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Need for compatibility and future-proof design CF3

Innovation Summit 2015 - 4 - CF3

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Need for compatibility and future-proof design

CF3™

Need for compatibility and future-proof design

Wireless Interface

2G

3G

4G

Application Processing

Essential Connectivity

Pin count Features

CF3™

Future

CF3™ concept definition

Common

Generations | Technologies

Flexible

Solder-down | Socket-able

Form

Fixed Size

Factor

Standard Footprint

3 keys to CF3™

Miniaturization •  XY  dimension  convergence  

22mm  x  23mm      

•  Innova2ve  +  cost  compe22ve    packaging  technology  

3 keys to CF3™

RF PCB

RF Components RF Components

Baseband PCB

Baseband Components

Miniaturization

RF Components

Baseband PCB Baseband Components

Typical module layout >1,000mm2 ~500mm2 CF3™ module layout

[TOP VIEW] [SIDE VIEW]

3 keys to CF3™

RF PCB

RF Components RF Components

Baseband PCB

Baseband Components

Main Board 1

Main Board 2

Frame Board 0.8mm

1.2mm

Metal Can

Solder

Solder

Miniaturization

3 keys to CF3™

Footprint •  Future-­‐proof  +  swappable  

 •  2  flexible  footprint  designs  

3 keys to CF3™

CORE PINS never change, guaranteed forward / backward

compatibility

EXAMPLE Reset pin will always be: •  Pin 11 •  Voltage: 1V8 •  Polarity: active-low RES

EXTENSION PINS enable additional features without

impacting compatibility

EXAMPLE GNSS antenna will always be on pin 38 in every CF3 module with GPS + Glonass

Footprint

CUSTOM PINS enable unique module-specific features

EXAMPLE MIPI Debug may be on pins 2,8,9,10,60 in some modules

3 keys to CF3™

Footprint

Essential Connectivity footprint

TOTAL

Core Ext.

28 38

66

Application Processing footprint

TOTAL

Core Ext.

62 95

157

3 keys to CF3™

Socket •  Common  socket  for  all  plaCorms  

 •  Rugged  enough  to  withstand  any    

environmental  requirements  

3 keys to CF3™

Socket

snap-in snap-out

solder down

Both options use the same board space

CF3™ + AirPrime® embedded modules

CF3™  

Essential Connectivity: HL Series Application Processing: WP Series

2G

3G

4G

3G

4G

CF3™ + AirPrime® embedded modules

Wireless Interface

2G

3G

4G

Application Processing

Essential Connectivity

Pin count Features

CF3™

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Innovation Summit 2015