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NFX Best Practice
Evaluation of Junction Temperature of a
Semiconductor System Used in Telecommunications
Powerful, Fast, Affordable FEA | www.midasNFX.com
Overview
Predict junction temperature of the system under the condition of forced air cooling by fans.Improve system design according to analysis results.
General flow analysisFluid-solid coupled heat transfer CFD analysis
Modeling: 3D solid elementsAnalysis Condition:Inlet: fan (pressure-flux curve)Outlet: fan (pressure-flux curve)Surface: non-dimensional wall distance, chip heat generationLoading condition: Forced displacement of 4 times material thickness on y direction
Results
Temperature distribution on whole system Temperature distribution on cross section
Temperature evaluation of PCB – chip –heat sink system
Temperature evaluation
Authors
Apoorv SharmaCAE Consultant at Midas IT
Cyprien RusuCAE Mechanical Engineer
Piotr StepienSenior Application Engineer
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