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1 Share Passion Create Harmony Solution for Future Technology QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE Share Passion Create Harmony Dec 2008 C C o o r r p p o o r r a a t t e e P P r r o o f f i i l l e e QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE

Elec and Eltek Corporate Profile 2008 Dec English

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Share Passion Create Harmony

Solution for Future Technology

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Share Passion Create Harmony

Dec 2008

CCoorrppoorraattee PPrrooffiillee

QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE

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General Information

QTA SERVICE HDI BACKPLANE HIGH-END SERVER 2-40L RIGID PCB LEAD-FREE

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Corporate Milestone

2008Further expansion in Kaiping South site which is especially designed for HDI products. Expansion of GZ East VI is under progress.

1988Established our 1st oversea PCB plant in Thailand

1992 Established our 1st China PCB plant in Kaiping

1993Established a PCB plant in Guangzhou, China

1994 PCB Group was listed on Singapore main board

1995Acquired a PCB plant in Nanjing, China and established a PCB material plant in Thailand and China respectively

1972Elec & Eltek was founded as a double-sided PCB maker in Hong Kong

2001 Construction of a new PCB plant in Guangzhou East

2004HDI manufacturing expansion in Kaiping plant

2005Expansion of Guangzhou East Plant was completed

2004 E&E Group became a family member of Kingboard Chemical Holdings

1980 Began Multilayer PCB manufacturing

2006 Expansion of KP III E was completed and production was commenced. Construction of KPPIC phase I was completed.

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- China (Shenzhen, Kaiping)

- Thailand (Rojana)

Material Factory Locations:

- China (Hong Kong, Guangzhou, Kaiping, Nanjing)

- Thailand (Pathumthani)

PCB Factory Locations:

11,692 (As of 29 Nov, 2008)No. of Employees:

Listed on Singapore Main Board in 1994Public Listing:

HDI, High Layer Count, High Speed/Low Loss Materials, High Aspect Ratio, Sequential Lamination, High Reliability

Advanced Technologies:

2-40 layers rigid PCBs , Backplanes, HDIProduct Types:

1972 (Headquartered in Hong Kong)Found:

Elec & Eltek International Company LimitedCompany Name:

Company Snapshot

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Shareholding Structure

Listed on Singapore Main Board

As of 5 Dec, 2008

Listed on The Main Board of Hong Kong Exchange

Kingboard Chemical Holdings Ltd

PCB PCBRaw Material

Listed on The Main Board of Singapore Exchange

Elec & Eltek International Company Ltd

71.33%

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Organization Structure

Group Sales

Supply ChainManagement

Group MarketResearch

H/L & HDI BusinessDevelopment

KP SiteStandard & Advanced Product

KPPIC

Guangzhou Site

Thailand SiteTLPCB / PIM

SZ PIC

Group Technology

Nanjing Site(Nanjing)

Group Finance /Group IT /Company Secretarial Service

Group Human Resource & training

Group Quality

Group Procurement

Chadwick MokVice-Chairman

Philip ChanExecutive Director

Thomas LiExecutive Director

Clement SunExecutive Director

Chadwick MokExecutive Director

Procurement Council

Technical Center

KB PCB Group

HK plant & QTA

KP SiteGeneral Support

Alen ChanExecutive Director

CC LiExecutive Director

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To be a world-class PCB supplier that offers the Best Value to our partners

We strive to be a leading PCB manufacturer that supplies high-end PCB in mass volume at competitive price with excellent services & quality

Company Vision Company Vision

Company MissionCompany Mission

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Pathumthani Plant, Thailand

Guangzhou West Plant, ChinaGuangzhou East Plant, China

Hong Kong Plant, China Kaiping Plant, China

Nanjing Plant, China

Production Facilities - PCBProduction Facilities - PCB

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PIC – Shenzhen, China

PIM – Rojana, Thailand

ProductionProduction Facilities – PCB Materials Facilities – PCB Materials

PIC – Kaiping, China

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Sales Performance &

Marketing Strategy

We Are Growing Continuously

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Focus on organic growth

Strive for higher value-added product mix

Further streamline processes to achieve better operational eff iciency

Leverage on business synergies with Kingboard group

Upgrade skil ls and move up technology scale

Recruit industry talents to drive future growth

Strategies For GrowthStrategies For Growth

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Target End Market

ServerMedical

Equipment

Computer & Peripherals

Consumer Electronics

Automotive

Communication

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236

289

411

465

516

572

421

0

100

200

300

400

500

600

700

CY2002 CY2003 CY2004 CY2005 CY2006 CY2007 Q1-Q3CY2008

Sal

es (

US

D M

illio

n)

Sales Performance

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Source: NT Information

Worldwide Top 10 PCB EnterprisesWorldwide Top 10 PCB Enterprises

-0.518031794JapanIbiden1

10.714711629JapanNippon Mektron*2

20.812501510TaiwanUnimicron3

7.211871272KoreaSamsung E-M4

12.510991236JapanCMK5

9.011151215TaiwanNanya PCB6

5.09691017JapanShinko Electric7

9.2870950JapanNTK8

20.0760912Hong KongKingboard Group/ Elec & Eltek

9

33.1632841TaiwanTripod10

Growth (%)

2006 (US$M)

2007 (US$M)CountryMakerRank

*FPC Maker

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Turnover By Layer Count

2, 4 & 6 Layer 8, 10 & 12 Layer 14 Layer & up Microvia

CY2006

YTD Q3 CY2008

CY2007

4%

13%

14% 69%

14%

67%

16%

3%

70%16%

4%10%

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Turnover By Industry Sector

Computer & PeripheralCommunication & NetworkAutomotiveConsumer ElectronicsOthers

CY2006

YTD Q3 CY2008

CY2007

11%

9%

13%

22%

45%

49%

12%

15%

9%

15%

19%

41%

11%

18%

11%

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Turnover By Region

South East Asia

China & HK

Other Asian Countries

Europe

USA

Others

CY2006

YTD Q3 CY2008

CY20075%

8%21%

18%

48%

1%

4%

57%

3%

20%

1%

14%

51%

20%1%6%

18%

4%

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Our Key Customers

WESTERN DIGITAL

IBM

DELL

LENOVO

PANASONIC

VALEO

PHILIPS

MOTOROLA

IXXXLALCATEL

ERICSSON

SONY ERICSSON

SIEMENS

JOHNSON CONTROLS

HITACHI

NVIDIA

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Production

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Mobile Phone / Digital Products85HDI / 2L-10L18,000EEKP IIIE

Automotive / Communication / Instrumentation

2152L-12L26,400EETLThailand

60 2L – 8L6,000EENJ Consumer Electronics / Automotive / Instrumentation / Computer & Peripherals

Nanjing

Communication / Server902L-22LEEKP III

Mother Board / Automotive / Consumer Electronics

2452L-10L

21,000

EEKP I, II, V

Kaiping

All High-end Products / Server / Computer & Peripherals/ Medical & Instrumentation / Backplane

502L-32L/ Backplane/ HDI

10,900EEGZ III

Computer & Peripherals/ Consumer Electronics/ Medical

3602L-18L 21,100EEGZ I, II

Guangzhou

Communication & Networking / Computer & Peripherals / High-end Server / Instrumentation

20 2L-40L/ Backplane/ HDI/ QTA services

9,500 EEHK Hong Kong

SegmentationsProduction Capacity

(K sq ft/ week)

Products & Services

Floor Area (sq

meters)PlantLocation

Plant SnapshotPlant Snapshot

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Actual CY2007 Year End@ Around 56.0 Million Sq. Ft. Per Annum

Projected CY2008 Year End@ Around 58.7 Million Sq. Ft Per Annum

PCB with mass laminate11.5 million sq. ft.

11.5 million sq. ft

PCB raw materials

Kaiping Guangzhou Nanjing Shenzhen

China + Hong Kong44.5 million sq. ft.

47.2 million sq. ft

Thailand11.5 million sq. ft.

11.5 million sq. ft

3.8 million sq. ft

NJPCB

3.8 million sq. ft.

GZ + HK PCB with mass laminate

21.9 million sq. ft

GZ + HK PCB with mass laminate

19.2 million sq. ft.

PCB raw materialsKP PCB with mass laminate

21.5 million sq. ft.

KP PCB with mass laminate

21.5 million sq. ft

PCB raw materials

PCB raw materials

Production Capacity

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Technology & Capability

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+/-7%Impedance Control

Photo imageable, Peelable typeSolder Mask

3 mil/ 3 milMinimum Line Width/Space

6 milMinimum Hole Size

Lead-free HASL, OSP, ENIG, Immersion Tin, Immersion Silver, Selective OSP/ ENIG, Electrolytic Gold, Carbon Ink

Surface Finish

1/3 oz to 5 ozCopper Foil

2 milMinimum Core Thickness

FR-4, High Tg FR-4, BT, Rogers, Getek, Thermount, PTFE, Hybrid, Halogen free, Lead-free, Anti-CAF, Nelco-13, Arlon, High Speed/ Low Loss

Base Materials

Rigid multilayer PCB from 2L to 40LLayer Count

2008

Capability - Conventional PCB

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Capability - Microvia

+/ - 8%Impedance Control

1:1Aspect Ratios

Ink Plugging, Copper PlatingLaser Via Filling

Conformal Mask, Direct Drilling, Bare Resin Drill

Laser Via Formation Method

2 mil/ 8 milMinimum/ Maximum Laser Via Size

3 mil/ 3 mil

(4/4 mil for via filling design)

Minimum Line Width/ Spacing

Up to 3+N+3 with IVH

Up to 3 X IVH (microvia)

Structure - Sequential Build-up- Sequential Lamination

Aramid, BT, FR4, LD Prepreg, RCCBuild up Materials

2008

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Capability - Backplane

+/-7%Impedance Control

+/ -2 milPress fit hole tolerance

236 mil (6mm)Maximum Board Thickness

24” X 36”Maximum Panel size

2 milMinimum Core Thickness

+/- 8%Thickness Tolerance

16:1Aspect Ratio

3mil / 3milMinimum Line Width/ Space

Up to 40 LayersLayer Count

2008

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1/3 oz to 5 ozCopper Foil

+/-7%Impedance Control

+/-2 milPress fit hole tolerance

236 mil (6mm)Maximum Board Thickness

24” X 36”Maximum Panel size

2 milMinimum Core Thickness

+/- 8%Thickness Tolerance

18:1Aspect Ratio

3 mil/ 3 milMinimum Line Width/ Space

Up to 40 LayersLayer Count

2008

Capability - High-end Server

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Capability – QTA Service

Photo ImageableSoldermask

+/- 10%Impedance Control

30 milMin. Micro BGA Pitch Size

3 mil/ 4 milMin. Line Width/ Spacing

High Aspect Ratio (15:1), PTH, Blind Via, Buried ViaVia Hole

8 milMin. Hole size (Drill Size)

Inner: 1/2 oz – 5 oz; Outer: 1/3 oz – 2 ozCopper Foil

2 milMin. Core Thickness

Low CTE/ High Tg FR-4, Halogen-free, BT Epoxy, Getek ML200, Nelco N4000-13, Rogers RO4000, Arlon 25FR, IS620HT, FR408

Base Materials

Up to 30 LayersLayer Count

2008

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Multi-Sites Manufacturing Capability

FR4High Tg FR4

Imm Silver

+/-7%

10:1

3mil/3mil

8mil

2mil

EEKP IIIE

FR4 High Tg FR4Halogen FreeAnti-CAF

Carbon InkENIGHASLImm SilverImm TinOSPGold fingerPeelable S/M

+/-7%

6.67:1

4 mil / 4 mil

10 mil

2 mil

EETL

CEM 3FR4 High Tg FR4Lead-freeHalogen Free

HASLOSPLead-free OSPElectrolytic Gold Finger

+/-10%

6:1

4 mil / 4 mil

6 mil

4mil

EENJ

FR 4 High Tg FR4RCCAramidHalogen FreeBTGetek / MegtronRogersAnti-CAFHigh Speed/Low LossMicrowave

FR 4 High Tg FR4BTAnti-CAFLead-freeHalogen-free

FR4 High Tg FR4Nelco-13BT ArlonRogersHalogen FreeAnti-CAF, High speed/ Low loss, MircrowaveLead-free

FR4 High Tg FR4RogersHalogen Free (High Tg and Mid Tg)Anti-CAFLead-freeLow Dk/Low DfMircrowave

FR4 High Tg FR4Halogen-FreeAnti-CAF

Base Material

ENIGHASLOSP / Sel OSPImm TinImm Silver

Lead-free HASLImm. GoldImm SilverOSP/ Sel. OSP

Carbon InkENIGLead-free HASL Imm. SilverImm. TinOSP / Sel OSPElectrolytic Gold

Carbon InkENIGHASL Imm. SilverImm. TinOSP / Sel OSP

ENIGHASL Imm Silver Imm TinOSP / Sel.OSP

Surface Finish

+/-7%+/-7%+/-7%+/-7%+/- 7%Impedance Control

14:11:1

14:118:10.7:1

15:112:1 Aspect Ratio-Mechanical-Microvia

3 mil / 3 mil3 mil / 3 mil3 mil / 3 mil3 mil / 3 mil3 mil / 3 milMinimum Line/Space

8 mil 4 mil

8mil8 mil 4 mil

6 mil 8 mil

Minimum Finished Drill Hole-Mechanical-Microvia

2 mil2 mil2 mil2 mil2 milMinimumDielectricThickness

EEKP IIIEEKP I, II & VEEHKEEGZ IIIEEGZ I&II

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Technology Roadmap

2 mil/ 2 mil3 mil/ 2 mil3mil/ 3 milMinimum Line Width/ Spacing (Outer)

5 oz

Isola IS620HT,

FR408, BT

Nelco N4000- 13EP

Roger RO4300

+/ -4 mil

@ 20-mil hole, 100-mil drill depth

3mil/ 3 mil

3 mil/ 3 mil

15:1

10 mil

236 mil

40

24” X 36”

2008

5 oz

+/ - 4 mil

@ 16-mil hole, 160-mil drill depth

3 mil/ 2 mil

3 mil/ 2 mil

18:1

8 mil

236 mil

42

24” X 36”

2009

5 ozMaximum Copper Thickness

Low-loss Materials Application

+/ - 4 mil

@ 12-mil hole, 160-mil drill depth

Backdrill Depth Tolerance

2 mil/ 2 milMinimum Line Width/ Spacing (Inner)

2 mil/ 2 milMinimum Line Width/ Spacing (Outer)

20:1PTH Aspect Ratio

8milMinimum PTH Size

236 mil Maximum Board Thickness

48Maximum Layer Count

24” X 36”Maximum Board Size

2010Mass Production Capability (Mechanical)

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TQM (Total Quality Management)

KAIZEN

Comply with ISO and UL

requirements

Quality Policy

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QualityQuality

Quality People. Quality Products. Quality Services.

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By providing excellent quality product & services at By providing excellent quality product & services at competitive cost, we strive to satisfy customers’ current & competitive cost, we strive to satisfy customers’ current & future need through continuous improvement in all future need through continuous improvement in all business processesbusiness processes

Quality Manifesto

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ISO14001

PathumthaniThailand

Nanjing

Kaiping

Guangzhou

Hong Kong

China

ISO/TS16949ISO 9001:2000ULPCB Plants

Kaiping

RojanaThailand

ShenzhenChina

ISO14001ISO 9001:2000ULPCB Raw Material Plants

Quality Accreditation

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We are dedicated to protect the global environment and conduct green manufacturing

Every plant has been certified with ISO 14001

Wastewater treatment facilities at all plants

Water and air handled before discharged

Environmental Policy

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Delivery

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MRP

Material Resource Planning

GIS

Geographical Information System

CIM

Computer-integrated Manufacturing

EDI

Electronic Data Exchange

CFM

Continuous Flow Manufacturing

FMS

Flexible Manufacturing Systems

Technology on Delivery

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Services

Global Services. Instant Response.

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Our Global Services

Asean ✰ Malaysia ✰ Singapore ■ ✰ Thailand Plant

✰ Office

USA✰ Santa Clara, CA✰ Stillwater, MN✰ Boston, MT

Europe✰ London, UK✰Battenberg, Germany

North Asia ✰ Hong Kong, China ✰ Guangzhou, China ✰ Kaiping, China ✰ Nanjing, China✰ Shanghai, China✰ Shenzhen, China✰ Taiwan✰ Macau, China

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Cost

Competitive cost through vertical integration

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Cost Competitiveness

Early SupplierInvolvement

VerticalIntegration

China Factors

Cost Competitiveness

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Expansion Project

Exploring Opportunities. Expanding Business

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Our Expansion Plan – China & Hong KongOur Expansion Plan – China & Hong Kong

3,800K sq.ft./ year

2008 Capacity

21,500K sq. ft./ year

2008 Capacity

33,000K sq. ft./year

2009 Capacity

21,500K sq.ft./ year

2008 Capacity

Guangzhou + HK

Kaiping

Nanjing

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Pathumthani

11,500K sq.ft./ year

2008

Capacity

15,000K sq.ft./year

2009

Capacity

Our Expansion Plan - Thailand

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Contact Info

Tel: 662-975-3001-15Fax: 662-975-3022-3

134 Moo 2, Tambon Bang Khayang, Amphur Muang, Pathumthani Province, 12000, Thailand

Pathumthani Plant, Thailand

Tel: 86-25-85803800Fax: 86-25-85803886

Heng Tong Road 3#, Nanjing Economic & Technological Development Zone, Jiangsu Province, PRC

Nanjing Plant, China

Tel: 86-750-2218428Fax: 86-750-2210993

No. 318 Siqian Xi Road, Shagang, Kaiping City, Guangdong Province, PRC

Kaiping Plant, China

Tel: 86-20-82266328Fax: 86-20-82216218

No.388 Lianvun Road, Guangzhou Economic& Technological Development District Guangzhou, PRC

Guangzhou East Plant, China

Tel: 86-20-82212222 Fax: 86-20-82216218

No.3 LinJiang Road, Bei Wei Industrial Section, Guangzhou Economic & Technological Development District, Guangzhou, PRC

Guangzhou West Plant, China

Tel: 852-27653888Fax: 852-23347979

2/F, Block A, Merit Industrial Center, 94 Tokwawan Road, Kowloon, Hong Kong

Hong Kong Plant

Tel: 86-755-82022155Fax: 86-755-82022150

Flat F&G, 24/F, Noble Center, No.1006, Fu Zhong 3rd Road, Futian District, Shenzhen 518026, PRC

Macao Commercial Offshore(Shenzhen Office)

Tel: 853-28389471Fax: 853-28389470

Av. Da Praia Grande No. 599, Edificio Comercial Rodrigues, 3rd Andar E, Macao

Macao Commercial Offshore (Macao Office)

Tel: 852-29543333Fax: 852-29543111

1/F, Habour View 1, No.12 Science Park East Avenue, phase II, Hong Kong Science Park, Shatin, N.T., Hong Kong

Hong Kong Office

PCB General Offices & Plants

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Contact Info

Tel: 66-35-330-772Fax: 66-35-330-775

1/68, Moo 5, Rojana Industrial Park, Rojana Road, Uthai District, Phrana-komsriayutthaya Province, 13210, Thailand

Rojana Plant, Thailand

Tel: 86-750-2206998Fax: 86-750-2203090

No.318 Siqian Xi Road, Shagang, Kaiping City, Guangdong Province, PRC

Kaiping Plant

Tel: 86-755-26619698Fax: 86-755-26619047

Oi-Lin Ave, Bei Huan Road, Nanshan District, Shenzhen, PRC

Shenzhen Plant

PCB Raw Material Plants

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Contact Info

Tel: 44-1628-531-000United Kingdom

Tel: 1-408-727-4223United States

Tel: 604-390-2288Fax: 604-390-1688

Malaysia

Tel: 662-975-3001Thailand

Tel: 65-6226-0488Singapore

Tel: 886-3426-6477Taiwan

Tel: 86-21-5172-7988Shanghai, China

Tel: 86-20-8221-2222Fax: 86-20-82216218

Guangzhou, China

PCB Sales Representative Offices

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Thank You