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V L S IWELCOME
Lavesh KumathHead, R & D (VLSI Division )Scientech Technologies Pvt. Ltd., [email protected]
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THE ART OF VLSIBasics of VLSI
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Semi conductor
Diodes
Transistors
FET
JFET
N Chan P Chan
BJT – TTL,RTL, ECL
MOSFET
N MOS P MOS CMOS
Gates
ICs
endless Journey……
Power
Area Speed
Density
Functionality FeaturesSSI MSI LSI VLSI
Gates
ICs
SSI MSI LSI
DTL
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TTL Logic
Design Specification
Truth Table
Boolean Expression
AvailableInventory
Cost and performancerequirement
Logic minimizationand multilevel
logic optimization
Implementation
General Design Flow….
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Digital Design Process
A B C D X
0 0 0 0 0
0 0 0 1 0
0 0 1 0 0
0 0 1 1 1
0 1 0 0 0
0 1 0 1 1
0 1 1 0 1
0 1 1 1 1
1 0 0 0 0
1 0 0 1 1
1 0 1 0 1
1 0 1 1 1
1 1 0 0 1
1 1 0 1 1
1 1 1 0 1
1 1 1 1 1
Logic 2 or >2 I/P = 1 then O/P 1
1. Design Specifications 2. Truth Table
0 0 1 0
0 1 1 1
1 1 1 1
0 1 1 1
/CD 00 01 11 10AB
00
01
11
10
Boolean Eq. -> X = AB + CD + BD + BC + AD + AC OR X’ = A’B’C’ + A’B’D’ + A’C’D’ + B’C’D’
3. Reduce Expression
A B C D
O/P = X
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Digital Design Process1. Design Specifications
2. Truth Table
3. Reduction using Boolean or K Map
Boolean Eq. -> X = AB + CD + BD + BC + AD + AC --> 2 - 7408, 3 - 7432, 3 level of logic 1 - 7474 for synchronization
4. Minimize of Device or No. of Level i.e. Cost Vs Performance (Min Prop. Delay)
5. Examine Available Inventory
6. Eqn Re-written in NAND-NAND implementation
Few Device and Few logic i.e. Less Cost and Better Performance
Boolean Eq. -> X = {(AB)’. (CD)’ . (BD)’ .(BC)’. (AD)’ .(AC)’ }’ --> 2 - 7400, 1 - 7430, 2 level of logic 1 - 7474 for synchronization 1
2
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Basics of VLSI ………..
• VLSI Introduction
• History of VLSI.
• Why VLSI …. ?
• VLSI Design Styles
• VLSI Design Flows
• VLSI Design Approaches
• Xilinx Vs Altera
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VERY LARGE SCALE INTEGRATION
“ Is the art of integrating millions of transistors on a Silicon Chip ”
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“ A device called a transistor, which has several applicationsIn radio where a vacuum tube ordinarily is employed, was
demonstrated for the first time at Bell Telephone Laboratories, 463 West Street, where it was invented.”
23 December 1947
The First Transistor
First point contact transistor (germanium), 1947John Bardeen and Walter Brattain
Bell Laboratories
History of IC Design
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- Evolution of ICs -
Vacuum tubes
Transistors
Gates
ICs
?High Performance
High Reliability
High complexity or small Area
High applicability
Low Power Dissipation
Low power consumption
Low Cost
Fast Design time
Simple Design Process
Integrated Circuits
IC is a collection of Electronic Circuits made by simultaneously forming individual Transistors, Diodes and Resistors on a small chip of Semiconductor material, typically
silicon that are interconnected to one another with a metal, such as aluminum, deposited on the chip surface.
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The Progressive Trend of IC Technology
Integration Level Number of TransistorsYear
SSI - Individual Gates
MSI - Counter, Shift Reg.
LSI - Small Logic Function
VLSI - Large Logic Function
1950s
1960s
1970s
1980s
1990s
2000s
Less than 10^2
10^2 – 10^3
10^3 – 10^5
10^5 – 10^7
10^7 – 10^9
Over 10^9
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Evolution in IC Complexity
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Moore’s Law
http://www.intel.com/technology/silicon/mooreslaw/
In 1965, Intel co-founder Gordon Moore
saw the future. His prediction, now popularly
known as Moore's Law, states that
“The number of transistors on a chip doubles about every two years”
Transistor Count – Number of Transistor doubles every 2-3 Yrs
Clock Frequency – Clock Frequency doubles every 2.168 Yrs
Other Trends-
Features Size – Gate Length is divided by 2 every 5.43 Yrs
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VLSI Technology - CMOS Transistors
Key feature:transistor length L
p+ p+
n substrate
channel
Source Drain
p transistor
G
S
D
SB
Polysilicon GateSiO2Insulator L
W
G
substrate connectedto VDD
Polysilicon GateSiO2Insulator
n+ n+
p substrate
channel
Source Drain
n transistor
G
S
D
SB
LW
G
S
D
substrate connectedto GND
2002: L=130nm2003: L=90nm2006: L=65nm
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2002 and beyond ?
Semiconductor Industry Association (SIA) Road Map, 1998 Update1999 2002 2014
Technology (nm) 180 130 35Wafer diameter (mm) 300 300 450Memory-samples (bits) 1G 4G 1TTransistors/cm2 (P) 6.2M 18M 390MWiring levels (maximum) 6-7 7 10Clock, local (MHz) 1250 2100 10000Chip size: DRAM (mm2) 400 560 2240Chip size: P (mm2) 340 430 901Power supply (V) 1.5-1.8 1.2-1.5 0.37-0.42Maximum Power (W) 90 130 183Number of pins (P) 700 957 3350
IEEE Spectrum, July 1999
Special report: “The 100-million transistor IC”
These scaling trends will allow the electronics market to growth at 15% / year
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Power & Clock Frequencies
Power Consumption, Clock frequency, Supply Voltage are related as follows :-
Capacitance Supply Voltage Clock Frequency
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Why VLSI Design ?
• Large Scale Integration -
Size ….. <<<
Speed …. >>>
Power …. <<<
• Integration reduce manufacturing costs (almost) no manual assembly
• Money Vs Performance
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VLSI Design Styles
Integrated Circuits
Full-CustomASICs
Semi-CustomASICs
UserProgrammable
PLD FPGA
SPLDPLAPAL LUT(Look-Up Table)
MUXGates
System-OnCHIP
CPLD
1 2 3 4
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VLSI Design Styles
1. Programmable Logic (PLD, FPGA)
2. Application-Specific Integrated Circuit (ASIC)
3. Full Custom
4. System-on-Chip
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VLSI Design Styles
Integrated Circuits
Full-CustomASICs
Semi-CustomASICs
UserProgrammable
FPGA
LUT(Look-Up Table)
MUXGates
System-OnCHIP
PLD
SPLDPLAPAL CPLD
1 2 34
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1. Programmable Logic (PLDs, FPGAs)
• Pre-manufactured components with programmable interconnect
• CAD tools greatly reduce design effort
• Low Design Cost
• Low NRE Cost
• High Unit Cost
• Lower Performance as compared to ASIC better than General digital design
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Logic Circuits
Standard Logic Circuits Programmable Logic Circuits• Realize single function or set of
functions • No possibility of changing.• More Debugging Time• More Interconnections and I/Os• High Standby and Switching current• No Design Security• Not Flexible• No Tools for Automation• More NRE & Time to Market Single Change require – redesign
• Possibility of realizing various functions
• Re-configurable• Less Debugging Time• Fewer total I/Os & Switching O/P- • Lower Standby & Switching Currents• Design Security • Flexibility …….. Greatest Advantage• Automation is Possible• Less NRE & Less Time to market only reprogramming is required
…… FPLD
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• PLA - Programmable Logic Arrays• PAL - Programmable Array Logic• CPLD - Complex Programmable Logic Devices• FPGA - Field Programmable Gate Arrays
PLD
FPLD Representatives
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What is a CPLD ?
Complex Programmable Logic Devices (CPLD) are another way to extend the density of the simple PLD.
CPLD uses less board space, improve reliability, and reduce cost.
CPLD contains multiple logic block, which communicate with one another using Signals routed via a programmable interconnect.
Easily Routed.
CPLDs are great at handling wide and complex gating at blistering speeds e.g. 5ns which is equivalent to 200MHz.
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CPLD Architecture
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CPLD Architecture
Complex Programmable Logic Devices
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Why use a CPLD ?
Ease of Design
Lower Development Costs
More Product Revenue
Reduced Board Area
Reconfigurable
Flexible
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Evolution of PLD: FPGA
• Difficult extending CPLDs architectures to higher densities - a different approach is needed
• FPGAs comprise an array of uncommited circuit elements, called logic blocks, and interconnect resources
• FPGA configuration is performed through programming by the end user.Xilinx FPGA
Configuration
contains a set of basic functions
(gates, FFs, memory cells)
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General FPGA Architecture• Field Programmable Gate Array
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FPGAs -- Pros
• Reasonably Cheap at low volume– Good for low-volume parts, more expensive than IC for high-volume parts– Can migrate from SRAM based to fuse based when volume ramps up
• Short Design Cycle (~1sec programming time)• Reprogrammable
– Can download bug fix into units you’ve already shipped• Large capacity (100 million gates or so .….• More flexible than PLDs -- can have internal state• More compact than MSI/SSI
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FPGA’s -- Cons
• Lower capacity, speed and higher power consumption than building an ASIC– Sub-optimal mapping of logic into CLB’s – often 60% utilization
– Much lower clock frequency
– Less dense layout and placement and slower operation due to programmability
• Overhead of configurable interconnect and logic blocks
• PLDs may be faster than FPGA for designs they can handle
• Need sophisticated tools to map design to FPGA
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Key Factors For Comparing FPGAs
• Logic density
• Clock management
• On-chip memory
• DSP capabilities
• I/O compatibility
• Software support & other design services
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Programmable Logic (PLDs, FPGAs)• Pre-manufactured components with programmable interconnect• CAD tools greatly reduce design effort• Low Design Cost / Low NRE Cost / High Unit Cost• Lower Performance
Medium Type Design, Combinational CLB – LUT, MUX, FF, I/Os, PI, DLL, Sequential
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ADVANTAGES OF PROGRAMMABLE LOGICS
• Save Valuable Board Space• Power Requirement is low• Increases Performance• Design Security• Lower Standby and Switching Current • Integration increases Design Reliability• I/Os Delay Reduces• Flexibility • No NRC Cost• Low Time to market• Process Automation• High Density ……… or Complex Design
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How to Cope with Complexity ?Electronic Design Automation (EDA)• Computer Aided Design (CAD) …. Front - end• Computer Aided Engineering (CAE) …. Back - end
Simulation – H-Spice (Synopsis), Spector (Cadance), Spector RF, H-Sim (Synopsis for Digital), DA (Design Architect Mentor), Co-Sim (Synopsis for Mixed), FineSim SPICE, Fine Wave (Megma)
Synthesis & Implementation - DC (Synopsis), ISE (Xilinx), Quartus (Altera), Blast – Integrated RTL-to-GDSII Flow (Megma)
Timing Analysis & Verification – Prime Time, Formality – (Synopsis), DRC & LVS (Magma), Modelsim – Mentor,
Physical Design – Astro, Layout – Vertuoso (Cadance), Magic, L-Edit
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Design Entry
Synthesis
Implementation
Bit Stream
Configurable Logic
Configurable Switch Matrix
Configuration Memory
Software PLD Chip
VolatileNon-volatile
TransistorSwitch Muxes
LUT’s or GatesFlip-flop
User Constraint file
Gate Level circuit
Device Type, Constraints Floor Planning
Device type ,
Constraint
VHDL or Verilog code
Device independent
Download cable
General Tool Flow for PLDs
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VLSI Design Styles
Integrated Circuits
Full-CustomASICs
Semi-CustomASICs
UserProgrammable
PLDFPGA
SPLDPLAPALLUT(Look-Up Table)
MUXGates
System-OnCHIP
CPLD
1 2 34
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2. Application-Specific Integrated Circuit (ASIC)
• Constrained design using pre-designed (and sometimes pre-manufactured) components
• Also called semi-custom design
• CAD tools greatly reduce design effort
• Low Design Cost / High NRE Cost / Med. Unit Cost
• Medium Performance
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• Designs must be sent for expensive and time consuming fabrication in semiconductor foundry
• Bought off the shelf and reconfigured by designers themselves
Two competing implementation approaches
ASICApplication SpecificIntegrated Circuit
FPGAField Programmable
Gate Array
• Designed all the way from behavioral description to physical layout
• No physical layout design; design ends with a bitstream used to configure a device
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Balance ………. FPGAs
Off-the-shelf
Low development cost
Short time to market
Re-configurability
High performance
ASICs
Low power
Low cost inhigh volumes
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ASICASIC == AApplicationpplication SSpecificpecific IIntegratedntegrated CCircuitsircuits tailor-made on demand for specific applicationstailor-made on demand for specific applications
FPGAFPGA == FFieldield PProgrammablerogrammable GGateate AArrayrray flexibility of software + speed of hardware flexibility of software + speed of hardware designdesign
Which way to Go
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3. Full Custom Design
• Each circuit element carefully “handcrafted”• NO use of any Library.• Huge design effort.• High Design & NRE Costs• High Performance• Typically used for high-volume applications• Design Productivity is Very Low
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4. System-on-a-chip (SOC)
• Idea: combine several large blocks– Predesigned custom cores
(e.g., microcontroller) - “intellectual property” (IP)
– ASIC logic for special-purpose hardware
– Programmable Logic (PLD, FPGA)
– Analog
• Open issues– Keeping design cost low– Verifying correctness of
design
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VLSI Design Flow & Tools
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Front-end & Back-end
Front-end Back-end
• Logic design (RTL)
• Simulation
• Synthesis
• Implementation
• Floorplanning
• Placement
• Routing
• GDSII (final Output, Foundary)
Verification
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• Microelectronic system
• ASICs
• System partitioning
• ASIC floorplanning
• Placement
• Routing
• A City
• Buildings
• City planner
• Architect
• Builder
• Electrician
Physical design vs. Building a City
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Programmable Logic Vendors
Xilinx - Xilinx Foundation Series.
Altera - Max Plus – II
Lattice - ISP Expert Compiler
Actel - Actel’s Designer Series FPGA Development System
Lucent - ORCA Foundry Development System
Cypress - Warp2
Atmel - FPGA Integrated Development System ( IDS )
QuickLogic - QuickWorks
Gatefield - ASIC master
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XILINX Vs ALTRA Design Flow, Tools and Files
• Key players: Xilinx, Altera, Lattice, Actel• PLD market estimated at $57 billion and rapidly growing• The goal is to expand the market:
– by lowering per-unit cost to attack the low-end market– by increasing speed capabilities to attack the high-end market
PLD market sharePLD market share
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• Virtex and Stratix families are direct opponents, as are Spartan and CycloneVirtex and Stratix families are direct opponents, as are Spartan and Cyclone
XILINX Vs ALETRA
Altera Xilinx
Cyclone Spartan
Stratix Virtex
Stratix Kintex
Max10 Artix
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FPGA Design Flow – Xilinx - ISEDesign Entry
Design Synthesis
Design Implementation
Download to Device
Functional Simulation
Static Timing Analysis
Timing Simulation
In Circuit Verification
Design Verification
*Translate
*Mapping
*P & R
*Fitting
*Bit stream Generation
•Schematic editor•HDL (.v or .vhd)
Text – (EDIF, XNF) XST + GUI = NGC
UCF
Net list + Constraints = NGD
NCD – Native Circuit Description
VM6 -------- CPLD
.BIT or .JED
Library
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Xilinx Devices at a Glance
FPGAs
CPLDs
Vertex
Spartan
Cool Runner
XC9500
XC9500, 5V, 36 to 288 MacrocellsLow Cost
XC9500XL, 3.3V, 36 to 288 Macrocells
XC9500XV, 2.5V, 36 to 288 Macrocells
XCR3000XL, 3.3V, 36 to 512 Macrocells
XC2Cxxx, 1.8V, 32 to 512 MacrocellsLow Power, High Speed, Low Cost
Spartan, 5V, 5000 to 40000 Max System Gates
Spartan II E, 1.8V, 50000 to 300000 Max System Gates
Vertex, 2.5V, 50000 to 1 Mil. Max System Gates
VertexII, 1.5V, 40000 to 10 Mil. Max System Gates
VertexE, 1.8V, 50000 to 3.2 Mil. Max System Gates
Spartan II , 2.5V, 15000 to 200000 Max System Gates
Spartan XL, 3.3V, 5000 to 40000 Max System GatesLow Cost
Feature Rich, High Density
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Altera Devices at a Glance
• Programmable Logic Families
– High & Medium Density FPGAs• Stratix™ II, Stratix, APEX™ II,
APEX 20K, & FLEX® 10K– Low-Cost FPGAs
• Cyclone™ & ACEX® 1K
– FPGAs with Clock Data Recovery• Stratix GX & Mercury™
– CPLDs• MAX® 7000 & MAX 3000
– Embedded Processor Solutions• Nios™, ExcaliburT™
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TTL Logic
Design Specification
Truth Table
Boolean Expression
AvailableInventory
Cost and performancerequirement
Logic minimizationand multilevel
logic optimization
Implementation
Design Specification
Design Description
Design Software
Fuse Map
Programmable Logic
Compare Design Process ….
Device
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The Goal of IC Designer
Meet the market requirement
Satisfying the customers needs
- Beating the competition
- Increasing the functionality
- Reducing the cost
Achieved by
- using the next generation Silicon Technologies
- new design concepts & tools
- high level integration
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