×
Log in
Upload File
Most Popular
Art & Photos
Automotive
Business
Career
Design
Education
Hi-Tech
+ Browse for More
The top documents tagged [bump pads]
Documents
LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1
221 views
Documents
ILP-Based Inter-Die Routing for 3D ICs Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, and Chien-Nan Jimmy Liu Department of Electrical Engineering, National
217 views
Documents
Low cost and low mass bump bonding
38 views
Documents
System in Package and Chip-Package-Board Co-Design
32 views