Ag associates heatpulse 8108 rapid thermal annealing system

Original Equipment Manufacturer:AG Associates

Equipment Model: Heatpulse 8108

Product Category: Rapid Thermal Annealing System

Condition: Fully Refurbished with warranty by Seller in U.S.A

SPECIFICATIONS

OPERATING SPECIFICATIONS

The following are the operating specifications for the Heatpulse® 8108 system.

• Wafer handling: automatic serial processing, using standard cassettes.

• Throughput: Process dependent, approximately 80 wafers per hour (in anull cycle) without flat-finder.

• Wafer sizes: 5 inches, 6 inches, and 8 inches (standard).

• Ramp-up rate: Programmable, 1 - 180°C per second.

• Steady-state duration: 1 - 600 seconds per step.

• Ramp-down rate: Programmable, 1 - 180˚C per second. Ramp-down rateis temperature and radiation dependent, maximum 150˚C per second.

• Recommended steady-state temperature range: 400 - 1200˚C.

• ERP temperature accuracy: +3°C to -7°C, when calibrated against aninstrumented thermocouple wafer (ITC).

• Temperature repeatability: + 3°C or better at 1150°C wafer to wafer.(Repetition specifications are based on a 100-wafer set.)

• Temperature uniformity: + 5°C across an 8-inch wafer at 1150°C. (Thisis a 1-sigma deviation from 100-angstrom oxide uniformity.) For a titaniumsilicidation process, no more than 1.5 percent increase to uniformity duringthe first anneal at 650 - 700°C.

Heatpulse® 8108 System [email protected] for more information

http://www.semistarcorp.com/product-category/inventory/rapid-thermal-processing/rapid-thermal-annealing-equipment/

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PHYSICAL DIMENSIONS

• Width Monitor-Fab-Wall configurations: 40 in. (102 cm)Monitor-Side-Panel configurations: 60 in. (152 cm)

• Depth 42 in. (107 cm)

• Height 82 in. (208 cm)

• Weight Monitor-Fab-Wall configurations: 1800 lbs (816 kg);Monitor-Side-Panel configurations: 1840 lbs (835 kg)

• Shipping weight Monitor-Fab-Wall configurations: 2000 lbs (907 kg);Monitor-Side-Panel configurations: 2040 lbs (925 kg)

UTILITY REQUIREMENTS

Utility requirements include:

• Power Standard Domestic: 208 VAC, 60 Hz; 125 A maximum;3-phase plus ground and neutral

European: 400 VAC, 50 Hz; 90 A maximum;3-phase plus ground and neutral

Japanese: 200 VAC, 50/60 Hz, 125 Amaximum; 3-phase plus ground

• Water Type Refer to the Heatpulse® 8108 Facilities Manual.(Recirculator)

Heatpulse® 8108 System

AG Associates Heatpulse 8108 Rapid Thermal Annealing System

[email protected] for more information

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FACILITY CONNECTIONS

The following table is a summary of the facility connections for the Heatpulse8108 system:

Table A-1. Facility Connections

UTILITY SERVICE SIZE CONN. TYPE

Tube Cooling CDA or Utility N2 1/2 inch Swagelok Valve Actuation CDA or Utility N2 1/4 inch Swagelok

Cooling Water Supply 1/2 inch Swagelok Cooling Water Return 1/2 inch Swagelok

Gas Box Exhaust 4-inch OD Duct

Cooling Exhaust 2-inch OD Duct Scavenger Hood Exhaust 2-inch OD Duct Containment Exhaust (Optional) 2-inch OD Duct

OR

Exhaust Manifold Outlet 3-inch OD Duct

Process Gas Exhaust (Scrubber) 3/8 inch VCR, Male

Process Gas Supply 1/4 inch VCR, Female

Recirculator Water Supply 1/2 inch Swagelok Recirculator Water Return 1/2 inch Swagelok

Heatpulse® 8108 System [email protected] for more information

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UTILITY SPECIFICATIONS

The following table is a summary of the utility specifications for the Heatpulse8108 system:

UTILITY FLOW RATE PRESSUREMIN. TYP. MAX. MIN. TYP. MAX.

CDA or Utility N2 (Cooling) 35 SCFM 40 SCFM 45 SCFM 80 psi 90 psi 100 psi CDA or Utility N2 (Valve Act.) <1 SCFM <1 SCFM <1 SCFM 80 psi 90 psi 100 psi

Cooling Water Supply 3 GPM 3.5 GPM 4 GPM 30 psi 40 psi 60 psi Cooling Water Return 2.5 GPM 3 GPM 3.5 GPM 20 psi 30 psi 40 psi

Gas Box Exhaust 0 SCFM 100 SCFM 150 SCFM .5" H2O .75" H2O --------

Cooling Exhaust 25 SCFM 30 SCFM 40 SCFM .5" H2O .75" H2O -------- Scavenger Hood Exhaust 20 SCFM 25 SCFM 30 SCFM .5" H2O .75" H2O -------- Containment Exhaust (Optional) 0 SCFM 0 SCFM 2 SCFM .5" H2O .75" H2O --------

OR

Exhaust Manifold Outlet 45 SCFM 55 SCFM 72 SCFM .5" H2O .75" H2O --------

Process Gas Exhaust (Scrubber) 20 SCFM 20 SCFM 20 SCFM 1" H2O 2" H2O 2.5" H2O

Process Gas Supply 20 SCFM 20 SCFM 20 SCFM 20 psi 30 psi 55 psi

Recirculator Water Supply 3 GPM 5 GPM 7 GPM 40 psi 50 psi 60 psi

[email protected] for more information

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SYSTEM INTRODUCTION

OVERVIEW

The Heatpulse® 8108 system is a single-wafer, cassette-to-cassette rapid thermal processor, capable of processing in inert or corrosive ambients. The system is built for the production environment. It is housed in a compact, through-the-wall frame (which can also be installed stand-alone, if desired). Front views of the 8108 Heatpulse system are shown as follows: Figure 1:2-1a shows the Monitor-Fab-Wall-Mount configuration; Figure 1:2-1b shows the Monitor-Side-Panel-Mount configuration.


AG Associates Heatpulse 8108 Rapid Thermal Annealing System


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com8108 system components include:

• Process chamber (also called the oven), containing twohigh-intensity tungsten halogen lamp arrays

• STD Bus for real-time operation• Quartz isolation tube• Robot and robot controller• Gas control electronics• ULPA filtration system• Graphic User Interface (GUI) computer system

The 8108 contains a subsystem for each of the following:

• Electronics (including a dedicated microprocessor)• Mass-flow-controlled gas handling• Cooling• ULPA filtration• Mechanical assemblies

Software programs, called recipes, specify the details for each process. Thesystem includes a 3-1/2-inch floppy disk drive for process recipe storage.

A three-axis industrial robot automates processing by transporting wafers intoand out of the process chamber. It uses closed-loop feedback for precisemotion control and accurate positioning.

To provide cold-wall processing, water is circulated through theprocess-chamber walls. The quartz isolation tube is cooled with nitrogen orcompressed air.



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A G A s s o c i a t e sA G A s s o c i a t e s

STATUSINDICATOR

ULPAFILTER

FRONTDOOR

PROCESSCHAMBER

Access doorslocated on the right and left side of the system toallow access torobot electronics,pyrometer cooling system and cabling

WINDOWOVERRIDESWITCH

WINDOWCONTROLS

SIDE ACCESSPANEL

CASSETTESTATION

INTERLOCKRESET BUTTON

FLOPPY DISK DRIVE

EMERGENCY OFF BUTTON

LAMINARFLOWSCREEN

CASSETTESTATION

POWERON/OFF

ROBOT

CASSETTEINDICATOR

CASSETTEINDICATOR

OVEN DOORRELEASE

Figure 1:2-1a. 8108 Heatpulse System Features (Monitor-Fab-Wall Mount)



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A G A s s o c i a t e sA G A s s o c i a t e s

STATUSINDICATOR

ULPAFILTER

FRONTDOOR

PROCESSCHAMBER

Access doorslocated on the right and left side of the system toallow access torobot electronics,pyrometer cooling system and cabling

WINDOWOVERRIDESWITCH

WINDOWCONTROLS

SIDE ACCESSPANEL

CASSETTESTATION

INTERLOCKRESET BUTTON

FLOPPY DISK DRIVE

EMERGENCY OFF BUTTON

LAMINARFLOW

SCREENCASSETTESTATION

POWERON/OFF

ROBOT

GUI DISPLAY

KEYBOARD

SIDE PANEL

CASSETTEINDICATOR

CASSETTEINDICATOR

OVEN DOORRELEASE

Figure 1:2-1b. 8108 Heatpulse System Features (Monitor-Side-Panel Mount)



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comFEATURES

The Heatpulse 8108 system contains many capabilities which providesignificant advantages over conventional batch processing in the production ofVLSI circuits. Cleanroom integrity, precise temperature control andmeasurement, software flexibility, and the physical structure of the system(designed for the production environment) are among these advantages.

Contaminant-Free Processing

The Heatpulse 8108 system is designed with the cleanroom environment inmind. The following are the key features which make this Heatpulse systemcontaminant-free:

• Stainless-steel laminar flow processing floor and ULPA filter located in theprocessing area to reduce the number of particles in the environment. Thewalls of the processing area are also stainless steel.

• Design which prevents particles from circulating around the wafer-handlingarea, which allows the front panel door to remain open during processing.

• Easy service access available from rear and side panels.

• Through-the-wall installation, which maintains cleanroom integrity.

• No belts and pulleys (a large source of particle contamination) exist in the8108 wafer-handling area.

• Front touch-screen controller remotely mounted to further reduce particleattraction.



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comHeating, Cooling, and Temperature Measurement

The following lists the key features of 8108 heating, cooling, and temperaturemeasurement:

• High-intensity radiation which heats wafers for short periods of 1 to 600seconds at precisely controlled temperatures in the 400-to-1200°C range.

• Tungsten halogen lamps and cold process-chamber walls which allow fastwafer heating and cooling rates, respectively.

• Lamps arranged in 2 banks of 14 lamps each, 1 bank above and the otherbelow the process chamber. Upper lamps which run crosswise and lowerlamps which run lengthwise. Thus, the upper and lower lamps are at rightangles to each other for optimization of temperature control. In addition,10-zone lamp control to enable further wafer uniformity.

• The system delivers time and temperature profiles tailored to suit specificprocess requirements.

• Pyrometer or thermocouple sensing (with DTC option) which offersprecise closed-loop temperature control.

• Open-loop intensity control (OLIC) option which offers accurate, repeatabletemperature control. (This feature requires ±0.5 VAC at 208 VAC linevoltage regulation to function accurately.)

• Purge gas which flows through the process chamber and cooling gas(CDA) which flows around the isolation tube and lamps.

• Water de-ionizing system for oven cooling water to minimize metalcorrosion.



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comSoftware

The Heatpulse 8108 system features touch-screen operation which is easy tolearn. Additional software features are listed below.

• Menu screens which allow a process cycle to be easily defined andexecuted.

• Status reports continually displayed on the screen as the system operates.

• Self-diagnostic routine active whenever the system is on and terminates thecycle in progress if an abnormal condition is detected.

• Access codes which provide security for the system, recipe programming,and diagnostic functions.

• Highly flexible recipes and process procedures.

• Simple and easy-to-use menu screens.

• Touch-screen menus which eliminate the need for special commands.

• Manual mode which allows engineers and service personnel to activateindividual subassemblies and functions.

• Discrete diagnostic routines, using a separate Diagnostic mode, areavailable.

• Maintenance menu which allows you to customize messages by conditionand date to appear on the GUI screen at a set time.

• Thermal processing cycles which may be customized for unique processingrequirements.

• Custom recipes created by process engineers which may be saved onfloppy diskette and executed by production line operators.



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Service Access

The 8108 system has been built for fast servicing in the production environmentwhich provides low mean time to repair (MTTR ). The features listed belowreflect this purpose:

• Optional menu screen available at the rear of the system, enabled through akey control switch.

• Gas box specifically designed for easy access and maintenance.

• Front access window closes to prevent cleanroom contamination duringmaintenance for through-the-wall installation.

• Top window, which flips out of the way, enables easier wafer-handlingarea access.

Wafer Handling, Control, and Accuracy

8108 wafer-handling system features include the following:

• Consistent wafer-to-wafer process cycle repeatability

• Optional send and receive cassette bases which swivel to accommodateloading and unloading by a cleanroom robot in a fully robotic environment

• Antistatic Ion Bar in the laminar flow system which reduces electrostaticcharges on wafer handling components.

• Controlled ambient

• Robotic transport of wafers in excess of 80 wafers per hour (in a null cyclewithout the flat-finder option)

• A process-per-wafer (PPW) feature which enables you to program adifferent recipe for each wafer in a cassette. For pick-and-place operation,one recipe and be selected for each cassette, or up to 50 different recipes canbe programmed when two 25-slot cassettes are used, or 52 recipes whentwo 26-slot cassettes are used


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The 8108 system was designed with safety in mind. Safety features include:

• Software and hardware interlocks to prevent hazardous gas combinations

• Emergency shut-off buttons in both the front and rear of the system

• Error messages and alarm signals to convey system status

• Domestic 8108 systems are listed by Underwriters Laboratories

• European 8108 systems meet European CE label requirements

Cost Savings

The 8108 offers two features which result in a considerable cost savings whencompared to conventional batch processing. Thus, it requires:

• Small tool footprint

• Low energy use

• Few employees for operation and maintenance



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OPTIONS

The following options can be added to the 8108 Heatpulse system at any time:

• Direct Direct Thermocouple Control (ez-DTC) is a closed-loopThermocouple thermocouple-based temperature control system whichControl is much less sensitive to emissivity variations wafer to

wafer than the pyrometer, thus increasing processrepeatability. The DTC temperature probe is an R-typethermocouple sealed in a non-contaminating siliconcarbide sheath.

• Ceramic The Ceramic Shield is semiconductor grade materialShield installed beneath the wafer. When combined with the ez-

DTC option, it provides emissivity independentoperation to Heatpulse systems

• Slip-Free/ This hardware and software option dramaticallyWafer Aligner reduces slip for high-temperature processing. It includes

slip-free rings, the ez-DTC quartz tray, and Wafer-Aligner. The Wafer-Aligner, or Flat-Finder, finds theflat edge of the wafer prior to loading it into the processchamber.

• GEM SECS Hardware/software subsystem, compatible with SEMIGEM 93 standards, which allow a host computer tomonitor and control the Heatpulse system. The host canremotely control process program selection and processprogram operation. The host can also exchange textinformation with the operator using the GUI screen. TheHeatpulse can report various events and alarm conditionsto the host. GEM SECS screens are accessed from theLog menu. For more details on this feature, refer to theGEM SECS Operator's Manual supplied with thisoption.

• Throughput This option features a nitrogen curtain to reduce oxygenRetrofit leaking into the process chamber, high nitrogen purge to

reduce oxygen purge time, cassettes which accomodateloading in a fully robotic environment, and a low-massquartz tray designed for fast purging. For more details,refer to the Throughput Retrofit Technical Manualsupplied with this option.


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com• 8800 Provides 28 individually-tunable per-lamp power

Retrofit modules, regulating power to each lamp within +0.5 watts. Lamp configurations are user-selectable in 10lamp zones.

• O2 Sensor This remote oxygen sample measuring system includesa microprocessor-based controls/display system.

• Swivel This option allows both the send and receive cassetteCassettes bases swivel to accommodate loading and unloading by

a clean-room robot in a fully robotic environment.

• Printing Allows printing of certain GUI screens. This optionHardware requires 1) a printer supported by Windows, 2) a cart to

hold the printer, and 3) a standard printer cable. Theseitems may be supplied by the customer or purchased asa package from AG.

AG recommends locating the printer and cart in thechase area behind the Heatpulse.

• UPS and This feature records all data required to recover from aProcess power failure during a process cycle. This featureRecovery includes an uninterruptable power supply (UPS).

• Rear Trackball-operated controller for operation from theController rear of the system to facilitate maintenance activities.

• SWP Short-Wave Pyrometer (SWP) wafer temperaturemeasurement device.

• Dual-Color The Dual-Color Pyrometer (DCP) measures waferPyrometer temperature at two different wavelengths. This enables

selection of the pyrometer wavelength that provides thebest control for your particular application.

• Emissivity Device which calibrates the system pyrometer to aTemperature reference wafer to allow fast emissivity correction.Calibrator Includes a portable cart and closed-loop cooling system.



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APPLICATIONS

The Heatpulse 8108 system is a versatile tool which can be useful for manyapplications, such as (but not limited to):

• Silicon dielectric growth

• Implant annealing

• Glass re-flow

• Silicide formation and annealing

• Nitridation of metals

• Contact alloying

• Oxygen donor annihilation

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Technology

Ag associates heatpulse 8108 rapid thermal annealing system