Embed Size (px)
Citation preview
October 2017
From Technologies to Market
Fan-Out Packaging
Technologies and Market Trends
Sample
2
REPORT SCOPE
The main objectives of this report are the following:
o To identify and describe which technologies can be classified as “Fan-Out”
o To update the business status of Fan-Out technologies markets
o To provide a market forecast for the coming years, and estimate future trends
o To analyze key market drivers, benefits and challenges of Fan-Out packages by application
o To describe the different existing technologies, their trends and roadmaps
o To analyze supply chain and Fan-Out landscape
The Fan-Out markets are studied from the following angles:
o State-of-the-art technologies and trends
o End-User applications and drivers
oMarket value
o Industrial supply chain & value chain
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
3
TABLE OF CONTENTS 2017
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
• Report scope & definitions p.7
o Scope of the report
o Companies cited in this report
o Glossary
• What’s new p.13
• Executive summary p.19
• Advanced packaging trends p.52
o Advanced Packaging platforms segmentation
• Motivations and drivers p.67
o Fan-Out Definition
o Thickness, electrical performance, integration
o Cost
• Products and technologies p.96
o Segmentation
o Fan-Out Packaging Technologies available and expected (eWLB,
RCP, InFO, SWIFT, M-Series, etc…)
o IP status
o Limitations and challenges + Roadmaps
• Supply Chain p.178
o Players and positioning within the supply chain
• Commercialization Status p.193
o Type of products and markets of interest
o Which type of Fan-Out for which application?
• Telecom products, APE, Automotive, MEMS, HPC, etc…
o Stories and Analysis: Who sold what and where? /
Manufacturing capabilities / Alliances
o Market shares
o Limitations for the market
• Market forecasts p.242o Revenues (per end-markets, per applications)
o Volumes (in wafers, in packages)
• Panel Manufacturing p.268
o Panel/carriers for Fan-Out status, cost comparison and forecast
• Conclusions p.286
• Related Reports / Company presentation p.289
4
Biography & contact
ABOUT THE AUTHOR
Jérôme Azémar
Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team of Yole Développement. As a technology and market analyst
since 2013, Jérôme provided numerous market research and strategy analysis on Power Electronics, Advanced Packaging and Semiconductor
Manufacturing and he performed several presentations, keynotes and market briefings in semiconductors conferences.
Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three
years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he then honed
over a two-year stint as a Process Engineer at STMicroelectronics. While with ST he developed new processes, co-authored an international
publication and worked on metrology structures embedded on reticules before joining Yole Développement in 2013.
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
5
FAN-OUT TECHNOLOGY PRINCIPLE
Fan-Out: Dies embedded in mold compound, no advanced substrate and interconnections fanned out of chip surface
eWLB example (chip-first face-down)
Pick and place
Wafer level
molding
Carrier removal/de-bonding
Tape lamination
Standard WLB process
(Passivation, pattern, RDL,
bonding)
Dicing
Source: Infineon
Carrier
Carrier with foil and chips
Molding with liquid mold compound
WLP Fan-Out wafer
After singulation
Reconstituted wafer
after molding
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
6
Smaller footprint and thinner package than
Flip-Chip BGA
Lower thermal resistance compared
to Flip-Chip BGA
Simplified supply chain and manufacturing
infrastructure
No laminate substrate required
No restriction in bump pitch
Shorter interconnections
Fan-Out zone adaptable to customer
needs
FAN-OUT KEY DIFFERENTIATORS
Fan-Out provides several advantages
Mold Chip
And others such as:
• Better board level reliability
compared to WLCSP
• RoHS an REACH compliant
package
• Excellent electrical
performance
• High degree of package design
freedom
• Reliable, miniaturized high
performance package
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
7
EMBEDDED PACKAGING TECHNOLOGIES
Embedded packaging technologies with connections
fanned out of IC surface
Embedding in organic laminate Embedding in epoxy mold compound
CHIP FIRST: CF
CHIP LAST: CL
FACE UP: FU
FACE DOWN: FD
Process typeLamination around
the chip
Cavity dig in
substrate
Interconnections type RDLFoundry
BEOL + RDL
Advanced
Substrate
Chip orientation
Encapsulator type
CF / CLCF / CL CL
FU / FD FU / FD
Chip placing
Embedded Die
Fan-Out Packaging
(Focus of the report)
Flip-Chip
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
8
Chip-First Face-Down Chip-First Face-Up Chip-Last
- Co-planarity of active surfaces of dies
makes it easier to embed
- Wafer-level-package Lower cost than
Chip-Last
- Face-up allows to have mold compound in
between die surface and RDL which allows
better high frequency performance
(optimized spacing, less parasitic
inductances) and higher reliability vs
mechanical stress
- Face-up can have higher misalignment
tolerance than Face-Down (limited die pad
size vs full pillar size)
- Easier debonding on non-active IC faces.
- No loss of KGD: Known good die check
before process to wafer and known good
RDL check before IC flip
- Higher yield:
- No die shift nor warpage due to
compound thermal expansion
- No need for low temperature cure
dielectric material
- Higher IO count embedding:
- Higher number of RDL achievable and
high resolution
- Easiness of embedding because of flip-chip
(thickness of the die is not an issue)
- Sensitivity to Die-Shift: Face-Down is
constrained by via to die pad tolerance
- If failure, known good die is lost: No info
on known good RDL before the package is
done
- Wafer-Level-Package Tight
requirements for materials to avoid issues
with mold (low cure dielectric materials,
warpage, etc…)
- Non co-planarity of active surface of dies
makes it harder to embed
- If failure, known good die is lost: No info
on known good RDL before the package is
done
- Wafer-Level-Package Tight
requirements for materials to avoid issues
with mold (low cure dielectric materials,
warpage, etc…)
- Higher cost than chip-first solutions (more
process steps, two parts to assemble)
- More complex process
DIFFERENT PROCESS APPROACH FOR DIFFERENT RESULTS
Pros and cons of different Fan-Out process approaches
©2016 | www.yole.fr | Fan-Out Packaging: Technologies & Market Trends©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
9
Topography
Due to different sizes of devices to
embed, non planarity can
become an issue for SiP integration
Chip-to-mold non-planarity
Die protrusion at the interface can
lead to RDL distortion
Die shift
Lack of precision in die positioning during pick and place induces challenges for
lithography steps and alignments
Reliability
In case of large packages (beyond15*15mm) creepfatigue and solder joint issues appear Issue for large
die embedding and PoP
Warpage Nonuniform stress
during process steps like molding
compound deposition and die placing can impact wafer flatness and
stress on dies
IC 1 IC 2
FAN-OUT PACKAGING: TECHNICAL CHALLENGES
Fan-Out packaging faces technicalchallenges itmust over-come to enlarge itsscope of compatible applications
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
10
PATENT LANDSCAPE OVERVIEW
Time evolution of patent publications related to Fan-Out Wafer Level Packaging
Patent activity in the field of fan-out wafer level packaging4,008 patents (1,534 patent families*), including 2,083 granted patents and 1,517 pending patent applications
Knowmade © 2017
Note: The data
corresponding to
the year 2017 is
not complete
patent search
was performed
in June 2017.
Extension of
priority patents
First wave
of patented inventions
The second wave of patent filings combined to an increase of patent extensions
worldwide is an indication of the technology maturity and market ramping up
General Electric
US5353498 (expired)
Substrate for IC module with molding
material around semiconductor chips,
except for chip surfaces containing
contact pads
MCNC / Unitive International
US5892179 (expired)
Patent rights acquired by Amkor in 2012
Redistribution routing conductor
EPIC Technologies
US5841193 (expired)
Thin multichip and
single chip modules
Fraunhofer
US6093971 (granted)
Patent rights acquired by
PacTech in 2000
Chip module
22% CAGR
2008-2016
* A patent family is a set of patents filed in multiple countries by a common inventor(s) to protect a single invention.
Innovation
triggers
Expected patent
publications in 2017
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
11
FAN-OUT 2017 FORECAST REVENUES MARKET SHARES (IN $M)
2017 FOWLP market status is representative of FO market duality.
HD FO represent more than 50% of the value and TSMC takes it all
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
12
WHAT TO EXPECT FROM THE HIGH-DENSITY MARKET?
Focus on APE packaging – Apple case
Die
manufacturer
Package
Manufacturer
?
?
2013 2014 2015 2016 2017 2018
Package type FC-PoP FC-PoP FC-PoP FO-PoP FO-PoP FO-PoP?
Apple is king and uses its dominance over the two global innovation leaders available
• Only TSMC and Samsung can have enough resources to be leading edge innovation players satisfying enough for Apple from volume capability, performance and cost
• As a major customer, Apple has enough influence to put both TSMC and Samsung in competition at both die and package levels. With FO-PoP offer TSMC took the lead in 2016/2017 but choice is not clear for 2018
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
13
$ 0M
$ 500M
$1 000M
$1 500M
$2 000M
$2 500M
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022
Fan-Out activity revenues forecast (M$)
Breakdown per Fan-Out market type
"Core" Fan-Out "High Density" Fan-Out
FAN-OUT ACTIVITY MARKET FORECAST
Core FO market with steady growth and HD FO follows flagships’ production
CAGR ~ 90%
APPLE/TSMC
entry
• Entry of A10 APE of iPhone7, 7+
and newer in 2016 doubled the
market!
• After the first jump, further
acceptance by players other than
Apple (Qualcomm?) is appearing,
maintaining the growth
• Market estimated to exceed $2B
by 2021 and keep growing after
CAGR ~ 10%
Intel Mobile/
Infineon
eWLB-driven Transition phase
1
2
3
4
~$2.3B
$80M $244M
Confirmation phase: Apple
keeps its APE in FO and
other players follow the trend
$131M
$1.4B
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
14
FAN-OUT ACTIVITY MARKET
Focus on capacity
So far large playersalready have decentcapacity but landscape maychange withnew comersand panel investment
2017 capacity per player (in 300mm eq. wafers per month)
? ? ?
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
15
WHICH TYPE OF PANEL?
Two main trends… Different sizes, different challenges, different success?
From Fan-Out on wafers to Fan-Out
on panel
From panel to Fan-Out on panel
• Several actors used to manufacture panels are willing to use their panel know-how and aging equipment to build FO panel line
• Several advantages:
• Most of equipment are panel ready, no big investment required
• Line can be used for its initial purpose (depending on the player it can be LCD, PCB or advanced substrate)
• Some concerns:
• How can resolution with such tools compete with FO at wafer level?
• What about specific FO steps such as molding?
This approach leads to standard sizes of PCB (ex: 600x600mm²) and LCD (ex: 650x650mm²)
• Fan-out specialists are willing to reduce their costs through moving to panel
• Several advantages:
• Fan-Out process well mastered and specs well established (line/space, etc..)
• Some concerns:
• Big investment to build a new line for panel
• How good can the process be transferred on panel?
This approach can lead to any size of panel because lines are new. Most likely close to PCB too due to equipment being cheaper. Small size as start to develop process and limit investment cost also exit (ex: 300x300mm²)
LCD
PCB MEOL
Wafer
650x650mm² 300x300mm²
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
16
2015 2016 2017 2018 2019 2020 2021 2022
Fan-Out Revenues Forecast (M$)
Panel/wafer breakdown
Wafer 300mm Panel
FAN-OUT COST EVOLUTION: MARKET TRENDS FOR CARRIERS
Panel will progressively take market shares
Yole Développement August 2017
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
17
RELATED REPORTS
©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
© 2017
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
19©2017 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE
Yole Développement’s 35+ analysts operate in the following areas
MEMS & Sensors
Compound
Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Solid State
Lighting(LED, OLED, …)
20©2017 | www.yole.fr | About Yole Développement
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns & reverse costing analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Financial services
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yole.fr
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast services
• Events
www.i-Micronews.com
21©2017 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Due diligences
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Test lab
Expertise
Research & innovationwww.piseo.fr
22©2017 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Yole Inc.
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Phoenix
Yole Korea
Seoul
23©2017 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Multi-
Customers
Action
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
24©2017 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plan along the entire
supply chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
25©2017 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We are workingacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systemsIndustrial and
defense
Energy
26©2017 | www.yole.fr | About Yole Développement
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professional and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com
27©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− 3D Imaging & Sensing 2017
− Microspectrometers Markets and Applications 2017
− Status of the MEMS Industry 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D Business Update: Market & Technology Trends 2017*
− Advanced QFN: Market & Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
*2016 version still available / **To be confirmed
28©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017*
− Silicon Power Mosfet: Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017**
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications*
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Automotive Lighting 2017 - Technology, Industry and Market Trends
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and Lasers - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management for LED and Power 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation
− Risk and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Micropumps: Patent Landscape Analysis 2017
− GaN Technology: Top-100 IP Profiles 2017
− MicroLEDs: Patent Landscape Analysis 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.*2016 version still available / **To be confirmed
29©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
30©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
31©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience. Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 8,500+
monthly visitors, the 11,500+
weekly readers of @Micronews
e-newsletter
Seven main events planned for
2017 on different topics to
attract 140 attendees on average
Gain new leads for your business
from an average of 300
registrants per webcast
Contacts: Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]), Marketing & Communication Project Managers.
32©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
Follow us on
