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The top documents tagged [package bonding]
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Packaging. Packaging Requirements Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal
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Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O Credits: David Harris Harvey Mudd College (Material taken/adapted from Harris’ lecture
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S. Reda EN1600 SP’08 Design and Implementation of VLSI Systems (EN1600) Lecture 32: Pad Frame Design and Packaging Prof. Sherief Reda Division of Engineering,
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Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 13.1 EE4800 CMOS Digital IC Design & Analysis Lecture 13 Packaging, Power and Clock Distributions
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