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The top documents tagged [packaging hierarchy]
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ECB
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EML 4561 Introduction to Electronic Packaging W. Kinzy Jones, Professor MME MWF 11:00-11:50
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305-393-0506(mobile) 305-348-4663 (office )
215 views
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1. Interconnection Networks ◦ Terminology, basics, examples Optical Interconnects ◦ Motivation ◦ Architecture examples for Data Centers and HPC ◦
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AN OVERVIEW OF ADVANCED ELECTRONIC PACKAGING TECHNOLOGY.pdf
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G93427.1 Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on Printed Circuit Boards and Integrated Circuits A. C. Cangellaris
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Illinois June 20021 Task 2: Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on PCBs and ICs A. C. Cangellaris and E. Michielssen
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