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Covered in this Report• The report includes the present scenario and the
growth prospects of the global interconnect market for the period 2015-2019.
• The market can be segmented into two divisions: connectors and cable assemblies.
• Technavio's report, Global Interconnect Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.
• The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years.
• The report includes a discussion of the key vendors operating in this market.
Global Interconnect Market 2015-2019
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Market Overview• Interconnect is an electrical connection that
connects two or more devices.
• It derives its applications in the process and discrete industries by facilitating effective interconnection and smooth operations.
• With the increase in integration of IT and electronics in process and discrete industries, there is a growing need of interconnects which can connect various devices in use and provide real-time information to the operators on shop-floor.
• Technavio's analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019.
To know more aboutGlobal Interconnect Market 2015-2019,
please mail us [email protected]
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Key Vendors and Regions
• Amphenol
• Foxconn
• Molex
• TE Connectivity
• Yazaki
• 3M
• Alstom SA
• Belden Incorporated
View Our Report: Global Interconnect Market 2015-2019
• APAC
• Europe
• North America
Vendors Regions
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Key Findings
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• With the advances in hardware components and overall systems, the integration of electronics with industrial applications is becoming increasingly important.
• The introduction of IT intelligence across the shop floor ensures real-time data from the connected devices.
• This enables communication and transportation of large amounts of data quickly and reliably, resulting in an optimized supply chain. In order to cater to the changing needs of process and discrete industries, vendors are focusing their efforts on including industrial communication products in their product portfolio.
• Some of the industrial communication products are industrial ethernet, I/O
links, and industrial wireless communication.
• These devices employ interconnects to ensure smooth operations.
Key Questions Answered in Our Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
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• Decision makers and influencers in sales & marketing, strategy, product and R&D teams rely on research from Technavio. We have a large and growing base of happy customers worldwide. Our customers include technology suppliers, end users, consulting companies, investment firms and research institutes.
• Technavio was founded in 2003 in London. We have about 300 analysts globally. We cover more than 500 technologies across 80 countries. Traditional media such as Forbes Asia and New York Times, along with other web media portals, like to quote us.
About Technavio
Some of our clients include:ACT Global, Flextronics, Huawei Technologies Co, Infosys, Harris Corporation, Infosys, Intercad, Hidaka Precision Tools & Dies Company, Huawei Technologies Co, American Capital, Analysis Group, Netscout, NTT DoCoMo
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Global Interconnect Market 2015-2019
77 Pages | SKU: IRTNTR6610
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