Die Product Applications

Die Product ApplicationsChris Windsor

Portelligent Inc.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Furthermore, Portelligent extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

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Outline

• CDMA Phones – Past & Present• GSM Phones – Past & Present• Example of “Extreme” IC Packaging• Key IC Metrics for CDMA Phones and PDAs


CDMA PhonesPast & Present

1997 Qualcomm Q Phone102 mm x 56 mm x 25 mm

147 grams

2001 Samsung SPH-x420089 mm x 50 mm x 24 mm

94 grams


Qualcomm Q PhoneDual-Mode Phone (CDMA 800 MHz & Analog)

• All ICs packages have peripheral leads.

• All 12 of the ICs directly support phone functions in some way

1. Flash Memory2. SRAM Memory3. EEPROM Memory4. Baseband CDMA Processor5. Controller6. Multiplexer7. Dual Frequencey Synthesizer8. Rx AGC Amplifier9. Baseband Analog Processor10. Tx AGC Amplifier11. Power Amplifier12. Linear Amplifier

• 20.1 cm2 of IC packaging

• 608 IC Pins

1

52

4

12

11

10 9

8

7

6

3

Qualcomm Q PhoneDual-Mode Phone (CDMA 800 MHz & Analog)


Samsung SPH-x4200CDMA-2000 Phone

• Almost all ICs are packaged into area array type packages.

• The phone functions performed by 13 ICs:

1. Fujitsu Flash and NEC FCRAM memory2. Atmel EEPROM (WL-CSP)3. Tx Processor4. Tx ASIC5. Voltage Regulator6. PLL / Synthesizer7. LNA / Mixer8. Rx Processor9. Dual Comparator10. Audio Processor11. Audio Synthesizer12. AMD Flash & Samsung SRAM


• 714 IC Pins

1

3

4

8

10

11

5

6

9

13

2

7

12


Multi-Chip BGAs

AMD DS42585Underfilled Stacked Memory Package

(73-Ball Fine-Pitch Grid Array 8 x 11 mm; 0.80 mm pitch)

Contains an AMD/Fujitsu 4 Mbyte Flash die and a Samsung 1 Mbyte SRAM Die

• The AMD/Fujitsu die is on bottom, and measures 10.00 x 4.82 mm

• The Samsung SRAM die measures 8.07 x 5.32 mm• For more info, see

www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/25032.pdf

Fujitsu MB84VD23280FAUnderfilled Stacked Memory Package

(65-ball plastic FBGA; 0.80 mm pitch)

Contains an AMD/Fujitsu 8 Mbyte Flash die and a NEC 1 Mbyte FCRAM Die

• The AMD/Fujitsu die is on bottom; measures 7.72 x 6.86 mm• The NEC FCRAM die measures 8.00 x 4.53 mm• For more info, see

http://edevice.fujitsu.com/fj/DATASHEET/e-ds/e550221.pdf

Stacked packages that combine Flash and SRAM are common place in today’s cellular phones. Some of the components combine ICs from different fabricators as exemplified by these two memory products from AMD and Fujitsu. Notice that the components noted below, as well as the large BGA to their left, are underfilled with a clear material. Approximately 30% of the relatively large fine-pitch BGA components Portelligent sees are underfilled.

Main Board


Wafer Level CSP

Atmel 24C256Wafer Level CSP

• 32 Kbyte EEPROM• Die Size = 3.78 x 2.32 mm• Atmel’s 8-ball 0.75 pitch, Die Ball Grid

Array Package format (dBGA)• For more info, see

http://www.atmel.com/atmel/acrobat/doc0670.pdf

Main Board

Many vendors are starting to offer small, commodity ICs in a simple WL-CSP formats, as exemplified by this EEPROM part from Atmel. Given the small size of these components, underfilling is deemed unnecessary.


Adhesive Flip ChipFlex Circuit Assembly for the Display

Side 1 Side 2

NEC Power Supply IC adhesive flip chip bonded

2-LayerPolyimideSubstrate


Anisotropic Conductive Film Adhesive Flip Chip Bonding

NECDisplay Power Supply

IC #uPD161660Die Size = 4.19 x 4.34 mm

68 IO with gold bumpsIO Pitch = 0.20 mm

ACF Adhesive Film

ACF Flip Chip has been used for several years as an attachment method for Chip-On-Glass (e.g. attaching display drivers to displays. It is now starting to be used in other applications – such as this flex circuit – that would otherwise have used a packaged IC or a Tape-Automated Bonded (TAB) IC.

One of the inherent attributes of ACF flip chip bonding is the ACF underfills the bonded device. The bead of material seen around the bottom edge of the chip is a result of the material being squeezed out during the thermocompressionbonding process.


GSM PhonesPast & Present

1996 Nokia 1610160 mm x 58 mm x 28 mm

250 grams

2001 Nokia 831097 mm x 43 mm x 17 mm

84 grams


Nokia 1610900 MHz GSM Phone

• All ICs packages have peripheral leads.

• All 12 of the ICs directly support phone functions in some way

1. Power Controller2. Transceiver3. Synthesizer / PLL4. RF Front End5. Battery Charge Controller6. Flash Memory7. Controller ?8. SRAM Memory9. Power Amplifier10. Analog Interface11. Baseband Processor12. Interface Controller


• 636 IC Pins

1 2

4

3

5

6 7 8

12 11 10

9


Nokia 8310900/1800 MHz GSM Phone

• All ICs except one are packaged into various area array packages.

• The phone functions of the 8310 performed by 4 ICs:

1. Nokia GSM Transceiver

2. AMD Flash Memory

3. TI Baseband Processor

4. STMicroelectronics Power Mgmt

• All phones have some amount of SRAM memory, but this 8310 had no separate device present, so it is assumed the SRAM is integrated into one of the ASICs


• 568 IC Pins3 4

2

1

AM/FM RadioDual Band PA Module


The Mitsubishi D2101VAn Outlier or an Example of Phones to Come?

Released by NTT DoCoMo in March 2002, the D2101V is a continuation of the FOMA handset line and the first to use i-motion video-clip and music transmission service with a videophone. The 3G phone features a single, fixed digital camera that allows viewing from two directions: one for real time videoconferencing and the other for taking photographs or making videos. The phone also features a large 132x162-pixel color display and has a data transfer rate of 384Kbps (packet transmission) or 64Kbps for videophone calls.


Mitsubishi D2101V“Extreme” IC Packaging Techniques

• Dual Chip BGA Package assembled with Adhesive Flip Chip– The first use of adhesive flip chip bonding of a large processor type

IC that was made even more notable by having two chips bonded on both sides of a substrate. Also notable was that the chips were extraordinarily thin.

• Stacked Processor ICs– Stacked memory chips (e.g. combinations of Flash and SRAM)

have become common place; but this is the first observed instance of two large processor ICs being stacked.

• Multi-Chip Modules– Two custom (hybrid) components in the form of fine-pitched BGAs.


Baseband & Application Processors

Dual Chip BGA

Two chips assembled by adhesive flip chip on both sides of 6 layer, build-up substrate. Chip thicknesses were 0.15 mm on bottom side and 0.20 mm on top. The stacked package wasunderfilled at the package perimeter after surface mount.

B - B’

B - B’ Adhesive Flipchip #1 (face-down)Adhesive Flipchip #2 (face-up)

Epoxy around the component’s perimeter

Main Board

6-layer,Microvia Substrate1.00 mm

Top Die Size10.6 x 11.8 x 0.2 mm

Package Size22.0 x 22.0 x 1.0 mm


Bottom Side ofBaseband / Application Processor

620 IOs on a 0.5 mm pitch.

Bottom Die Size10.6 x 10.6 x 0.15 mm


Video Processor

Dual Chip BGA

A - A’

Main Board

A - A’ 1.24 mm

Top chip is wire-bonded; bottom chip is solder flip chip bonded. The package is not underfilled.

Package20.0 x 20.0 x 1.24 mm

465 Connections0.5 mm Pitch

Wirebonded top die; 12.0 x 12.0Solder FlipChip bonded bottom die; 12.25 x 12.25


Display Assembly

Multi-Chip BGA Components

3-Chip BGA PackageLCD ControllerDisplay Driver

Unknown Function

Wirebonded chips, laid side-by-side onto organic substrate

14 x 13 x 1.5 mm134 connections

0.8 mm pitch

2-Chip BGA PackageDisplay Driver

Voltage Generator

Wirebonded chips, laid side-by-side onto organic substrate

8.3 x 9.6 x 1.35 mm72 connections

0.8 mm pitch


Key IC Component Metrics

• CDMA Phones• PDAs


CDMA Mobile PhonesIC Component Counts

Yellow bars indicate phones made before year 2000.0 5 10 15 20 25 30 35 40

'01 Withus WCE-100'00 Motorola V.8162 '99 Samsung SCH-A100 '99 Sprint Touchpoint '98 Sony Z100 '99 NeoPoint NP1000 '97 Qualcomm Q Phone '99 Qualcomm PDQ 1900 '01 Samsung SPH-X4200

'01 LG TM510'01 Kyocera QCP3035'01 Samsung SPH-T100'01 Sanyo SCP5000 '00 Motorola P8767 '99 Qualcomm 860 '01 Audiovox CDM-9100'97 Qualcomm 2700

'01 NEC N2001'01 Panasonic 2101v

CDMA / Analog; Avg. = 16

W-CDMA; Avg. = 27CDMA-2000

CDMA; Avg. = 18(Median = 16)

Average number of ICs for phones made before 2000 is 21; average for 2000 and later is 14.


CDMA Mobile PhonesIC Pin Counts

0 200 400 600 800 1000 1200 1400 1600 1800 2000

'99 Samsung SCH-A100 '01 Withus WCE-100'99 Sprint Touchpoint '98 Sony Z100 '97 Qualcomm Q Phone '99 NeoPoint NP1000 '00 Motorola V.8162 '99 Qualcomm PDQ 1900 '01 Samsung SPH-X4200'01 NEC N2001'01 Panasonic 2101v'01 LG TM510'01 Samsung SPH-T100'01 Kyocera QCP3035'99 Qualcomm 860 '97 Qualcomm 2700 '01 Audiovox CDM-9100'01 Sanyo SCP5000 '00 Motorola P8767

W-CDMA; Avg. = 1577CDMA-2000

CDMA; Avg. = 623(Median = 589)

CDMA / Analog; Avg. = 634(Median = 578)

Yellow bars indicate phones made before year 2000.

Average IC pin count for phones made before 2000 is 623; average for 2000 and later is 643.


CDMA Mobile PhonesIC Package Areas

(cm²)

0 5 10 15 20 25 30 35 40 45

'01 Withus WCE-100'00 Motorola V.8162 '99 Samsung SCH-A100 '99 Sprint Touchpoint '98 Sony Z100 '99 NeoPoint NP1000 '97 Qualcomm Q Phone '99 Qualcomm PDQ 1900 '01 Samsung SPH-X4200'01 NEC N2001'01 Panasonic 2101v'01 LG TM510'01 Kyocera QCP3035'01 Samsung SPH-T100'01 Sanyo SCP5000 '99 Qualcomm 860 '01 Audiovox CDM-9100'00 Motorola P8767 '97 Qualcomm 2700

CDMA / Analog; Avg. = 10.5

W-CDMA; Avg. = 14.8

CDMA-2000

CDMA; Avg. = 16.8(excluding the PDQ 1900)


Average IC package area for phones made before 2000 was 18.9; average for 2000 and later is 8.6.


CDMA Mobile PhonesIC Die Area to Package Area Ratios

(Total Die Area ÷ Total Package Area)

'99 NeoPoint NP1000 '99 Sprint Touchpoint '99 Qualcomm PDQ 1900 '97 Qualcomm Q Phone '98 Sony Z100 '99 Samsung SCH-A100 '01 Withus WCE-100'00 Motorola V.8162 '01 Samsung SPH-X4200'01 NEC N2001'01 Panasonic 2101v'97 Qualcomm 2700 '01 Audiovox CDM-9100'01 Samsung SPH-T100'00 Motorola P8767 '99 Qualcomm 860 '01 Kyocera QCP3035'01 Sanyo SCP5000 '01 LG TM510

0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70

CDMA / Analog; Avg. = 0.20

W-CDMA; Avg. = 0.56CDMA-2000

CDMA; Avg. = 0.18


Average IC chip area to package area ratio for phones made before 2000 was 0.17; average for 2000 and later is 0.27.


CDMA Mobile PhonesAverage IC Pins per CM2 of Package Area

'99 Qualcomm PDQ 1900

'97 Qualcomm Q Phone '99 NeoPoint NP1000

'99 Sprint Touchpoint '98 Sony Z100

'99 Samsung SCH-A100

'01 Withus WCE-100'00 Motorola V.8162

'01 Samsung SPH-X4200'01 Panasonic 2101v

'01 NEC N2001

'97 Qualcomm 2700 '01 Audiovox CDM-9100

'99 Qualcomm 860 '01 Samsung SPH-T100

'01 LG TM510

'01 Sanyo SCP5000 '01 Kyocera QCP3035'00 Motorola P8767

0 20 40 60 80 100 120 140

CDMA / Analog; Avg. = 60

W-CDMA; Avg. = 120

CDMA-2000

CDMA; Avg. = 37


Average IC pins per cm2 of package area for phones made before 2000 was 37; average for 2000 and later is 76.


PDAsIC Component Counts

Yellow bars indicate PDAs made before 2000.Hatch filled bars indicate PDAs that are also mobile phones.

Other OS and >$100Avg. = 23

EPOCH OS

Palm OSAvg. = 19

WinCEAvg. = 28

<$100 PDAAvg. = 5

0 5 10 15 20 25 30 35 40 45

'99 Psion Revo

'00 Vtech Phusion

'00 Panasonic Pocket-E

'98 Nokia Communicator 9110


'99 Epson Locatio

'99 Palm V

'00 Handspring Visor

'01 Palm i705

'00 Sony Clie

'02 Sony Clie PEG-NR70V

'99 Palm VII

'02 Handspring Treo 180

'00 HP Jornada 548

'99 Vadem Clio

'01 Compaq iPAQ Pocket PC

'01 Allstar Protégé

'01 Royal daVinci DV1

Avg. = 19

Average number of ICs for PDAs made before 2000 is 22; average for 2000 and later is 19.


PDAsIC Pin Counts


EPOCH OS

Palm OSAvg. = 636

WinCEAvg. = 1119

<$100 PDAAvg. = 307

0 200 400 600 800 1000 1200 1400 1600 1800

'99 Psion Revo

'00 Vtech Phusion




'99 Epson Locatio

'99 Palm V


'99 Palm VII

'01 Palm i705

'00 Sony Clie



'00 HP Jornada 548

'99 Vadem Clio


'01 Allstar Protégé



Average IC pin count for PDAs made before 2000 is 893; average for 2000 and later is 758.


PDAsIC Package Areas

(cm²)'01 Royal daVinci DV1

Other OS and >$100Avg. = 25.19

EPOCH OS

Palm OSAvg. = 13.46

WinCEAvg. = 32.15

<$100 PDA

0 5 10 15 20 25 30 35 40 45

'99 Psion Revo



'00 Vtech Phusion


'99 Epson Locatio

'99 Palm V



'01 Palm i705


'99 Palm VII

'00 Sony Clie

'00 HP Jornada 548


'99 Vadem Clio


Average IC package area for phones made before 2000 was 24.0 cm²; average for 2000 and later is 17.2 cm².


PDAsIC Die Area to Package Area Ratios

(Total Die Area ÷ Total Package Area)

Other OS and >$100Avg. = .23

EPOCH OS

Palm OSAvg. = 0.19

WinCEAvg. = 0.21

<$100 PDA

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50

'99 Psion Revo

'00 Vtech Phusion


'99 Epson Locatio



'99 Palm VII


'01 Palm i705

'00 Sony Clie

'99 Palm V




'99 Vadem Clio

'00 HP Jornada 548


Avg. = 0.14


Average IC chip area to package area ratio for PDAs made before 2000 was 0.21; average for 2000 and later is 0.26.


PDAsAverage IC Pins per CM2 of Package Area

(Total Pins ÷ Total Package Area)


EPOCH OS

Palm OSAvg. = 51

WinCEAvg. = 35

<$100 PDA

0 20 40 60 80 100 120

'99 Psion Revo


'00 Vtech Phusion

'99 Epson Locatio



'99 Palm VII


'00 Sony Clie

'99 Palm V

'01 Palm i705



'99 Vadem Clio


'00 HP Jornada 548


Avg. = 39


Average IC pins per cm2 of package area for PDAs made before 2000 was 39; average for 2000 and later is 50.

Technology

Die Product Applications