Architecting for Hyper-Scale Datacenter Efficiency

Architecting for Hyper-scale Datacenter Efficiency

Diane Bryant Senior Vice President & General Manager

Datacenter & Connected Systems Group

Today’s News

Intel® Atom™ Processor C2000 now in production 1st “Silvermont” based SoC

>50 new systems designs enabled Microserver, Cold Storage and Entry Networking

New Rack Scale Architecture technologies unveiled Next generation interconnect technologies using Intel® silicon photonics

Cloud Service Provider Environment

Drives Need for Dynamic, Efficient, Workload Optimized Infrastructure

159 new services & features in 20122

>175% YoY user growth3

1. http://blog.instagram.com/post/8758396471/testing-testing; http://www.digitalbuzzblog.com/infographic-instagram-stats/

2. Amazon year end results press release Jan 2013

3. http://www.tencent.com/en-us/content/at/2013/attachments/20130814.pdf August 2013

100M >1B photos

uploaded in <1 year1

*Other brands and names are the property of their respective owners

Manage Workload Diversity

Ramp New Services

Support Dramatic Growth

Software Defined Infrastructure Application-driven allocation of resources for greater efficiency

Datacenter Orchestration

Workload Optimized Solutions

System Attributes

Power Performance Thermals Security Utilization

NETWORK STORAGE SERVER

Cloud Services

I/O Intensive

Co

mp

ute

In

ten

siv

e

Cold Storage

Workload Optimized Solutions

E- Commerce

Dedicated Hosting

Enterprise Resource Planning

Dynamic Modeling and Simulation

Big Data Content Delivery and Gaming

Graphics Rendering

Entry Networking

Edge Routing

Storage De-dupe

Cloud RAN

Static Web Memory

Caching Dedicated

Hosting Cold Storage Entry

Networking

Static Web Memory

Caching

Collaboration Tools

Workload Optimized Solutions Lightweight workloads require right-sized processing & low power

Architecting for Hyper-scale Efficiency Software Defined, Workload Optimized Infrastructure

PROCESSOR SYSTEM RACK

End to End Innovation

Low Power Product Direction

2011

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

2012 2013 2014+

Xeon E3

Sandy Bridge 32nm

As low as 20W

“Broadwell” 14nm

Xeon E3

Ivy Bridge 22nm

As low as 17W

Xeon E3

Haswell 22nm

As low as 13W

Atom S1200 32nm

As low as 6W “Denverton”

14nm

“Broadwell”

SoC

14nm

Atom C2000 22nm

As low as 6W

ANNOUNCING

TODAY

Higher Performance • Up to 7x faster1

Energy Efficient • Up to 6x higher2 performance per watt

IA Software Compatibility

• Leverages existing SW ecosystem

Datacenter Class

• 64 bit, ECC memory, Intel® Virtualization Tech

Workload Optimized • 13 customized configurations • Intel Quick Assist Technology

Intel® Atom™ Processor C2000 Product Family 2nd Generation Workload Optimized SoCs

IN PRODUCTION NOW!

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,

components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated

purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. 1 Performance based on Dynamic Web Benchmark Performance: Atom S1260(8GB,SSD,1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351. 2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260(8GB,SSD,1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE), Score=8778, est node power=19W,

PPW=462. Source: Intel Internal measurements as of August 2013. Refer to backup for additional details. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any

difference in system hardware or software design or configuration may affect actual performance.

ANNOUNCING

TODAY

http://www.intel.com/performance

Extending Low Power IA Into New Segments

WIRELESS

LINE CARDS

ROUTERS SWITCHES

MICROSERVERS COLD

STORAGE

NETWORK SECURITY

APPLIANCES

8C, Intel QuickAssist

Technology 8C, 64GB,

4x2.5GbE

2C, 7W,

10yr reliability

4C, <15W,

6 SATA

2C, Fanless, 7-yr

supply

4C, Intel QuickAssist

Technology 8C, Intel VT

And more configurations available…

Mats Karlsson Vice President and Head of Architecture and

Process, Group Function Technology

*Other brands and names are the property of their respective owners.

Slide title

44 pt

Text and bullet level 1

minimum 24 pt

Bullets level 2-5

minimum 20 pt

Characters for Embedded font: !"#$%&'()*+,-./0123456789:;<=>?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_`abcdefghijklmnopqrstuvwxyz{|}~¡¢£¤¥¦§¨

©ª«¬®¯°±²³´¶·¸¹º»¼½ÀÁÂÃÄÅÆÇÈËÌÍÎÏÐÑÒÓÔÕÖ×ØÙÚÛÜÝÞßàáâãäåæçèéêëìíîïðñòóôõö÷øùúûüýþÿĀāĂăąĆćĊċČĎďĐđĒĖėĘęĚěĞğĠġĢģĪīĮįİıĶķĹĺĻļĽľŁłŃńŅņŇňŌŐőŒœŔŕŖŗŘřŚśŞşŠšŢţŤťŪūŮůŰűŲųŴŵŶŷŸŹźŻżŽžƒȘșˆˇ˘˙˚˛˜˝ẀẁẃẄẅỲỳ–—‘’‚“”„†‡•…‰‹›⁄€™ĀĀĂĂĄĄĆĆĊĊČČĎĎĐĐĒĒĖĖĘĘĚĚĞĞĠĠĢĢĪĪĮĮİĶĶĹĹĻĻĽĽŃŃŅŅŇŇŌŌŐŐŔŔŖŖŘŘŚŚŞŞŢŢŤŤŪŪŮŮŰŰŲŲŴŴŶŶŹŹŻŻȘș−≤≥fifl

ΆΈΉΊΌΎΏΐΑΒΓΕΖΗΘΙΚΛΜΝΞΟΠΡΣΤΥΦΧΨΪΫΆΈΉΊΰαβγδεζηθικλνξορςΣΤΥΦΧΨΩΪΫΌΎΏ

ЁЂЃЄЅІЇЈЉЊЋЌЎЏАБВГДЕЖЗИЙКЛМНОПРСТУФХЦЧШЩЪЫЬЭЮЯ

АБВГДЕЖЗИЙКЛМНОПРСТУФХЦЧШЩЪЫЬЭЮЯЁЂЃЄЅІЇЈЉЊЋЌЎЏѢѢѲѲѴѴҐҐәǽẀẁẂẃẄẅỲỳ№

Do not add objects or text in the

footer area

© Ericsson AB 2013 | 2013-09-04 | Page 12

Slide title

44 pt


minimum 24 pt

Bullets level 2-5

minimum 20 pt







footer area

© Ericsson AB 2013 | 2013-09-04 | Page 13

Ericsson cloud system The Network Enabled Cloud

Operator network

Network & DC Infrastructure

Ericsson Cloud Execution Environment

Ericsson

Cloud Manager

Ericsson Cloud System

Application Application Application

Application Application Application

Innovation & TTM

Performance

Efficiency

Slide title

44 pt


minimum 24 pt

Bullets level 2-5

minimum 20 pt







footer area

© Ericsson AB 2013 | 2013-09-04 | Page 14

Ericsson and INTEL

Announcing the Intel Atom C2000 in Ericsson’s cloud infrastructure

Common SW framework Energy efficiency

Intel VT, Intel DPDK Scalable product portfolio



High Density System Innovation ANNOUNCING

TODAY

Intel® Ethernet Switch FM5224

Compressed Memory Connector

Shared Management Architecture

Up to

30%1

Server Density

Memory

Density

Up to

2x3

Power

& Components Up to

75%2

Reduction

*Other brands and names are the property of their respective owners

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,

components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated

purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance.

1. Based on 2.5G port count compared to the BCM56540

2. Based on 8 node configuration where 8 BMCs are replaced by a two component MMC solution

3. Based on Intel SSI based Tiger Cove CRB using Compressed Footprint Connector (CFC) compared to a standard DIMM connector

Eco

syste

m E

nablin

g

MMC

SoC

SoC

SoC

SoC

SoC

SoC

SoC

SoC

50+ Atom C2000 System Designs

Microserver

Cold Storage

Entry Network


Germain Masse Chief Operating Officer


© 2013 ovh.com. All rights reserved

2013

10 servers

150 000 servers

1999

10 000 servers

70 000 servers

Breathtaking Growth Racks of servers < 1h delivery

OVH.com


150 000 physical servers

12 datacenters

*Netcraft source, nov. 2012

3rd worldwide hosting provider*


Innovation for Technology and Cost Leadership

Watercooling Unique No Rack design

SSD based High performance storage

Own high speed WW fibre n/w 2 Tbps capacity

OVH.com deploying Intel Atom C2000


Storage Servers (Deep archiving)

Entry-level Dedicated Servers Memcache Servers

Higher Performance

Larger Memory Capacity

Low Power Consumption

Vs. Intel® Atom™ Processor S1200 Vs, Intel® Atom™ Processor S1200 Vs. Intel® Atom™ Processor S1200

Intel® Atom™ Processor C2000 Collaborating with Leading Cloud Providers & Hosters

“The right size performance, power efficiencies and data center class features makes

the Intel Atom Processor C2000 the right choice for our entry level dedicated hosting service that will launch this

year.”

Robert Hoffmann, CEO Hosting, United Internet

Multiple joint R&D projects:

Specialized rack architecture

Multi-tier data storage

Broad use of Xeon in storage today and evaluating Atom C2000 for entry storage




Intel® Silicon Photonics

Silicon: Intel® Atom™ & Xeon

Open Network Platform

CPU / Mem Modules

Intel Rack Scale Architecture Innovation

Orchestration

ANNOUNCING

TODAY


New MXC connector Up to1.6 Terabits per second bandwidth1

New “ClearCurve” fiber Enables >3x cable length (300m) at 25Gbps2

Higher Bandwidth, Modularity & Density

2ClearCurve fiber operating at 300 meters was tested using 300 meters of new ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that

included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector.

1Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32 error detector. MXC connector used had

32 fibers for an actual data rate of .8 tera-bits. Mechanical models and CAD simulations show that the MXC can accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits per second.

Live Rack Scale DEMO

Intel Rack Scale Architecture Growing Range of Implementations

January

Open Compute

Project

April

Project

Scorpio

Today

Next Gen Cloud

Scale Architecture


Chris Phillips General Manager, Windows Server &

System Center Program Management


Innovation Cycle at Global Scale drives ‘Cloud OS’

‘Cloud OS’ - Blurring lines within, across racks

Software Compatibility

Global Ecosystem

Technology Portfolio

Architecture Consistency

Workload Optimized

Silicon

Most Energy Efficient

Transistors

Intel’s Unmatched Assets

Today’s News

Intel® Atom™ Processor C2000 now in production 1st “Silvermont” based SoC

>50 new systems designs enabled Microserver, Cold Storage and Entry Networking

New Rack Scale Architecture technologies unveiled Next generation interconnect technologies using Intel® silicon photonics

Q&A

Continue the Atom-C Conversation with live audiocast interviews from our launch event featuring: Advantech, Dell, HP, Intel, Portwell, and Wiwynn

http://intel.ly/inteldc7


Legal Disclaimers

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.

SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information.

Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.

Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo

Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/ or contact your Intel representative for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_number

Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice.

Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.

Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon, Atom and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

All dates and products specified are for planning purposes only and are subject to change without notice

*Other names and brands may be claimed as the property of others.

* Other names and brands may be claimed as the property of others.

http://www.spec.org/

http://www.intel.com/info/hyperthreading

http://www.intel.com/go/turbo

http://ark.intel.com/

http://www.intel.com/products/processor_number

Legal Disclaimers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

* Other names and brands may be claimed as the property of others.

Performance Configuration Details

Dynamic Web Perfomance:

Atom S1260: DBC SDP w/Intel® Atom™ S1260 (2.0GHz, 2C), Hyper-Threading Enabled, 1x8GB DDR3-1333 MHz UDIMM ECC, BIOS version D134.4, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x 150GB SSD, Addl Drive 2x 150GB SSD, 2xGbE, Score: 1522

Atom C2xxx: MPK SDP w/Intel® Atom™ C2xxx (8C), Turbo Disabled, 4x8GB DDR3-1600 MHz UDIMM ECC, BIOS version 18D05, Fedora* 17, Linux Kernel 3.3.4-5fc.x86_64, Apache 2.2.22, PHP 5.4.7, Boot Drive 1x150GB SSD, Addl Drive 1x 800GB SSD, 1x10GbE, Score: 11109

Perfomance Per Watt:

Atom S1260: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013 Supermicro* 5017A-EF with one Intel® S1260 processor (2-core 2.0GHz), EIST Enabled, Hyper-Threading Enabled, 8GB memory (1x 8GB DDR3-1333 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4 . Estimated score:int_rate_base2006=18.7. Est. Power=20W

Atom C2xxx: FOR.INTEL.cpu2006.1.2.ic13.1.linux64.01june2013 Intel® Mohon Peak Alpha platform with one Intel® Avoton processor (8-core), Turbo Boost Disabled, 16GB memory (2x 8GB DDR3-1600 UDIMM ECC), 250GB SATA 7200RPM HDD, Red Hat Enterprise Linux 6.4. Estimated score:int_rate_base2006=69, Est. Power=19W