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The top documents tagged [adhesion strength]
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Y. Miyagawa (AIST)CCP2006 Gyengju Plasma analysis for PIII processing by a PIC-MCC simulation Y. Miyagawa, M. Ikeyama, S. Miyagawa National Institute
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Sparks, B.; Hoff, E.; Hayes, L. Patton, D. Chem. Mater. 2012 , Submitted
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SpecChem Waterproofing System
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