0.5 mm SMT Board-to-Board Connector System

STECKVERBINDER

COM Express Connectors for 10+ Gbit/s applications

Key Features

Designed to meet requirements of PICMG COM Express® and SFF-SIG CoreExpress®

Intermatability with available connectors in the market

Robust connector design

Plug connector with ground shield

Receptacle connector with ground pins

Custom configurations in pin count

Multiple stack heights

0.5 mm SMT BtB Connector

Technical Specification Colibri® for COM Express®

0.5 mm SMT Board-to-Board connector system

Specification PICMG COM.0

Number of contacts 220 / 440

Termination SMT

Operating temperature range -40°C to +85°C

Insulator material LCP, UL 94 V-0

Contact material Copper alloy

Contact surface Au over Nickel

Pitch 0.5 mm

Mating force per pin max. 0.9 N

Separating force per pin min. 0.1 N

Durability 30 mating cycles

Coplanarity max. 0.1 mm

Operational current max. 0.5 A

Operating voltage 50 VAC

Contact resistance max. 75 mΩ

Insulation resistance > 100 MΩ

Test voltage 200 VAC

Data transfer rate 10 Gbit/s

Soldering temperature 260°C according to J-STD-020

MSL 1

Packaging Tape and Reel or Tray

Assembly Pick and place

UL file: E130314

Environment RoHS compliant

220 pins

0.5 mm pitch

5 or 8 mm board-to-board distance

Ground shield connected to 24 dedicated ground pins

Different versions for multiple stack heights possible

Customized pin counts possible

Plug [used on Carrier Board]

220 pins

0.5 mm pitch

Same receptacle fits for different stack heights

Dedicated ground pins

Customized pin counts possible

Receptacle [used on COM Module]

The 440 pin connector pair consists of two 220 pin connectors

arranged according to PICMG® COM.0

held together by a plastic carrier during assembly and soldering

5 or 8 mm board-to-board distance

Same receptacle fits for different stack heights

440 contact version (connector pair)

Packaging: Tape and Reel as standard Tray packaging on request

Processing: Pick and Place

Pick & place cap available for 220 contacts version

MOQ 1 reel

Reflow solder temperature 260° C according J-STD-020 for lead free soldering

Additional Information

Signal Integrity

Simulations with the Colibri® COM Express® connector system at 8 or 10 Gbps demonstrate first-rate signal integrity even at high data transfer rates.

High density board designs

COM Express®

CoreExpress®

Board-to-Board

Mezzanine Add-on Cards

…

For example used at

Industrial

Medical

Ticket machines

Gaming

…

Applications

Thank you for your attention!