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From Technologies to Markets
Sample
November 2017
Market Opportunities for Thermal Management Components
in Smartphones
2
Biographies & contacts
Dr. Milan Rosina
Dr. Milan Rosina works as a senior analyst in the fields of energy conversion and emerging materials. Before joining Yole Développement, he worked as a researchscientist and a project manager in photovoltaics, microelectronics and LED. He has more than 15 years of scientific and industrial experience with prominentresearch institutions and a utility company.
E-mail: [email protected]
Mattin Grao Txapartegi
Mattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reportsdedicated to the evolution of inverters architecture and passive components, from capacitors to protection devices. Getting a deep understanding of thetechnology evolution, the market trends and the strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and marketscouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape analysis.Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault.As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an advanced master inaeronautics from the Arts & Métiers ParisTech (FR).
E-mail: [email protected]
Jonathan Liao
Jonathan Liao is a Senior Analyst & Business Development Manager at Yole Développement (Yole). Jonathan is leading the quarterly power management marketupdates. In addition, he performs technology & market reports for gate driver, discrete, module, compound semiconductors, and power management IC.Before joining Yole, Jonathan served as a power electronics Sr. Analyst at IHS Markit. Within a global semiconductor business ecosystem, financial analyses andpower management scouting were part of his mission. Prior to IHS, he was a product engineer at Microchip Technology Inc. During this period, Jonathan gained astrong expertise in analog & mixed signal devices.Jonathan Liao earned his Master of Science (AZ, USA) and graduated with a Bachelor of Science (PA, USA).
Email : [email protected]
©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
3
COMPANIES CITED IN THIS REPORT
Amkor Technology, Apple, ARM, ASUSTeK Computer, Inc. (ASUS), Auras, Asia Vital Components (AVC), Broadcom, CCI, CompeqManufacturing, DECA Technologies, Furukawa Electric, Huawei, Coolpad, HiSilicon, Henkel, Huawei, HTC, Intel, Lenovo, LG,
Mediatek, Microsoft, Nvidia Corp., Nanium, Nippon Mekron, NXP, Oppo, Qualcomm, Samsung, Samsung Electro-Mechanics Co, Ltd, Sony, STATS ChipPAC, Vivo, Taisol Group, TCL, Tripod Technology, TSMC, Xiaomi, Zhen Ding Technology, ZTE, and more.
©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
4©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
WHY THERMAL MANAGEMENT IS NEEDED IN SMARTPHONES?
• To avoid component /smartphone damage
• To eliminate potentialbattery hazards (thermalrunaway, fire, explosion)related to uncontrolledtemperature
• To improve xxxxxxxxxxx
• To improve round-tripefficiency and chargeacceptance of the battery
• To ensure xxxxxxxxxxx
• To eliminate hot spots thatdiscolor the display
Thermal management in smartphones is needed mainly for better device operation and longer lifetime, but also for the user’s comfort and safety.
The hot enclosure of smartphone would gives undesired feeling to the
user.
Safety
Generally, the lifespan of semiconductor devices is
halved for every 10 degrees rise in junction temperature.
5©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
MAIN REASONS WHY A SMARTPHONE GETS HOT
The reasons why a smartphone gets hot are mainly related to its design, components used and operation mode.
Exchange with surrounding environment
Smartphone design Components used
Materials used
Xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Slim & Small
xxxxxxxxxxxxxxxxxxxxxxxx
Thermal properties vs. other characteristics and costs
Design vs. Functionality
Operation mode
Xxxxxxxxxxxxxxxxxxxx
Xxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxx
* Manufacturing defects are not considered here
6©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
TM SOLUTIONS AT DIFFERENT PACKAGING LEVELS
• Thermal management in asmartphone can be realized atdifferent packaging levels:
1. Chip
2. Chip packaging – “primarypackaging”
3. Printed Circuit Board(PCB) – “secondarypackaging”
4. System level - “tertiarypackaging”
5. Smartphone enclosure
• Today, the dedicated TMsolutions are principallyimplemented on the xxxxxxlevel.
• The strongest improvement ofthermal issues in a smartphonecan be done on the xxxxx level.
• The other levels of smartphonepackaging (x, xx and xxx) aretoday not yet in a focus of astrong thermal optimization.
• The thermal management can be realized at different packaging levels.
• Optimally, the thermal issues are handled as close as possible to the heat generating source.
1 2 3
5
4
Different levels of thermal solutions in a smartphone
Yole Développement
Dedicated
TM solutions
are at this
level
Surrounding environment
Smartphone
Software
management
7©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
FACTORS STRENGTHENING SMARTPHONE TM CHALLENGES
Many factors make TM in smartphone increasingly challenging
New challenges
Water resistant
Wireless charging
High-resolution
streaming, gamingVirtual reality,
avatar
Battery with very
high energy density
(Wh/kg, Wh/L)
New functionalities
requiring new components
8©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
SMARTPHONE THERMAL MANAGEMENT BILL OF MATERIALS IN 2016
• In 2016, the largest part ofcost related to thermalmanagement components insmartphone was representedby xxxxxxxxxxx
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
• “Dedicated” thermalcomponents such as heatpipes, thermal sheets andother components representtogether about xx%.
Smartphone thermal management components market in 2016. Split per component.
Yole Développement
9©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
MARKET VALUE OF THERMAL MANAGEMENT COMPONENTS IN SMARTPHONES
The market value for TM components in smartphones will reach $xxxx million by 2022.
Market value of thermal management components in smartphones
Yole Développement
10©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
PROCESSOR – HARDWARE AND SOFTWARE IMPROVEMENTS
The processor improvements can be done on hardware and software levels
Processor improvements
Manufacturing
technologyxxxxxxxxxxxxx Software control
• Xxxxxxxxxxxxxxxxxx
• xxxxxxxxxxxxxx
Example: Two groups of 4 cores in Snapdragon 835
• Multiple-core architecture
• “High-power” and “low-power” cores
SoftwareHardware
11©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
PACKAGING IN SMARTPHONES: STILL LOW FOCUS ON THERMAL CHARACTERISTICS
• The focus ofadvanced packagingcompanies regardingsmartphoneapplications is mainlyon the betterelectricalperformance andminiaturization.
• Thermalmanagement insmartphone is still ofa minor interest, butfirst innovations inthis field begin toappear.
Most high-performance
advanced packaging
solutions have poor thermal characteristics
Electrical performance
Signal propagation time
Low signal loss (low parasitic)
Small form factor
TM
High
Low
Pri
ori
ty leve
l
Thermal management (TM) is not yet amongst the principal
priorities while choosing the advanced packaging solution:
12©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
HEAT PIPES IN SMARTPHONE - TIMELINE
Heat pipe is used in almost every portable computer today.
Heat pipe is an “old” technology, but its miniaturization has enabled introducing it in smartphones.
2013 2014 2015 2016 2017
Ultra-thin
heat pipe
introduced
for
smartphone
CPU cooling
• 4.7-inch
• 0.6 mm in size,
water-filled heat pipe
• a quad-core 1.7GHz
Qualcomm
Snapdragon S4 Pro
processor
Several leading smartphone
manufacturers have integrated heat pipe
solutions in their devices
Sony
Xperia Z3+xxx
xxx
1963 1965
First
application
of heat
pipes in
satellites
Heat pipe
invented at
Los Alamos
National
Laboratory
NEC – Media X06E
Pixel 2 XL
In 2017, some
leading
smartphone
suppliers made a
choice of using
heat pipes, other
not.
xxx xxx
13©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
HEAT PIPE VS. VAPOR CHAMBER IN SMARTPHONE APPLICATIONS
Vapor chamber can offer better thermal performance than heat pipe.
Comparison of heat pipe and vapor chamber for applications in smartphones
Yole Développement
Heat pipe Vapor chamber
Heat transfer capacity High Very high
Commercial use in smartphonesYes
In some models onlyxxxxxxxxxxxx
Manufacturing cost Low High
Complex manufacturing No Yes
Effective heat transfer area Typically 3 mm x 4 mm xxxxxxxx
Can cover the whole CPU area
ThicknessXxx mm to xxx mm (in high volume
production)~xxx mm (R&D only)
Images: Fujikura, Delta
14©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
SOFTWARE SOLUTIONS FOR THERMAL MANAGEMENT IN SMARTPHONES
Software Thermal Management (STM) includes intervention in device operation depending on the device temperature.
Thermal management
Hardware-based Software-based
xxxxxxxxxxxxxSoftware control of a
device to stop using the core which is hot
xxxxxxxxxxxxxx
Examples:
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
x
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
x
xxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxx
15©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
TECHNOLOGY TRENDS IN PCB
Smart design of electrical wiring
• According toYole’s estimates,about 40 to xxx%of the heattransfer in thePCB is throughthe metal layers(electrical wiring).
• Xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Electrical circuits design can be improved for better better thermal dissipation
Wider lines
Thicker lines
Grouped lines
(no electrical function,
thermal function only)
Envisaged solutions for enhanced thermal management by smart wiring design (top view of a PCB illustrated
here). Each solution has its advantages and drawbacks.
Yole Développement
Up to 18µm is recorded
for applications <10W
Backside Cu via connection
behind the hotspot alone can
reduce temperature up to 10 °C
Cu vias next to hotspots
Dummy lines
16©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
WIRELESS CHARGING
Case study: iPhone 8 and Samsung Galaxy 8
• The latest smartphonesof the two marketleaders incorporatewireless technology.
• Xxxxxxxxxxxxxcharging technologyis used in these twomobile devices.
o xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxx inductive technology (from xxxxxx) is likely to become the standard solution for smartphones.
iPhone 8 Samsung Galaxy 8
Photo courtesy of System Plus Engineering
The receiver coil
Photo courtesy of System Plus Engineering
17©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
HEAT PIPES: WHO SUPPLIES WHO?
Auras is the leading supplier of heat pipes for smartphones
Heat pipe Smartphone
18
RELATED REPORTS
©2017 | www.yole.fr | Market Opportunities for Thermal Management Components in Smartphones | Sample
The growing smartphone market, expected to reach almost $2.1 billion smartphones annually by 2022, represents a great opportunity for suppliers of different smartphone components and technology solutions.
Thermal management of handheld devices, such as smartphones, is becoming increasingly challenging. As detailed in the report, the main reasons for this are the growing number of smartphone functionalities and raised customer requirements for processing speed, leading to increased heat dissipation. Additional components needed to ensure new smartphone functions desired by customers, including wireless charging, high-resolution cameras, 3D gaming, security, authentication, and high-speed streaming, also result in denser component integration, making thermal management even more difficult.
Actually, smartphones contain several components that generate heat, and components whose performance and lifetime is negatively impacted by heat. Excessive heating of some components, such as lithium ion batteries, has to be avoided for safety reasons. The processor is the hottest component in a smartphone. Amongst other heat-generating components in a smartphone are image sensors, light sources and the battery.
Suitable thermal management solutions are now sought to avoid hot spots in smartphone and keep the component temperature at acceptable levels. The enclosure temperature, or skin temperature, must be also kept relatively low to avoid users feeling uncomfortable when using the smartphone.
MARKET OPPORTUNITIES FOR THERMAL MANAGEMENT COMPONENTS IN SMARTPHONES Market & Technology report - November 2017
GROWING THERMAL CHALLENGES WITHIN A BOOMING SMARTPHONE MARKET
How can smartphones deal with growing heat management challenges?
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Detailed discussion about trends
in smartphones and how they will impact the needs for enhanced thermal management solutions
• Deep insights into different smartphone components and their role in thermal management
• Focus on different strategies to deal with thermal issues in smartphones, including: software and hardware thermal management; reducing heat-generation by using chips with lower thermal losses; using thermally-enhanced smartphone solutions for packaging and PCBs; enclosures; heat pipes; and vapor chambers
• Market forecast in millions of dollars for thermal management components in smartphones for 2017–2022
• Overview of main suppliers for key thermal management components in smartphones
OBJECTIVES OF THE REPORT• Provide a clear overview of the
smartphone thermal management solutions, covering “hardware” solutions and software thermal management
• Furnish market data for thermal management components in smartphones
• Present the technology trends for smartphone thermal management components
• Deliver an overview of the main suppliers of key components
(Yole Développement, November 2017)
Main heat sources in a smartphone
Picture: System Plus Consulting
Processor
LED
Battery B ttery
Smartphones pose a significant challenge to the implementation of traditional cooling schemes, such as heat sinks and fans, due to form factor limitations and the specific way the device is used by customers.
As detailed in the report, there are different approaches for thermal management, based both on hardware and software solutions. Software thermal management (STM) has several advantages. It enables additional
WHAT ARE THE THERMAL SOLUTIONS IN SMARTPHONES?
MARKET OPPORTUNITIES FOR THERMAL MANAGEMENT COMPONENTS IN SMARTPHONES
TECHNOLOGY INNOVATION IN THERMAL MANAGEMENT IN SMARTPHONES AND THEIR SUPPLIERS
design flexibility and an optimal reaction to a given thermal event and can be improved by a software update in existing products. Contrary to hardware solutions, such as heat pipes, STM does not take additional space in smartphone.
The optimal way to deal with heat in smartphones would be to reduce heat
generation, by using higher performance chips. Significant improvements have been made in chip manufacturing, with the 10 nm node introduced in 2016, and chip architectures, including multiple core architectures, with “high-power” and “low-power” cores, associated with appropriate software control. However, in the future, processor improvements might be not fast enough to follow rapidly elevating customer requirements for smartphone functionality and performance.
So other thermal management solutions will increasingly be needed. As shown in the report, similar trends were observed in the past, when thermal transfer sheet performance was not sufficient to dissipate heat from poorly thermally designed processors, leading to heat pipes being introduced into the first smartphones from NEC and Sony. Today, the Samsung Galaxy S8, LG G5, Google Pixel 2 XL are just a few examples of smartphones relying on heat pipes to improve their thermal management.
Alternatively, vapor chambers might perform better than heat pipes in the near future. Ultrathin vapor chambers are already under development by several players, such as Furukawa Electric, TaiSol, AVC and Delta, but still face difficult technology challenges.
Until recently, the thermal management in smartphones was only of minor interest to smartphone component and device designers.
Beside some “dedicated” thermal management components like heat pipes and thermal transfer sheets, most smartphone components have been designed and built without thermal performance in mind.
According to Yole Développement’s analysis, this will greatly change in the future. A fierce battle
for each mm3 of volume available in smartphones to implement components enabling new functionality and for larger batteries will lead to efforts to enhance thermal characteristics of existing smartphone components, instead of adding dedicated bulky thermal components.
Future efforts will be focused mainly at the packaging level, in chip packaging and Printed Circuit Boards (PCBs). These two solutions will account for more than ¾ of the $3.6 billion market for thermal components solutions by 2022. Fan-out packaging solutions and high-density thermally-enhanced PCBs will especially attract interest. Amongst other, leading PCB suppliers such as Mektec, Samsung Electro-Mechanics, AT&S and Unimicron, and leading packaging suppliers such as Amkor Technology, ASE, TSMC and STATS ChipPAC will take part in this spectacular thermal transition in smartphones. The integration of several functions into one component is another promising approach for future smartphones.
Despite cost barriers in the cost-sensitive smartphone industry environment, the huge quantities of thermal management components needed result in attractive market value. Moreover, new technology solutions add more product-differentiating value compared to their competitors and open market opportunities in other applications areas, such as medical, gaming, pico-projectors, virtual reality and drones.
Vapor chamber vs. existing thermal management solutions
Smartphone thermal management component market
(Yole Développement, November 2017)
(Yole Développement, November 2017)
Ultra-thin vapor chamber
Thermal foils
10
Hea
t flu
x (W
/cm
2 )
Thickness (mm) 0.3
Ultra-thin heat pipes
0.6
1
Low profile
High heat dissipation capacity
U
-
1
2
3
4
2016
CAGR2016-2022: 26.1%
2017 2018 2019 2020 2021 2022
US$
Bill
ion
Report details complete breakdown with thermally-enhanced packaging, thermally-enhanced PCB, heat pipe/vapor chamber, thermal sheet, back cover, other
MARKET & TECHNOLOGY REPORT
Find more details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)Amkor Technology, AT&S, Apple, ARM, ASUSTeK Computer, Inc. (ASUS), Auras, Asia Vital Components (AVC), Broadcom, CCI, Compeq Manufacturing, DECA Technologies, Furukawa Electric, Huawei, Coolpad, HiSilicon, Henkel, Huawei, HTC, Intel, Lenovo, LG, Mediatek, Microsoft, Nvidia Corp., Nanium, Nippon Mekron, NXP, Oppo, Qualcomm, Samsung, Samsung Electro-Mechanics Co, Ltd, Schoeller Electronics Systems, SONY, STATS ChipPAC, Vivo, Taisol Group, TCL, Tripod Technology, TSMC, Xiaomi, Zhen Ding Technology, ZTE, and more…
Introduction 7
Executive summary 12
Global smartphone market trends 43
Thermal issues in smartphones 48
> Main reasons why a smartphone gets hot > What are the main heat sources in a
smartphone?> Thermal management priority levels> Thermal management solutions in
smartphones> Classification of thermal management
solutions in a smartphone> Different ways to deal with heat in a
smartphone> TM solutions at different packaging levels> Synergies of TM for smartphones with
other applications
Technology and market challenges 62
> Challenges to thermal management in smartphones
> Factors strengthening smartphone TM challenges
> Smartphone cooling system features sought> Smartphones are getting slimmer and
slimmer – or, are they?
Market forecast 71
> Methodology> 2016-2022 smartphone market in Munits> 2016-2022 smartphone market value in
$ million> Leading smartphone companies in 2016 –
units sold per year> Leading smartphone companies in 2016 –
revenues> Smartphone bill of materials in 2016> Smartphone thermal management bill of
materials in 2016 and 2022> Market value of thermal management
components in smartphones
Smartphone components and their role in thermal management 84
Processor 86
> Hardware and software improvements> Single-core vs. multiple-core processor > Comparative table of different processors> Low efficient processor additional
thermal solutions needed
Packaging and PCB 92
> Smartphone as a driver for packaging development
> Packaging in smartphones: still little focus on thermal characteristics
> Benefits of fan-out packaging over other packages
> Comparison of different packaging technologies in smartphones
> Underfill> PCB materials> PCB and thermal management in smartphones> PCB surface area in different
smartphones – comparative graph> Smartphone PCB main specifications> PCB – how to improve thermal spreading
capability?Thermal sheet 108
Heat pipe and vapor chamber 112
> Advantages & inconvenience of using heat pipes in smartphones
> Heat pipes in smartphone - Timeline > Heat pipe as thermal management
improvement in Samsung Galaxy S7> Comparison heat pipe & graphite thermal
sheet> Vapor chamber structure and principle> Heat pipe vs. vapor chamber in
smartphone applicationsBattery 123
Smartphone enclosure 128
Other thermal management components 135
> Air fan/air blower> Heat absorbent films/pads of Phase
change materials > Thermoelectric cooling> Midframe
Software solutions for thermal management in smartphones 143
Technology trends 151
Wireless charging 164
Thermal characterization, simulation and testing 170
Supply chain 172
> Smartphone microprocessor and software management supply chain
> Packaging: Fan-out manufacturers> Packaging: Fan-out supply chain> Underfill players> Heat pipes: who supplies who?> Vapor chamber developers for smartphones> Smartphone PCB suppliers
Conclusions 182
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Status of Advanced Packaging industry 2017 • Advanced Substrate Overview: From IC
Package to Board
RELATED REPORTSBenefit from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages
AUTHORSDr. Milan Rosina is a Senior Analyst for Energy Conversion and Emerging Materials at Yole Développement. Before joining Yole, he worked as a Research Scientist and a Project Manager in the f ields of photovoltaics, microelectronics, and LEDs. Dr. Rosina has more than 15 years of scientif ic and industrial experience with prominent research institutions, an equipment maker, and a utility company. His exper tise includes new equipment and process development, due diligence, technology, and market surveys in the f ields of renewable energy, energy storage, batteries, power electronics, thermal management and innovative materials and devices.
This repor t has been per formed in collaboration with Mattin Grao Txapartegi and Jonathan Liao both analysts par t of the Power Electronics, Compound Semiconductor and Energy Management team at Yole Développement.
Find all our reports on www.i-micronews.com
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• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com
28©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− Integrated Passive Devices Market Status 2017
− 3D Imaging & Sensing 2017
− Status of the MEMS Industry 2017
− Silicon Photonics 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017**
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Integrated Passive Devices Market Status 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced QFN: Market & Technology Trends 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
− Embedded Software for Machine Vision Systems 2017**
o BATTERY AND ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed
29©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power MOSFET 2017: Market and Technology Trends
− IGBT Market and Technology Trends 2017
− Power Module Packaging: Material Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Integrated Passive Devices Market Status 2017
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− MicroLED IP 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management Technology and Market Perspectives in Power Electronics
and LEDs 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk
and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− MicroLEDs: Patent Landscape Analysis 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− FLUIDIGM Patent Portfolio Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
*2016 version still available / **To be confirmed
30©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
31©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
32©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
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product/brand visibility. They
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adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
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33©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
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