quickly enable the user to run and evaluate the Qseven™

range of ARM-based modules. The kit does not contain a Qseven module allowing the user to

select the most suitable one from MSC’s wide offerings.

Highlights

• 3.5" Qseven carrier board with socket for

Qseven module

• Heatspreader with heatsink for all module

variants of the Q7-IMX6PLUS module family

• 12V power supply and cable kit included for

immediate operation of the Starter Kit

• Resource USB Flash stick with drivers,

manuals etc.

• DVI/HDMI graphics output

• LVDS graphics output on standard 30-pin connector;

backlight connector includes adjustable backlight

voltage and dimming

• 2x Ethernet (10/100/1000 LAN) connector

• SATA connector

• 4x USB 2.0, 1x microUSB OTG

• UART/RS-232 on pin header

• MMC/SD-Card socket, mSATA slot

• I2C, CAN connectors

• Optional 7" WVGA (800 x 480) and 12.1" XGA

(1024x768) TFT kit

MSC Q7-SK-IMX6-EP4Starterkit for ARM-based Qseven™ 2.0 Modules

Highlights

• 3.5" Qseven carrier board with socket

for Qseven 2.0 module

• Heatspreader with heatsink for all module

variants of the respective Qseven family


immediate operation of the Starter Kit

• Resource USB Flash stick with drivers, manuals etc.

• DP graphics output

• LVDS graphics output on standard 30-pin con-

nector; backlight connector includes adjust-

able backlight voltage and dimming

• 2x Ethernet (10/100/1000 LAN) connector

• SATA connector

• USB 3.0, 3x USB 2.0, 1x microUSB OTG

• 2x UART

• SD-Card socket

• MiniPCIexpresss and mSATA slots

• Optional 7" WVGA (800 x 480) and 12.1" XGA

(1024x768) TFT kit

The MSC SK-AL-EP6 is the new Starterkit for Qseven™ modules based on the Intel E3900

"Apollo Lake" processor family. The MSC SK-BT-EP6 is the Starterkit suitable for Qseven™ mod-

ules based on the Intel E3800 “BayTrail" and the N3000 “Braswell” processors. Both kits are

based on the 3.5" Qseven 2.0 carrier board MSC Q7-MB-EP6 and contain all necessary products

to quickly enable the user to run and evaluate the Qseven module range.

MSC Q7-SK-AL-EP6 MSC Q7-SK-BT-EP6Starterkits for x86-based Qseven™ 2.0 Modules

435 x 170


https://www.msc-technologies.eu/products/boards/qseven/msc-q7-sk-al-ep6.html

https://www.msc-technologies.eu/products/boards/qseven/msc-q7-mb-rp3.html

https://www.msc-technologies.eu/products/boards/qseven/msc-q7-sk-imx6-ep4.html

43

The recent revision 2.0 of the SMARC module

standard (Smart Mobility ARChitecture) has

every ingredient to become the best and most

future-proof standard for small form-factor

embedded modules. With 314 pins available

on its inexpensive and robust MXM3 connec-

tor, SMARC has ample space for proven and

popular interfaces. In the new standard revi-

sion, PCIe now features 4 lanes instead of 3,

USB now covers up to 2x USB 3.0 and up to

6x USB 2.0 interfaces, LVDS now supports two

independent dual-channel connections which

alternatively can be used for embedded Dis-

playPort (eDP) or for DSI, two Gigabit Ethernet

ports are now supported, Audio has indepen-

dent HDA and I2S ports and up to 4 UARTs are

available. In addition to SPI, also eSPI is sup-

ported for attachment of peripheral devices

on the baseboard or the application hardware.

And still there are a lot of reserved pins left for

future upgrades. Never again has it been so

easy and natural to use ARM-based and x86-

based computer modules on a modern and up-

to-date module standard.

SMARC™ 2.0

SMARC™ 2.0 Properties

The SMARC™ 2.0 Standard uses the inexpensive MXM-3 connector which provides 314 pin connections. The connector is robust

and proven, and there are versions available which are certified for automotive use. The edge contacts enable a low-resistance

high-speed contact which is usable even for advanced signal speed up to Gigabit Ethernet, PCI-Express and SATA. The Standard

defines two Module sizes: 82mm x 50mm (short size) and 82mm x 80mm (full size).

82 mm

80

mm

50

mm

82 mm


45

SMARC™ 2.0


SMARC™ 2.0

Highlights







• Up to 8GB LPDDR4 SDRAM


• SATA-III interface (6Gbps)

• DisplayPort++ interface

• LVDS / embedded DisplayPort interface



• Dual MIPI CSI-2 Camera Interface


• 2x USB 3.0 Host, 5x USB 2.0 Host interfaces

• 1x USB 2.0 Host/Device interface

• Gigabit Ethernet


The MSC SM2S-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation

that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into

one solution. Fast LPDDR4 memory, eMMC and USB 3.0 are integrated on this SMARC 2.0 Short

Size module.

MSC SM2S-ALIntel® Atom™/Pentium®/Celeron® SOC

SMARC™ 2.0

Highlights









• Up to 64GB SATA NAND Drive (optional)

• SATA-III interface (6Gbps)

• DisplayPort++ / HDMI interface

• LVDS / embedded DisplayPort interface



• Dual MIPI CSI-2 Camera Interface


• 2x USB 3.0 Host, 5x USB 2.0 Host interfaces

• 1x USB 2.0 Host/Device interface

• Gigabit Ethernet, Wireless Module (optional)


The MSC SM2F-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation that

integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one

solution. Fast DDR3-1866 memory, eMMC, SATA Flash, USB 3.0 and a on-board Wireless Module are

integrated on this SMARC 2.0 Full Size module.

MSC SM2F-ALIntel® Atom™/Pentium®/Celeron® SOC

SMARC™ 2.0

82 x 80

7/14 W

82 x 50

7/14 W

-40... +85 °C

-40... +85 °C

NEW

The SMARC™ 2.0 Embedded Platform MSC SM2-MB-EP1 offers many embedded interfaces

such as dual Gigabit LAN, USB 3.0, USB 2.0, SATA, UART/RS232 and CAN as well as DVI/HDMI,

embedded DisplayPort and LVDS display interfaces. In addition a PCI Express™ socket and an

SD Card socket are supported.

MSC SM2-MB-EP1SMARC™ 2.0

Highlights

• Socket for SMARC™ 2.0 modules

• PCI Express x4 slot

• SD Card slot

• Mini-PCI-Express Card slot

• Two USB 3.0 interfaces

• USB 2.0 OTG, two USB 2.0 Host

• DVI/HDMI and DisplayPort connectors


• SATA connector

• Two GbE interfaces

• Two CAN interfaces

• I2S audio and HD audio codec

• Two UART interfaces

• Various additional SMARC™ specific interfaces

• Power supply via ATX-style power connector

• Power jack for 12-24V input voltage

The MSC SM2S-IMX6 module is fully compliant with the new SMARC™ 2.0 standard and is

based on NXP's i.MX6 CPUs offering quad-, dual- and single-core ARM Cortex-A9 compute

performance at very low power consumption and excellent graphics performance combined

with a high dregree of functional integration.

Highlights

• NXP™ i.MX6 ARM® Cortex™-A9 quad-, dual-,

dual-lite or single-core CPU

• Supports i.MX 6QuadPlus, i.MX 6DualPlus

• MPEG-4 Video En-/Decoding 1080p,

• HDMI graphics 1920x1080x30fps,

• dual-channel LVDS 1920x1080x30fps

• Up to 4GB DDR3L DRAM

• Up to 64GB eMMC Flash memory

• 10/100/1000 GbE LAN interface

• 1x PCI Express x1

• 1x SATA-II (3Gbps, quad-/dual-core only)

• 1x USB Device/Host + up to 5x USB 2.0 Host

• 1x MMC / SD / SDIO interface

• 2x CAN interface

• I2S Audio interface

• MIPI CSI-2 camera interface

MSC SM2S-IMX6SMARC™ 2.0

82 x 50

4/6 W

170 x 170

2 W

-40... +85 °C

-40...+85 °C

NEW

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2s-al.html

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2-mb-ep1.html

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2f-al.html

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2s-imx6.html

47 46 | www.msc-technologies.eu

SMARC™ 2.0 - Accessories SMARC™ 2.0 - Accessories

Highlights

• SMARC 2.0 carrier board in Mini-ITX format with

socket for SMARC 2.0 modules

• Heatspreader suitable for all variants of the

SM2S-IMX6 module family


immediate operation of the Starterkit

• Bootable Linux installation in Flash, ready-to-run



backlight connector includes adjustable backlight voltage

and dimming

• Ethernet (10/100/1000 LAN) connector

• SATA, 4x USB 2.0 Host, USB Host/Client, UART, SD-

Card socket

• Optional TFT Kits available

The SMARC 2.0 Starter Kit for SMARC modules with the NXP™ i.MX6 processors is based on a

Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contains all necessary products to quick-

ly enable the user to run and evaluate the SM2S-IMX6 module range. The kit does not contain a

SMARC 2.0 module allowing the user to select the most suitable one from MSC’s offerings.

MSC SM2-SK-IMX6-EP1Starterkit for ARM-based SMARC™ 2.0 Modules

Highlights

• SMARC 2.0 carrier board in Mini-ITX format with

socket for SMARC 2.0 modules

• Heatspreader suitable for all module variants of

the SM2F-AL or SM2S-AL module families


immediate operation of the Starterkit

• Bootable Linux installation in Flash, ready-to-run


• DisplayPort Connector


backlight connector includes adjustable backlight

voltage and dimming

• Ethernet (10/100/1000 LAN) connector

• SATA, 4x USB 2.0 Host, USB Host/Client,

UART, SD-Card socket

• Optional TFT Kits available

The SMARC 2.0 Starter Kits for SMARC modules with the Intel® E3900 “Apollo Lake” processors are

based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contain all necessary products to

quickly enable the user to run and evaluate the SM2F-AL and SM2S-AL module families, respectively.

The kits do not contain a SMARC 2.0 module allowing the user to select the most suitable one from

MSC’s offerings.

MSC SM2F-SK-AL-EP1 MSC SM2S-SK-AL-EP1Starterkits for x86-based SMARC™ 2.0 Modules

For all its SMARC modules, MSC is offering tai-

lored cooling solutions which perfectly fit the

geometry of the COM product.

MSC is providing a heatspreader for each SMARC

module, and a single-piece heatsink for the high-

er-performance modules.

SMARC™ 2.0 Cooling Solutions

A heatspreader offers a blank surface allowing to

mount a cooling device or to contact the metal

housing of a system, while the underside provides

contact areas for the heat generating parts of the

module’s geometry.

A heatsink is shaped like the heatspreader,

but shows cooling fins on the upper side so

as to maximize the surface used to dissipate

heat into the surrounding air.

Heatspreaders Full and Short Size

Heatsinks Full and Short Size

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2-sk-imx6-ep1.html

https://www.msc-technologies.eu/products/boards/smarc/msc-sm2f-sk-al-ep1.html

49

The nanoRISC module standard has been created

for applications requiring a small form factor and

lowest power consumption.

The nanoRISC modules simplify the design of

embedded systems by providing a processor

core with an extensive set of interfaces on a

small form factor board. Boot loader and adap-

tations for popular Operating Systems will be

provided by MSC so that design times will be

shortened dramatically.

nanoRISC modules can be used as a processing

“supercomponent”, while users only need to add

application-specific periphery. The 230-pin MXM

connector used as interface to the baseboard is

inexpensive but robust and proven. A variety of

easy-to-use interfaces are available. All popular

embedded interfaces are included, and addi-

tional interfaces can be provided by adding

suitable controllers on the baseboard and con-

necting them to the processor bus available on

the MXM connector.

nanoRISC® ®®


nanoRISC® Properties

The nanoRISC® Standard uses a compact module

size of 70mm x 50mm. The module PCBs have

230 edge fingers that mate with a low profile 230

pin 0.5mm pitch connector called MXM-2 which

is available in abundance, rugged and proven.

Module PCB

Carrier PCB Depending of socket used

1.20±0.1

max. 2.501.20±0.1

max. 6.00, typ. 3.01.20 (depending on module) 0±0.1

50

mm

70 mm

The MSC NANORISC-AM335X module is based on the Texas Instruments® Cortex™-A8 processor

AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to

512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB eMMC Flash and

10/100 Ethernet LAN, optionally second LAN or GbE LAN.

Highlights

• Texas Instruments Cortex™-A8 CPU AM335x

clocked up to 800MHz

• Up to 512MB DDR3 SDRAM soldered

• Up to 512MB SLC NAND Flash soldered

• Up to 64GB eMMC Flash soldered

• 10/100 Base-T Ethernet Interface

• Optional 2nd 10/100 LAN or GbE

• USB 2.0 HS Host, USB 2.0 HS OTG

• RGB 16/18/24 bit up to 1366 x 768

• CAN 2.0B, 3x UART, 2x SPI, 2x I²C

• I²S audio interface

• SD V2.0 / SDIO V1.0 / MMC V4.2

• Optional SGX530 graphics acceleration

• Optional industrial (Realtime) Ethernet

• Commercial and extended commercial

temperature range

• Support for Linux

(Android, Windows EC7 on demand)

MSC NANORISC- AM335XTexas Instruments® AM335X

70 x 50

2.5 /4.5 W

70 x 50

2.0 W

Highlights

• NXP™ i.MX6 Cortex™-A9, 1/2/4 core(s) CPU

clocked up to 1.2GHz

• Up to 4GByte DDR3 SDRAM soldered

• Up to 4GByte SLC NAND Flash soldered

• Up to 64Gbyte eMMC Flash

• Gigabit Ethernet interface

• USB 2.0 Host

• USB 2.0 OTG Host/Client High Speed

• Graphics Interfaces: HDMI/DVI, LVDS, RGB up to

1920 x 1080, dual independent display support

• Video decoder and scaler

• CAN 2.0B, 3x UART, 2x SPI, 2x I²C

• I²S audio interface

• SD V3.0 / SDIO V2.0 / MMC V4.3

• Parallel bus interface

• Camera interface ITU656 / CSI

The MSC NANORISC-IMX6 module is based on the NXP™ Cortex™-A9 processor i.MX6x which is

available as quad-core, dual-core and single-core CPU. On the module it is combined with up to

4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB eMMC Flash and Gigabit

Ethernet LAN.

MSC NANORISC-IMX6NXP™ i.MX6 ARM MPU

-40 +85 °C

-40 +85 °C

nanoRISC®


nanoRISC®

The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC’s range of nanoRISC

processor modules. It consists of the nanoRISC Embedded Platform board MB2, a 7-inch WVGA

display with capacitive touch and a suitable power supply.

Highlights

• Evaluation and Development Kit for all

nanoRISC® modules

• Includes 7" LCD panel 800 x 480 pixels with

all required interface cables

• Power supply included

• Integrated Debug Adapter on-board

• SD Card with pre-installed Linux or Android

Operating System to be ordered with CPU

module of choice

• nanoRISC CPU module not contained

- please order separately

• Complete range of usable interfaces

• GbE or 2x 10/100 Base-T (dep. on module)

• 1 or 2 USB Host Port (dep. on module)

• USB OTG Port (dep. on module)

• CAN Bus, 2x COM Ports on 9-pin Sub-D

• I2S or AC97 audio codec with standard

audio connectors

MSC NANORISC-SKEvaluation and Development Kit

Highlights

• Socket for nanoRISC compatible modules

• LCD panel interfaces with RGB TTL output

• Backlight power 8..20VDC

• Graphics extension connector for optional

graphics modules (LVDS, HDMI)

• 2x 10/100 Base-T Ethernet interface or GbE

• 2x USB Host, USB OTG Host/Client port

• Touch Screen support (capacitive + resistive)

• ITU656 video input interface on ext. connector

• 2x COM ports on 9pin Sub-D connector

• I2S audio codec with standard audio connectors

• SD Card socket

• PCIe, SATA, CAN, Local Bus, SPI, I2S

on extension pad field

• Battery charger support (Lithium cell)

• 8..20V power supply input

The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics

RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C

and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are

provided. An SD Card socket is supported.

160 x 110

-40 +85 °C

MSC NANORISC-MB2Embedded Platform

51

https://www.msc-technologies.eu/products/boards/nanorisc/msc-nanorisc-am335x.html

https://www.msc-technologies.eu/products/boards/nanorisc/msc-nanorisc-sk-mb2.html

https://www.msc-technologies.eu/products/boards/nanorisc/msc-nanorisc-imx6.html

https://www.msc-technologies.eu/products/boards/nanorisc/msc-nanorisc-mb2.html

AUSTRIA/SLOVENIA

Aredstrasse 13

A - 2544 Leobersdorf

Phone +43 2256 63975 0

BENELUX COUNTRIES

Stadionstraat 2, 6th fl

NL - 4815 NG Breda

Phone +31 76 5722 400

CZECH REPUBLIC/POLAND/SLOVAKIA

Nádražní 2369/10

CZ - 678 01 Blansko

Phone +420 516 411 494

FRANCE

Parc Club du Moulin à Vent 33,

rue du Dr.G. Levy – Bât 10

F - 69693 Venissieux Cedex (Lyon)

Phone +33 472 78 02 61

HUNGARY

Budafoki út 91-93 West Irodahaz

H - 1117 Budapest

Phone +36 1 436 72 29

ITALY

Via Vittorio Emanuele II, Nr. 55

I - 31029 Vittorio Veneto

Phone +39 0438 939 21

MALTA

UB40 Triq Dun Korm, San Ĝwann

Phone +356 2148 4804

ROMANIA

Calea Floreasca 175, et 8

R - 014459 Bucharest

Phone +40 725 944 401

SPAIN

Calle Chile 10, 2nd Planta, Oficina 222

ES - 28290 Las Matas, Madrid

Phone +34 91 721 69 51

SWITZERLAND

Industriestrasse 25

CH - 8604 Volketswil

Phone +41 43 355 33 66

TURKEY

Inonu Cd. Seylan Is Merkezi

83/6 Kozyatagi

TR - 34736 Istanbul

Phone +90 216 411 2333

DENMARK

Phone +45 3678 6250

[email protected]

FINLAND

Phone +358 20 749 9 260

fi [email protected]

FRANCE

Phone +33 1 64 47 29 29

[email protected]

ISRAEL

Phone +972 9 7780 280

[email protected]

ITALY

Phone +39 02 660 92 1

[email protected]

SOUTH AFRICA

Phone +27 11 319 8600

[email protected]

SWEDEN/NORWAY

Phone +46 8 587 46 400

[email protected]

UNITED KINGDOM

Phone +44 1628 518 900

[email protected]

AUSTRALIA

Phone +61 3 97604250

[email protected]

NEW ZEALAND

Phone +64 3 9620580

[email protected]

HEADQUARTERS STUTENSEE

Industriestrasse 16

76297 Stutensee

Phone +49 7249 910 0

Fax +49 7249 799 3

HEADQUARTERS FREIBURG

Munzinger Strasse 3

79111 Freiburg im Breisgau

Phone +49 761 8819 0

Fax +49 761 8819 849

HEADQUARTERS

USA AND CANADA

Phone +1 480-643-2000

[email protected]

[email protected]

© MSC Technologies. All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions. All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.

Engineering Leadership

www.avnet-embedded.euwww.avnet.com

www.msc-technologies.eu