1 October 2012

INVESTOR PRESENTATION

Q3-2012 QUARTERLY RESULTS

2 October 2012

SAFE HARBOR STATEMENT

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including, but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use

of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitute forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including our inability to maintain

continued demand for our products; the impact on our business of potential disruptions to European economies from euro

zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders,

generally without charges; the volatility in the demand for semiconductors and our products and services; failure to

adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle,

incurring additional restructuring charges in the future, acts of terrorism and violence; risks, such as changes in trade

regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and

foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage

our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31,

2011 and other key factors that could adversely affect our businesses and financial performance contained in our filings and

reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such

obligation to) update or alter our forward-looking statements whether as a result of new information, future events or

otherwise.

3 October 2012

AGENDA

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

4 October 2012

I. COMPANY OVERVIEW

5 October 2012

COMPANY OVERVIEW

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging, plating, wire bond

• Strategic positioning in wafer level and substrate packaging

• Global manufacturing operations in 7 countries; 1,615 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• 2011 revenue and net income of € 326.9 and € 26.7 million

• Cash at 9/30/12: € 89.8 million

• Total debt at 9/30/12: € 30.6 million Financial Highlights

• 2009 acquisition, restructuring and Asian production transfer have transformed company and earnings potential

• Advanced packaging, smart phone/tablet growth and Asian production transfer offer significant upside potential

• Stock market valuation at significant discount to peers

Investment Considerations

6 October 2012

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

0

50

100

150

200

250

300

350

400

2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

Gro

ss M

arg

in

Re

ve

nu

e (

€ m

illio

n)

Revenue Gross Margin

CORPORATE TRANSFORMATION

Restructuring

Asian Production Transfer

Dragon I

complete:

€ 6 million

cost savings

Dragon II

complete:

€ 15 million

cost savings

Die Attach Acquisitions

Record Revenue:

€ 351 million

Record Profit:

€ 47 million

Standard packaging and certain die

bonding systems transferred to

Malaysia

Dutch tooling &

Hungarian die bonding

transferred

DB 2100 transferred to

Malaysia

Asia

capacity

expansion

completed

€ 14 million spent to build, expand and equip Malaysian system and

Chinese tooling operations

Asian headcount increased from 34% in ‘06 to 51% in ‘11

Cost

savings

plan

initiated

13%

Headcount

reduction;

Plating unit

restructuring

DB 2009

transfer to

Malaysia

initiated

7 October 2012

• Market cap € 195 million: 37.8 million shares x € 5.15 price (October 23)

• Shares listed on NYSE Euronext Amsterdam (BESI) and NASDAQ OTCQX

International (BESIY). 2011 average daily volume of 132,079 shares

• Trading at significant discount to industry multiples:

Besi (a) Peers (b, c) Industry (c, d)

TTM P/S 0.7x 1.2x 1.9x

TTM EV/EBITDA 3.7x 6.1x 7.8x

2012E P/S 0.7x 1.1x 1.6x

2012E EV/EBITDA 2.9x 6.2x 8.1x

STOCK PRICE INFORMATION

Source: a) Besi: Canaccord Genuity, SNS Securities research & ABN Amro b) Peers: ASMPT, Disco Corp, Mühlbauer, Tokyo Seimitsu, Shinkawa, Suess Microtec and K&S c) Reuters & MS estimates d) Industry: Reuters semi equipment universe

8 October 2012

BESI EQUIPMENT PORTFOLIO

Die Attach

• Die Bonding

- 2100 xP

- 2009 series

- 2100 hS

- 2100 sD

• Component

Packaging

- 2200 evo

• Flip Chip - 8800 Quantum

- 8800 Chameo

- "Smart Line"

- 2100FC

Packaging & Plating Wire Bonding

• Die Sorting

- DS 9000E

- CS 1250

- DS 11000

• 3100

• 3100

Smart Card

• 3200 Smart

Card

• Molding

- AMS series

- AMS Foil

- AMS WLM

• Trim & Form

- Compact series

- Power series

- Compact Line

XHD

• Singulation

- FSL

• Plating

- Leadframe

- Solar

- Film & foil

New

New

New

In Development

• Common die attach platform

• Common packaging platform

New

New

New

9 October 2012

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

BESI PRODUCT POSITIONING

10 October 2012

GLOBAL OPERATIONS

as of 30 September 2012

Europe/N.A. Asia

Revenue (MMs) € 54.2 24.9% € 163.2 75.1%

Headcount 761 47.1% 854 52.9%

• Development activities in Europe and USA

• Increasing production and sales & service

activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

Chengdu Shanghai

Korea

Taiwan

Philippines Malaysia

Singapore*

Salem* Suzhou

Radfeld, (Austria) Cham,

(Switzerland)

Duiven & Drunen,

(The Netherlands)

Chandler

Shenzhen

11 October 2012

Customers End Products End Use

CUSTOMER ECOSYSTEM

• Blue chip customer base, top 10 customers represent 45% of 2011 revenue

• Leading IDMs and Asian Subcontractors. 41%/59% split in 2011

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years

12 October 2012

Computer, PCs50%

Tablets &

Wireless Devices

22%

Auto13%

Industrial10%

LED3%

Service2%

2008

PRODUCT SHIFT TO ADVANCED PACKAGING

END USER APPLICATIONS

Computer, PCs21%

Tablets & Wireless Devices

35%

Auto17%

Industrial

10%

LED5%

Service12%

2011

Source: 2011 Company Estimates

• Tablets and wireless

devices now equal

35% of end user

revenue

• Automotive has also

increased

significantly in recent

years

• Service/spare parts

have grown to 12%.

Less cyclical revenue

stream

13 October 2012

II. MARKET

14 October 2012

ASSEMBLY EQUIPMENT MARKET COMPOSITION

• 52% assembly market 2011 represented by die attach and wire bonding equipment

• Besi focus: die attach and packaging segments

Die Attach

60%

Packaging

39%

Plating

1%

Flip Chip

12%

Die Sorting

3%

Singulation

8%

Presses

9%

Molds

15%

Lead Trim &

Form

7% Die Bonding

44%

Assembly Equipment Market *

(2011: $4.2 billion) Besi Addressable Market *

(2011: $1.7 billion)

Wire Bonding

25%

Die Attach

27%

Packaging

18%

Plating

1%

Other Assembly

(Inspection, Dicing)

29%

* Source: VLSI January 2012

Plating

2%

15 October 2012

ASSEMBLY EQUIPMENT MARKET FORECAST

Source: VLSI October 2012

• VLSI estimates total assembly market of $4.2 billion in 2011

• 2012/2013 estimates uncertain given market volatility

2.9

2.1

4.5

4.24.0 4.0

-26.2% -28.2%

120.5%

-7.8%-3.7% -1.0%

0

1

2

3

4

5

6

2008 2009 2010 2011 2012E 2013E

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

160%

Assembly Equipment Market Size YoY Growth Rate

16 October 2012

IC PRICING AND ASSEMBLY MARKET TRENDS

Assembly Capacity Utilization & IC Pricing

Book to Bill Ratio

16

• Softening seen at end of Q2 accelerated in Q3

• Assembly equipment market fell much more than overall semi equipment market in Q3

• Some mixed signals:

• Assembly capacity utilization trends ok

• Semi pricing seems stable for now…although at much lower levels than 2011

Source: VLSI September 2012 Source: Semi September 2012

1.12

0.81

1.40

0.540.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

Oct 10

Dec 10

Feb 11

Apr 11

Jun 11

Aug 11

Oct 11

Dec 11

Feb 12

Apr 12

Jun 12

Aug 12

SEMI Equipment Market(3 month moving average)

Assembly

Total

1.16

1.18

1.20

1.22

1.24

1.26

1.28

1.30

1.32

1.34

1.36

1.38

1.40

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

2010 JAN

APR JUL OCT 2011 JAN

APR JUL OCT 2012 JAN

APR JUL

3 M

on

th A

vg

Pri

cin

g (

$)

% C

ap

acit

y U

tili

zati

on

Assembly Utilization IC ASP

17 October 2012

27% 24% 27%

0%

10%

20%

30%

40%

2009 2010 2011

Addressable Market Share

13% 10%

12%

0%

10%

20%

30%

40%

2009 2010 2011

Packaging Market Share

29% 29% 32%

0%

10%

20%

30%

40%

2009 2010 2011

Die Attach Market Share

11% 14% 14%

0%

10%

20%

30%

40%

2009 2010 2011

Assembly Market Share

BESI COMPETITIVE POSITION

Mkt Size: $1,015MM Mkt Size: $668MM

*Source: VLSI Jan 2012

Mkt Size: $1,700MM Mkt Size: $4,192MM

Competition: ASM-PT, K/S, Shinkawa, Tokyo

Semitsu, Disco

Company Position: #3

• #3 leading assembly supplier

• #2 in addressable market with

27% share

• Leader in die attach

• Gained market share in 2011:

• Die attach (die bonding and

sorting)

• Packaging (molding)

• Leader in growth areas:

• Multi module die attach

• Flip Chip

• Ultra thin molding

• Accuracy, precision and

speed distinguishes Besi vs.

competition, particularly for

mainstream market

Competition: ASM-PT, Shinkawa, Panasonic,

Muhlbauer

Company Position: #1 Die Bonding, #1 Multi Module,

#1 Flip Chip,

#2 Die Sorting

Competition: Towa, ASM-PT, Yamada, Dai Ichi

Seiko, Gallant, Hanmi, Rocco

Company Position: #2 Molding, #2 T&F

#3 Singulation

Competition: ASM-PT, Disco, Shinkawa, Towa,

Hanmi, Hitachi

Company Position: #2

18 October 2012

III. STRATEGY

19 October 2012

BUSINESS STRATEGY

Vision

Technology-led, mainstream supplier of substrate and wafer level

packaging solutions

How to win

Market

positioning Fast growing, leading edge market segments

World class assembly

equipment manufacturer

Actions

Leverage "One Besi" Strategy

Enter selected

markets with

leading technology

Maximize product

value with transfer

into mainstream

Exit when

technology becomes

“commoditized”

(II) Accelerate revenue growth

(III) Reduce structural costs

(IV) Transfer production to Asia

(V) Acquire complementary companies

(I) Maintain leading edge technology

20 October 2012

PRODUCT STRATEGY:

ADVANCED PACKAGING IS THE FUTURE

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage.

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2011E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, 2100

• Flip Chip: DC 8800 FC

• Multi Module: DC EVO 2200

Packaging

• Molding: AMS-W

• Singulation: FCL

High Growth End

User Areas:

Tablets, Smart

phones, Digital set

top boxes, Autos,

MEMS

21 October 2012

Source: Prismark

1,050 900 850 600

400 650 850 1,500

0

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 2015 2016

mill

ion

ph

on

es

Smart Phones 2011-2016

Basic Phones Smart Phones

62.5%

30.8%

76.4%

Tablets 2011 - 2014

SMART PHONE / TABLET MARKET TRENDS

• Rapid unit growth in smart

phones and tablets forecast

over next 5 years

• Estimated unit growth rates:

• Smart phones:

• 2012: 62.5%

• 2016: 3.5x

• Tablets:

• 2012: 120%

• 2014: 4x

• Significant potential revenue

growth driver

22 October 2012

SMART PHONE ILLUSTRATION

Main Components Manufacturer Country Besi Systems Utilized

Processor Samsung South Korea 8800FCQ, AMS-W, Singulation

DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation

Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation

Battery Samsung South Korea N/A

Power Management Dialog Germany 2100sD, 2009

Compass AKM Japan N/A

Accelerator/Gyroscope ST Micro Italy/France 2100sD

Communications

Radio Frequency Memory Intel USA 8800FCQ, Singulation

Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation

Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation

PA Module Skyworks, Triquint USA

2200 evo, AMS-W, Singulation, 8800 Chameo

Video/Audio

Touch Screen Control TI USA 2100sD, AMS-W, Singulation

Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation

LCD Display LG South Korea N/A

Touch Screen Wintek USA N/A

Camera – 5/8 megapixel/VGA LG, Foxconn, CoWell

South Korea, China 2200 evo

Besi systems are capable of assembling components representing up to 50% of smart phone content

23 October 2012

Wire Bonding

$1,067 76%

Flip Chip$337 24%

2016E

FLIP CHIP/WIRE BOND OPPORTUNITY

• Move to <40 nanometer can only be accomplished by flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 16% of total potential market of $1.3 billion (2011)

• Rapid share gain vs. wire bonding over next 5 years (9.9% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates of key IDMs/subcons

Wire

Bonding$1,053 84%

Flip Chip

$208 16%

2011

CAGR 2011 – 16

Flip Chip 10.2%

Wire Bond 0.3%

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI October 2012

24 October 2012

KEY OPERATIONAL OBJECTIVES

2011 2012 2013

Key Operational Objectives

DB 2100 production transfer to Malaysia

DB 2009 production transfer to Malaysia

50% MY/100% China capacity expansion

Reduce European cost structure

• Asian production transfer on schedule: • 80% of YTD 2012 systems produced in Asia • Transfer of DB 2100 epoxy die bonder from Switzerland to Malaysia completed in 2011 • DB 2009 soft solder system transfer accelerated to Q1-13 from Q4-13

• October 2012 headcount reduction plan initiatives:

• Reduce European fixed headcount • Rationalize Dutch plating operations • Further integrate Die Attach operations • Align Asian production capacity with current demand • € 11 million annualized cost savings

25 October 2012

AQUISITION STRATEGY

1993 1995 1997 2000 2002 2005 2009

• € 50 million packaging company has become € 327 million assembly

equipment supplier

• Consolidating leading edge assembly technologies

• 4 acquisitions since 2000 totaling € 80 million, net have created Die Attach

leader

• Seeking technology led companies which increase advanced packaging

presence and can be incorporated into One Besi platform

Packaging Plating Leadframes Flip Chip Chip Sorting Flip Chip/

Multi Chip

Single Chip

Packaging & Plating Die Attach

26 October 2012

IV. FINANCIAL REVIEW

27 October 2012

SUMMARY FINANCIAL HIGHLIGHTS

• Financial transformation since 2008

• Scale and market presence have changed

due to Esec acquisition:

• Expanded mainstream presence

• Leveraged revenue potential

• Strategic positioning in advanced

packaging has yielded benefits:

• Enhanced top line growth

• Increased gross margins

• Solid gross margins and profits in 2011

despite downturn due to:

• Advanced packaging presence

• Ongoing Asian production transfer

• 2010 product line restructurings

• Solid liquidity base. Expanding net cash

• Dividend initiated in 2010

Year Ended December 31,

(€ millions, except share data) 2009 2010 2011

Revenue

147.9

351.1 326.9

Orders 162.5 376.5 301.1

Gross margin 28% 39% 40%

EBITDA 17.9 60.5 45.8

Pretax income 4.9 47.4 34.6

Net income 5.4 47.3 26.7

EPS (diluted) 0.16 1.25 0.73

Net margin 4% 13% 8%

Adj. net income (loss) (28.0) 41.6 27.4

Adj. EPS (diluted) (0.85) 1.11 0.75

Net Cash 19.6 22.9 62.7

Dividend per share - 0.20 0.22

28 October 2012

REVENUE/GROSS MARGIN TRENDS

56.6

89.5

100.6104.4

91.1

89.9

75.6

70.4

55.8

87.0

74.6

97.3

133.7

88.1

57.4

88.3

82.5

75.1

55.2

84.2

91.1

48.7

33.4%

38.7%

40.1% 40.2% 40.0%

41.2%

40.0%

38.5%39.4%

41.5%

40.3%

30.0%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

0

20

40

60

80

100

120

140

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12

(eu

ro in

mill

ion

s)

Revenue Orders Gross Margin

• Quarterly revenue/order patterns show

cyclicality of semiconductor business:

• Two cycles past 24 months; very volatile

• Influenced by global macro demand

• 14.3% decrease in Q3-12 sequential

revenue

• Product mix shift past 3 years to higher

margin advanced packaging systems:

• Multi module and flip chip die attach

• Ultra thin molding systems

• Influenced by smart phones, tablets and

intelligent automotive components

• Exit from lower margin wire bonding and

packaging system sales has also helped

• Gross margins remained relatively stable

despite cyclical revenue/order trends:

• Increased scalability of production model

• Product mix shift to higher margin

advanced packaging systems

• Lower unit costs due to Asian production

transfer

29 October 2012

(2.6)

15.4

19.4

3.4

1.2

11.0

14.4

4.2

10.0

15.0

9.6

8.8

4.9

0.2

4.3

-5

0

5

10

15

20

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12

(eu

ro in

mill

ion

s)

Net Income Adjusted Net Income

NET INCOME TRENDS

• Cyclical peak earnings of € 47.3 million

reached in 2010

• Significant contribution from Esec

products/turnaround

• Restructuring benefits

• 2011 earnings declined to € 26.7 million.

Adversely affected by:

• Global macro concerns/increased

customer caution

• Increase of CHF vs. euro reduced

operating profit by € 4 million

• Increased incentive stock based comp

of € 3.1 million

• Renewed volatility in 2012:

• Significant quarterly profit swings

• Macro uncertainty causes very short

term customer purchasing patterns

• Significant leverage in operating model

• Quarterly opex have ranged between

€ 20-24 million over past 8 quarters

30 October 2012

47.7 48.1

55.0

69.3

65.5

61.8

76.6

87.5

93.5

77.3

89.8

46.8

49.4 49.9

46.4 45.9

16.1

27.0 24.8

23.1

27.9 30.6

0

10

20

30

40

50

60

70

80

90

100

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12

(euro

in m

illio

ns)

Cash Debt

LIQUIDITY TRENDS

Net Cash 0.9 (1.3) 5.1 22.9 19.6 45.7 49.6 62.7 70.4 49.4 59.2

• Net cash position has grown to € 59.2

million from € 19.6 million at year end

2009

• Significant increase in profitability

• Redemption and share conversion of

5.5% convertible notes in Q2-11

• Improved inventory management

• € 1.57 per share relative to share price

of € 5.62 at end of Q3-12

• € 25 million spent on share

repurchases and cash dividends in

2011/2012

• Dividends initiated in 2011

• 1.5 million share buyback program

announced in October 2012

• Strong balance sheet supports future

organic growth and acquisition

strategy

31 October 2012

V. OUTLOOK & SUMMARY

32 October 2012

Q4-2012 GUIDANCE

• Customer caution continues into Q4-12

• Q4-12 sequential revenue down 25-35% vs. Q3-12

• Gross margins (ex restructuring) will range between 36-38%

• Opex declines to approximately € 22.0 million (ex restructuring)

• Capex of € 1.8 million to complete Asian capacity expansion

Revenue Gross Margin* Operating Expenses* Capex

Q3 Q4 Q3 Q4 Q3 Q4 Q3 Q4

€ 74.6 40.3% € 22.6 € 1.5

36%

-

38%

Down

25%

-

35%

Up

€ 0.3

MM

* Excluding restructuring

Down

€ 0.6

MM

33 October 2012

SUMMARY

Leading semi assembly equipment supplier with #1

or #2 positions in fast growing advanced

packaging segments

Scalability and profitability of business model greatly

enhanced

Macro uncertainty causes volatility in quarterly results

2011-2012

Solid liquidity position.

€ 59.2 million net cash at end of Q3-12

Significant upside potential.

Advanced packaging, smart phone/tablet growth,

ongoing cost reduction and Asian production

transfer

Attractive stock market valuation relative to peers

34 October 2012

FINANCIAL CALENDAR

25-Oct-12 Roadshow Frankfurt, Germany, organized by ABN AMRO Bank

14/16-Nov-12 Morgan Stanley Technology, Media & Telecom Conference,

Barcelona, Spain