Atmospheric plasma
Radio Frequency Scanner
Modern trends and challengesNew Material and Coatings
development:Composites space, automotive, aviation,
constructionsProtective, anticorrosive coatingsFunctional
filmsFlexible printed circuit boardsChallenge: low adhesion
level
Chemical/Electro-chemical methods toxic, product utilization
problem, high specialization, inertness, multistep
processingUV-treatment low intensity, ozone generationPlasma
methodsLow pressure high cost, high resultIon gunPlasma
treatmentAtmospheric methods cheap, lower
intensityCorona/Dielectric Barrier Discharge low stability, large
areas, high power consumptionRF Jet treatment high stability, small
areas
Existing Technologies
Plasma surface treatment leads to:Dirt, dust, oil
removalSterilization (due to UV-generation)Relief complexity
increaseFunctional groups formation (OH-, COC-, CH3- etc.)Benefits:
Unselective process can be applied to metals, plastics, glass,
othersControlled treatment intensityEco-friendly technologyBetter
precision (against chemical methods)
Less defect rate, the protective coating is much more stable, it
is possible to use unique combinations of materials, with the
exception of primer, etc.Trend: plasma activation usage. Why?
What are the methods nowadays?Benefits and
limitationsLarge-scaleHigh power consumptionLow stabilityHigh ozone
generationSpot-scaleLow power consumptionHigh stabilityLow ozone
generation
DBD discharge RF Jet
Vetaphone SurfxtechnologiesDYNE Technology Jesagi Hankooj
LTDFraunhofer IFAM
Atmospheric plasma device companies
New approach Radio Frequency ScannerOnly advantages
airstringIgnitionelectrode
Large scaleHigh stabilityLow ozone generationLow power
consumption
Technologies comparisonFeatureDBDRF JetRF ScannerTreatment
intensityMediumHighHighTreatment homogeneityMediumHighHighPower
consumption15-30kW200W2kWTreatment
width100-300cm5cm80-160cmIgnition voltage25kV8kV8kVWorking
voltage15kV5kV5kVDevice stabilityLess due to high
voltagesHighHighOzone generationHighLowLowInert gases use for
ignitionYesNoNo
Radio Frequency Scanner - new opportunities in large-scale
plasma processing:High scalable methodLow-cost process: 1$ =
2,200m2(15-times less power consumption) Higher stability due to
lower working voltagesIndependent speed control (doesn`t require
power increase to maintain homogeneity)Ability to treat thick and
thin materials
Copper platingWetting angle increasePSPIPE
Device approbation
: adhesion tests(Oil paint)
After treatment
cross-cut testcross-cut testmechanical stress (10 times
deformation)
raw
poor adhesionhigh adhesionTreatment
APP treatment ( Analysis of surface: microscope) Magnifying: 100
times
raw
1 time treatment 2 times treatment 4 times treatment 6 times
treatmentFootwear rubber
Future work
Further researchGas dynamics and plasma simulationsGas discharge
channel geometry modelingPrototyping and optimization of:gas
discharge channelbreakdown and discharge gap distanceactive
electrode curvaturegas inlet-outlet modulesgas flow
pressure-velocityDual-channel RF generator purchaseTwo-sided system
with better treatment homogeneity development and optimization
Current prototype
Video materials
Testing new configuration
Video materials
Material processing
Interested OrganizationsProcessing of sheet aluminum before
painting, "Sespel" factory (Cheboksary, Russia)Glass processing
before applying LCDs, SunPla Eng. (South Korea)Sheet glass
processing for armored glass production. OJSC
"Mosavtosteklo(Moscow, Russia)Russian Quantum Center is interested
in co-investment
Looking forward for collaboration
PlasmaTreat- www.plasmatreat.ru Vetaphone - www.vetaphone.com
Tantec - www.tantec.comDYNE Technology -
www.dynetechnology.co.ukAcxys - www.acxys.ruEnercon Industries -
www.enerconind.comSigma Technologies www.sigmalabs.comAhlbrandt -
www.ahlbrandt.deJesagi Hankooj LTD. - en.jesagi.comArcotec -
www.arcotec.com SurfxTechnologies -
www.surfxtechnologies.comCompanies Scitations
