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FWT- 3203 Panel Products, Adhesion, Adhesive and Finishes Cement Bonded Particle Board, Gypsum Board, Binder less Board, Other board Md. Sajjad Hossain Tuhin Student ID: 100510 Forestry and Wood Technology Discipline Khulna University 8/14/2014 Group 5 1

Binderless board

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FWT- 3203Panel Products, Adhesion, Adhesive and Finishes

Cement Bonded Particle Board, Gypsum Board, Binder less Board, Other board

Md. Sajjad Hossain Tuhin

Student ID: 100510

Forestry and Wood Technology Discipline

Khulna University

8/14/2014

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Presentation outline

2. Cement Bonded Particle Board

History

Manufacturing Process

Production

Uses

Advantages and Disadvantage

3. Gypsum Wood Particle Board

History

Manufacturing Process

Uses

Types

Advantages and Disadvantage8/14/2014

1. Binderless Wood Particle Board

Advantages and Dis-advantages

Uses

Manufacturing Process

Density profile

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Binderless Wood Particle Board

A panel of wood particles (e.g., cellulosic fibers) formed by using only

water, heat and pressure and without any adhesives.

Binder less particle Board is the type of panel where no external adhesives

are used and in wood lignin and hemicelluloses acts as adhesives.

Hot pressing Temperature can be 150°C- 250°C and for cold pressing it is

pressed with water and 20-25°C

Compression rate is depends on particle type and pressing system usually it

is 0.1-3Mpa

Density is around 450 kg/m3 - 1350 kg/m3

Heat and pressure is depends upon the particles properties.(e.g. density,

MC)

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Particle preparation

Final pressing160-170°C

Mat Forming

Removal of the frame

Hot pressingMC: 20%Framing

Final panel

Manufacturing process

Hot Pressing

150°C- 250°C

0.6- 1 Mpa

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Particle composition based on mesh analysis

Mesh Size (mm) Weight %

<0.25 6.4

0.25 - 0.50 14.4

0.50 – 1.00 37.3

1.00 – 2.00 37.2

>2.00 4.7

Particle composition in coconut Husk board

0.12 0.35 0.75 1.5 20

5

10

15

20

25

30

35

40

Particle composition analysis

Weight %

Mesh size in mm

Perc

enta

ge

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Influence of temperature

By increasing of temperature MOR of the produced panel is increased , Water absorption and roughness is decreased. Internal board strength is increasing but decreasing after 190°C

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Binding Properties

In wood 38-50% Cellulose, Hemicellulose 23-32% and Lignin 15-25%

Around 50-55% is Hemicellulose 23-32% and Lignin 15-25%

Hemicellulose and Lignin are much more thermoplastic than Cellulose

Lignin shows thermal softening at 127-235°C

Hemicellulose shows thermal softening at 167-217°C

Cellulose shows thermal softening at 231-253°C

In 20% MC Lignin thermal softening point at 72-128°C and Hemicellulose

is 54-142°C

Cellulose shows decreasing thermal softening point only 6-9°C

So binding temperature used at 170-180°C with 20% MC

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Influence of Compression

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FIG.1 shoes a density profile for a binderless fiberboard having uniform density throughout the thickness of the panel.

Density Profile

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Uses of Binderless wood particle board

Decorative use

Light construction

Internal use

Sound insulation

Partition wall making

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Produce thick board of medium density.

Density profile significantly more

uniform

Supplementary particle can be used,

Good appearance

Environmentally friendly.

Less costly

Can be recycled

Good insulating properties

Less water absorption

Advantages and Dis-advantages of Binderless wood panel

Dis-advantages

Not much durable

Require more pressure

Difficult to prepare

Low MOR and MOE

Advantages

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Cement Bonded Particle Board

Also known as Wood- Cement Board (WCB)

First commercially manufactured in the early nineteen seventies (1970)

It is a mixture of wood particles and Portland cement together with some additives

Ratio: Cement 50-60%, Wood 20-25%, Water 25-30%. (2.2:1:1-1.1)

It is very good sound insulator and dimensionally stable

Density is around 1100 kg/m3 - 1200 kg/m3

Density can be decreased at 850 kg/m3 in Oriented-wood-cement Boards(OWCB)

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1900 - The first mineral bonded board was produced by an Austrian carpenter using wood shavings and gypsum.

1920 - The first Wood Wool Cement Board (WWCB) is produced in Austria. Several others in Europe followed.

1930 - Wooden lath reinforced WWCB roofing boards produced in Holland, along with the first Cement Bonded Wood Chips (Durisol) boards.

1950 - Velox boards produced in Austria from course wood particles and cement.

1970 - The first Cement Bonded Particle Board (CBPB), called Duripanel, was produced in Switzerland.

2000 - Eltomation developed a fully automatic plant for Wood Strand Cement Board with approx. 1100 kg/m³, called EltoBoard

History

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Manufacturing Process

Cement

Water

Wood Mixer

Mat distribution on form board

Pressing

Curing room/yard

Trimming andfinishing

Final Panel

C:R:W=2.2:1:1-1.1

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It is manufactured by 43 companies world wide.

CBPB is currently produced by 16 manufacturers around the world

18% of world-wide cement board production.

Most of the major cement board producers are privately owned companies that do not publish financial reports, limiting the analysis of company progress

0 1 2 3 4 5 6 7

Developed countries

Global

2011

2012

2013

2014

Production

Percentages

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Source: http://www.globalcement.com

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Uses of WCB

Exterior and partition walls

Coating of the wall

Decoration

Acoustic and thermal insulation.

Flooring

Large size prefabricated elements for permanent shuttering of concrete walls

The production of complete prefabricated houses.

Roofing, shingles and shades.

Ceilings and architraves.

Fire resistant construction.

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Floor

s

Office

con

tain

ers,

House

man

ufac

ture

rs

indu

stry

Faca

des

othe

r0%

5%

10%

15%

20%

25%

30%

15%

20%

15%

25%

5%

20%

Use Pattern of WCB

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Source: http://www.wbpionline.com/features/building-the-future-on-strong-foundations

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High fire resistance

Wet and dry rot resistance because of its high alkalinity (pH 11)

Freeze-thaw resistance

Termite and vermin resistance

Excellent workability

Exceptional insulation and acoustic performance

Low cost and ease of manufacture

Can be used in both exterior and interior purposes

Advantages of WCB

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Disadvantage of WCB

High Density

For high density it is very difficult to handle in manufacturing and use. Need more transportation cost and can not used in light constructions like furniture.

For long curing time manufacturing process is more complex and time consuming. Needed extra care and attention in hydration process of cement. Need more labor.

Long curing time

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Solution of the problems

Density Problem: Oriented wood-cement boards (OWCB)

Oriented wood-cement boards (OWCB) were manufactured with wood/cement (w/w) ratio of 1:1 and SiO2 used as cement replacement up to 20%. Specific gravity 850 kg/m3 and MOR 2.1 to 2.8 Mpa.

Time problem: Mainly reduction of alkalinity from 13-17 to around 10.

1. Using additives: CaCO3, CaSO4,Calcium Salfoaluminate (CSA). etc.

2. Carbon-di- oxide treatment.

3. Converting manufacturing temperature( 1500°C to 1200°C)

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Gypsum

Gypsum is a mineral found in sedimentary rock formations in a crystalline form known as calcium sulfate di-hydrate CaSO4•2H2O

Gypsum Wood Particle Board (Drywall)

Gypsum Particle board Gypsum board is the generic name for a family of panel products that

consist of a noncombustible core, composed primarily of gypsum, and a paper surfacing on the face, back and long edges.

Gypsum board is often called drywall, wallboard, or plasterboard.

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The first plasterboard plant in the UK was opened in 1888.

Rochester Kent Sackett Board was invented in 1894 by Augustine Sackett and

Fred Kane.

The first mineral bonded board was produced by an Austrian carpenter using

wood shavings and gypsum in 1900

In 1910 United States Gypsum Corporation bought Sackett Plaster Board

Company and by 1917 came out with a product they called Sheetrock.

Gypsum Board evolved between 1910 and 1930 beginning with wrapped

board edges, and elimination of the two inner layers of felt paper in favor of

paper-based facings.

History

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Manufacturing Zones Sizes

Canada and the United States Width : 48-inch (1.2 m),54-inch (1.4 m) and 96-inch (2.4 m) Thicknesses: 1⁄2-inch (13 mm) , 5⁄8-inch (16 mm), and 1⁄4-inch.

Europe Width: 20 cm ,90 cm and 60 cm Lengths: 250, 260, 270, 280, 300 cm Thicknesses: 9.5 mm to 25 mm

Australia and New Zealand Thicknesses:10mm, 13mm, and 16mm, and up to 25mm.

Mainly Produced in U.S.A, Canada, Europe, Australia and New Zealand

Over 8 Billion Pounds of Drywall Scrap Annually in the U.S.A.

Production

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Manufacturing process

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Uses of Drywall

Gypsum board can be applied over wood or metal framing.

It can be applied to masonry and concrete surfaces.

To overcome dampness in exterior walls.

Use for decorative purpose

Use pattern of Drywall from 1995-2008

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Abuse-resistant gypsum board (Greater resistance to surface friction)

Eased edge gypsum board (Has a tapered and slightly rounded)

Exterior gypsum soffit board (Use on the undersides of eaves)

Foil-backed gypsum (Aluminum foil laminated to the surface)

Gypsum base for veneer plaster (Coats with gypsum veneer plaster)

Mold-resistant board

Non-paper-faced gypsum (has a facing other than paper)

Regular gypsum board

Sag-resistant board

Types of used Drywall

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Ease of installation

It can also be adhesively attached to many substrates.

Lightweight material.

It is an excellent fire-resistive building material.

Preventing the transfer of unwanted sound .

Gypsum board is used to construct strong, high quality walls and

ceilings.

Cheap manufacturing cost

Advantages of Gypsum Board

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Drywall may become damaged when exposed to water.

Water mold damage.

Environmentally not sound

Harmful for health produce toxic SO2 gas

High wastage in use and manufacturing 2,000 Square Foot

House = 1 Ton of Waste

High density about 1.1-1.4

Disadvantages of Drywall

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Wood-based panels

(OSB, plywood)

Drywall

(Gypsum board)

Wood-cement materials

(CBPB, WWCB)Concrete

Water resistance

Fire resistance

Fungal/termite/

mold resistance

Acoustic insulation

Bending strength

Lightweight

Nail holding capacity

Workability

Durability

Compare among different wood boards

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References Almeida, R. R.; Del Menezzi, C. H. S.; Teixeira, D. E. 2002. Utilization of the coconut shell of

Babaçu (Orbignya sp.) to produce cement-bonded particleboards. Bioresource Technology 85 (2): 159-163.

Hashim R ,Hamid SHA , Sulaiman O, Ismail N, Ibrahim M H, Jais H, et al. 2009, Extractable formaldehyde from waste medium density fibreboard .J Trop ForestSci2009;21:25–33

Hermawan D (2001). Manufacture of cement-bonded particleboard using carbon dioxide curing technology. A Dissertation present to the Department of Forest and Biomass Science, Graduate School of the Faculty of Agriculture, Kyoto University, Japan

http://books.google.com.bd http://en.wikipedia.org/wiki/Cement_board http://en.wikipedia.org/wiki/Drywall http://www.thefreelibrary.com/Binderless+particleboard+resistance+to+termite+attack.-

a0318492657 M. Sato, 2002 “Study on manufacture and mechanical properties of kenaf binderless

board”,Timber construction in the new millennium, World Conference on Timber Engineering, vol.2, 2002, pp.262-268.

Mobarak F,Fahmy Y,Augustin H.1982, Binderless lignocelluloses composite from bagasse and mechanism of self bonding. Holzforshung 1982;36:131–5

Viswanathan, R., and Gothandapani, L., 1999. Pressure density relationships and stress relaxation characteristics of coirpith". Journal of Agricultural Engineering Research, 73 ,pp.217-225.

Widyorini R, XuJ, Watanabe T, Kawai S. 2005, Chemical changes in steam-pressed kenaf core binderless particleboard. J Wood Sci 2005;51:26–32.

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Question?????

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