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ZXSS10 B200Broadband Gateway

Hardware Description Manual

Version 2.00.50

ZTE CORPORATIONZTE Plaza, Keji Road South,Hi-Tech Industrial Park,Nanshan District, Shenzhen,P. R. China518057Tel: (86) 755 26771900Fax: (86) 755 26770801URL: http://ensupport.zte.com.cnE-mail: [email protected]

LEGAL INFORMATION

Copyright © 2006 ZTE CORPORATION.

The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution ofthis document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPO-RATION is prohibited. Additionally, the contents of this document are protected by contractual confidentiality obligations.

All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE CORPORATIONor of their respective owners.

This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions are dis-claimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-in-fringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on theinformation contained herein.

ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering the subjectmatter of this document. Except as expressly provided in any written license between ZTE CORPORATION and its licensee,the user of this document shall not acquire any license to the subject matter herein.

ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.

Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.

The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History

Revision No. Revision Date Revision Reason

R1.0 Dec 28th,2009 Version upgrade

Serial Number: sjzl20096977

Contents

About This Manual.............................................. i

Hardware Structure of ZXSS10 B200-R08 .........1System Appearance ........................................................ 1

SMP.............................................................................. 3

Line Interface Board ....................................................... 6

Power Module ................................................................ 9

Fan Shelf......................................................................12

Hardware Structure of ZXSS10 B200-R04........15System Appearance .......................................................15

SMNP...........................................................................17

SMPI............................................................................20

Line Interface Board ......................................................22

Power Module ...............................................................25

Fan Shelf......................................................................27

Hardware Structure of ZXSS10 B200-R02........29System Appearance .......................................................29

SMNP...........................................................................30

SMPI............................................................................31

Line Interface Board ......................................................31

Power Module ...............................................................34

Fan Shelf......................................................................36

Hardware Structure of ZXSS10 B200-S01........39System Appearance .......................................................39

Front Panel ...................................................................39

Back Panel....................................................................41

Technical Indexes ..........................................................42

Hardware Structure of ZXSS10 B200-S02........45System Appearance .......................................................45

Front Panel ...................................................................46

Back Panel....................................................................48

Main Board Structure .....................................................49

Technical Indexes ..........................................................51

Figures ............................................................55

Tables .............................................................57

About This Manual

Purpose This manual describes ZXSS10 B200 Broadband Gateway productseries in terms of system structure, main modules as well as re-lated technical indexes.

IntendedAudience

This manual is intended for engineers and technicians who performoperation activities on ZXSS10 B200 Broadband Gateway productseries.

Prerequisite Skilland Knowledge

To use this manual effectively, users should have a general under-standing of wireless telecommunications technology. Familiaritywith the following is helpful:

� ZXSS10 SS1b SoftSwitch system

� Local operating procedures

� Equipment Environment

� Operation and functionality of ZXSS10 SS1b B200

What Is in ThisManual

This manual contains the following chapters:

TABLE 1 CHAPTER SUMMARY

Chapter Summary

Chapter 1, Hardware Structure ofZXSS10 B200-R08

It introduces the hardwarestructure of ZXSSS10 B200-R08.


It introduces the hardwarestructure of ZXSS10 B200-R04.


It introduces the hardwarestructure of ZXSS10 B200-R02.

Chapter 4, Hardware Structure ofZXSS10 B200-S01

It introduces the hardwarestructure for ZXSS10 B200-S01,and some related technicalindexes as well.

Chapter 5, Hardware Structure ofZXSS10 B200-S02

It introduces the hardwarestructure for ZXSS10 B200-S02,and some related technicalindexes as well.

RelatedDocumentation

The following documentation is related to this manual:

� ZXSS10 B200 (V2.00.50) Broadband Gateway Product De-scription Manual

� ZXSS10 B200 (V2.00.50) Broadband Gateway Hardware In-stallation Manual

� ZXSS10 B200 (V2.00.50) Broadband Gateway Data Configu-ration Guide

� ZXSS10 B200 (V2.00.50) Broadband Gateway Operation Guide

Confidential and Proprietary Information of ZTE CORPORATION i

ZXSS10 B200 Hardware Description Manual

� ZXSS10 B200 (V2.00.50) Broadband Gateway MaintenanceManual

� ZXSS10 B200 (V2.00.50) Broadband Gateway CommandsManual

ii Confidential and Proprietary Information of ZTE CORPORATION

C h a p t e r 1

Hardware Structure ofZXSS10 B200-R08

Table of ContentsSystem Appearance ............................................................ 1SMP.................................................................................. 3Line Interface Board ........................................................... 6Power Module .................................................................... 9Fan Shelf..........................................................................12

System AppearanceOverview Figure 1, Figure 2, and Figure 3 show the whole appearance of

ZXSS10 B200-R08 hardware platform. -48V DC or 220V AC isapplied in the power supply of ZXSS10 B200-R08, as shown inFigure 2, and Figure 3.

FIGURE 1 THE FRONT VIEW OF B200

Confidential and Proprietary Information of ZTE CORPORATION 1


FIGURE 2 AC POWER SUPPLY-THE BACK VIEW OF B200

FIGURE 3 DC POWER SUPPLY- THE BACK VIEW OF B200

Whole-SystemStructure

ZXSS10 B200-R08 is made up of a plug-in box, two power sup-pliers, several boards, a fan shelf, and a backplane, as shown inFigure 4.

2 Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1 Hardware Structure of ZXSS10 B200-R08

FIGURE 4 THE MAKEUP OF ZXSS10 B200-R08

Here,

� System main control modules (including SMPs and SNPs) bothsupport the 1+1 redundancy mode.

� -48V DC or 220V AC serves as the power supply. Power mod-ules support the 1+1 redundancy mode.

� Supports 8 slots for users.

SMPFunctions SMP refers to Main Processor Board. As a core part of ZXSS10

B200-R08, SMP completely separates control and forwarding byusing two CPUs to process management & control and the routingcalculation respectively.

SMP includes the Central Processor Board (CPB), Switching Board(SS) and Network Processor Board (SNP).

Both CPB and SS are fixed on SMP, and SNP is cascaded on SMP.These modules are flexibly configured and adjusted as required.

The active/standby switchover function for SMP underlies the 1+1redundancy configuration.

Circuit Board Figure 5 shows the panel of SMP.

FIGURE 5 THE PANEL VIEW OF SMP

Indicators Table 2 lists the functions of multiple indicators on SMP.



TABLE 2 DESCRIPTIONS OF INDICATORS FOR SMP

Indicator Function

PWR indicator (green) When the PWR indicator goes on,it means the power supply worksin a good state.

RUN indicator (green) When the RUN indicator goes on,it means system functions well.

ALM indicator (red) When the ALM indicator goes on,it means system is out of service.

CLK indicates the working state ofSMP phase lock loop.

Goes on permanently if the phaselock loop is normal.

Flashes when the phase lock loopis in failure.

CLK

Goes off without the phase lockloop, i.e., without the function ofclock tracking.

BITS indicate the working state ofSMP phase lock loop.

Goes on permanently if the phaselock loop locks the external clocksource of 2MBITS.

Flashes if the phase lock loopcan not permanently locks, andstill system tracks external clocksource of 2MBITS.

BITS

Goes off without the phase lockloop, i.e., without the function ofclock tracking.

It indicates the working state ofSNP1.

Goes on permanently when SNP1is in a normal state.

Flashes when SNP1 is in failure.

NP1

Goes off when SNP1 is notinserted.



Indicator Function


Goes on permanently if SNP2 is ina normal state.


NP2



Goes on permanently when SNP3is in normal state.


NP3



Goes on permanently when SNP4is in a normal state.


NP4


It indicates the working state ofactive/standby SMP.

Goes on permanently when SMPis in an active state.

MST

Goes off when the SMP is in astandby state.

Double-8 digital pipe It helps the manufacturer toidentify the working state of CPUfor SMP. It displays the“—“symbolwhen B200 is in a normal state.

Button There is a button on the SMP panel, and its function is listed inTable 3.

TABLE 3 DESCRIPTION OF SMP BUTTON

Name Description

RST Resets the board manually.

Interfaces Table 4 lists the description of interfaces on the SMP panel



TABLE 4 DESCRIPTIONS OF INTERFACES FOR SMP

Name Type Description

COMM RS232 Used to connectthe backgroundmanagementterminal. Maintainsand operates B200on the backgroundmanagementterminal throughHyper terminal etc.COMM is a RS232DB9 male serialconnector, connectedto COM interfaceof the backgroundmanagement terminalthrough a serialcable. Both endsof the connectioncable use DB9 femaleconnectors.

10/100M RJ45 Serves as themanagementinterface for systemto connect thebackground. Servesas the port ofout-of-band NM forB200

TRACE RJ45 Serves as the10/100Ethernetinterface forcommissioning thebackup CPU

BITS Interface There is a BITS interface in the SMP panel, which acts as the inter-face of external clock source for SMP phase-lock loop. It receivesthe 2M bits signals through its left hole, and sends the 2M bitssignals through its right hole.

Line Interface BoardOverview Line interface boards of ZXSS10 B200-R08 are classified into two

types, i.e., Fast Ethernet interface boards (with optical interfacesor electrical interfaces), and Gigabit Ethernet interface boards.There are different types of interface connectors used in the Lineinterface boards of B200. Line interface boards with different typesof connectors are applied on different transmission mediums andtransmission distances.

2-Port Optical &Electrical HybridGigabit Ethernet

Board

The 2-port optical & electrical hybrid gigabit Ethernet interfaceboard provides two RJ45 Gigabit Ethernet electrical interfaces(10/100/1000BASE-T compatible interfaces), or two SFP GigabitEthernet optical interfaces (1000BASE-X interfaces). RJ45 Gigabit



Ethernet electrical interface uses the parallel or cross gigabit cable(unshielded C5 cable).

Hot pluggable SFP fiber module is applied on the Gigabit Ether-net optical interface, which supports the transmission distance upto 120 km. Detailed transmission distance depends on which SFPfiber module is used. The 2-port optical & electrical hybrid Giga-bit Ethernet interface board, fully complying with the IEEE802.3standard, supports two Gigabit Ethernet interfaces (each interfaceis only allowed to use the optical interface or electrical interfacetype).

Figure 6 shows the panel of the 2-port optical & electrical hybridGigabit Ethernet interface board.

FIGURE 6 2-PORT OPTICAL & ELECTRICAL HYBRID GIGABIT ETHERNETINTERFACE BOARD

Table 5 lists the characteristics of interfaces on the 2-port optical& electrical hybrid Gigabit Ethernet interface board.

TABLE 5 CHARACTERISTICS OF INTERFACES ON THE 2-PORT OPTICAL &ELECTRICAL HYBRID GIGABIT ETHERNET INTERFACE BOARD

Interface Type Description

Gigabit Ethernet ElectricalInterface (RJ45)

� In accordance with IEEE802.3 standard

� RJ45 connector� Cat 5 Unshielded Twist

Pair (UTP)� Supports parallel cables

and cross cables� The maximum transmission

distance:– 10BASE-T:185 m– 100BASE-T:100 m– 1000BASE-T :100 m

Gigabit Ethernet ElectricalInterface (SFP)


� SFP fiber module� LC fiber� Transmission distance:

500m-80 km� Supports single mode/

multi-mode fibers

One indicator corresponds to an interface on the interface board,and its description is listed in Table 6.



TABLE 6 DESCRIPTIONS OF 2-PORT OPTICAL &ELECTRICAL HYBRID GIGABITETHERNET INTERFACE BOARD

Indicator Description

ACT per interface Flashes if data are sent andreceived, and goes off if no dataare sent and received.

LINK per interface Goes on permanently if links aresuccessfully set up in the physicallayer.

Goes off if links fail to be set up.

8-Port FastEthernet Interface

Board

The 8-port Fast Ethernet interface board provides 810/100100Base-TX adaptive electrical interfaces of B200.Figure7 shows the panel of 8-port Fast Ethernet interface board.

FIGURE 7 THE PANEL OF 8-PORT FAST ETHERNET OPTICAL INTERFACEBOARD

Table 7 lists characteristics of 8-port 10/100Base-TX electrical in-terface board.

TABLE 7 DESCRIPTIONS OF 8-PORT 10/100BASE-TX ELECTRICALINTERFACE BOARD

Port Type Characteristic

10Base-T � In accordance with IEEE802.3 standard

� RJ45 connector� Cat 3,4,5 Unshielded Twist

Pair (UTP)� The maximum transmission

distance: 185m

100Base-TX � In accordance with IEEE802.3u standard



distance: 100m

Note:

Cross cables are used to interconnect the 10/100Base-TX inter-faces with concentrators, exchangers and routers. Straight cablesare used to connect the host.



There are two indicators (one left, one right) above each interfaceof the 8-port 10/100Base-TX interface board, and their functionsare listed in Table 8.

TABLE 8 DESCRIPTION OF INDICATORS ON THE PANEL OF 8-PORT10/100BASE-TX INTERFACE BOARD

Indicator Function

Indicator at the upper left of theinterface (yellow)

Goes on if links are successfullyset up.

Indicator at the upper right of theinterface (green)

Goes on if current link works at100M rate.

Goes off if the link works at 10Mrate.

8-Port FastEthernet OpticalInterface Board

(SFEO)

The 8-port Fast Ethernet optical interface board provides 8100Base-FX optical ports for B200. SFX optical module is op-tional.Figure 8 shows the panel of the 8-port Fast Ethernet opticalinterface board.


Table 9 lists functions of indicators on the panel of the 8-port FastEthernet optical interface board.

TABLE 9 DESCRIPTION OF INDICATORS ON THE PANEL OF THE 8-PORT FASTETHERNET OPTICAL INTERFACE BOARD

Indicator Function

D indicator per interface Goes on permanently if data aresent and received.

Goes off if no data are sent andreceived.

L indicator per interface Goes on permanently if PHY setsup links successfully.

Goes off if PHY fails to set up links.

Power ModuleOverview To meet reliability standards of operators, hot backup is applied

on -48V DC or 220V AC, which is used to provide power sup-ply for ZXSS10 B200-R08. Load sharing is applied on normalactive/standby power modules. When one module is out of ser-vice, the other module begins to function.Figure 9 shows the powermodules of B200.



FIGURE 9 THE POWER SUPPLY OF B200

SPWA Figure 10 shows the power AC Board (SPWA).

FIGURE 10 THE PANEL OF AC POWER SUPPLY MODULE

Its technical parameters are as follows.

� Input voltage: single-phase 220V VAC±10%

� Input current: 3A

� Frequency: 50±5%

� Distortion rate of line voltage waveform: <5%

There are three power indicators on the AC Board.Table 10 liststheir functions.

TABLE 10 DESCRIPTIONS OF INDICATORS ON THE PANEL OF AC POWERMODULE

Indicator Function

3.3 V indicator (green) Indicates the working state ofSPWA for 3.3V output. Goes onpermanently if the SPWA is in anormal state, and goes off if theSPWA is over/under voltage.


5 V indicator (green) Indicates the working state ofSPWA for 5V output. Goes onpermanently if the SPWA innormal state, and goes off if theSPWA is over/under voltage.



DC Power Module(SPWD)

Figure 11 shows the Power DC Board (SPWD).

FIGURE 11 THE PANEL OF DC POWER MODULE


� Rated voltage: -48V

� Permitted range of voltage variation: -57V~-40V

� Input voltage: 10A

� Maximum consumption: 500W

There are four connecting terminals as follows.

� -48V

� -48V GND

� Protection Earth (PE )

� Working Ground (GND)

Three power indicators are situated at SPWD.Table 11 lists theirfunctions.


Indicator Function

3.3 V indicator (green) Indicates the working state ofSPWD for 3.3V output. Goes onpermanently when the SPWD is ina normal state, and goes off whenthe SPWD is in an abnormal state(over/under voltage).


5 V indicator (green) Indicates the working state ofSPWA for 5V output. Goes onpermanently when the SPWD is innormal state, and goes off whenthe SPWD is in abnormal state(over/under voltage).



Fan ShelfOverview Left blowing is applied on heat dissipation of ZXSS10 B200-R08.

Two parallel-connected fans blowing wind to the inside of B200,lies on the left side, while air exhaust vent forming the wind pathlies on the right side. Fans generate cool winds to reduce heatfrom all boards. Chips that generate most of heat are dissipatedthrough the aluminum heat sink.

Dust prevention nets at fans and the air inlet are centralized onthe fan shelf. Modularization is applied in the planning of the fanshelf and are readily detachable for maintenance and cleaning.

Figure 12 shows the panel of the fan shelf for ZXSS10 B200-R08.

FIGURE 12 THE PANEL OF THE FAN SHELF

There are three indicators on the panel of the fan shelf. Table 12lists their functions.

TABLE 12 DESCRIPTIONS OF INDICATORS ON THE PANEL OF FAN SHELF

Indicator Function

FAN1 Goes off if Fan 1 is in a normalstate, and goes on if Fan 1 is outof service.

FAN2 Goes off if Fan 2 is in a normalstate, and goes on if Fan 2 is outof service.



Indicator Function

HOT Goes off if the inside temperatureof B200 is normal, and goes on ifthe inside temperature exceeds70℃.

The allocation of slot numbers for ZXSS10 B200-R08 is marked onthe fan shelf.



This page is intentionally blank.


C h a p t e r 2


Table of ContentsSystem Appearance ...........................................................15SMNP...............................................................................17SMPI ...............................................................................20Line Interface Board ..........................................................22Power Module ...................................................................25Fan Shelf..........................................................................27

System AppearanceOverview Figure 13, Figure 15, and Figure 14 show the whole appearance of

ZXSS10 B200-R04.

FIGURE 13 THE FRONT VIEW OF ZXSS10 B200-R04



FIGURE 14 THE BACK VIEW OF ZXSS10 B200-R04

FIGURE 15 THE REAR VIEW OF ZXSS10 B200-R04 (SMPI)

Whole-SystemStructure



Here,



� System main control modules (including SMPs and SNPs) sup-port the 1+1 redundancy mode.

� -48V DC or 220V AC serve as the power supply. Power modulessupport the 1+1 redundancy mode.


SMNPFunctions SMNP refers to Main Processor Board. As a core part of ZXSS10

B200-R04, SMNP is made up of Central Processor Board (includingProtocol Processor Board and Control Processor Board), and Net-work Processor Board. SMNP reduces users’ cost to a maximumdegree by increasing the level of integration.

� Central Processor Board: Processes protocols and realizes con-trol.

� Network Processor Board: Realizes functions regarding net-work.

The active/standby switchover function of SMNP underlies the 1+1redundancy configuration.

Circuit Board Figure 17 shows the panel of SMNP.

FIGURE 17 THE PANEL VIEW OF SMNP

Indicators Table 13 lists the descriptions of 9 indicators on SMNP.

TABLE 13 DESCRIPTIONS OF INDICATORS ON SMNP

Indicator Function

PWR indicator (green) When the PWR indicator goes on,it means the power supply worksin a good state.

RUN indicator (green) When the RUN indicator goes on,it means system functions well.

ALM indicator (red) When the ALM indicator goes on,it means system is out of service.

Goes on permanently when thenetwork processor works in anormal state.

Flashes when the networkprocessor is in failure.

NP

Goes off when the networkprocessor fails to be initiated.



Indicator Function

Goes on permanently when thefan works in a normal state.

FAN

Flashes when the fan is out ofservice.

Flashes when the insidetemperature of B200 is abnormal.

HOT

Goes off when the insidetemperature of B200 is normal.

It indicates the working state ofSMNP4.

Goes on permanently whenSMNP4 works in a normal state.

Flashes when SMNP4 is in failure.

NP4

Goes off when SMNP4 is notinserted.

It indicates the working state ofSMNP as an active/standby board.

Goes on permanently when SMNPis in an active state.

MST

Goes off when SMNP is in astandby state.

Double-8 digital pipe It helps the manufacturer toidentify the working state ofCPU for SMNP. It displays theflashing“—“symbol when B200 isin a normal state.

Button There are three buttons on the SMNP panel, and their functionsare listed in Table 14.

TABLE 14 DESCRIPTION OF THE PUSHBUTTON ON ESC

Name Description

RST Resets SMNP where the RST islocated if the RST is in a push-instate. When SMNP is in an activestate, and there is a normalstandby SMNP, the active/standbyswitchover is performed. Whenthere is not any standby SMNP,ZXSS10 B200-R04 is reset. WhenSMNP is in a standby state, it isreset.

EXCH When SMNP works in an activestate, the button in push-instate leads to the active/standbyswitchover between SMNPs.



Name Description

When the button is located onthe standby SMNP, the button inpush-in state leads to nothing.

EXCH Active/standby switchover isperformed if the button is pushedin the active SMNP. No operation isperformed if the button is pushedin the standby SMNP.

Interfaces Table 15 lists the description of interfaces on the SMNP panel.

TABLE 15 DESCRIPTIONS OF INTERFACES ON SMNP PANEL

Name Type Description

CONSOLE interface RS45 Used to connectthe backgroundmanagementterminal. Maintainsand operates ZXR10GER-2/GER-4 onthe backgroundmanagement terminalthrough the Hyperterminal, etc.CONSOLE is a RS232serial port RJ45socket, connectingto the COM interfaceon the backgroundmanagement terminalthrough a serialcable. One end ofthe connection cableuses DB9 femaleconnector socket, andthe other end usesthe RJ45 socket.

AUX RJ45 Used to connectModem to realizeremote monitoring ofthe equipment. AUXinterface uses theDB9 male connector(socket), matchingwith the DB9 femaleconnector (socket).

10/100/1000M RJ45 Used to connectsystem to thebackground. Actsas the out-of-bandNM interface for therouter.

USB interface USB Used to insert the USBfacility, such as theflash memory facility.



SMPIFunctions As a core part of ZXSS10 B200-R04, SMPI consists of the cen-

tral processing module (including the protocol process module andcontrol process module) and network processing module. This in-creases the system’s integration level, and therefore reduces costfor customers to a maximum degree.

� Central process module: Provides protocol process and controlprocess functions

� Network process module: Provides the network process func-tion.

SMPIs, with the active/standby switchover function, can be con-figured in 1+1 redundancy mode.

Circuit Board Figure 18 shows the SMPI panel.

FIGURE 18 THE SMPI PANEL

Indicators There are total nine indicators on the SMPI panel.Table 16 lists thefunction for each indicator.

TABLE 16 DESCRIPTION FOR INDICATORS ON THE SMPI PANEL


PWR(green)

On: The device is powered on.

RUN(green)

On: The system operates normally.

ALM (red) On: Some failures occur.

NP On: The network processor operates normally.

Flashes: Some failures occur.

Off: Initialization fails.

FAN On: The fan operates normally;


HOT Off: Internal temperature is normal.


NP4 On: The 4th SNP board operates normally.

Flashes: Some failures occur on the 4th SNP board.




Off: The 4th SNP is not inserted.

MST On: The SMPI board operates in active state.

Off: The SMPI board operates in standby state.

Dual DigitsDisplays

Flashes at “--“ (for commissioning use): The SMPI’s CPUoperates normally.

Button There are total three buttons on the SMPI panel.Table 17 lists thefunction for each button.

TABLE 17 DESCRIPTION FOR BUTTONS ON THE SMPI PANEL

Button Description

RST In the case where the RST button on an active SMPI ispressed, the active/standby switchover starts if the standbySMPI operates normally. Otherwise, the device is reset. Inthe case where the button on a standby SMPI is pressed,the standby board is reset.

EXCH In the case where the button on an operating SMPI (active)is pressed, the active/standby switchover starts. Pressingthe button on a standby SMPI will not result in any opera-tion.

Interfaces Table 18 lists description for interfaces on the SMPI panel.

TABLE 18 DESCRIPTION FOR INTERFACES ON THE SMPI PANEL

Inter-face

Type Description

CONSOLEPort

RJ45 Used to connect the background manage-ment terminal. Maintains and operates ZXR10GER-2/GER-4 on the background managementterminal through the Hyper terminal, and soforth. CONSOLE port is a RS232 serial port RJ45socket, connecting to COM port on the back-ground management terminal through a serialcable. One end of the connection cable uses DB9female connector socket, and the other end usesthe RJ45 socket.

AUX Port RJ45 Used to connect Modem to provide remote moni-toring of the equipment. AUX port uses the DB9male connector (socket), matching with the DB9female connector (socket).



Inter-face

Type Description

10/100/1000M(1)

RJ45 Used to connect the system to the backgroundsubsystem. Acts as the out-of-band NM port forthe router.

10/100/1000M(2)

RJ45 As a service port, provides the uplink channel forhigh-performance service data.

10/100/1000M(3)

RJ45 As a service port, provides the uplink channel forhigh-performance service data.

As an active/standby communication port on theB200-R04 rack, is externally unavailable.

10/100/1000M(4)

RJ45

As a service port on the B200-R02 rack, providesthe uplink channel for high-performance servicedata.

USB Port USB Used to hold USB facilities, such as the flashmem-ory facility.

Line Interface BoardOverview The line interface boards of ZXSS10 B200-R04 supports 4 slots for

users, i.e., four line interface boards.

Line interface boards of ZXSS10 B200-R04 are classified into twotypes, i.e., Fast Ethernet interface boards (with optical interfacesor electrical interfaces), and Gigabit Ethernet interface boards.There are different types of interface connectors used in the Lineinterface boards of B200. Line interface boards with different typesof connectors are applied on different transmission mediums andtransmission distances.


Board

The 2-port optical & electrical hybrid gigabit Ethernet interfaceboard provides two RJ45 Gigabit Ethernet electrical interfaces(10/100/1000BASE-T compatible interfaces), or two SFP GigabitEthernet optical interfaces (1000BASE-X interfaces). RJ45 GigabitEthernet electrical interface uses the parallel or cross gigabit cable(unshielded C5 cable).



















multi-mode fibers


TABLE 20 DESCRIPTIONS OF 2-PORT OPTICAL &ELECTRICAL HYBRIDGIGABIT ETHERNET INTERFACE BOARD






Board





Table 21 lists characteristics of 8-port 10/100Base-TX electricalinterface board.






distance: 185m




distance: 100m

Note:




Indicator Function









(SFEO)

The 8-port Fast Ethernet optical interface board provides 8100Base-FX optical ports for B200. SFX optical module is op-tional.Figure 21 shows the panel of the 8-port Fast Ethernetoptical interface board.




Indicator Function






on -48V DC or 220V AC, which is used to provide power supplyfor ZXSS10 B200-R04. Load sharing is applied on normal ac-tive/standby power modules. When one module is out of service,the other module begins to function.Figure 22 shows the powermodules of B200.













Indicator Function















� -48V

� -48V GND





Indicator Function




Fan ShelfOverview Figure 25 shows the panel of the fan shelf for ZXSS10 B200-R04.



FIGURE 25 THE PANEL OF THE FAN SHELF

Left blowing is applied on heat dissipation of ZXSS10 B200-R08.Two parallel-connected fans blowing wind to the inside of B200,lies on the left side, while air exhaust vent forming the wind pathlies on the right side. Fans generate cool winds to reduce heatfrom all boards. Chips that generate most of heat are dissipatedthrough the aluminum heat sink.



C h a p t e r 3


Table of ContentsSystem Appearance ...........................................................29SMNP...............................................................................30SMPI ...............................................................................31Line Interface Board ..........................................................31Power Module ...................................................................34Fan Shelf..........................................................................36

System AppearanceIntroduction Figure 26, Figure 28, and Figure 27 show the appearance of

ZXSS10 B200-R02.

FIGURE 26 THE FRONT VIEW OF ZXSS10 B200-R02

FIGURE 27 THE BACK VIEW OF ZXSS10 B200-R02



FIGURE 28 THE REAR VIEW OF ZXSS10 B200-R02 (SMPI)

Whole SystemStructure



Here,

� The main control module (including SMP and SNP) supports the1+1 redundancy mode.

� -48V DC or 220V AC serve as the power supplies. Power mod-ules support the 1+1 redundancy mode.


SMNPOverview The difference between ZXSS10 B200-R02 and ZXSS10 B200-R04

lies in the former uses the SMNP as the main control board withoutthe 1+1 redundancy configuration (i.e., only a SMNP is used). Formore information about SMNP, refer to SMNP of Hardware Struc-ture of ZXSS10 B200-R04.



SMPIThe SMPI serves as the system control board in ZXSS10 B200-R02.The hardware platform of ZXSS10 B200-R02 differs from that ofZXSS10 B200-R04 in that it uses only one SMPI board.

For more information about the hardware structure of the SMPI,see .

Line Interface BoardOverview ZXSS10 B200-R02 supports 2 slots for users, i.e., four line inter-

face boards.

Line interface boards of ZXSS10 B200-R02 are classified into twotypes, i.e., Fast Ethernet interface boards (with optical interfacesor electrical interfaces), and Gigabit Ethernet interface boards.There are different types of interface connectors used in the Lineinterface boards of B200. Line interface boards with different typesof connectors are applied on different transmission mediums andtransmission distances.


Board

The 2-port optical & electrical hybrid gigabit Ethernet interfaceboard provides two RJ45 Gigabit Ethernet electrical interfaces(10/100/1000BASE-T compatible interfaces), or two SFP GigabitEthernet optical interfaces (1000BASE-X interfaces). RJ45 GigabitEthernet electrical interface uses the parallel or cross gigabit cable(unshielded C5 cable).



















multi-mode fibers


TABLE 27 DESCRIPTIONS OF 2-PORT OPTICAL &ELECTRICAL HYBRIDGIGABIT ETHERNET INTERFACE BOARD






Board



Table 28 lists characteristics of 8-port 10/100Base-TX electricalinterface board.








distance: 185m




distance: 100m

Note:




Indicator Function







(SFEO)

The 8-port Fast Ethernet optical interface board provides 8100Base-FX optical ports for B200. SFX optical module is op-tional.Figure 32 shows the panel of the 8-port Fast Ethernetoptical interface board.






Indicator Function






on -48V DC or 220V AC, which is used to provide power supplyfor ZXSS10 B200-R02. Load sharing is applied on normal ac-tive/standby power modules. When one module is out of service,the other module begins to function.Figure 33 shows the powermodules of B200.













Indicator Function













� -48V

� -48V GND







Indicator Function




Fan ShelfOverview Figure 36 shows the panel of the fan shelf for ZXSS10 B200-R02.



FIGURE 36 THE PANEL OF ZXSS10 B200-R02 FAN SHELF

Left blowing is applied on heat dissipation of ZXSS10 B200-R08.Two parallel-connected fans blowing wind to the inside of B200,lies on the left side, while air exhaust vent forming the wind pathlies on the right side. Fans generate cool winds to reduce heatfrom all boards. Chips that generate most of heat are dissipatedthrough the aluminum heat sink.






C h a p t e r 4

Hardware Structure ofZXSS10 B200-S01

Table of ContentsSystem Appearance ...........................................................39Front Panel .......................................................................39Back Panel........................................................................41Technical Indexes ..............................................................42

System AppearanceOverview ZTE server is applied to the hardware of ZXSS10 B200-S01.Figure

37 shows the whole appearance of ZXSS10 B200-S01.

FIGURE 37 THE WHOLE APPEARANCE OF ZXSS10 B200-S01

Front PanelOverview Figure 38shows the front panel of ZXSS10 B200-S01.



FIGURE 38 THE FRONT VIEW OF ZXSS10 B200-S01

Table 33 lists the descriptions of the front panel for ZXSS10 B200-S01.

TABLE 33 DESCRIPTIONS OF THE FRONT PANEL FOR ZXSS10 B200-S01

Number Name Number Name

A Power switch B Power indicator

C Network card 1status indicator(green)

D Network card 2status indicator(green)

E Hard diskpower indicator(green)

F USB interface

G USB interface H LCD panel

I LCD controlbutton

Figure 39 shows the LCD.

FIGURE 39 LCD

Table 34 lists the descriptions for LCD buttons.


Chapter 4 Hardware Structure of ZXSS10 B200-S01

TABLE 34 DESCRIPTIONS FOR LCD BUTTONS

Button Description

Left-move button

Right-move button

Up-move button

Down-move button

Selection button

Canceling/exit button

Back PanelOverview Figure 40 shows the back panel of ZXSS10 B200-S01.

FIGURE 40 THE BACK PANEL OF ZXSS10 B200-S01

Table 35 lists the description of the back panel for ZXSS10 B200-S01.



TABLE 35 THE DESCRIPTION OF THE BACK PANEL FOR ZXSS10 B200-S01

Number Name Number Name

A Power plug B Power switch

C PS2 interface D RJ45 networkinterface

E RJ45 networkinterface

F Displayinterface

G Serial port H USB interface

I PCI barrier

Technical IndexesTable 36 lists several related technical indexes.

TABLE 36 TECHNICAL INDEXES

Item Technical Specification

CPU Supports 2.8GHZ Intel P4 or evenhigher main frequency.

Secondary buffer 1M/2M

Front bus 533MHz/800MHz

Memory DDRII 400 4 DIMM, up to 4GB

Chip group I INTEL 915GV(MCH)

GC INTEL 915GV

CD-ROM Connects to USB CD-ROM.

FD Connects to USB FD.

PCI expansion slot One 32-bit / 33 MHz PCI slot onthe riser card

Hard disk Supports an IDE hard disk or twoSATA hard disks.

Network card An integrated FE/GE network card

Power supply Standard ATX 300W single-modepower supply.

Cabinet size

Depth *width*height (mm) 387mm * 424mm * 43.5mm




Environment Requirements

Temperature Working environment5°C~35°C

Transportation/storageenvironment-40°C~70°C

Relative humidity Working environment35%~80%

Transportation/storageenvironment95% for non-workingsituation, and no condensed dewbelow 30°C.

Security Passes CCC certification.





C h a p t e r 5

Hardware Structure ofZXSS10 B200-S02

Table of ContentsSystem Appearance ...........................................................45Front Panel .......................................................................46Back Panel........................................................................48Main Board Structure .........................................................49Technical Indexes ..............................................................51

System AppearanceOverview ZTE server is applied to the hardware of ZXSS10 B200-S02.Figure

41 shows the whole appearance of ZXSS10 B200-S02.

FIGURE 41 THE WHOLE APPEARANCE OF ZXSS10 B200-S02

Structure Figure 42 shows the structure of ZXSS10 B200-S02.



FIGURE 42 THE STRUCTURE OF ZXSS10 B200-S02

Table 37 lists the descriptions of whole components for ZXSS10B200-S02.

TABLE 37 DESCRIPTIONS OF ZXSS10 B200-S02

Location Name Location Name

A Air director B Memory slot

C PCI holder D PCI expansioncard

E PCI transitioncard

F Power supply

G Air cooling fan H CPU

I Fan J CD

K Hard disk

Front PanelOverview Figure 43 shows the front panel of ZXSS10 B200-S02.

FIGURE 43 THE FRONT VIEW OF ZXSS10 B200-S02

Table 38 lists the descriptions of the front panel for ZXSS10 B200-S02.



TABLE 38 DESCRIPTION OF THE FRONT PANEL

Number Name Description

A System statusindicator

Indicates the runningstatus of the server.For more information,refer to Table 24.

B Slimline CD Slimline DVDROM orCOMBO

C Hard disk slot Supports up to 8hot-plugging SAShard disks in 2.5 inch.

D Display interface Connects to the frontVGA interface of thedisplay.

E USB interface Two front USBinterfaces

F ID button andindicator

Used to switch on/offID indicators. Forinformation about theID indicator, refer toTable 24.

G Power button andindicator

Used to turn on/offthe power supplyof the server. Forinformation about thepower indicator, referto Table 24.

Figure 44 shows the indicators.

FIGURE 44 THE VIEW OF CONTROL PANEL

Table 39 lists the indicators on the front panel.



TABLE 39 DESCRIPTIONS FOR SYSTEM INDICATORS


H Network port A statusindicator (green)

Flashes when data aretransmitted throughnetwork.

I Network port B statusindicator (green)

Flashes when data aretransmitted throughnetwork

J System alarmindicator (red)

Flashes when systemalarm occurs.

K Fan alarm indicator(red)

Flashes when fanalarm occurs.

L Power alarm indicator(red)

Flashes when poweralarm occurs.

M ID status indicator(blue)

The ID indicatoris switched onthrough the ID buttonor managementsoftware for theoperator to search thefailed server. Aftersolving the failure,the operator switchesoff the indicator.

N Power status indicator(orange & green)

Orange indicatormeans system is ina standby state, andgreen indicator meanssystem is in a normalpower supply state.

Back PanelOverview Figure 45 shows the back panel of ZXSS10 B200-S02.

FIGURE 45 THE BACK PANEL OF ZXSS10 B200-S02

Table 40 lists the descriptions of the back panel for ZXSS10 B200-S02.



TABLE 40 THE DESCRIPTIONS OF THE BACK PANEL FOR ZXSS10 B200-S02


A GE interfaces (three) 10M/100M/1000Mself-adaptableEthernet interfaces

B PCI expansion slot Supports all kindsof standard PCIexpansion cards toconnect to externalmemory facilities.

C Power module � Supports 1+1redundancypower supplies

� Supports AC oruni-mode DCpower supply.

D USB interfaces (two) Connects to USBfacilities.

E ID indicator Lighted when the IDbutton is pushed.

F RJ-45 serial port (one) Used forcommissioning andconfiguration use

G Display interface Connects to the backVGA interface of thedisplay.

H Serial port of the backpanel

DB-9 serial port

I PS/2 interfaces (two) Connects to themouse and keyboardrespectively

Main Board StructureOverview The high-reliable main board with high performance is applied to

ZXSS10 B200-S02.

The main board consists of several parts as follows.

� Intel S5000P chip group

� Two double-core Intel Woodcrest processor (alternative: four-core Clovertown processor)

� Four DIMM memory slots (up to 16GB memory)

� Integrated ATI ES1000 display chip (16MB VRAM)

� Three integrated GE cards

� A maximum of 3 PCI expansion slots (PCI-X/ PCI-E×8/ PCI-E×16)



� A maximum of eight hot-plugging SAS hard disks in 2.5 inch.

Figure 46 shows the structure of the main board for ZXSS10 B200-S02.

FIGURE 46 THE STRUCTURE OF THE MAIN BOARD FOR ZXSS10 B200-S02

Table 41 lists the descriptions of the main board for ZXSS10 B200-S02

TABLE 41 DESCRIPTIONS OF THE MAIN BOARD FOR ZXSS10 B200-S02

Number Description Number Description

A Managementsub-cardconnector

B BIOS chip

C Two USBinterfaces

D PCI transitioncard slot

E RJ45 serial port F Uni-port GEinterface

G Double-port GEinterface

H Displayinterface

I DB-9 serial port J PS/2 interface

K Display chip L Four Memoryslots



Number Description Number Description

M North bridgechip

N Two CPUfootstands

O Six fan sockets P IDE interface

Q Front controlpanel interface

R 8-pin powerinterface

S 24-pin powerinterface

T SAS control chip

U X7 jumper V South bridgechip

W Two SAS×4interfaces

X Main boardpower

Y SATA×4interface

Technical IndexesTable 42 lists several technical indexes.

TABLE 42 TECHNICAL INDEXES


Host Performance

CPU � Intel 5100 series (doublecores)/ 5300 series (fourcores)

� 1.6GHz~3.0GHz� Front bus frequency:

1066/1333 MHz

Cache 4MB Woodcrest /8MB Clovertownsecondary buffer, CPU inter-chipintegration

SMP Supports two double-core IntelWoodcrest processor (alternative:four-core Clovertown processor)

System bus frequency � 1066/1333MHz� Transmission bandwidth:

up to 21Gb/s

Memory type Fully Buffer DIMM with533/667MHz frequency

Chip group Intel S5000P




Memory slot and memory capacity � 4×DIMMs� supports uni-memory/double-

memory� supports up to 16GB memory

if 4G uni-memory is used

SAS controller an integrated LSI SAS1068E SAScontroller, supporting RAID-0 andRAID-1

SAS interface for the main board Two SAS×4 connectors

IDE controller and interface Integrates an Ultra ATA100 for themain board

Display An integrated ATI ES1000 displaychip(32MB VRAM)

Network Integrates an Intel 82563EBnetwork card PHY and an Intel82573EB network card.

CD A slimline DVDROM or a COMBO

FD USB FD (optional)

Expansion performance and interfaces

I/O expansion slot � Three PCI expansion slotsin the riser board

� One PCI-X 64 bit/133M slot� One PCI-E ×8 slot� One PCI-E ×16 slot (working

at PCI-E ×8 rate)

Hard disk expansion capacity � Supports up to 8 hot-plugginghard disks

� Eight 2.5-inch SAS harddisks or four 2.5-inchSATA hard disks

External facility interface � 2×PS/2 interface� 2×serial port (at the back

panel: one DB-9 serial port,one RJ-45 serial port)

� 2×VGA interface ( one is atthe back of the rack, and theother is at the front panel)

� 4×USB2.0 interface (twoare at the back of the rack,and another two are atthe front panel)

� 3×RJ-45 GE interface

System Dissipation Performance

Number of system fans Three system fans and threeredundant fans (optional)

Characteristics of Power Supply




Input voltage DC:100~240VAC / 50Hz

AC: -72VDC~-48VDC

Power supply � 600W AC or uni-mode DCpower supply

� 600W AC or hot-pluggingredundant DC power supply(optional)

Environment Requirement

Temperature Working environment50°C~40°C

Transportation/storageenvironment-40°C~70°C

Relative humidity Working environment35%~80%

Transportation/storageenvironment95% for non-workingsituation, and no condensed dewbelow 30°C.

Physical Specification

Size 88 mm*440 mm*600 mm(height*width*depth)

Weight 17kg ~ 27kg

Security

System security Passes CCC and CE certifications





Figures

Figure 1 The Front View of B200........................................... 1

Figure 2 AC Power Supply-the Back View of B200 ................... 2

Figure 3 DC Power Supply- the Back View of B200 .................. 2

Figure 4 The Makeup of ZXSS10 B200-R08 ........................... 3

Figure 5 The Panel View of SMP............................................ 3

Figure 6 2-port optical & electrical hybrid gigabit Ethernet

interface board................................................... 7

Figure 7 The Panel of 8-Port Fast Ethernet Optical Interface

Board................................................................ 8


Board................................................................ 9

Figure 9 The Power Supply of B200......................................10

Figure 10 The Panel of AC Power Supply Module ....................10

Figure 11 The Panel of DC Power Module .............................11

Figure 12 The Panel of the Fan Shelf ....................................12

Figure 13 The Front View of ZXSS10 B200-R04 .....................15

Figure 14 The Back View of ZXSS10 B200-R04 ......................16

Figure 15 The Rear View of ZXSS10 B200-R04 (SMPI) ............16

Figure 16 The Makeup of ZXSS10 B200-R04 .........................16

Figure 17 The Panel View of SMNP .......................................17

Figure 18 The SMPI Panel ...................................................20


interface board..................................................23


Board...............................................................24


Board...............................................................25

Figure 22 The Power Supply of B200 ....................................25



Figure 25 The Panel of the Fan Shelf ....................................28

Figure 26 The Front View of ZXSS10 B200-R02 .....................29

Figure 27 The Back View of ZXSS10 B200-R02 ......................29

Figure 28 The Rear View of ZXSS10 B200-R02 (SMPI) ............30



Figure 29 The Makeup of ZXSS10 B200-R02 .........................30


interface board..................................................31


Board...............................................................32


Board...............................................................33

Figure 33 The Power Supply of B200 ....................................34



Figure 36 The Panel of ZXSS10 B200-R02 Fan Shelf ...............37

Figure 37 The Whole Appearance of ZXSS10 B200-S01...........39

Figure 38 The Front View of ZXSS10 B200-S01 .....................40

Figure 39 LCD...................................................................40

Figure 40 The Back Panel of ZXSS10 B200-S01 .....................41

Figure 41 The Whole Appearance of ZXSS10 B200-S02...........45

Figure 42 The Structure of ZXSS10 B200-S02 .......................46

Figure 43 The Front View of ZXSS10 B200-S02 .....................46

Figure 44 The View of Control Panel ....................................47

Figure 45 The Back Panel of ZXSS10 B200-S02 .....................48

Figure 46 The Structure of the Main Board for ZXSS10

B200-S02.........................................................50


Tables

Table 1 Chapter Summary .................................................... i

Table 2 Descriptions of Indicators for SMP ............................. 4

Table 3 Description of SMP Button ........................................ 5

Table 4 Descriptions of Interfaces for SMP.............................. 6

Table 5 Characteristics of Interfaces on the 2-port optical &

Electrical Hybrid Gigabit Ethernet Interface Board .. 7

Table 6 Descriptions of 2-Port Optical &Electrical Hybrid

Gigabit Ethernet Interface Board .......................... 8

Table 7 Descriptions of 8-port 10/100Base-TX Electrical

interface board .................................................. 8

Table 8 Description of Indicators on the Panel of 8-Port

10/100Base-TX Interface Board ........................... 9

Table 9 Description of Indicators on the Panel of the 8-port

fast Ethernet optical interface board...................... 9

Table 10 Descriptions of Indicators on the Panel of AC Power

Module ............................................................10


Module ............................................................11

Table 12 Descriptions of Indicators on the Panel of Fan Shelf ...12

Table 13 Descriptions of Indicators on SMNP ........................17

Table 14 Description of the Pushbutton on ESC .....................18

Table 15 Descriptions of Interfaces on SMNP Panel ................19

Table 16 Description for Indicators On the SMPI Panel ...........20

Table 17 Description for Buttons on the SMPI Panel ...............21

Table 18 Description for Interfaces on the SMPI Panel.............21


Electrical Hybrid Gigabit Ethernet Interface Board

.......................................................................23


Gigabit Ethernet Interface Board .........................23


interface board .................................................24


10/100Base-TX Interface Board ..........................24




fast Ethernet optical interface board.....................25


Module ............................................................26


Module ............................................................27


Electrical Hybrid Gigabit Ethernet Interface Board

.......................................................................32


Gigabit Ethernet Interface Board .........................32


interface board .................................................33


10/100Base-TX Interface Board ..........................33


fast Ethernet optical interface board.....................34


Module ............................................................35


Module ............................................................36

Table 33 Descriptions of the Front Panel for ZXSS10

B200-S01 ........................................................40

Table 34 Descriptions for LCD Buttons .................................41

Table 35 The Description of the Back Panel for ZXSS10

B200-S01 ........................................................42

Table 36 Technical Indexes .................................................42

Table 37 Descriptions of ZXSS10 B200-S02 ..........................46

Table 38 Description of the Front Panel ................................47

Table 39 Descriptions for System Indicators ..........................48

Table 40 the Descriptions of the Back Panel for ZXSS10

B200-S02 ........................................................49

Table 41 Descriptions of the Main Board for ZXSS10

B200-S02 ........................................................50

Table 42 Technical Indexes..................................................51
