2. Automated process Automated PCB unloading Multi magazine
Nutek unloader Automated PCB loading Multi magazine Nutek loader
Highproductivity Panasonic screen printer Application accuracy of
20 microns Panasonic pick and place modular system Productivity of
up to 210 000 cph Senju convection oven High efficiency Teknek
cleaning system Removing of the smallest pollution 3D Koh Young
Paste inspection 100% 3D quality control of solder paste
application Workstation Visual check of the mounted boards 3D Koh
Young AOI of the soldered products 100% 3D control of the soldered
products Highquality
3. Nutek laser marking system
4. Nutek laser marking system PCB marking
5. PCB marking StarLine production PCB laser marking with the
unique code 100% durability Clear identification of each PCB Full
tracebility of a product lifecycle No identification of each PCB No
tracebility and a product history Fragility of the labels Ordinary
production No marking Labels
6. Teknek PCB cleaning system
7. Teknek PCB cleaning system Adhesive rollers remove
micropollution from the PCB
8. PCB before cleaning PCB after cleaning PCB cleaning StarLine
production Microparticles on the PCB surface Microdefects in solder
joints Ordinary production PCB without cleaning Teknek adhesive
rollers remove micropollution from the PCB Cleaning provides high
quality of the solder joints
9. Panasonic SP-70 screen printer
10. Panasonic SP-70 screen printer Accuracy of solder paste
application is 20 microns
11. 100% automation = 100% quality Solder paste application
StarLine production Production stops for solder paste adding Paste
verification either by a bare guess or after detection of assembly
defects Application speed and printing accuracy depend on operators
skills Ordinary production Hand-made or semiautomatic equipment
Automatic solder supply. Continuous solder printing. Measurement of
squeegees height on stencils. Stable quality Application speed is
12 sec. with printing accuracy of 20 microns
12. 3D Koh Young solder paste inspection
13. 3D Koh Young solder paste inspection 3D inspection of
solder paste volume
14. 3D Koh Young solder paste inspection Solder paste
inspection StarLine production 2D inspection of screen printer No
control of solder oversupply or shortage Low productivity No solder
paste inspection No quality control The application defects result
in spoilage of the mounted products Ordinary production 3D
measurement and defect detection of solder paste application: 100%
3D quality control of solder paste application in accordance with
IPC 610 requirements Oversupply Shortage Misalignment Bridging
Change of form
15. High-performance Panasonic NPM-W pick and place modular
system
16. High-performance Panasonic NPM-W pick and place modular
system Velocity of up to 210 000 cph
17. High-performance Panasonic NPM-W pick and place modular
system Placement accuracy of 50-150 microns Low velocity Ordinary
production Surface mounting StarLine production Small-scale or
medium-scale pick and place systems Placement of components with
01005 size Velocity of up to 210 000 cph with placement accuracy of
20 microns Placement of connectors on the Pin&Paste technology
Placement of components with non-standart shape
18. Senju SNR-1065 convection oven
19. Senju SNR-1065 convection oven 10 heater zones 2 cooling
zones
20. Senju SNR-1065 convection oven No active cooling Unstable
temperatures High power consumption Ordinary production Soldering
and reflow StarLine production Convection oven High quality solder
joints due to active cooling Use of PB-free technology Stable
temperatures in the zones of 1C Energy efficiency and environmental
friendliness
21. Koh Young Zenith 3D Automotical Optical Inspection
22. Koh Young Zenith 3D Automotical Optical Inspection 100%
quality control
23. Koh Young Zenith 3D AOI inspection Human-factor dependence
Low productivity No component height measurement False alarm
Ordinary production Component inspection StarLine production Visual
inspection 2D inspection High-speed 3D camera Component height and
volume measurement Component inspection in accordance with
IPC-A-610 standards
24. Automatic PCB separator SAR-1300
25. Automatic PCB separator SAR-1300 Disk and milling PCB
separating
26. Automatic PCB separating SAR-1300 PCB separating StarLine
productionOrdinary production Manual PCB separating High accuracy
and repeatability of the separation Separation by means of disk and
milling cutter ESD protection Possible damage of components
(microcracks) Low productivity Semi-automatic PCB separating
Possible PCB damage
27. X-ray control
28. X-ray control Quality control of the solder joints
29. X-ray control X-ray control StarLine productionOrdinary
production No X-ray control Quality control of mounted complex
components such as BGA, QFP, FlipChip, etc. Quality control of the
solder joints: short circuit, hollow spaces in solder joints No
quality control of mounted complex components such as BGA, QFP,
FlipChip, etc. No quality control of the solder joints
30. Super Swash washing
31. PCB before washing PCB after washing PCB washing StarLine
production Flux remaining on the PCB Risk of corrosion and white
bloom Low productivity Need of additional operation: PCB drying
Possible damage of crystals Ordinary production PCB without washing
Ultrasonic washing Automatic PCB washing Drying by heated air with
the use of air knives
32. Functional testing
33. Functional testing Functional product testing StarLine
production Decrease in production of high-quality products Failure
during operation Ordinary production No functional testing 100%
checking of products Guarantee of reliable work
34. Climate chamber
35. Product testing Product testing StarLine production No
product testing in severe climatic conditions Decrease in product
reliability Failure at the end user Ordinary production No testing
Product testing at temperatures from -75 to +180 C and humidity
from 0 to 98% Detection of potential defects and their
elimination
36. Storage of components Antistatic components protection
37. Correct storage of components Storage of components
StarLine production Risk of components damage by a static charge
Moisture accumulation by the components poor solderability Ordinary
production Incorrect storage of components ESD protection of
components Adherence and control of temperature and humidity
modes
38. Dry storage cabinets Adherence of moisture protection
requirements
39. Correct storage of components Storage of components
StarLine production Penetration of moisture into components
Appearance of latent defects at the soldering reflow Ordinary
production Incorrect storage of components Protection of sensitive
components against moisture No risk of damaging components
40. 3D modeling and housing production
41. 3D modeling and case production 3D case modeling StarLine
production Manual mechanical engineering Expensive prototypes
Ordinary production 3D modeling and housing production Computer
mechanical modeling Prototyping with the aid of 3D printer
42. Design of packaging and printed materials
43. Design of packaging and a full range of printed materials
Design of printed materials StarLine production No use of optimal
sized packaging Featureless products No product recognition
Ordinary production No packaging design service Use of packaging
which closely matches the product dimensions logistics optimization
Self-selling packaging Design in the customer corporate style
44. Ordering and getting the test sample from abroad Testing
and debugging of the test sampleTesting and debugging of the test
sample Pre-production Production of electronic devices abroad
Delivery to Russia Assembling, packaging, preparation for shipment,
input quality control of the components 1 0 2 3 4 5 6 7 8 9 10 11
12 Pre-production, assembling of test sample in Saint-Petersburg
Production of electronic devices Delivery of components for serial
production Assembling, packaging, preparation for shipment Product
modification (if necessary) Product modification (if necessary)
Timefornewideas Production in Saint-Petersburg Term of production
StarLine production Logistics cost grows with the rate of $ Cost of
work grows with the rate of $ 4-6 months for the repeated order
Ordinary production Production in South-East Asia Logistics cost is
in rubles Cost of work is in rubles 2-4 weeks for the repeated
order
