A Fresh Look at HPC from Huawei Enterprise

www.huawei.comHUAWEI TECHNOLOGIES CO., LTD.

A Fresh Look at HPCHUAWEI TECHNOLOGIES

Francis LamDirector, Product Management

Page 2 HUAWEI TECHNOLOGIES CO., LTD.

WORLD CLASS HPC SOLUTIONS TODAY170+

Countries 2016 Revenue USD

16

R&D Centers

36Joint Innovation

Centers

#3

Top Server Vendor WW

Standalone Compute

Node 1P-32PModular HPC

Systems

NVMe SSD

HPC storage

Big Datastorage

Network FabricModular & Container

Data center

$74.8B

of Revenue in R&D

14.2%

Huawei FusionServer

OceanStor CloudEngine

Reduce Complexity

More Performance / $

Design for Growth

HPC Private Cloud

》》

Petascale System

Direct Liquid Cooling

Workload Optimization

Ecosystem Partnership

》》


300＋ World Records For Computing Performance

Flexible Density Optimized

Rack Mount Servers

High Performance Blades

Large Scale Deployment

SERVERS FOR HIGH PERFORMANCE COMPUTING

RH5885

RH8100

RH1288/2288

KunLun

16/32S System

RH5288

NVMe SSD card

Acceleration

GPGPU/Phi

E9000

X6800


MAXIMIZE EFFICIENCY ACCELERATE WORKLOAD

MAXIMIZE PERFORMANCE FOR

INDIVIDUAL WORKLOAD

Flexible, modular architecture

Multiple innovative form factors

Deep optimization with hardware

acceleration

Super Fat nodes

ADAPT TO CHANGE

FUTURE PROOF

Solve problem using emerging

hardware technologies

Single HPC cluster and storage

system for both traditional HPC

MPI workload and Hadoop

Leverage flexibility and

expandability of cloud technology

HUAWEI ADVANTAGES

MORE COMPUTE LESS SPACE

LOWER POWER CONSUMPTION

End-to-end energy efficient design

HVDC

High Ambient Temperature ~40oC

Direct Liquid Cooling ~ 84% coverage

Tight integration with Huawei data

center infrastructure

SDS

Big Data

SDI


Energy Efficient Server Design

Bottom line of Greener IT

Higher Temperature

Up to 8%↓ WW DC power consumption w/ 5ºC↑

HVDC

Up to 9-15% conversion efficiency

improvement

Free Air Cooling

Up to 20-70% cooling saving

In-Memory Computing

Up to 90+% less power

consumption than HDD-based

SSD Storage

Up to 60+% less power consumption than

HDD-based

Air Containment

Up to 30%↑ in cooling efficiency

Green IT Reduces Energy Bill & CO2 Emission, Extends DC Life, Lowers TCO

Hot Water

Eliminate Chiller Free cooling

Right-sized Power

~20% better power & cooling utilization

END-TO-END GREEN HPC DESIGN

Hardware Acceleration

~ 2X+ Performance Per Watt


CPU Load XH620 V3(X6800） 1U Server

Watt Saving Per

Node

% Power Saving Per

Node

100% 303 313 10 3%

90% 267 283 16 6%

80% 225 235 10 4%

70% 191 206 15 7%

60% 166 183 17 9%

50% 152 164 12 7%

40% 139 151 12 8%

30% 127 138 11 8%

20% 114 125 11 9%

10% 101 112 11 10%

0% 61 73 11.5 16%

X6800

Vs.

Workload：SPECpower2008，Power Meter：WT210，Thermometer：Digi Watchport/H

1U Server

POWER EFFICIENT FORM FACTORS


HUAWEI FUSIONSERVER LIQUID COOLING SYSTEM

• FusionServer LCS is composed of Liquid Cooling Rack and external CDU

• CPU, Memory and VRD are cooled directly by up to 45 ℃ water

• Chiller is optional, cooling PUE < 1.1

• Industry leading serviceability


MAXIMIZE EFFICIENCY DIRECT LIQUID COOLING40% Energy SavingPoznan Supercomputing and Networking Center (PSNC)

513960

460572

925,128

552,686

0

100000

200000

300000

400000

500000

600000

700000

800000

900000

1000000

Air cooling (PUE=1.8) Liquid cooling (PUE=1.2)

Devices

Rooms

- 40.3%

Note: Compared with the air cooling, the liquid cooling saves

3.26 million kWh power consumption for PSNC each year.


Scalability

I/O

Storage

Memory

bandwidth

Memory

capacity

CPU

Workload Characteristics

WORKLOAD OPTIMIZED HIGH PERFORMANCE BLADES

Maximize CPU compute density

Maximize Memory Per Core

Maximize Memory BandwidthMaximize Local Storage Per Node

Maximize I/O, Hardware Acceleration


E9000 HIGH PERFORMANCE BLADE SYSTEMC

ha

ss

is E9000 chassis

Chassis

Co

mp

ute

no

de

CH121 V3

Sw

itch

mo

du

le

Switch module

CH220 V3CH140 V3

Half-width 2-socket

compute node

High density

Large memory

capacity

Adopts a modular design for computing, storage, switching, power supply, and cooling.

12-U-high chassis, providing 8 full-width or 16 half-width slots.

Supports next 3 generations of high-performance Intel CPUs.

Supports next-decade network technology evolution.

Compute node

CH222 V3 CH226 V3 CH242 V3

Half-width 2*2-socket twin

compute nodes

Super high density

Outstanding computing

capability

Full-width I/O

expansion compute

node

Large memory

6*PCIe slots

Full-width storage node

Large memory

15*2.5'' HDDs/SSDs


Large memory

6*3.5'' HDDs

Full-width 4-socket compute node

Outstanding computing capability

(E7 v2, E7 v3)

Superb storage and I/O expansion

capability

GE 10GE/FCoE converged Ethernet IB FDR/EDR Multi-plane switch module8G/16G FC 40GE

CX110 CX310 CX311CX116 pass-

through

CX317/CX318

pass-through

CX611 10GE+FC

CX912

CX111 CX210

8G FC

GE+FC

CX915

CX710CX220

16G FC

CH225 V3


All-flash

12*NVMe SSDs


X6800 HIGH DENSITY RACK MOUNT SERVERS

XH628 V3

XH622 V3

XH620 V3

High Density Compute Node

Big Data Storage Node

Hardware acceleration Node


BROAD RANGE OF NVME SSD SERVERS

4 ╳ NVMe RH1288 V3

2 ╳ NVMe XH620 V3

12 ╳ NVMe RH2288H V3

24 ╳ NVMe RH2288H V34 ╳ NVMe 5288 V3

4 ╳ NVMe RH2288(H) V3

NVMe SSD Disk

2 ╳ NVMe CH121 V3

12 ╳ NVMe CH225 V3

4 ╳ NVMe CH242 V3

4 ╳ NVMe RH5885(H) V3

8 ╳ NVMe RH8100 V3

Blade Server

X6800(4U8)

6 ╳ NVMe XH321 V3

High-Density Server

X6000(2U4)

E9000


FUSIONSERVER X6000 — HIGH-DENSITY SERVER

Front View Rear View

24 NVMe SSDs or SAS/SATA HDDsUnified

management

network port

platinum AC PSUs

(hot-swappable, 1+1

redundancy)

2 PCIe slots

LOM service port

Node management port

Universal connector port


DEEP SYSTEM OPTIMIZATION ACCELERATE RESERVOIR SIMULATION

1

4

16

64

256

1024

1 4 16 64 256 1024 4096

Number of cores

Accele

rati

on

Replace hundreds of thin nodes based on typical design with 32 fat nodes

Significantly reduce costs and complexity of reservoir simulation practice

32 x Fat node

1 x Parallel

File Storage

Computing network(EDR IB)

Management network(GE)


IN-MEMORY COMPUTING ACCELERATE REAL-TIME ANALYTICS

SnapVX: http://snap.stanford.edu/snapvx

FusionServer RH8100 V3

12TB RAM

24TB RAM

SnapVX: http://snap.stanford.edu/snapvxKunLun 9032

http://snap.stanford.edu/snapvx

http://snap.stanford.edu/snapvx


Emerging Workload

LEAP FORWARD WITH HUAWEI INNOVATIONS

Enabling HPC Cloud

Open Telekom Cloud Unified HPC and Big Data Platform

Big Data Acceleration

HPC Class Hardware

• InfiniBand Fabric

• Hardware Accelerators

• Bare Metal Compute Node

Advancing Cloud Software Stack

• HPC class storage

• Container support

• Same stack for private & public

cloud

Emerging Hardware Technology

• Big In-Memory Compute Node

• New Storage Class Memory

• FPGA and custom accelerator

Advancing Big Data Software

• Massive streaming data

• Millisecond latency

• Artificial Intelligence

Business Driven Innovation

• Team with customers to

identify new business

problems

• Creative use of new

technology such as IoT and

AI

• Partner with industry leaders

AI/ML/DL

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.gallup.com/businessjournal/165704/managers-create-high-performance-cultures.aspx&ei=FfdpVbKJGMrQtQXd_IDoDw&bvm=bv.94455598,d.cGU&psig=AFQjCNGEcJASYVThg2alLUI3gN5g87Xufg&ust=1433093796826466


Manufacturing CAE/CFD Education/Research/Supercomputing

HUAWEI HPC MOMENTUM

Chip Design & Manufacturing

Oil & Gas ExplorationEnergy Production & Distribution Digital Media


HUAWEI HPC SOLUTIONS

MAXIMIZE ACCELERATE ADAPT