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1www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
PowerSoC & PowerSiP markets are preparing. Are you?Or Micro-power electronics world explained
Alex AVRON – [email protected]: @pntpower
2www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Outline of the presentation
§ Introduction
§ PowerSiP & PowerSoC World
§ Enabling Power SiP
§ Trends to watch
§ Conclusion
3www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Introduction
4www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
« Power » under the spotlight
Power electronics and power consumption are under the spotlight:• At high power for renewables, transport…• At low power for tablets, phones, laptops and all embedded
electronics
Drivers towards micro power electronics integration are here, and the market will follow:
• Power efficiency
• Power output stability
• Time-to-market
5www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Computing power vs. Consumed power (1/2)
1980 1990 2000 2010
10
1000
10 000
1 000 000
Transistors(thousands)
Frequency(MHz)
Typical power(Watts)
Year
Frequency and energyconsumption diet
Source: Intel, Wikipedia, “Dr. Dobb's Journal” #3 03/2005
1
100 000
100
Intel processors specifications evolution since… 1975
6www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Power system size reduction: Trendy at all levels!
Lifetimein years
Efficiency
CostSizeWeight
Traditional Prototype Expected
Source: DTU - Arnold Knott – ECPE Workshop 2015Hypothesis on a 50W-100W range power supplies
26
1085% 86% 92%
100%
100%
100%
20%
20%
10%
10%30
%50%
Frequency of switching 150 kHz 30 MHz +100 MHz
7www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
PowerSiP & PowerSoC world
8www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
PowerSiP & PowerSoC: Definitions 1/2
LDO Control IC FET driver Power FET Inductor Capacitor
MCMPower IC
Co-packageDriver+FET
Driver+FETMonolithicPower ICPMU
PassivesPowerControl
Pack
age
inte
grat
ion
Waf
er in
tegr
atio
n
PowerSiP
PowerSoC
9www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
PowerSiP & PowerSoC: Definitions 2/2
Discrete components on PCB
Co-packaged inductorwith capacitor on PCB
Inductor+IC on chipwith capacitor on PCB
Inductor+Capacitor+ICin package
Inductor+Capacitor+ICon one die
The key hurdle is still passives: Integration in package or on wafer
Pack
age
inte
grat
ion
Waf
er in
tegr
atio
n
10www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Most advanced solution to date: PowerSiPPackage integrationWafer integration
11www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Enabling PowerSiPwith advanced packaging
12www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Competing Wafer/panel scale packaging landscapeCandidates for Power Electronics Integration
P-o-PInterposer3DICEmbedded IC
Ultra fine pitch<20µm
For hi-densityHi I/O number
Ultra fine pitch<20µm
For hi-densityHi I/O number
Large pitch250µm
For med-densityLow I/O number
Larger pitch50-100µm
For med-densityLow I/O number
Easier passiveintegration
Best
sol
utio
n fo
r pow
er e
lect
roni
cs
Packaging leaders
13www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Example: AT&S ECPAT&S ECP
• Single Power Device embedded• Up to 10A• Substrate level integration:• 40% to 70% footprint reduction
• Applications• Power Management Unit• Li Battery charger• µDC/DC buck converter
Different heights
Applied in:• GaNsystems 600V
devices
14www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Example: TDK SeSUBSilicon Embedded SUBstrate
• All integrated System-in-Package solution• Up to 8A• 40% to 70% footprint reduction• Low power only (less than 5V)
• Applications• Power Management Unit• Li Battery charger• µDC/DC buck converter
1mm
0.3mm
Multiple layers
Applied in:• Blackberry Z10
smartphones (2013)
15www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Example: ASE a-EASI
Die
Bump
• Half-Bridge + Driver Power Device• Up to 10A• Substrate level integration:• 40% to 70% footprint reduction
• Applications• Power Management Unit• Small Power Converter/inverter• DC/DC converters
Applied in:• Infineon Half-Bridge
a-EASI
16www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Micro Power Electronics device manufacturers
§ Mainly US based companies
17www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Integrated power maker’s product positionningHigh end
Volume of production
Low end
Prod
uct
rang
e
PowerSiPPowerSoC
Mass productionSmall volume
18www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Advanced Packaging players
§ Asian companies will be the « doers » ( Fab and packaging).
19www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
M&A in the « Micro power electronics » world
20www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
M&A in the « Micro power electronics » world
A semiconductor company:- FPGA- ASIC- µprocessor
Intel, Altera, MicrochipA PSiP/PwrSoC – converter maker:- DC/DC converter- Power IC- Patent and IP
Enpirion, Volterra, Micrel…
• Semiconductor heavy players, having needs for power management in their integrated computing ICs.
• Spending what’s needed to have both Information processing and power processing
21www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Applications of PowerSoC and PowerSiP
System Power
Tota
lAcc
essi
ble
mar
ket
2016
Server & Data computing
Personalelectronics
Home appliances
LED lighting
MilitarySatellite
Communications
Used for “fast design cycle” and “PCB space saving”
1st target market
Autonomous car
Wearable Electronics
22www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
PSiP and PowerSoC market forecast
0
200
400
600
800
2014 2015 2016 2017 2018 2019 2020
PwrSoC and PSiP market forecast in USD Millions
PSiP
*Figures include only open-market
This is a preliminary figure. It is subject to evolution and adjustment.Your feedbacks are welcome!
23www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Trends to watch
24www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
The key role of Packaging in today’s supply-chain
Device design Fab
Packaging
Wafer level Assembly&Test PCB Assembly End-product
FoundriesFabless
IDMs
OSAT
SiP/SoC strategic playground
§ Advanced packaging players will be at the heart of Power Electronics SiP/SoC supply-chain (as they are today for other SiP-SoC)
25www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
GaN IC –> higher power integratin levels
Illustration example based on Powdec SJ GaN design
Source Drain
Gate
P-GaN
AlGaNGaNSapphire
IsolationControl IC
Potential design of a GaN Power IC
Companies to watch in GaN based power ICs
Power+IC on the same GaN Wafer
Target applications
LED lighting Home appliances
AC adaptor
26www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Conclusion
27www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Conclusion• Strong market drivers• Need for better performance and specifications• Technologies becoming available• Strategic acquisition of companies and their know-how/knowledge
PowerSoC and PowerSiP is very active.We are at the edge of an evolution, to become a revolution.
At very low power:Intel is making most of it, with its integrated VR in Haswell processor combined with Enpirion’sacquisition (through Altera). Other players also work toward this path integrating passives and low power devices.
At Low Power:All Power management unit maker’s are willing take profit of the technologies and supply-chain in place for other applications (MEMS, RF…). Power Electronics will become another application of several SiP packaging technologies.
At Medium Power:Start-ups will come with concepts, IP and patents of integrated converters unleashing performances from GaN and VHF conversion. GaN IC with integrated drivers will help !Passive components maker have now a reason to develop integrated passives.But this will come step by step: System makers need to be assured it will work!
28www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
OUR
CONTACT INFORMATION
SOCIAL MEDIA
www.pointthegap.comwww.pointthepower.com
ADDRESS
WEB
TEL
61 cours de la Liberté69003 – LyonFrance
+33 6 14 77 22 95
Feel free to ask any question…This is an on-going work,Feedbacks are welcome
Check www.PointThePower.com for updates on PowerSoCand PowerSiP, and power electronics in the future
Twitter: @pntpower
29www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Point the GapYour tailor made market intelligence specialistExperts in power electronics and semiconductor [email protected]
30www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
The idea: A tailor made market intelligence service
Gather your team to discuss competitive landscape… …and put them on a learning
curve about market and technologies
…and identify your new market
opportunities
Validate your products and projects in the competitive landscape…
Keep track of yourcompetitors and competing technology…
…and anticipate and act knowing the landscape
31www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
What we do? Market intelligence
Market research:
Analysis of business models and strategies
Custom report tailored to your needs
Direct interviews with experts
Get the full picture of your market
« How can I know my strategy is right? »
Anticipate trends and evolutions
++
=
32www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
What we do? Market Intelligence
Marketing survey:
Direct interviews with experts
Innovation marketing methodologies
Evaluate your innovations or technologies
« What are the markets for my technology? »
Build your strategy on facts and feedbacks from the field
+
=
33www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
What we do? Market reports
1. You pre-buy a report
2. We get to work
3. You receive a market report answering your questions
With thousands of potential leads to investigate, let’s decide togetherwhich subjects are crucial!
« The best market reports are the one, answering your key questions »
We suggest a list of reports. You pre-buy the reports you need.As a pre-sales, the report is not available now, but is also cheaper. For 4 to 6 weeks, we follow our proven
design process: phone interviews, data scouting and nights of analysis!
You are charged when the report isdelivered, and can enjoy specificinformation at competitive price.
34www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Market reports: Basics of Power electronics
Basics of Power ElectronicsA stress relief and communication optimization tool between tech & non-tech staff – December 2015
Our level
7"
Conversion is needed everywhere, as we produce electricity in one place, transport it and use it for different purposes in different places. Improving power converter’s efficiency is key in our way to a sustainable future.
Material and packaging level
10#
These switches are made from a raw semiconductor material sliced into wafers that is subject to chemical treatments, processes, then diced into dies. Each small piece of wafer (a die) can then be packaged to be used as a switch.
Switch
The different types of conversion
• DC to AC: also called inversion – Inversion is made using switches to make a direct current
flow alternatively in one way and the other. The controlled switch is the basic of semiconductor and power semiconductors. Controlling the switches, we can control the voltage and the frequency of the output. It is then smoothed using filters, to approach a sinus wave.
Volt
age
Volt
age
Volt
age
DC power (= Direct current) Through an inverter (Simplified view)
AC power
17#
Power electronics applications: market drivers
104$
Weight're
duc,o
n'
Efficiency
'
Cost'r
educ,
on'
Form'factor'
Energ
y'cost'raise'
Green'tech'needs'
Big'Da
ta'
Smart'grid'
Electric'm
obility'
Factory'Auto
ma,on'
PV'inverter'
Electric'car'
Rail'trac,on'
Wind'turbine'
Uniterrup,ble'Power'Supply'
Motor'drive'
Growth'drivers'Main'stakes'Reliab
ility'
35www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Market reports: GaN devices and applications
Gallium Nitride devices and applicationsAll about device makers and targeted applications – August 2016
5 www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Gallium Nitride power devices market difficult to estimate
-
$ 100M
$ 200M
$ 300M
$ 400M
$ 500M
$ 600M
$ 700M
2014 2015 2016 2017 2018 2019 2020
GaN power market to 2020 draft estimation
? 8 www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
GaN power devices players: What and how?
8’’
6’’ 4’’
2’’ GaN
GaN
GaN
Si
GaN
Si
GaN
Si
600V
650V
600V
600V
450V
600V
600V
Rated voltage
Device type
Cascode
Cascode
Cascode
Enhancement mode
Enhancement mode
Enhancement mode
Enhancement mode planned
Substrate
6 www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
GaN power devices start-ups & heavy players
Heavy players
Start-ups
?
36www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
How we do it: Our expertise in action
Marketing survey
Market research
Conferences
Direct interviews
•Data mining software•Data graph tools•Design results
•Business model analysis• Innovation Marketing•Market analysis tools
Web & Data Mining
News
All tailored to your specific focus and needs using:
Step 2 Step 3 Results
How we do it:
Step 1Get to know you, your projects, your targets
Market intelligence
+ =
37www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Our expertise: concerned fields
Wat
ts
Pass
ives
Pack
agin
g
Sem
i-con
duct
or
Kilo
wat
ts
Meg
awat
ts
Disc
rete
&
mod
ules
Conv
erte
rs
Si/S
iC/G
aN
From material,
through manufacturing,
passives and assembly,
and up to applications
Power electronics:
38www.pointthegap.com - 2015 | Power electronics and semiconductor competitive intelligence services
Who we are
Point the Gap is…
…initiated by Alex AVRONEng. Electronics and semiconductor
4 years experience as Market and Technology analyst in Power semiconductors at Yole
Competitive intelligence teacher in University
Readable material Business-oriented Technology expertise
…made of “communicating-business-technologists”: