CorporateProfile

Corporate Office:15991 Red Hill Ave Suite 102, Tustin, CA 92780Direct: 408-667-3333Office: 714-460-0718 x 115

Home Page:WWW.PALPILOT.COM

Advanced PCBs, Interconnects, and Magnetics

China PCB Production / 2001Taiwan PCB Production / 1999N. & S. California Facility Established / 1993 / 1997

PALWONN Group Established 2010Component Division Established. Strategic Alliance with / 2007

Established FastPrint PalPilot North America / 2013

Magnetic, PalCELL and PalMEMS Divisions / 2012 Strategic Alliance with Sitor / 2011 Suzhou (ZPW) Started Production / 2011

1993 2007 2011 2013 2014

Milestones

GLOBAL REVENUE / 09-13

0 US$ Million

200 US$ Million

400 US$ Million

600 US$ Million

800 US$ Million

1000 US$ Million

1200 US$ Million

PCBConnectorPCB Design

Revenue Totals Based on Global Alliance PartnersGlobal Revenue / 2009-2015

2009 2010 2011 2012 2013 2014 2015*

*Projected

EngineeringDivision

Measurement

High Speed Connectors PCB Manufacturing

Advanced Packaging Supply

Enclosures

Integrated Interconnect Solutions

CrossFunctional

Design

SI/PI ModelingCollaborativeDevelopment

- Component Library- Schematic Symbol Creation- 2D/3D Mechanical Design- Footprint Creation

- Design PCB Layout- Place & Route- 24-Hour PCB Routing Services

- Constraint Rules Driven- 100% Manual Hand Routing- Design Partitioning, Multiple

Designers

- Connector Innovation- USB 3.1 Contributing Member- SFF, MSA Compliant- Customized High Speed Design

- Thermal/Electrical Enhancement

- Signal/Power Integrity (SI/PI) Modeling- Impedance Optimization- Minimize Return Loss- Insertion Loss Reduction- Cross Talk Reduction - Power I/R Drop Characterization

- Agilent Joint Laboratory (System Measurement)- Simulation Vs Measurement- Characterization & Validation

Integrated Interconnect Solutions

PCB Fab&

IC Substrates

PalPilot’s Factories Offer

- Quick Turn Around 5-10 days from Asia- High Mix Low/Medium Volume (HMLV) Production For Low and High technology PCB’s

- High Volume Production (1 -40 layer) - High Layer (Line card/Backplane)- Flex and Ridge Flex- High Density Interconnect (HDI)

- IC Substrate High Density CSP Substrate Next Generation High I/O (<100um FC Package) Metal Core + Flex (High Thermal Substrate) Class10,000 Cleanroom; Class 1,000 Photoprinting

PCB & Substrate Manufacturing Disciplines

PCB DIVISIONCapabilities / Rigid PCB

- Layers 1-40 (layers)- Max Board Size 24” x 40”- Max Board Thickness .315”- Min. Board Thickness 4 layers 16mil, 6 layers 24mil, 8 layers 40mil, 10 layers 48mil, 12~16 layers 63mil- HDI Boards Blind, Buried & Stacked Vias- Min. Line Width / Space 3mil- HDI Line Width / Space <1mil- Min. Mechanical Drill / Pad 6mil/16mil- Min Laser Drill / Pad 4mil/10mil- PTH Dia. Tolerance ±3mil- NPTH Dia. Tolerance ±1mil- Hole Position Deviation ±3mil- Outline Tolerance ±4mil- Solder mask Dams 3mil- Aspect Ratio Mechanical 15:1- Aspect Ratio Laser 1:1- Flammability 94V-0- Impedance Control ≤50 OHMS = ±5OHMS >50 OHMS = ±10%

PCB DIVISIONCapabilities / Flex

- Layers 1-8 (layers)- Max Board Size 8.6” x 13.8”- Max Board Thickness .031” without stiffener- Min. Board Thickness 4mil- Min. Line Width 3mil- Min. Line Space 3mil- Min. Mechanical Drill 6mil- Outline (Laser) Tolerance ±2mil- Cover Layer Dams 8mil- Flammability 94V-0- Impedance Control ≤50 OHMS = ±5OHMS >50 OHMS = ±10% 

- Leaded HASL- Lead Free HASL- Immersion Gold (ENIG)- Immersion Gold (ENEPIG)- Immersion Silver- Immersion Tin- Hard Gold (Fingers)- Selective Hard Gold- Wire Bondable Soft Gold- Flash Gold- OSP- Carbon Ink

MATERIALS SURFACEFINISHES

MATERIALSUPPLIERS

- Isola- Sheng Yi- ITEQ- Ventec- Nelco- Megtron- Rogers- Taconic

Materials & Surface Finish

- Standard Tg FR-4- Mid Tg FR-4- High Tg FR-4- High Speed Materials- Mixed Dielectric Constructions- Halogen Free- High CTI- Polyimide (adhesive, adhesiveless)- PET / Polyester- Metal Cores

IC Substrate / Package Product Family

CSP Substrate(WB & FC)

Ceramic on Organic Laminate (COOL)

Metal CoreFlex/COB

High DensityCSP Substrate

ThermalManagement

Ultra High Density “Core Less” Package

IC Substrate Product Family

- IC Package Electronic Test Services:- Impedance & S Parameter…

- Package Design- IC Substrate Design- Substrate Production…

ElectricalPackage / Substrate PackageMeasurement

- Package EM Simulation- Extracting RLC Parameters & S Parameters- Package SI/PI Simulation- PKG & PCB Co-Simulation

Components

- USB 3.1- USB 3.1

Type-C - USB 3.0- USB 2.0- USB Type A- USB Type B- USB Type AB- Mini USB- Micro USB

- SATA- eSATA- Micro SATA

- Type A (1.0 Spec)- Type B (1.0 Spec)- Type C (1.3 Spec)- Type D (1.4 Spec)- Type E (1.4 Spec)- Mini-HDMI- Micro-HDMI

USB, SATA & HDMI Connectors

HDMISATA USB

- 10/100/1000 Base-T- 10GBase-T- RJ45 + USB Combo- PoE/PoE Plus with Internal Diode Bridge

- Single Port- Multiple Port- Stacked Port- Low Profile- Vertical- Custom Configurations- Optional Emi Tabs

- Integrated Magnetics- Tab Up or Tab Down- LED Color Options- Surge Protection- RoHS Compliant

Types Features

RJ45 W/ Magnetics

Packages

LANModules Inductors Filters

CommonMode

ChokesTransformers

- 10/100/1000 Base-T LAN Magnetic Discrete Modules- PoE/PoE+ Modules

- Power- Signal- Energy Storage- Power Supply

- Signal Filtering- Noise Filtering- Power Supply

- Noise Suppression- Power Supply- Telecom

- Flyback- Coupling- Analog- RF - Switching- PoE/PoE+- T1/E1

Discrete Magnetics

- nQSFP+ 100G/112G 25~28Gbps/Channel - nSFP+ 25~28Gbps Data Rate

- QSFP+ 40G~56G- 10~14Gbps/Channel- Press-Fit or Solder Tail- Light Pipe- Heat Sink

- SFP+ 10~14Gbps Data Rate- Press-Fit or Solder Tail- Light Pipe- Heat Sink

- SFP 1~5Gbps Data Rate- Press-Fit or Solder Tail- Light Pipe- Heat Sink

Meet SFF Committee Specification & Fully MSA Compliant

nQSFP+nSFP+ SFPQSFP+ SFP+

High Speed I/O Connector

- 0.4 Pitch. 0.8H/0.9H/ 1.0H/1.5/H2.0H.- 10 Pin~60 Pin- Designed to Prevent Tin Wicking- Narrow Design to Reduce Space for PCB

- 0.3mm, 0.5mm Pitch 1.0H- 6 Pin ~ 67 Pin- Front and Backflip Lock- Designed to Prevent Tin Wicking- Superior Solder Peg

- 1.2H/1.5H/2.5H Plug and Socket Series 0.81/1.00/1.13/1.32 /1.37 Wire- Supports Insert Molding Process for Sealing- Strong Chamber for Better Molding and Mating Guide

- 1.5/1.30H Push Pull Type Micro SD- Locking Feature for the Design- Anti Card Fast Eject Function- Detection Switch Pin Attached- Low Profile Sim Card

- Plastic Cover- Stamping Contact- Insert Molding Mechanical Structure

FPCConnector

RF Connector

Custom Made

ConnectorMemory

CardBTB

Connector

BTB, FPC, RF, Custom Connector, Memory

- Flex-Pin Design with Beryllium Copper material - The best solution for resisting vibration and shock- Small contact size, 50 mil pitch- Ø 0.27” outer housing with 12 contacts - Tail options for pre-wired, solder cup, and solid straight tail

- PSU or PEI plastic housing - Peek insulator for high performance- Autoclave sterilization & disinfection levels- Tough-proof design- Color identification & Keying options - Disposable types

- Robust self-latch mechanism- DIP and Solder cup contacts - Error-proof keying options- Fully EMC protected - 2 to 32 contact options- Water tight IP67 F0K/F1K/ F2K series

- Robust self-latch mechanism- Solder, Crimp and Print Style Contacts - Error-proof keying options- Fully EMC protected - 2 to 32 contact options- IP50

Segment View

Push-Pull Locking Circular Connector

P SeriesPush-Pull

B-Series Push-Pull

K SeriesPush-Pull

MicroCircular

Cable Assembly

AOC HDMI USB LVDSSATA RF

- 56G QSFP + AOC - 40G QSFP+AOC- 10G SFP+AOC- HDMI + AOC- Hot Pluggable- Fiber to 100M- QSFP+MSA Compliant

Form Factor- HDMI Compliant with

version 1.4a

- HMDI 19 Pin Male to Male

- HDMI 19 Pin Male to DVI-D

- Custom Design - Low Noise- High Volume

Manufacturing Capabilities

- USB 2.0 A to B- USB 3.0 to 3.1- USB 3.1 Type-C - Custom Design- USB Committee

Member

- Crimp Terminal LVDS

- Housing LVDS- SATA 7pin/

7+6pin/7+15pin/

- Matches high frequency characteristics

- 1.2H/1.5H/2.5H plug and socket series 0.81/1.00/1.13/1.32/1.37 wire

Injection Molding, Coating, & Metal Die-Casting

- Tooling Design

- Hot Runner

- Double-Shot

- Makino & Charmiles Manufacturing Equipment

- Quality, Ultra-Slim Plastic Injection

- Metal Stamping

- Extrusion Aluminum Die-Casting

- Gate Cut in Mold Technology

- More than 220 High Speed Injection Machines

- Advanced Spray Painting Tech

- Anti-Finger Print Finish

- Soft Touch Finish

- 8 Fully Automatic Lines Up to 5 Chambers/Line

SprayPaintingInjection

ToolingShop

Amazon Kindle Fire HD Tablet Lenovo Yoga Blade Tablet Lenovo S8 Custom Heat Sink

Corporate Offices / Design Center Regional Sales Offices PCB Manufacturing / Design Center

PalPilot Taiwan Magnetic ManufacturingConnector Manufacturing

Global Locations

EMS Customers

OEM Customers

Any Inquiries, Contact:

Randy Yang, Sales ManagerDirect: 408-667-3333

randy.yang@palpilot.com15991 Red Hill Ave Suite 102,

Tustin, CA 92780