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The top documents tagged [flexible interconnects]
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Packaging and Fab of Electronics for Harsh Environments (Continuation of an FY08 Task) Description:FY09 Plans: Costs: Lead Center/PI: MSFC/Melanie Bodiford
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F. Savary on behalf of the WP11 team Input from V. Baglin, D. Ramos
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Slide - 1 Taking the Mystery out of Signal Integrity Dr. Eric Bogatin, CTO, GigaTest Labs Signal Integrity Engineering and Training 134 S. Wolfe Rd Sunnyvale,
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